A semiconductor chip flip pick-up device

Abstract

The semiconductor chip turnover pickup device disclosed in the application comprises a suction part for sucking a chip, a turnover part comprising a turnover structure and a servo motor, the suction part being fixedly installed on the turnover structure, the driving end of the servo motor being connected with the turnover structure to drive the suction part to turn over, a translation part comprising a translation plate, a linear track, a linear motor and a grating ruler, the turnover part and the suction part being fixedly installed on the translation plate, the translation plate being movably arranged on the linear track, the driving end of the linear motor being connected with the translation plate to drive the suction part to translate, and the grating ruler being correspondingly arranged with the translation plate to measure the displacement of the translation plate. The linear motor and the grating ruler are matched to realize the linear fast movement of the suction part with a large distance and ensure the accuracy of the movement positioning. The servo motor is directly connected with the turnover mechanism to ensure the accuracy of the turnover positioning of the suction part, improve the overall accuracy of the equipment, and realize the high-speed and stable pickup of small chips.

Description

Technical Field

[0001] This application relates to the field of automation equipment technology, and more specifically to a semiconductor chip flipping and picking device. Background Technology

[0002] In the field of semiconductor chip mounting, the required mounting accuracy is getting higher and higher, and the accuracy of flipping and picking before mounting is also increasing. Currently, the existing equipment on the market usually uses a flexible connection between the synchronous belt and the motor shaft for the flipping axis. In terms of overall picking accuracy, speed and settling time, it cannot meet the increasingly high production requirements. Summary of the Invention

[0003] To overcome the above-mentioned shortcomings, the purpose of this application is to provide a semiconductor chip flipping and picking device, thereby effectively solving the above-mentioned technical problems.

[0004] To achieve the above objectives, this application adopts the following technical solution:

[0005] This application provides a semiconductor chip flip-and-pickup device, comprising:

[0006] The suction section is used to pick up the chip;

[0007] The flipping part includes a flipping structure and a servo motor. The suction part is fixedly mounted on the flipping structure. The drive end of the servo motor is connected to the flipping structure to drive the suction part to flip.

[0008] The translation unit includes a translation plate, a linear track, a linear motor, and a grating ruler. The flipping unit and the suction unit are fixedly mounted on the translation plate. The translation plate is movably arranged on the linear track. The drive end of the linear motor is connected to the translation plate to drive the suction unit to translate. The grating ruler is correspondingly arranged with the translation plate to measure the displacement of the translation plate.

[0009] Furthermore, the flipping structure is provided with a micro-motion guide rail, the suction part is movably disposed on the micro-motion guide rail, and the translation direction of the suction part is the same as the translation direction of the translation plate.

[0010] Furthermore, the suction unit includes a suction head, a mounting base, and an air connector. The suction head is fixedly mounted on the mounting base, and the air connector is connected to the suction head through an air passage to allow air to be supplied to the air connector for vacuum adsorption of the chip.

[0011] Furthermore, a return spring is provided on the mounting base, and the return spring acts on the suction part.

[0012] Furthermore, it also includes a first photoelectric sensor and a second photoelectric sensor, the first photoelectric sensor being disposed on the moving path of the translation plate, and the second photoelectric sensor being disposed on the flipping path of the flipping structure. Beneficial effects

[0013] This application provides a semiconductor chip flip-and-pickup device that, through the cooperation of a linear motor and a grating ruler, achieves rapid linear motion of the pick-up section over a long distance while ensuring accurate positioning. The servo motor is directly connected to the flipping mechanism to ensure the accuracy of the flipping positioning of the pick-up section, thereby improving the overall precision of the device, enabling high-speed and stable pickup of small chips, improving the overall performance of the flip-and-pickup structure, and meeting the needs of high-speed and high-precision chip placement scenarios. Attached Figure Description

[0014] The accompanying drawings are provided to illustrate the technical solutions of this disclosure and form part of the specification. They are used together with the embodiments of this disclosure to explain the technical solutions of this disclosure and do not constitute a limitation on the technical solutions of this disclosure. The shapes and sizes of the components in the drawings do not reflect actual proportions and are only intended to illustrate the content of this application.

[0015] Figure 1 This is a schematic diagram of a semiconductor chip flipping and picking device provided in an embodiment of this application.

[0016] In the above attached figures,

[0017] 1. Suction head; 2. Mounting base; 3. Air connector; 4. Flip structure; 5. Servo motor; 6. Translation plate; 7. Linear track; 8. Linear motor; 9. Micro-motion guide rail; 10. Spring. Detailed Implementation

[0018] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.

[0019] Unless otherwise defined, the technical or scientific terms used in the embodiments of this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. In this document, "electrical connection" includes the situation where constituent elements are connected together by an element having some electrical function. There is no particular limitation on the "electrically functioning element," as long as it enables the transmission and reception of electrical signals between the connected constituent elements. An "electrically functioning element" can be, for example, an electrode or wiring, a switching element such as a transistor, or other functional elements such as a resistor, inductor, or capacitor. "Up," "down," "left," and "right" are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0020] In this application, the terms "upper," "lower," "inner," "middle," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation. Example

[0021] One embodiment of this application provides a semiconductor chip flip-and-pickup device, such as... Figure 1 As shown, the device includes:

[0022] The suction section is used to pick up the chip. The suction section includes a suction head 1, a mounting base 2, and an air connector 3. The suction head 1 is fixedly mounted on the mounting base 2. The air connector 3 is connected to the suction head 1 through an air passage so that the air connector 3 can pass air to perform vacuum adsorption on the chip.

[0023] The flipping part is used to drive the suction part to flip. The flipping part includes a flipping structure 4 and a servo motor 5. The suction part is fixedly installed on the flipping structure 4. The drive end of the servo motor 5 is connected to the flipping structure 4 to drive the suction part to flip. The accuracy of the suction part flipping and positioning is ensured by the direct connection between the servo motor 5 and the flipping mechanism, so as to achieve a 180° flip within 50ms and a flipping positioning accuracy of ±2.5μm.

[0024] The translation section, used to drive the suction section to translate, includes a translation plate 6, a linear track 7, a linear motor 8, and a grating ruler. The flipping section and the suction section are fixedly mounted on the translation plate 6, which is movably mounted on the linear track 7. The drive end of the linear motor 8 is connected to the translation plate 6 to drive the suction section to translate. The grating ruler is correspondingly set with the translation plate 6 to measure its displacement. Through the cooperation of the linear motor 8 and the grating ruler, the suction section can move quickly and linearly over a large distance while ensuring accurate positioning. The speed can reach 650 mm / s, the acceleration is 2.2g, and the positioning accuracy is ±2μm.

[0025] The flipping structure 4 is equipped with a micro-motion guide rail 9, and the suction part can move up and down by means of a slider cooperating with the guide rail.

[0026] The translation direction is the same as that of the translation plate 6. The micro-motion guide rail 9 structure is adopted, which greatly improves the rigidity of the suction head 1 within the buffer stroke and ensures the positioning accuracy of the flipping is ±2.5μm. The return spring 10 acts on the suction head 1 and plays a buffering role. At the same time, when the suction head 1 finishes picking up, the return spring 10 can use the rebound force to reset the suction head 1 on the micro-motion guide rail 9.

[0027] The device is also equipped with a first photoelectric sensor and a second photoelectric sensor. The first photoelectric sensor is located on the moving path of the translation plate 6 and its function is to sense when the translation plate 6 returns to the origin. The second photoelectric sensor is located on the flipping path of the flipping structure 4 and its function is to sense when the flipping structure 4 flips back to the origin.

[0028] The above embodiments are only for illustrating the technical concept and features of this application, and are intended to enable those skilled in the art to understand the content of this application and implement it accordingly. They should not be used to limit the scope of protection of this application. All equivalent changes or modifications made in accordance with the spirit and essence of this application should be included within the scope of protection of this application.

Claims

1. A semiconductor chip flip-and-pickup device, characterized in that: include: The suction section is used to pick up the chip; The flipping part includes a flipping structure and a servo motor. The suction part is fixedly mounted on the flipping structure. The drive end of the servo motor is connected to the flipping structure to drive the suction part to flip. The translation unit includes a translation plate, a linear track, a linear motor, and a grating ruler. The flipping unit and the suction unit are fixedly mounted on the translation plate. The translation plate is movably arranged on the linear track. The drive end of the linear motor is connected to the translation plate to drive the suction unit to translate. The grating ruler is correspondingly arranged with the translation plate to measure the displacement of the translation plate.

2. The semiconductor chip flip-and-pickup device as described in claim 1, characterized in that: The flipping structure is provided with a micro-motion guide rail, and the suction part is movably disposed on the micro-motion guide rail, and the translation direction of the suction part is the same as the translation direction of the translation plate.

3. The semiconductor chip flip-and-pickup device as described in claim 1, characterized in that: The suction unit includes a suction head, a mounting base, and an air connector. The suction head is fixedly mounted on the mounting base, and the air connector is connected to the suction head through an air passage to allow air to be supplied to the air connector for vacuum adsorption of the chip.

4. The semiconductor chip flipping and picking device as described in claim 3, characterized in that: The mounting base is provided with a return spring, which acts on the suction part.

5. The semiconductor chip flip-and-pickup device as described in claim 1, characterized in that: It also includes a first photoelectric sensor and a second photoelectric sensor, the first photoelectric sensor being disposed on the moving path of the translation plate and the second photoelectric sensor being disposed on the flipping path of the flipping structure.

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