Ball planting device

Abstract

Some embodiments of the present application provide a ball-planting device, including: a wafer; a jig including a receiving slot for receiving the wafer and a plurality of vacuum through holes, a spacing between the receiving slot and the wafer is greater than an extension of thermal expansion of the wafer; and a roller assembly for applying pressure to make the wafer adhere to the vacuum through holes. The present application increases the spacing between the jig and the wafer, so that the wafer is still in the jig even if it is thermally expanded, thereby reducing the warpage of the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor structure technology, and more specifically, to a bulb planting device. Background Technology

[0002] Previously, 300mm diameter panel (300panel) machines were used to support the wafer balling process. Due to the detection problem of vacuum holes, the wafer had to be put into the machine with a fixture. In this environment, some problems arose in operation: (1) the gap between the wafer and the fixture was too small, causing the wafer to warp onto the edge of the fixture after heating and expansion; and (2) the warping problem of the wafer caused the vacuum to be unable to make the wafer flat on the fixture.

[0003] Specifically, see Figure 1 , Figure 1 An existing ball-mounting device 10 is shown, in which a dedicated ball-mounting machine is currently used to place a 12-inch diameter wafer 12 on a fixture 11 and mount it on a 300mm diameter panel. For example... Figure 1 As shown, the spacing P between the wafer 12 and the sidewall 11s of the fixture 11 is small. When the diameter of the wafer 12 is 12 inches, the spacing P is approximately 10 μm (0.001 cm) (less than the thermal expansion of the wafer 12). Furthermore, the thickness h1 of the wafer 12 is 660 μm (0.066 cm), and the thickness h2 of the fixture 11 is 2000 μm (0.2 cm). With this small spacing P, a dedicated ball-mounting machine mounted on a 300 mm diameter panel may have the following problems:

[0004] (1) When the product (such as wafer 12) is large during molding expansion and contraction, and the warpage of wafer 12 is >1.0mm, a vacuum cannot be established, resulting in the inability to operate; and (2) based on experience in bumping, in this case, the warpage of the wafer entering the bumping station is at least 1.2mm. Using the aforementioned 12-inch wafer 12 fixture with a 300mm diameter panel, a dedicated bumping machine cannot be used because the warpage of wafer 12 is at least 1.2mm (such as 1.7mm) and therefore cannot be flattened, thus preventing operation. Utility Model Content

[0005] As can be seen from the above, there is a need for an improved ball-mounting device that allows 12-inch diameter wafers to share a 300mm panel-level machine. The specific implementation method is as follows: (1) increasing the distance between the fixture and the wafer so that the wafer remains within the fixture even if it expands thermally; (2) using rollers to forcefully hold the wafer in the fixture until the vacuum is acceptable; and (3) designing a receiving groove in the ball-mounting plate (such as a metal plate) to accommodate the fixture, providing a tightness between the ball-mounting plate (such as a steel plate) and the fixture.

[0006] Some embodiments of this application provide a ball-mounting device, including: a wafer; a fixture including a receiving groove for receiving the wafer and a plurality of vacuum vias, wherein there is a gap between the receiving groove and the wafer, the gap being greater than the elongation of the wafer due to thermal expansion; and a roller assembly for applying pressure to conform the wafer to the vacuum vias.

[0007] In some embodiments, the spacing is 0.005%-0.006% of the diameter of the wafer.

[0008] In some embodiments, the spacing is 15 μm.

[0009] In some embodiments, the ball-planting device further includes a track along which the roller assembly moves.

[0010] In some embodiments, the track is circular.

[0011] In some embodiments, the lateral width of the guide wheel of the roller assembly that contacts the wafer is greater than the spacing.

[0012] In some embodiments, the contact portion of the roller assembly with the wafer is within a range of 5.0 mm to 6.0 mm from the edge of the wafer.

[0013] In some embodiments, the ball-mounting device further includes a circuit layer disposed on the surface of the wafer, wherein the circuit layer is not disposed on the contact portion of the wafer.

[0014] In some embodiments, the fixture has a wall portion, wherein the height of the wall portion is greater than the height of the wafer.

[0015] In some embodiments, the ball-planting device further includes a ball-planting plate disposed above the wafer, wherein the ball-planting plate has a receiving groove corresponding to the wall portion.

[0016] In some embodiments, the wall portion extends into the receiving slot and is spaced apart from the bottom of the receiving slot away from the wall portion.

[0017] In some embodiments, the ball-mounting plate further includes a process area corresponding to the wafer, wherein, when viewed from above, the process area covers a larger area than the wafer and is surrounded by the receiving groove.

[0018] In some embodiments, the process area is a nickel mesh.

[0019] In some embodiments, the fixture further includes a groove disposed around the periphery of the wafer at the receiving slot.

[0020] In some embodiments, when viewed from above, the coverage area of ​​the storage slot is greater than the coverage area of ​​the wall portion.

[0021] In some embodiments, the ball-mounting device further includes a dielectric layer, wherein the circuit layer is disposed in the dielectric layer, and wherein the wafer is disposed of the dielectric layer at the contact portion.

[0022] In some embodiments, the guide rollers of the roller assembly that contact the wafer are made of rubber.

[0023] Other embodiments of this application provide a ball-mounting device, comprising: a wafer; and a fixture including a receiving groove for receiving the wafer, wherein there is a gap between the receiving groove and the wafer, the gap being 0.005%-0.006% of the diameter of the wafer.

[0024] In some embodiments, the spacing is 15 μm.

[0025] In some embodiments, the ball-mounting device further includes a roller assembly that applies pressure to adhere the wafer to the fixture, wherein the width of the roller assembly is greater than the spacing.

[0026] This application achieves wafer fabrication on panel-level machines by improving the relationship between the fixture, rollers, ball-mounting plate, and wafer, thereby reducing wafer warpage. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 The prior art ball-planting device is shown.

[0029] Figures 2 to 4 , Figures 5A to 5C as well as Figures 6A to 6B A ball-planting apparatus according to some embodiments of this application is shown.

[0030] Figure 7 The operating steps of a ball-planting device according to some embodiments of this application are shown. Detailed Implementation

[0031] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art are within the scope of protection of this application. In addition, when using terms such as "approximately," "about," "substantial," or "basically" to describe numerical values ​​or numerical ranges, unless otherwise stated, the term is intended to cover values ​​within ±10% of the described value. For example, the term "about 5nm" covers a size range from 4.5nm to 5.5nm.

[0032] The following disclosure provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and arrangements will be described below to simplify the present invention. These are merely examples and are not intended to limit the present invention. For example, in the following description, forming a first component above or on a second component may include embodiments where the first and second components are in direct contact, or embodiments where an additional component is formed between the first and second components such that the first and second components are not in direct contact. Furthermore, reference numerals and / or letters may be repeated in various instances of the present invention. Such repetition is merely for brevity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0033] This application provides an improved bulb-planting device 100, specifically, see [link to details]. Figure 2 The ball-mounting device 100 includes a wafer 102 and a fixture 101. In some embodiments, the fixture 101 has a wall portion 101s. In some embodiments, the height h2 of the wall portion 101s of the fixture 101 is greater than the height h2 of the wafer 102 to protect the wafer 102 during the fabrication of the wafer 102 (performing some processes on the wafer 102). Further, Figure 4 It shows Figure 2 Detailed view of jig 101 in the middle, combined with Figures 2 to 4It is understood that the fixture 101 includes a receiving groove 101R for accommodating the wafer 102 and a plurality of vacuum vias 101V, and there is a distance P' between the receiving groove 101R and the wafer 102, that is, there is a distance P' between the inner surface 101si of the wall portion 101s of the fixture 101 and the edge 102s of the wafer 102. This distance P' is greater than the amount of thermal expansion of the wafer 102, so that the wafer 102 can still be accommodated in the receiving groove 101R of the fixture 101 when it expands during the process. In some embodiments, the distance P' is 0.005%-0.006% of the diameter of the wafer 102. In some specific embodiments, when the diameter of the wafer 102 is 12 inches, the distance P' is about 15 μm. In this application, the fixture spacing P' is increased, for example, from 10 μm in the prior art to 15 μm, to ensure that the spacing P' is greater than the amount of thermal expansion of the wafer 102, thereby reducing the warpage of the wafer 102. In some embodiments, the fixture 101 is placed on the ball-mounting stage 1001.

[0034] In a further embodiment, see Figure 3 The ball-planting device 100 also includes a roller assembly 103, which applies pressure to attach the wafer 102 to the vacuum via 101V. Figure 3 Region A' shows a front view of a roller assembly 103 according to some embodiments of this application, while Region A shows a side view of a roller assembly 103 according to some embodiments of this application. Figure 3 As shown, the guide wheel 103l that contacts the wafer 102 is made of a flexible material (such as rubber). The lateral width w1 of the guide wheel 103l is approximately 3.0 mm. The lateral width w1 of the guide wheel 103l is greater than the aforementioned spacing P' to ensure that the roller assembly 103 can apply force to the wafer. In this embodiment, a flexible material (such as rubber) circular guide wheel 103l is fabricated to press down on the circumference of the 12-inch diameter wafer 102 at the location where the circuit layer 102M is not provided (EBR location) until a vacuum is established to <-85 kPa. At this point, the width of the guide wheel 103l must be narrow enough (3.0 mm) and be made of a flexible (soft) material, such as rubber. In this embodiment, the warpage of the wafer 102 is further reduced by fabricating a flexible material (such as rubber) circular guide wheel 103l.

[0035] Specifically, see Figures 5A-5C , Figures 5A-5C It shows Figure 2 An enlarged view of area B in contact with the roller assembly 103. Figures 5A to 5CAs can be seen, a dielectric layer 102A and a circuit layer 102M are disposed on the surface of wafer 102. In some embodiments, the circuit layer 102M includes a metal layer, such as a copper layer, and in some embodiments, the dielectric layer 102A includes a dielectric layer such as a polyimide layer. Figure 5A As shown, the circuit layer 102M is disposed on the dielectric layer 102A; however, as Figure 5B and Figure 5C As shown, the circuit layer 102M can be partially disposed within the dielectric layer 102A (e.g., Figure 5B As shown), it can also be completely disposed in dielectric layer 102A (as shown). Figure 5C As shown), further, the edge 102As of dielectric layer 102A is recessed from the edge 102s of wafer 102, and the edge 102Ms of circuit layer 102M is recessed from the edge 102As of dielectric layer 102A.

[0036] Further from Figures 5A to 5C As can be seen, the ball-planting device 100 also includes a track 102AG, along which the roller assembly 103 moves. In the top view, the track 102AG is circular because the wafer 102 is circular, and the track 102AG is positioned along the edge of the wafer 102. Furthermore, as... Figures 5A to 5C As shown, the contact portion 102AC between the roller assembly 103 and the wafer 102 is within a distance w2 of 5.0mm-6.0mm from the edge 102s of the wafer 102. In some embodiments, a dielectric layer 102A is provided on the wafer 102 at the contact portion 102AC. Figures 5A to 5C In the illustrated embodiment, wafer 102 does not have a wiring layer 102M at the contact portion 102AC. In this application, a circular guide wheel 103l made of a flexible material such as rubber is used to press down on the circumference of the 12-inch diameter wafer 102 at the position where the wiring layer 102M is not provided (EBR position) until a vacuum is established to <-85 kPa for subsequent processing operations.

[0037] Next, see Figures 6A to 6B , Figures 6A to 6B Different attachment states of the ball-planting device 100 with the ball-planting plate 104 are shown. Figure 6A A ball-mounting plate 104, separated from wafer 102, is shown, and Figure 6B A ball-mounting plate 104 attached to wafer 102 is shown. Figures 6A to 6B As can be seen, the ball-planting device 100 also includes a ball-planting plate 104 disposed above the wafer 102, the ball-planting plate 104 having a receiving groove 104R corresponding to the wall portion 101s. From Figure 6BAs can be seen, the wall portion 101s extends into the receiving groove 104R and is spaced apart from the bottom 104Rd of the receiving groove 104R away from the wall portion 101s. In some embodiments, when viewed from above, the coverage area S3 of the receiving groove 104R is larger than the coverage area S4 of the wall portion 101s to ensure that the wall portion 101s can extend into the receiving groove 104R. Further, the ball-mounting plate 104 also includes a process area 104A corresponding to the wafer 102, wherein, when viewed from above, the coverage area S1 of the process area 104A is larger than the coverage area S1 of the wafer 102 and is surrounded by the receiving groove 104R. In some embodiments, the process area 104A is a nickel mesh. In some embodiments, the skeleton 104B of the ball-mounting plate 104 can be a steel plate. Figure 6B This illustrates the integration of the ball-mounting plate 104 with the fixture 101 and the wafer 102, from... Figure 6B As can be seen, the fixture 101 may further include a groove 101e surrounding the periphery of the wafer 102 at the receiving slot. In this application, a receiving groove 104R is provided on the ball-mounting plate 104 to receive the fixture 101; specifically, the wall portion 101s of the fixture 101 engages with the fixture 101. In this embodiment, the warpage of the wafer 102 is further reduced by the provision of the ball-mounting plate 104.

[0038] Return to reference Figure 2 Some embodiments of this application provide a ball-mounting device 100, including: a wafer 102; and a fixture 101, including a receiving groove 101R for receiving the wafer 102, wherein a distance P' exists between the receiving groove 101R and the wafer 102, the distance P' being 0.005%-0.006% of the diameter of the wafer 102. In some embodiments, the distance P' is 15 μm. In some embodiments, refer to... Figure 3 The ball-mounting device 100 further includes a roller assembly 103, which applies pressure to adhere the wafer 102 to the fixture 101, wherein the width W1 of the guide roller 103l of the roller assembly 103 is greater than the spacing P'.

[0039] In summary, in this application, by: (1) increasing the distance between the fixture 101 and the wafer 102, so that the wafer 102 remains within the fixture 101 even if it expands thermally, specifically, increasing the distance P' between the receiving groove 101R of the fixture 101 and the wafer 102 from 10μm in the prior art to 0.005%-0.006% (such as 15μm) of the diameter of the wafer 102; (2) using the roller assembly 103 to forcefully hold the wafer in the fixture 101 until the vacuum acceptance is qualified, specifically, adjusting the conveying path of the fixture 101 to make a flexible material such as rubber, or a circular shape. The guide roller 103l circulates around the circumference of the 12-inch diameter wafer 102 at the position without the circuit layer 102M (EBR position) until the vacuum is built up to <-85Kpa; and (3) a receiving groove 104R for accommodating the fixture is designed in the ball-mounting plate 104 to provide tightness between the ball-mounting plate 104 (such as a steel plate) and the fixture 101. Specifically, the ball-mounting plate 104 (such as a steel plate) is placed in the receiving groove 104R to receive the fixture 101 and engage with the fixture 101, thereby realizing the shared mechanism of the 12-inch diameter wafer and the 300mm panel-level ball-mounting machine. It can be seen that this application utilizes the improvements between the ball-mounting plate 104, the fixture 101, the wafer 102, and the roller assembly 103 to achieve the function of performing wafers on the panel-level machine and reduce the warpage of the wafer 102.

[0040] For non-mass production units, the ball-mounting device 100 for placing wafers 102 provided in this application can evaluate product development of various sizes with the lowest cost fixture 101, which has a great advantage in terms of cost considerations. The ball-mounting device 100 provided in this application can not only be applied to the commonly used M-series and EWLB (Embedded Wafer-Level Ball Grid Array) 12-inch wafers / M-series and EWLB 300mm panels, but also to FoCOS (Fan-Out Chip-on-Substrate) / CoWos (Chip-on-Wafer-on-Substrate) / PLCSP (Panel-Level Packaging and Chip-Scale Packaging) processes 2.5D process / 3D process / FOMCM (Fan-Out Multi-Chip Module Packaging).

[0041] For the ball-planting device 100 provided in this application, see the specific embodiment below. Figure 7 Taking a 300mm panel-level machine as an example, the operation is carried out through the following steps.

[0042] First see Figure 7Step Q1 involves providing a 300mm panel-level ball-mounting stage 1001 in a front-opening wafer transfer cassette (FOUP). Then, referring to step Q2, a robotic transfer mechanism is used to move the ball-mounting stage 1001 into the flux coating module. At this point, a vacuum can be established. In this step, a jig 101 is added to perform multiple functions. In this embodiment, a 12-inch diameter wafer jig 101 is required. Next, see... Figure 7 In step Q3, the wafer 102 is transferred into the ball mount module using a robot. A vacuum can be established at this point. In this step, the wafer 102 can be added. In some embodiments, a jig with a pseudo-molded wafer (2.8 mm warpage, 0.66 mm thickness) is used for transfer. In some embodiments, a roller assembly 103 (and a ball mount plate 104, etc.) can be used in this step. Finally, see... Figure 7 In step Q4, a robot is used to transfer the wafer into the inspection and repair module, at which point a vacuum can be established. In this application, the aforementioned ball-mounting device (EQP) is used to meet the processing requirements of wafer 102. The initial test shows that the warpage of wafer 102 is 0.5 mm, and a vacuum can be established using fixture 101.

[0043] In summary, this application achieves a shared mechanism between a 12-inch diameter wafer and a 300mm panel-level ball-mounting machine by increasing the distance between the fixture 101 and the wafer 102, ensuring that the wafer 102 remains within the fixture 101 even with thermal expansion; using the roller assembly 103 to apply external force to hold the wafer in place until the vacuum is acceptable; and designing a storage groove 104R in the ball-mounting plate 104 to accommodate the fixture, providing a tight fit between the ball-mounting plate 104 (e.g., a steel plate) and the fixture 101.

[0044] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A bulb planting device, comprising: wafers; The fixture includes a receiving groove for accommodating the wafer and a plurality of vacuum vias, wherein there is a gap between the receiving groove and the wafer, the gap being greater than the amount of thermal expansion of the wafer; as well as A roller assembly applies pressure to bring the wafer into contact with the vacuum via.

2. The bulb-planting device according to claim 1, wherein, The spacing is 0.005%-0.006% of the diameter of the wafer.

3. The bulb-planting device according to claim 1, further comprising: The roller assembly moves along the track.

4. The bulb-planting device according to claim 1, wherein, The lateral width of the guide wheel of the roller assembly that contacts the wafer is greater than the spacing.

5. The ball-planting device according to claim 1, further comprising: A circuit layer is disposed on the surface of the wafer, wherein the circuit layer is not disposed at the contact portion between the roller assembly and the wafer.

6. The bulb-planting device according to claim 1, wherein, The fixture has a wall portion, wherein the height of the wall portion is greater than the height of the wafer.

7. The bulb-planting device according to claim 6, further comprising: The ball-mounting plate is positioned above the wafer. The ball-planting board has a storage groove corresponding to the wall portion.

8. The bulb-planting device according to claim 7, wherein, The wall portion extends into the storage slot and is spaced apart from the bottom of the storage slot away from the wall portion.

9. The bulb-planting device according to claim 7, wherein, The ball-mounting plate also includes a process area corresponding to the wafer, wherein, when viewed from above, the coverage area of ​​the process area is larger than the coverage area of ​​the wafer and is surrounded by the receiving groove.

10. The ball-planting device according to claim 1, wherein, The fixture also includes a groove surrounding the periphery of the wafer at the receiving slot.

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