Wafer chuck
By designing a wafer clamping fixture with arc-shaped clamping ends and buffer pads, the problems of wafer slippage and scratches caused by the small clamping area of existing fixtures have been solved, achieving more reliable and safer wafer clamping and improving product yield.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- 捷捷微电(南通)科技有限公司
- Filing Date
- 2025-09-09
- Publication Date
- 2026-07-21
AI Technical Summary
Existing wafer jigs have a small clamping area, which can easily cause wafers to slip and break. They are also prone to scratches and stress concentration during clamping, affecting product yield.
Design a wafer jig including a first clamping plate and a second clamping plate. The clamping plates are connected by a hinge shaft. The clamping end has an arc-shaped structure and is equipped with a buffer pad and a limiting post. The clamping end contacts the non-patterned area of the wafer. The clamping force is provided by an elastic element, and the stress concentration is reduced by the buffer pad and the limiting post.
The increased clamping contact area disperses the clamping force, reducing the possibility of wafer drop and scratches, improving the reliability and safety of clamping, and reducing the possibility of wafer damage.
Smart Images
Figure CN224538707U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a wafer clamp. Background Technology
[0002] In semiconductor wafer manufacturing and inspection processes, wafer jigs are crucial tools for manually picking up, transferring, and inspecting wafers. Currently, commonly used wafer jigs typically consist of two clamping arms connected by a pivot and springs. The operator grips the non-patterned areas of the wafer edge by squeezing the clamping arms to pick up and place the wafer.
[0003] However, the contact area between the clamping end of the fixture and the wafer is small, and the clamping force is concentrated. During operation, the wafer is prone to slipping and breaking due to insecure clamping, resulting in economic losses. Secondly, there are positioning notches on the edge of the wafer. If the fixture is mistakenly clamped at the positioning notch, the wafer is prone to chipping or even breaking due to stress concentration. In addition, the fixture material is usually hard and is very easy to scratch the edge of the wafer. These micro-damages may become the source of defects in subsequent processes and affect the product yield. Utility Model Content
[0004] The purpose of this invention is to provide a wafer clamp that can clamp wafers more reliably and safely, reducing the possibility of wafer damage due to clamping.
[0005] The embodiments of this utility model are implemented as follows:
[0006] In one aspect, this utility model provides a wafer clamping fixture, including a first clamping plate and a second clamping plate. The first clamping plate includes a first clamping end, a first hinge portion, and a first driving end arranged sequentially. The second clamping plate includes a second clamping end, a second hinge portion, and a second driving end arranged sequentially. The first hinge portion and the second hinge portion are connected by a hinge shaft so that the first clamping plate and the second clamping plate are stacked, and the axis of the hinge shaft is perpendicular to the stacking direction. The first clamping end and the second clamping end form a clamping portion for clamping the wafer, and the first driving end and the second driving end form a driving portion for driving the clamping portion to open and close. Both the first clamping end and the second clamping end have an arc-shaped structure adapted to the wafer contour, and the opposing surfaces of the first clamping end and the second clamping end are provided with buffer pads. The first clamping end and the second clamping end respectively contact the non-patterned area of the wafer to clamp the wafer.
[0007] Optionally, a limiting post is provided on the side of the buffer pad away from the opening of the clamping part, and the side edge of the wafer can abut against the limiting post so that the first clamping end and the second clamping end respectively contact the non-patterned area of the wafer to clamp the wafer.
[0008] Optionally, there are multiple limiting posts, which are evenly distributed along the edge of the buffer pad away from the opening of the clamping part.
[0009] Optionally, the wafer fixture further includes a first elastic element, which is disposed on the side of the hinge shaft near the drive portion; one end of the first elastic element abuts against the first clamping plate and the other end abuts against the second clamping plate; when the first drive end and the second drive end are driven to move closer to each other, the clamping portion opens and the first elastic element stores energy; when the driving force disappears, the first elastic element releases energy to drive the first drive end and the second drive end to move away from each other, and the clamping portion closes.
[0010] Optionally, the wafer fixture further includes a second elastic element, which is disposed on the side of the hinge shaft near the clamping portion; one end of the second elastic element abuts against the first clamping plate and the other end abuts against the second clamping plate; when the first elastic element is compressed and stores energy, the clamping portion opens to stretch the second elastic element; when the first elastic element releases energy and resets, the clamping portion closes to compress the second elastic element.
[0011] Optionally, the buffer pad includes a first buffer portion and a second buffer portion, which are respectively spaced apart on the inner surfaces of the first clamping end and the second clamping end.
[0012] Optionally, the wafer fixture also includes a fixing frame, which includes a limiting groove. The inner wall of the limiting groove is adapted to the outer wall of the second clamping plate, and the second clamping plate can be locked in the limiting groove of the fixing frame. The side of the fixing frame away from the second clamping plate is fixedly connected to the mounting plane by adhesive or fasteners.
[0013] Optionally, a connecting rope is provided at the end of the second clamp away from the clamping part.
[0014] Optionally, the side of the second clamping plate facing the first clamping plate has an inclined surface, and the second clamping plate has a horizontal surface corresponding to the driving part. The hinge shaft is disposed at the connection between the inclined surface and the horizontal surface. The first clamping plate is fitted with the inclined surface so that the first driving end and the second driving end have a preset interval. The first clamping end and the second clamping end are parallel to each other.
[0015] Optionally, the connecting rope is made of elastic material.
[0016] The beneficial effects of this utility model include:
[0017] This application provides a wafer clamping fixture, including a first clamping plate and a second clamping plate. The first clamping plate includes a first clamping end, a first hinge portion, and a first driving end arranged sequentially. The second clamping plate includes a second clamping end, a second hinge portion, and a second driving end arranged sequentially. The first hinge portion and the second hinge portion are connected by a hinge shaft so that the first clamping plate and the second clamping plate are stacked, and the axis of the hinge shaft is perpendicular to the stacking direction. The first clamping end and the second clamping end form a clamping portion for clamping the wafer, and the first driving end and the second driving end form a driving portion for driving the clamping portion to open and close. Both the first clamping end and the second clamping end have an arc-shaped structure adapted to the wafer contour, and the opposing surfaces of the first clamping end and the second clamping end are provided with buffer pads. The first clamping end and the second clamping end respectively contact the non-patterned area of the wafer to clamp the wafer. Compared to existing jigs that suffer from a small contact area with the wafer, this application addresses this issue by using an arc-shaped clamping end. This increases the clamping contact area, disperses the clamping force, reduces stress concentration, and minimizes the possibility of the wafer falling due to the small clamping area during operator handling. The buffer pad replaces the rigid clamping surface of traditional jigs, preventing scratches around the wafer. The buffer pad undergoes slight cushioning deformation during clamping; even if the wafer is accidentally clamped at the positioning notch at the edge, the deformation absorbs accumulated process stress within the wafer, preventing stress concentration-induced fragmentation. This wafer jig provides more reliable and safer wafer clamping, reducing the likelihood of wafer damage during clamping. Attached Figure Description
[0018] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1 This is one of the structural schematic diagrams of the wafer fixture provided in the embodiments of this utility model;
[0020] Figure 2 This is the second schematic diagram of the structure of the wafer fixture provided in the embodiment of this utility model;
[0021] Figure 3 This is the third schematic diagram of the structure of the wafer fixture provided in the embodiment of this utility model;
[0022] Figure 4 Fourth schematic diagram of the structure of the wafer fixture provided in this embodiment of the present utility model;
[0023] Figure 5 This is a schematic diagram of the structure of the wafer fixture fixing frame provided in an embodiment of the present invention.
[0024] Icons: 100-Wafer clamp; 101-Clamping part; 102-Drive part; 110-First clamping plate; 111-First clamping end; 112-First hinge part; 113-First drive end; 120-Second clamping plate; 121-Second clamping end; 122-Second hinge part; 123-Second drive end; 130-Buffer pad; 131-First buffer part; 132-Second buffer part; 140-Limiting post; 150-First elastic element; 160-Second elastic element; 170-Fixing frame; 171-Limiting groove; 180-Connecting rope; 190-Hinge shaft; 200-Wafer. Detailed Implementation
[0025] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0026] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0027] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the utility model product is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0028] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0029] Please refer to Figure 1 and Figure 3 This embodiment provides a wafer clamp 100, including a first clamping plate 110 and a second clamping plate 120. The first clamping plate 110 includes a first clamping end 111, a first hinge portion 112 and a first driving end 113 arranged sequentially. The second clamping plate 120 includes a second clamping end 121, a second hinge portion 122 and a second driving end 123 arranged sequentially. The first hinge portion 112 and the second hinge portion 122 are connected by a hinge shaft 190 so that the first clamping plate 110 and the second clamping plate 120 are stacked. The axis of the hinge shaft 190 is perpendicular to the stacking direction. The first clamping end 111 and the second clamping end 121 form a clamping portion 101 for clamping the wafer 200, and the first driving end 113 and the second driving end 123 form a driving portion 102 for driving the clamping portion 101 to open and close; the first clamping end 111 and the second clamping end 121 are both arc-shaped structures adapted to the contour of the wafer 200, and the opposing surfaces of the first clamping end 111 and the second clamping end 121 are provided with buffer pads 130; the first clamping end 111 and the second clamping end 121 respectively contact the non-patterned area of the wafer 200 to clamp the wafer 200.
[0030] Specifically, such as Figure 1 and Figure 3 As shown, the wafer jig 100 includes a first clamping plate 110 and a second clamping plate 120. In one embodiment of this application, the second clamping plate 120 has an inclined surface and a horizontal surface arranged sequentially, and the height of the inclined surface gradually decreases from the driving part 102 to the clamping part 101. The second hinge part 122 is located at the connection between the inclined surface and the horizontal surface, and the second driving end 123 is located at the horizontal surface of the second clamping plate 120. The first clamping plate 110 is partially attached to the inclined surface, such that the first hinge part 112 is located at the corresponding position at the connection between the inclined surface and the horizontal surface. The first hinge part 112 and the second hinge part 122 are connected by a hinge shaft 190. Since the first clamping plate 110 is inclined along the inclined surface, there is a preset interval between the first driving end 113 and the second driving end 123, so that the first driving end 113 has a certain rotation space.
[0031] When the first driving end 113 is driven, the first clamping plate 110 rotates around the hinge axis 190, which can drive the first clamping end 111 away from or near the second clamping end 121. When the first clamping end 111 moves away from the second clamping end 121, the clamping part 101 opens, and the wafer 200 can be placed in the clamping area of the clamping part 101; when the first clamping end 111 moves close to the second clamping end 121 until they are in contact, the clamping part 101 closes, and the wafer 200 is tightly clamped to prevent it from falling. In order to further improve the clamping force of the clamping part 101 on the wafer 200 and increase the contact area between the first clamping end 111 and the second clamping end 121 and the wafer 200, the first clamping end 111 and the second clamping end 121 are parallel to each other, so as to achieve surface contact between the first clamping end 111 and the second clamping end 121 and the non-patterned area of the crystal surface, respectively.
[0032] Preferably, both the first clamping plate 110 and the second clamping plate 120 are made of Teflon. Teflon material has the characteristics of high temperature resistance, chemical corrosion resistance, and smooth, non-stick surface, which can avoid chemical pollution and high temperature effects in the semiconductor wafer 200 manufacturing environment, thereby improving the reliability of the wafer fixture 100.
[0033] To further improve the clamping force of the clamping part 101 on the wafer 200, such as Figure 1 As shown, both the first clamping end 111 and the second clamping end 121 have an arc-shaped structure adapted to the contour of the wafer 200. Compared with the existing technical problem of small contact area between the clamp and the wafer, this application increases the clamping contact area, disperses the clamping force, reduces stress concentration, and reduces the possibility of the wafer 200 falling due to the small clamping area during the operation of the operator.
[0034] To further improve the reliability of wafer 200 clamping and prevent wafer 200 from being scratched or broken during clamping, such as Figure 1 and Figure 3 As shown, buffer pads 130 are provided on the opposite surfaces of the first clamping end 111 and the second clamping end 121. The shape of the buffer pads 130 is adapted to the shape and structure of the first clamping end 111 and the second clamping end 121. In one specific embodiment of this application, the buffer pads 130 are arc-shaped strip structures. Preferably, the buffer pads 130 are made of silicone, which has good deformation capability, so that the wafer jig 100 can slightly deform with the edge contour of the wafer 200 when clamping the wafer 200, ensuring a tight fit.
[0035] It should be noted that the shape and structure of the cushioning pad 130 can be other than an arc-shaped strip structure; and the number of cushioning pads 130 can be multiple. In one possible embodiment of this application, such as Figure 3As shown, the buffer pad 130 includes a first buffer portion 131 and a second buffer portion 132 disposed radially along the wafer 200. The first buffer portion 131 and the second buffer portion 132 are respectively spaced apart on the inner surfaces of the first clamping end 111 and the second clamping end 121, such that the first clamping end 111 contacts the non-patterned area of one side of the wafer 200 through the first buffer portion 131 and the second buffer portion 132, and the second clamping end 121 contacts the non-patterned area of the other side of the wafer 200 through the first buffer portion 131 and the second buffer portion 132. This arrangement ensures that the surface of the wafer 200 contacts the buffer pad 130 during clamping while reducing the cost of installing the buffer pad 130. Similarly, as... Figure 1 As shown, the buffer pad 130 may also include a plurality of buffer portions spaced circumferentially along the wafer 200, so as to further ensure that the wafer 200 surface contacts the buffer pad 130 when clamped, while reducing the installation cost of the buffer pad 130.
[0036] The buffer pad 130 replaces the hard clamping surface of the traditional fixture, which can avoid scratches around the wafer 200. The buffer pad 130 can undergo slight buffer deformation during clamping. Even if it is clamped to the positioning notch at the edge of the wafer 200 due to operation error, it can absorb the process stress accumulated inside the wafer 200 through deformation, avoiding fragmentation caused by stress concentration.
[0037] The aforementioned wafer clamp 100 can clamp the wafer 200 more reliably and safely, reducing the possibility of damage to the wafer 200 due to clamping.
[0038] In one possible implementation of this application, such as Figure 1 As shown, a limiting post 140 is provided on the side of the buffer pad 130 away from the opening of the clamping part 101. The side edge of the wafer 200 can abut against the limiting post 140 so that the first clamping end 111 and the second clamping end 121 respectively contact the non-patterned area of the wafer 200 to clamp the wafer 200.
[0039] Preferably, the limiting post 140 is made of silicone to avoid contact with the wafer 200 and cause scratches on the surface of the wafer 200. When the wafer 200 is placed in the clamping part 101, the side edge of the wafer 200 can just abut against the limiting post 140. At this time, the wafer 200 cannot continue to extend into the clamping part 101, thereby limiting the clamped area of the wafer 200 and preventing its pattern area from being clamped by the clamping part 101 due to the wafer 200 extending too far into the clamping part 101.
[0040] The number of limiting posts 140 is at least one, as described in one specific embodiment of this application, such as Figure 1As shown, there are multiple limiting posts 140. These multiple limiting posts 140 are evenly distributed along the edge of the buffer pad 130 away from the opening of the clamping part 101, so as to evenly distribute the clamping force of the wafer 200 side edge to the multiple limiting posts 140, further reducing the possibility of the wafer 200 breaking due to clamping stress concentration and improving product yield. In addition, the even distribution of multiple limiting posts 140 can avoid excessive wear of a single limiting post 140, reducing the maintenance and replacement frequency of the wafer fixture 100.
[0041] For example, such as Figure 3 As shown, the wafer jig 100 also includes a first elastic element 150, which is disposed on the side of the hinge shaft 190 near the drive portion 102; preferably, the first elastic element 150 is a spring. One end of the first elastic element 150 abuts against the first clamping plate 110, and the other end abuts against the second clamping plate 120; in order to improve the installation stability of the first elastic element 150, one end of the first elastic element 150 is fixedly connected to the first clamping plate 110, and the other end is fixedly connected to the second clamping plate 120; when the first drive end 113 and the second drive end 123 are driven to move closer to each other, the clamping portion 101 opens, and at this time the first elastic element 150 is driven to compress to store energy; when the driving force disappears, the first elastic element 150 releases energy to drive the first drive end 113 and the second drive end 123 to move away from each other, and the clamping portion 101 closes. By setting the first elastic element 150, after the clamping force is lost, the first elastic element 150 resets to drive the clamping part 101 to automatically close and clamp the wafer 200, which improves the ease of operation and work efficiency of clamping the wafer 200; at the same time, the reset force of the first elastic element 150 also reduces the possibility of the wafer 200 falling off due to insufficient clamping force.
[0042] Optionally, such as Figure 3 As shown, the wafer jig 100 also includes a second elastic element 160, preferably a spring. The second elastic element 160 is disposed on the side of the hinge shaft 190 near the clamping portion 101; one end of the second elastic element 160 abuts against the first clamping plate 110 and the other end abuts against the second clamping plate 120; to improve the installation stability of the second elastic element 160, one end of the second elastic element 160 is fixedly connected to the first clamping plate 110 and the other end is fixedly connected to the second clamping plate 120; when the first elastic element 150 is driven to compress and store energy, the clamping portion 101 opens to stretch the second elastic element 160; when the first elastic element 150 releases energy and resets, the clamping portion 101 closes to drive and compress the second elastic element 160.
[0043] Traditional wafer jigs 100 rely on a single elastic element to provide clamping force. If this elastic element breaks or its elasticity diminishes, the clamping reliability will be reduced. However, the wafer jig 100 of this application, in addition to the first elastic element 150, also includes a second elastic element 160. Since the first elastic element 150 and the second elastic element 160 are respectively located on opposite sides of the hinge shaft 190, when the first driving end 113 and the second driving end 123 are far apart, the first elastic element 150 is in a naturally extended state, and the first clamping end 111 and the second clamping end 121 are in contact, at which point the second elastic element 160 is in a compressed state. When the first driving end 113 and the second driving end 123 are close together, the first elastic element 150 is in a compressed state, and the first clamping end 111 and the second clamping end 121 are far apart, at which point the second elastic element 160 is in a naturally extended state.
[0044] This configuration not only meets the clamping requirements but also improves the reliability of the wafer clamp 100. Even if one of the elastic elements is damaged, the other elastic element can still be used normally without affecting the use of the wafer clamp 100.
[0045] In one possible implementation of this application, such as Figure 2 , Figure 4 and Figure 5 As shown, the wafer jig 100 also includes a fixing frame 170, which includes a limiting groove 171. The inner wall of the limiting groove 171 is adapted to the outer wall of the second clamping plate 120, and the second clamping plate 120 can be locked in the limiting groove 171 of the fixing frame 170 to achieve a detachable connection with the fixing frame 170. Preferably, the inner wall of the limiting groove 171 is provided with anti-slip texture to prevent the second clamping plate 120 from accidentally falling off. The side of the fixing frame 170 facing away from the second clamping plate 120 is fixedly connected to the mounting plane by adhesive or fasteners. In one specific embodiment of this application, the mounting plane is a workbench, operation panel, etc. This application does not impose any restrictions on the specific form of the mounting plane. By setting the fixing frame 170, the wafer jig 100 has a fixed placement area when not in use, avoiding random placement of the wafer jig 100 and improving work efficiency.
[0046] In one possible implementation of this application, such as Figure 2 and Figure 4 As shown, a connecting rope 180 is provided at one end of the second clamping plate 120 away from the clamping part 101. One end of the connecting rope 180 can be connected to the end of the second clamping plate 120, and the other end can be connected to other fixed areas. For example, the end of the connecting rope 180 away from the clamping part 101 is fixedly connected to the mounting plane or the side wall of the operation panel to prevent the wafer jig 100 from being dropped randomly and to improve work efficiency.
[0047] Optionally, the connecting rope 180 is made of elastic material to prevent operators from being easily bound when picking up and transferring wafers 200 due to excessively short rope length, and also to avoid the problem of the rope easily getting tangled and knotted when not in use. The elastic connecting rope 180 can be flexibly adjusted in length according to actual needs to adapt to different operating environments.
[0048] The above description is merely an optional embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
[0049] It should also be noted that the various specific technical features described in the above specific embodiments can be combined in any suitable way without contradiction. In order to avoid unnecessary repetition, this utility model will not describe the various possible combinations separately.
Claims
1. A wafer clamp, characterized in that, The system includes a first clamping plate (110) and a second clamping plate (120). The first clamping plate (110) includes a first clamping end (111), a first hinge portion (112), and a first driving end (113) arranged sequentially. The second clamping plate (120) includes a second clamping end (121), a second hinge portion (122), and a second driving end (123) arranged sequentially. The first hinge portion (112) and the second hinge portion (122) are connected by a hinge shaft (190) so that the first clamping plate (110) and the second clamping plate (120) are stacked. The axis of the hinge shaft (190) is perpendicular to the stacking direction. The first clamping end (111) and the second hinge portion (122) are connected by a hinge shaft (190) so that the first clamping plate (110) and the second clamping plate (120) are stacked. Two clamping ends (121) form clamping portions (101) for clamping wafers (200), and the first driving end (113) and the second driving end (123) form driving portions (102) for driving the clamping portions (101) to open and close; the first clamping end (111) and the second clamping end (121) are both arc-shaped structures adapted to the contour of the wafer (200), and buffer pads (130) are provided on the opposite surfaces of the first clamping end (111) and the second clamping end (121); the first clamping end (111) and the second clamping end (121) respectively contact the non-patterned areas of the wafer (200) to clamp the wafer (200).
2. The wafer fixture according to claim 1, characterized in that, The buffer pad (130) has a limiting post (140) on the side opposite to the opening of the clamping part (101). The side edge of the wafer (200) can abut against the limiting post (140) so that the first clamping end (111) and the second clamping end (121) respectively contact the non-patterned area of the wafer (200) to clamp the wafer (200).
3. The wafer fixture according to claim 2, characterized in that, The number of the limiting posts (140) is multiple, and the multiple limiting posts (140) are evenly distributed along the side edge of the buffer pad (130) away from the opening of the clamping part (101).
4. The wafer fixture according to claim 1, characterized in that, The wafer jig (100) further includes a first elastic element (150), which is disposed on the side of the hinge shaft (190) near the drive part (102). One end of the first elastic element (150) abuts against the first clamping plate (110), and the other end abuts against the second clamping plate (120). When the first drive end (113) and the second drive end (123) are driven to move closer to each other, the clamping part (101) opens, and the first elastic element (150) stores energy. When the driving force disappears, the first elastic element (150) releases energy to drive the first drive end (113) and the second drive end (123) to move away from each other, and the clamping part (101) closes.
5. The wafer fixture according to claim 4, characterized in that, The wafer jig (100) further includes a second elastic element (160), which is disposed on the side of the hinge shaft (190) near the clamping part (101). One end of the second elastic element (160) abuts against the first clamping plate (110), and the other end abuts against the second clamping plate (120). When the first elastic element (150) is compressed and stored, the clamping part (101) opens to stretch the second elastic element (160). When the first elastic element (150) releases energy and resets, the clamping part (101) closes to compress the second elastic element (160).
6. The wafer fixture according to claim 1, characterized in that, The buffer pad (130) includes a first buffer portion (131) and a second buffer portion (132), wherein the first buffer portion (131) and the second buffer portion (132) are respectively spaced apart on the inner surfaces of the first clamping end (111) and the second clamping end (121).
7. The wafer fixture according to claim 1, characterized in that, The wafer fixture (100) further includes a fixing frame (170), the fixing frame (170) includes a limiting groove (171), the inner wall of the limiting groove (171) is adapted to the outer wall of the second clamping plate (120), and the second clamping plate (120) can be locked in the limiting groove (171) of the fixing frame (170); the side of the fixing frame (170) facing away from the second clamping plate (120) is fixedly connected to the mounting plane by adhesive or fasteners.
8. The wafer fixture according to claim 1, characterized in that, A connecting rope (180) is provided at the end of the second clamping plate (120) away from the clamping part (101).
9. The wafer fixture according to claim 1, characterized in that, The second clamping plate (120) has an inclined surface on the side facing the first clamping plate (110), and the second clamping plate (120) has a horizontal surface corresponding to the driving part (102). The hinge shaft (190) is disposed at the connection between the inclined surface and the horizontal surface. The first clamping plate (110) is fitted to the inclined surface so that the first driving end (113) and the second driving end (123) have a preset interval. The first clamping end (111) and the second clamping end (121) are parallel to each other.
10. The wafer fixture according to claim 8, characterized in that, The connecting rope (180) is made of elastic material.