A power module with low stray inductance, electronic device and vehicle
By designing the input and output terminals in a radially symmetrical manner on the Z-axis plane and optimizing the DBC board, the problems of high stray inductance, large size, and low heat dissipation efficiency of existing power modules are solved, achieving efficient heat dissipation and miniaturization of low stray inductance power modules, which are suitable for automotive motor controllers.
CN224538717UActive Publication Date: 2026-07-21BEIJING XINGAN TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XINGAN TECH CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-21
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Figure CN224538717U_ABST
Abstract
The application discloses a low-stray inductance power module, an electronic device and a vehicle, wherein the power module is provided with a heat dissipation module, a module frame and an upper cover from bottom to top; a plurality of DBC sheets are arranged in the module frame; the bottom of each DBC sheet is covered with a heat conductive material and fixed to the heat dissipation module; a first terminal and a second terminal are connected to each DBC sheet; and the first terminal and the second terminal are arranged in a stack and symmetrically distributed in a mirror image in a Z-axis plane. The power module is designed in a stack of input and output terminals, so that the input and output terminals are distributed in a radial symmetry in the Z-axis plane, thereby reducing the stray inductance; the area of the DBC sheet is reduced, the chip layout is optimized, and the heat dissipation capacity of the chip is ensured, so that the power density of the power module is improved by 2 times.
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