Bluetooth audio chip capable of avoiding solder joint fatigue fracture

Abstract

The utility model discloses a kind of bluetooth sound chip to avoid soldering point fatigue fracture, it is related to bluetooth sound chip technical field, including chip body, the bottom of chip body is provided with anti-fracture mechanism, anti-fracture mechanism includes heat sink, the bottom of chip body is provided with heat sink, the both sides of heat sink are provided with mounting block. The utility model through the setting of anti-fracture mechanism, can reach the effect of preventing soldering pin fatigue fracture, in use process, through baffle to be fixed by welding, prevent soldering pin shake or be moved, make soldering pin fatigue fracture, through heat sink to chip body bottom heat dissipation, soldering pin can be avoided because it is difficult to prevent soldering pin fatigue fracture, and soldering pin is used for a long time, affected by external force possibly make soldering pin place metal fatigue, further make soldering pin fracture, let circuit directly disconnect, make equipment unable normal power-on or signal transmission interruption condition appear, guarantee the service life of the bluetooth sound chip.

Description

Technical Field

[0001] This utility model relates to the field of Bluetooth speaker chip technology, specifically a Bluetooth speaker chip that avoids fatigue fracture of solder joints. Background Technology

[0002] A Bluetooth speaker chip is a semiconductor chip integrated into a Bluetooth speaker device to realize core functions such as Bluetooth wireless connection and audio signal processing; it is equivalent to the "brain" of the Bluetooth speaker.

[0003] Most Bluetooth speaker chips currently in use are difficult to prevent fatigue fracture of the solder joints. During use, if fatigue fracture of the solder joints is difficult to prevent, the metal at the solder joints may become fatigued due to external forces after prolonged use, leading to solder joint fracture and direct circuit disconnection. This can cause the device to fail to power on or signal transmission to be interrupted, resulting in a shorter lifespan for the Bluetooth speaker chip. Furthermore, it is difficult to prevent the heat sink from conducting electricity. During use, if the heat sink is not prevented from conducting electricity, the conductivity of the heat sink can be directly transferred to the chip body, causing the chip to break down and rendering it unusable. This reduces the practicality of the Bluetooth speaker chip. Utility Model Content

[0004] The purpose of this invention is to provide a Bluetooth speaker chip that avoids fatigue fracture of solder joints, thereby solving the problems mentioned in the prior art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a Bluetooth speaker chip that avoids solder joint fatigue fracture, comprising a chip body, an anti-fracture mechanism provided at the bottom of the chip body, the anti-fracture mechanism comprising a heat sink, the bottom of the chip body being provided with a heat sink, mounting blocks being provided on both sides of the heat sink, and mounting plates being provided on both sides of the chip body.

[0006] As a preferred technical solution, threaded holes are provided inside both the mounting plate and the mounting block, and bolts are provided on the inner wall of the threaded holes.

[0007] As a preferred technical solution, the top of the heat sink is provided with a partition, and the number of partitions is two sets, with six partitions in each set.

[0008] As a preferred technical solution, the mounting plate is rectangular in shape, and the mounting block is rectangular in shape.

[0009] As a preferred technical solution, both ends of the chip body are provided with solder feet, and the number of solder feet is two groups of five.

[0010] As a preferred technical solution, a thermally conductive gel sheet is provided at the bottom of the heat sink, and the shape and size of the thermally conductive gel sheet match the shape and size of the heat sink.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] 1. This utility model, through the setting of the anti-fracture mechanism, can prevent fatigue fracture of the solder feet. During use, the partition is used to fix the solder feet in place, preventing them from shaking or being bent, which could lead to fatigue fracture. The heat sink is used to dissipate heat from the bottom of the chip body, which can avoid the situation where the solder feet are difficult to prevent from fatigue fracture. This is because the solder feet may become fatigued due to external force after long-term use, which could lead to solder foot fracture, direct circuit disconnection, and failure of the device to power on or interruption of signal transmission. This ensures the service life of the Bluetooth speaker chip.

[0013] 2. By using a thermally conductive gel sheet, this invention can prevent the heat sink from conducting electricity. During use, the thermally conductive gel sheet prevents the heat sink from conducting electricity while quickly transferring heat away. This avoids the situation where the heat sink conducts electricity directly to the chip body, causing the chip to break down and become unusable, thus ensuring the practicality of the Bluetooth speaker chip. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present utility model;

[0015] Figure 2 This is a schematic diagram of the anti-fracture mechanism of this utility model;

[0016] Figure 3 A schematic diagram of the threaded hole structure inside the mounting plate of this utility model;

[0017] Figure 4 This is a schematic diagram of the connection structure between the thermally conductive gel sheet and the heat sink of this utility model.

[0018] The components are: 1. Chip body; 2. Anti-breakage mechanism; 201. Heat sink; 202. Mounting block; 203. Mounting plate; 204. Threaded hole; 205. Bolt; 206. Partition; 3. Thermal conductive gel sheet; 4. Solder foot. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: Figure 1 and Figure 2 As shown, the present invention provides the following technical solution, including a chip body 1, a breakage prevention mechanism 2 at the bottom of the chip body 1, solder feet 4 at both ends of the chip body 1, the number of solder feet 4 being two groups of five in each group, and a thermal conductive gel sheet 3 at the bottom of the heat sink 201.

[0021] Specifically: When the chip body 1 is needed, it is necessary to prevent fatigue fracture of the solder pins 4 in advance. The anti-fracture mechanism 2 is set to prevent fatigue fracture of the solder pins 4. Then the chip body 1 can be used for operation. When the chip body 1 is used for operation, the thermal conductive gel sheet 3 is set to prevent the heat sink 201 from conducting electricity and breaking through the chip body 1, thereby completing the operation.

[0022] like Figure 1 , Figure 2 and Figure 3 As shown, a fracture prevention mechanism 2 is provided at the bottom of the chip body 1. The fracture prevention mechanism 2 includes a heat sink 201. The bottom of the chip body 1 is provided with a heat sink 201. Mounting blocks 202 are provided on both sides of the heat sink 201. Mounting plates 203 are provided on both sides of the chip body 1. Threaded holes 204 are provided inside the mounting plates 203 and the mounting blocks 202. Bolts 205 are provided on the inner wall of the threaded holes 204. A partition 206 is provided on the top of the heat sink 201. There are two sets of partitions 206, with six partitions in each set. The mounting plates 203 and the mounting blocks 202 are rectangular in shape.

[0023] Specifically: When the chip body 1 is needed, it is necessary to prevent fatigue fracture of the solder feet 4 in advance. At this time, the heat sink 201 is attached to the bottom of the chip body 1, so that the threaded hole 204 in the mounting block 202 is aligned with the threaded hole 204 in the mounting plate 203. Then, the bolt 205 is rotated and inserted into the threaded hole 204 to fix the heat sink 201. Then, while the heat sink 201 can dissipate heat from the bottom of the chip body 1, the partition 206 limits the solder feet 4 to prevent the solder feet 4 from being bent and causing fatigue fracture, thereby completing the anti-fracture work.

[0024] like Figure 1 and Figure 4As shown, a thermally conductive gel sheet 3 is provided at the bottom of the heat sink 201, and the shape and size of the thermally conductive gel sheet 3 match the shape and size of the heat sink 201.

[0025] Specifically, when the chip body 1 is in operation, the thermally conductive gel sheet 3 is used to prevent the heat sink 201 from conducting electricity and breaking down the chip body 1, thereby completing the anti-conductivity work.

[0026] The working principle of this utility model is as follows: When the chip body 1 is needed, it is necessary to prevent the solder feet 4 from fatigue fracture in advance. At this time, the heat sink 201 is attached to the bottom of the chip body 1, so that the threaded hole 204 in the mounting block 202 is aligned with the threaded hole 204 in the mounting plate 203. Then, the bolt 205 is rotated and inserted into the threaded hole 204 to fix the heat sink 201. Then, while the heat sink 201 can dissipate heat from the bottom of the chip body 1, the partition 206 limits the solder feet 4 to prevent the solder feet 4 from being bent and causing fatigue fracture, thereby completing the anti-fracture work. Then the chip body 1 can be used for operation. When the chip body 1 is used for operation, the thermal conductive gel sheet 3 is set to prevent the heat sink 201 from conducting electricity and breaking through the chip body 1, thereby completing the anti-conductivity work.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A Bluetooth speaker chip that avoids solder joint fatigue fracture, comprising a chip body (1), characterized in that: The bottom of the chip body (1) is provided with an anti-breakage mechanism (2), which includes a heat sink (201). The bottom of the chip body (1) is provided with a heat sink (201). Mounting blocks (202) are provided on both sides of the heat sink (201). Mounting plates (203) are provided on both sides of the chip body (1). A partition (206) is provided on the top of the heat sink (201). There are two sets of partitions (206), with six in each set. A thermally conductive gel sheet (3) is provided at the bottom of the heat sink (201). The shape and size of the thermally conductive gel sheet (3) match the shape and size of the heat sink (201).

2. The Bluetooth speaker chip for avoiding solder joint fatigue fracture according to claim 1, characterized in that: Both the interior of the mounting plate (203) and the interior of the mounting block (202) are provided with threaded holes (204), and bolts (205) are provided on the inner wall of the threaded holes (204).

3. A Bluetooth speaker chip for avoiding solder joint fatigue fracture according to claim 2, characterized in that: The mounting plate (203) is rectangular in shape, and the mounting block (202) is rectangular in shape.

4. A Bluetooth speaker chip for avoiding solder joint fatigue fracture according to claim 1, characterized in that: The chip body (1) has solder feet (4) at both ends, and the number of solder feet (4) is two groups of five.

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