Chip suction device with flip chip function

Abstract

The utility model provides a chip sucking device with flip chip function, including base, its connection in a transverse longitudinal displacement mechanism, mounting plate body, its setting in the bottom of base, and the middle of mounting plate body forms the open work area of region, spindle body, its rotatable setting in work area with horizontal attitude, the top surface of spindle body sets at least one sucking head, and the inhaled hole of sucking head is arranged through its upper end and lower end, the top surface of spindle body is provided with the through -hole of cooperation with inhaled hole, and in the inside one side of spindle body sets up the gas flow channel of communication with through -hole, and one end of spindle body sets up the gas -connection head of communication with gas flow channel for external connection negative pressure gas source, rotation subassembly, its setting in the bottom of mounting plate body and with the transmission connection of another end between spindle body through adapter stem body. The utility model discloses through horizontal rotation spindle body to integrate negative pressure adsorption gas path, effectively solved the problem that chip is easy to damage and flip in background art and is easy to fall.

Description

Technical Field

[0001] This utility model relates to the field of chip mounting technology, specifically, it demonstrates a chip pick-up device with a chip flipping function. Background Technology

[0002] In the chip bonding process, it is necessary to flip the chip 180°, that is, to flip the bonding surface of the chip over before the subsequent related bonding processes can be carried out.

[0003] Existing chip pick-up devices with chip flipping functions are either structurally complex and difficult to implement, making them unsuitable for use in small devices. Other devices may have chip pick-up devices with chip flipping functions, but these are simple in structure, consisting of only a rotary motor and an operating arm. The operating arm rotates under the drive of the motor to flip the chip. However, the chip pick-up process in this solution involves rigid contact or no contact, which can easily damage the chip or prevent it from being picked up. Furthermore, the stability of the chip on the operating arm cannot be guaranteed during its rotation, which can easily lead to the chip falling off the swing arm. Utility Model Content

[0004] The purpose of this invention is to provide a chip pick-up device with a chip flipping function, which can be automated and save time and effort.

[0005] The technical solution is as follows:

[0006] A chip pick-up device with chip flipping function, comprising:

[0007] The base is connected to a transverse and longitudinal displacement mechanism;

[0008] The mounting plate is located at the bottom of the base, and an open working area is formed in the middle of the mounting plate;

[0009] The spindle body is rotatably mounted in a horizontal position within the working area. At least one suction head is provided on the top surface of the spindle body. The suction head has a suction hole that runs through its upper and lower ends. A through hole that matches the suction hole is opened on the top surface of the spindle body. A gas flow channel communicating with the through hole is provided on one side of the inside of the spindle body. An air inlet head communicating with the gas flow channel is provided at one end of the spindle body for connecting to an external negative pressure air source.

[0010] A rotating assembly is located at the bottom of the mounting plate and is connected to the other end of the main shaft via an adapter rod.

[0011] In addition, the above embodiments of this utility model may also have the following additional technical features:

[0012] According to one embodiment of this utility model, the suction head includes an upper body and a lower body that are positioned vertically. The upper body is conical in shape, with a horizontal top end that is recessed inward to form a groove that communicates with the suction hole. The lower body is rectangular in shape. The top surface of the upper body provides a stable and sufficient contact area with the chip plane, and the groove area concentrates the negative pressure onto the central area of ​​the chip, resulting in a firm suction.

[0013] Specifically, the upper inner diameter of the suction hole inside the suction head is smaller than its lower inner diameter. This increases the negative pressure at the very top of the suction hole, thereby improving the adhesion to the chip.

[0014] According to one embodiment of this utility model, each of the two ends of the spindle is rotatably mounted on a bracket via a bearing, and the bracket is located at the bottom end of the mounting plate. The structure is simple, makes reasonable use of the space below the mounting plate, provides high stability for the spindle's movement, and prevents the spindle from wobbling or swaying during rotation.

[0015] According to one embodiment of the present invention, the rotating assembly includes:

[0016] A base plate, which is disposed on the mounting plate;

[0017] The motor component is mounted on the base plate, and the drive shaft of the motor component is connected to the main wheel;

[0018] The auxiliary wheel is mounted on the adapter rod and is connected to the main wheel by a transmission belt.

[0019] Rotary components have a simple structural design and relatively low cost.

[0020] According to one embodiment of this utility model, a notch area is formed on one side of the base, and support arms extend outward from both sides of the notch area. One side of the mounting plate is connected to the bottom end of a pair of support arms. This avoids the mounting plate and the rotating components below, reducing space occupation and structural interference.

[0021] According to one embodiment of this utility model, the width of the spindle body is smaller than the width of the working area on the mounting plate. This ensures that the spindle body does not collide or rub against the inner edge of the opening (working area) of the mounting plate during rotation.

[0022] According to one embodiment of the present invention, the transverse and longitudinal displacement mechanism includes:

[0023] A lateral drive component, the control end of which is connected to a first frame to realize the lateral displacement movement of the first frame;

[0024] A longitudinal drive component is disposed on the outside of the first frame, and its control end is connected to a second frame to realize the longitudinal displacement movement of the second frame, which is connected to the base;

[0025] A slider rail assembly is disposed between the first frame and the second frame.

[0026] The transverse and longitudinal displacement mechanism has a simple structural design and relatively low cost.

[0027] It also includes a buffer spring, with its upper and lower ends connected to the first frame and the second frame, respectively. This ensures the stability of the second frame during longitudinal displacement and prevents rigid impact on its associated base.

[0028] This includes a slotted photoelectric sensor mounted on the first frame and a trigger mounted on the second frame. During the longitudinal displacement movement of the second frame, the trigger passes through and activates the slotted photoelectric sensor. This increases the feedback detection of the displacement position of the second frame, improving the control accuracy and reliability of the lateral and longitudinal displacement mechanism.

[0029] Compared with the prior art, the beneficial effects of this utility model are as follows: by integrating the negative pressure adsorption gas path through the horizontal rotating main shaft, the problems of easy chip damage and easy chip falling during flipping in the background technology are effectively solved, further improving the chip adsorption stability and protection. The structure is compact and the design is relatively simple, with low cost, and it also meets the application needs of small equipment. Attached Figure Description

[0030] Figure 1 This is an overall schematic diagram of a chip picking device with chip flipping function according to an embodiment of the present invention;

[0031] Figure 2 This is a schematic diagram of the mounting plate portion in an embodiment of the present invention;

[0032] Figure 3 This is a schematic diagram of the main shaft portion according to an embodiment of the present invention;

[0033] Figure 4 for Figure 3 The diagram below shows the relevant part of the suction head.

[0034] Figure 5 This is a schematic diagram of the lateral and longitudinal displacement mechanism according to an embodiment of the present invention;

[0035] Figure 6 This is a schematic diagram (from a low angle) showing the rotating component according to an embodiment of the present invention.

[0036] Figure 7 This is a schematic diagram of the base and mounting plate of this utility model;

[0037] The relevant markings in the attached diagram are as follows: 1-Base, 2-Transverse and longitudinal displacement mechanism, 3-Mounting plate, 4-Main shaft, 5-Suction head, 6-Air inlet, 7-Rotating assembly; 11-Notch area, 12-Support arm, 21-Transverse drive component, 22-First frame, 23-Longitudinal drive component, 24-Second frame, 25-Slider rail assembly, 26-Buffer spring, 27-Slotted photoelectric element, 28-Trigger component; 31-Working area; 41-Through hole, 42-Gas flow channel, 43-Adapter rod, 44-Bearing component, 45-Bracket; 51-Suction hole, 52-Upper body, 53-Lower body, 54-Groove; 71-Base plate, 72-Motor component, 73-Main wheel, 74-Sub-wheel, 75-Transmission belt. Detailed Implementation

[0038] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0039] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 as well as Figure 7 As shown in the figure, this utility model embodiment proposes a chip pick-up device with a chip flipping function, mainly used to flip the bonding surface of the chip. The chip pick-up device includes a base 1, a mounting plate 3, a main shaft 4, and a rotating assembly 7. The base 1 is arranged horizontally, and one side of it is fixedly connected to a lateral and longitudinal displacement mechanism 2. That is, the lateral and longitudinal displacement mechanism 2 drives the base 1 to perform linear displacement movement in the lateral or longitudinal direction. This allows the entire pick-up device to move accurately in the XZ direction, which is convenient for accurately positioning above the chip to be picked up and at the final position where the chip needs to be placed.

[0040] The mounting plate 3 is also horizontally positioned on one side of the bottom of the base 1. Spatially, the mounting plate 3 and the base 1 are misaligned. A working area 31 with openings at both the top and bottom is formed in the middle of the mounting plate 3. In this embodiment, the design of the working area 31 on the mounting plate 3 is similar to the shape of a "racetrack". Of course, it can also be other shapes, but it must be ensured that it will not interfere with the subsequent chip flipping action. The working area reserves critical space for the subsequent rotation of the spindle and the flipping of the chip, so as to avoid collision and interference between the spindle and the inner wall of the mounting plate when it rotates.

[0041] The spindle 4 is rotatably mounted in the working area 31 in a horizontal position, and the mounting position of the spindle 4 is roughly in the center of the working area 31. The spindle is the core carrier of the flipping function. It can rotate 180° around the horizontal axis to realize the effective flipping of the chip. The spindle 4 is set in the working area 31, which makes full use of the space reserved on the mounting plate, so that the flipping action of the spindle can be completed.

[0042] At least one suction head 5 is provided in the middle of the top surface of the main spindle body 4. The suction head 5 provides the interface for chip contact and adsorption. There can be multiple suction heads 5 to improve the adsorption force and stability of the chip. In this embodiment, two suction heads 5 are arranged side by side and spaced apart on the top surface of the main spindle body 4. A suction hole 51 that can penetrate through its upper and lower ends is provided inside the suction head 5. A through hole 41 that can cooperate with the suction hole 51 is opened on the top surface of the main spindle body 4. In addition, a gas flow that can communicate with the through hole 41 is provided on one side of the interior of the main spindle body 4. The gas flow channel 42, that is, the through hole 41 and the suction hole 51 are interconnected. A gas connector 6 is set at one end of the spindle body 4. The gas connector 6 can be connected to the gas flow channel 42. The gas connector 6 is a standard part and is mainly used to connect an external negative pressure gas source. This forms a complete negative pressure path from the external negative pressure gas source → the gas flow channel inside the spindle body → the through hole on the top surface of the spindle body → the suction hole of the suction head → the bottom of the chip. The negative pressure gas source realizes the negative pressure attraction at the top of the suction hole to pick up the chip, avoiding damage to the fragile chip caused by mechanical rigid clamping.

[0043] The rotating assembly 7 is located at the bottom of the mounting plate 3. The rotating drive end of the rotating assembly 7 is connected to the other end of the main spindle 4 through the adapter rod 43. That is to say, the rotating assembly 7 drives the adapter rod 43 to rotate, thereby driving the main spindle 4 to rotate.

[0044] In the initial state, the suction head 5 on the spindle 4 is facing downwards. After the suction head successfully picks up the front side of the chip, the rotating component 7 drives the spindle 4 to rotate the suction head 5 to 180°, so that the suction head is facing upwards. At this time, the back side of the chip, i.e. the bonding surface, is also flipped upwards.

[0045] It should be noted that the suction head 5 includes an upper body 52 and a lower body 53 arranged vertically. The upper body 52 is conical in shape, with a horizontal top and an inwardly recessed groove 54. The groove 54 communicates with the suction port 51. The lower body 53 is rectangular in shape. The upper body contacts the chip, and the lower body connects to the spindle. The conical shape of the upper body makes it easier to contact the chip edge and provides better tolerance for chip positional deviations. Furthermore, the horizontal top of the upper body provides a stable and sufficient contact area with the bottom surface of the chip. The grooved area at the top of the upper body concentrates the negative pressure onto the central area of ​​the chip, achieving adsorption and firm suction of the chip.

[0046] It should also be noted that the upper inner diameter of the suction hole 51 inside the suction head 5 is smaller than its lower inner diameter. This increases the negative pressure at the very top of the suction hole, improving the adsorption force on the chip. The larger lower inner diameter helps reduce airflow resistance, allowing the negative pressure to be transmitted more smoothly to the upper region. When the airflow reaches the top, the flow velocity increases, the dynamic pressure increases, and the static pressure decreases. This results in increased negative pressure (suction force) at the very top of the suction hole (the position in contact with the chip), thereby improving the adsorption force on the chip, making the adsorption force very reliable.

[0047] It should be noted that each of the two ends of the spindle body 4 is rotatably mounted on a bracket 45 via a bearing 44. The bracket 45 is located at the bottom of the mounting plate 3. The two ends of the spindle body 4 each have a bearing 44, forming a two-point support that can withstand radial force and a certain degree of axial force, providing high stability for the spindle body's movement and preventing the spindle body from shaking or wobbling during rotation. The bracket is installed at the bottom of the mounting plate, which has a simple structure and makes reasonable use of the space under the mounting plate.

[0048] In some embodiments of this application, the rotating assembly 7 includes a base plate 71, a motor component 72, and a secondary wheel 74. The base plate 71 is disposed on the bottom end of the mounting plate 3, extending outward toward the outer side of the base 1. The motor component 72 is disposed on the base plate 71, spatially parallel to the base 1. The drive shaft end of the motor component 72 is connected to a main wheel 73, meaning the main wheel 73 can rotate clockwise or counterclockwise under the control of the motor component 72. The secondary wheel 74 is disposed on the adapter rod 43, and a transmission belt 75 connects the secondary wheel 74 and the main wheel 73. The main wheel 73 drives the secondary wheel 74 to move synchronously through the transmission belt 75, thereby realizing the rotation of the main shaft 4. The rotating assembly has a compact and simple structure, relatively low cost, and is economical.

[0049] It should be noted that a notch area 11 is formed on one side of the base 1, and support arms 12 extend outward from both sides of the notch area 11. One side of the mounting plate 3 is connected to the bottom of a pair of support arms 12. The main structure of the base, i.e. the support arms, provides support, forming a cantilever support method, avoiding the mounting plate and the rotating components below, reducing space occupation and structural interference. In addition, extending the entire suction and flipping module (main shaft, suction head, air inlet head, adapter rod) from below the base body is beneficial for overall layout optimization and center of gravity balance (combined with the design of the lateral and longitudinal displacement mechanism), and also facilitates access to the chip to be suctioned.

[0050] It should also be noted that the width of the spindle body 4 is smaller than the width of the working area 31 on the mounting plate 3. This design ensures that the spindle body 4 will hardly collide or rub against the inner edge of the opening (working area) of the mounting plate 3 during rotation, providing sufficient and safe rotation space for the chip to flip with the spindle body, ensuring the smooth progress of the flipping action and the safety of the device.

[0051] In some embodiments of this application, the lateral and longitudinal displacement mechanism 2 includes: a lateral drive member 21, whose control end is connected to a first frame 22 to realize the lateral displacement movement of the first frame 22; a longitudinal drive member 23, which is disposed on the outside of the first frame 22 and whose control end is connected to a second frame 24 to realize the longitudinal displacement movement of the second frame 24, the second frame 24 being connected to the base 1; and a slider-rail assembly 25, which is disposed between the first frame 22 and the second frame 24, for example, the rail is installed on the first frame and the slider is installed on the second frame, and the smooth displacement movement of the second frame relative to the first frame is realized through the slider-rail assembly.

[0052] The lateral and longitudinal displacement mechanism has a simple structural design and relatively low cost. The lateral drive component provides the base with precise X-axis (or Y-axis) movement capability, and the longitudinal drive component provides the base with precise Z-axis movement capability, so as to accurately approach the chip (pick-up) and facilitate the precise bonding (patch) of the chip afterwards.

[0053] The transverse and longitudinal displacement mechanism 2 also includes a buffer spring 26, the upper and lower ends of which are connected to the first frame 22 and the second frame 24 respectively. For example, the upper and lower ends of the buffer spring are connected to the first frame and the second frame respectively through a first rod and a second rod, so that the buffer spring is in a vertically stretched posture. The designed buffer spring is used to ensure the stability of the second frame during longitudinal displacement movement and to avoid rigid impact on its associated base during subsequent displacement.

[0054] In addition, a slotted photoelectric sensor 27 is provided on the first frame 22, and a trigger 28 is provided on the second frame 24. During the longitudinal displacement movement of the second frame 24 relative to the first frame 22, the trigger 28 can pass through and trigger the slotted photoelectric sensor 27. The cooperation between the slotted photoelectric sensor and the trigger 28 increases the feedback detection of the displacement position of the second frame, thereby improving the control accuracy and reliability of the transverse and longitudinal displacement mechanism.

[0055] The chip pick-up device solution provided in this application embodiment mainly integrates the negative pressure adsorption gas path through a horizontally rotating main shaft, which further improves the stability and protection of chip pick-up. The structure is compact and the design is relatively simple.

[0056] The above descriptions are merely some embodiments of this utility model. For those skilled in the art, various modifications and improvements can be made without departing from the inventive concept of this utility model, and all such modifications and improvements fall within the protection scope of this utility model.

Claims

1. A chip picking device with chip flipping function, characterized in that, include: Base (1), which is connected to a transverse and longitudinal displacement mechanism (2); Mounting plate (3) is set at the bottom of base (1), and an open working area (31) is formed in the middle of mounting plate (3). The main spindle (4) is rotatably set in the working area (31) in a horizontal position. At least one suction head (5) is provided on the top surface of the main spindle (4). A suction hole (51) is provided in the suction head (5) that runs through its upper and lower ends. A through hole (41) that matches the suction hole (51) is opened on the top surface of the main spindle (4). A gas flow channel (42) that communicates with the through hole (41) is provided on one side of the inside of the main spindle (4). A gas inlet (6) that communicates with the gas flow channel (42) is provided at one end of the main spindle (4) for connecting to an external negative pressure gas source. The rotating assembly (7) is located at the bottom of the mounting plate (3) and is connected to the other end of the main shaft (4) via a connecting rod (43).

2. The chip picking device with chip flipping function according to claim 1, characterized in that, The suction head (5) includes an upper body (52) and a lower body (53) that are positioned vertically. The upper body (52) is cone-shaped, with a horizontal top and an inwardly recessed groove (54) at its top. The groove (54) communicates with the suction hole (51). The lower body (53) is rectangular.

3. A chip picking device with chip flipping function according to claim 2, characterized in that, The upper inner diameter of the suction hole (51) in the suction head (5) is smaller than its lower inner diameter.

4. A chip picking device with chip flipping function according to claim 1, characterized in that, The two ends of the main shaft (4) are rotatably mounted on a bracket (45) via a bearing (44), and the bracket (45) is located at the bottom of the mounting plate (3).

5. A chip picking device with chip flipping function according to claim 1, characterized in that, The rotating component (7) includes: Base plate (71), which is disposed on the mounting plate (3); The motor component (72) is mounted on the base plate (71), and the drive shaft end of the motor component (72) is connected to the main wheel (73). A secondary wheel (74) is mounted on the adapter rod (43), and a transmission belt (75) is connected between the secondary wheel (74) and the main wheel (73).

6. A chip picking device with chip flipping function according to claim 1, characterized in that, A notch area (11) is formed on one side of the base (1), and a support arm (12) extends outward from each side of the notch area (11). One side of the mounting plate (3) is connected to the bottom of a pair of support arms (12).

7. A chip picking device with chip flipping function according to claim 1, characterized in that, The width of the main spindle (4) is smaller than the width of the working area (31) on the mounting plate (3).

8. A chip picking device with chip flipping function according to claim 1, characterized in that, The lateral and longitudinal displacement mechanism (2) includes: A lateral drive component (21) has its control end connected to a first frame (22) to realize the lateral displacement movement of the first frame (22); A longitudinal drive member (23) is disposed on the outside of the first frame (22), and its control end is connected to a second frame (24) to realize the longitudinal displacement movement of the second frame (24), which is connected to the base (1). A slider rail assembly (25) is disposed between the first frame (22) and the second frame (24).

9. A chip picking device with chip flipping function according to claim 8, characterized in that, It also includes a buffer spring (26), the upper and lower ends of which are respectively connected to the first frame (22) and the second frame (24).

10. A chip picking device with chip flipping function according to claim 8, characterized in that, It also includes a slotted photoelectric sensor (27) on the first frame (22) and a trigger (28) on the second frame (24). During the longitudinal displacement movement of the second frame (24), the trigger can pass through and trigger the slotted photoelectric sensor (27).

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