Integrated circuit module and pos terminal

Abstract

The application relates to an integrated circuit module and a POS terminal, the module comprising opposite first and second surfaces, the first surface being provided with a functional module, the second surface being provided with a plurality of first pads for heat dissipation, a plurality of second pads for leading out pin functions of the integrated circuit module, and third pads, a first part of the first pads being arranged in the center of the second surface, a second part being arranged around the first part at the periphery of the first part, the second pads and the third pads being arranged between the first part and the second part, wherein each first pad is substantially rectangular, the length of each side of the rectangle being 1.6-1.8 mm, the first pads being arranged at unequal intervals, and the area of each first pad being greater than the area of each second pad and the area of each third pad. Such a pad design can ensure the welding reliability of the integrated circuit module, is beneficial to the heat dissipation of the integrated circuit module, and can lead out the pin functions of the integrated circuit module to the maximum extent.

Description

Technical Field

[0001] This application relates to the field of integrated circuits, and more particularly to an integrated circuit module and a POS terminal containing the module. Background Technology

[0002] In the design of integrated circuit modules, circuit integration is increasing, functions are becoming more numerous, and power consumption is also rising, thus placing higher demands on heat dissipation. To address this issue, current integrated circuit module pad packaging designs typically incorporate large pads on the bottom surface of the module (the side opposite to the top surface containing the functional modules) for heat dissipation. For example, the heat dissipation pads used in Chinese utility model patent CN210668351 U are large-sized pads with side lengths of 3mm to 5mm. However, in practical applications of integrated circuit modules, when soldered onto circuit boards, excessively large heat dissipation pads can lead to uneven solder melting and numerous voids, affecting both soldering quality and heat dissipation performance.

[0003] Therefore, there is a need to improve the design of the heat dissipation pads for integrated circuit modules. Utility Model Content

[0004] One of the objectives of this application is to provide an optimized pad design that ensures the soldering reliability of the integrated circuit module, facilitates heat dissipation of the integrated circuit module, and maximizes the pin functions of the integrated module circuit.

[0005] Therefore, this application provides an integrated circuit module, including a first side and a second side opposite to each other. The first side is provided with a functional module, and the second side is provided with a plurality of first pads for heat dissipation, a plurality of second pads and a third pad for leading out the pin functions of the integrated circuit module. A first portion of the first pad is disposed in the center of the second side, and a second portion is disposed around the first portion. The second pad and the third pad are disposed between the first portion and the second portion. Each first pad is approximately rectangular, and the length of each side of the rectangle is 1.6 mm to 1.8 mm. The first pads are arranged at unequal intervals, and the area of ​​each first pad is larger than the area of ​​each second pad and the area of ​​each third pad.

[0006] In this application, an "integrated circuit module" is an electronic component with independent functions formed by integrating one or more integrated circuit chips and related electronic components (such as resistors, capacitors, inductors, connectors, etc.) on the same substrate according to specific functional requirements and through packaging processes.

[0007] In this application, "generally rectangular" means that the overall shape of an object is basically rectangular (including square), even if there are minor changes in shape (such as chamfers, waves, and serrations) in some parts, as long as it does not affect the overall impression that the object is rectangular to the observer.

[0008] In the above solution, the reliability of soldering is ensured by replacing the large heat dissipation pads in the prior art with multiple smaller heat dissipation pads (i.e., the first pads); the heat dissipation performance is improved by setting multiple heat dissipation pads that surround the second and third pads from both the inside and outside; and the pin functions of the integrated circuit module can be brought out as many times as possible by setting multiple second and third pads.

[0009] Based on the optional features of the integrated circuit module that can be used individually or in combination:

[0010] - The integrated circuit module is roughly rectangular. The first part of the first pad is arranged in a rectangular array. The second and third pads form one or more intermediate rectangular frames surrounding the first part. The second part of the first pad forms one or more outer rectangular frames surrounding the intermediate rectangular frames.

[0011] - Multiple third pads are also provided at each of the four corners of the second side.

[0012] - The first pad is square.

[0013] - The second pad is rectangular, with a short side of 0.7mm to 0.9mm and a long side of 1.1mm to 1.3mm, and is arranged at equal or unequal intervals. The spacing between two adjacent second pads is 1.4mm to 1.6mm.

[0014] - The third pad is square with a side length of 1.1mm to 1.3mm, and is arranged at equal or unequal intervals. The distance between two adjacent third pads is 1.4mm to 1.6mm.

[0015] This application also provides a POS terminal, which includes the integrated circuit module described above.

[0016] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the present invention. Other features, objects, and advantages of the present invention will become apparent from the specification, drawings, and claims. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. It will be readily understood by those skilled in the art that these drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. For illustrative purposes, these drawings may not be drawn to scale.

[0018] Figure 1 This is a plan view of the bottom surface of an integrated circuit module according to an embodiment of this application.

[0019] List of reference numerals

[0020] 1 Integrated circuit module; 10 First pad; 10A First portion of the first pad; 10B Second portion of the first pad; 20 Second pad; 30 Third pad Detailed Implementation

[0021] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments according to this application. Rather, they are merely examples of apparatuses consistent with some aspects of this application as detailed in the appended claims.

[0022] Figure 1 An integrated circuit module 1 according to an embodiment of this application is schematically shown, such as an Android smart module. The integrated circuit module 1 includes a first surface (i.e., the top surface, not shown) and a second surface (i.e., the bottom surface). Figure 1 The first surface (shown in the diagram) houses functional modules such as CPU chips, PMU chips, audio chips, RF transceiver chips, and WIFI / BT chips. The second surface has multiple first pads 10 for heat dissipation, multiple second pads 20 for bringing out the pins of the integrated circuit modules (such as GPIO pins and power pins), and multiple third pads 30. The multiple first pads 10 are roughly divided into two parts according to their position: a first part 10A located in the center of the second surface, and a second part 10B surrounding the first part 10A. The second pads 20 and third pads 30 are located between the first part 10A and the second part 10B. Each first pad 10 is approximately rectangular, with each side measuring 1.6mm to 1.8mm. The first pads 10 are arranged at unequal intervals, and the area of ​​each first pad 10 is larger than the area of ​​each second pad 20 and each third pad 30.

[0023] In the above scheme, each first pad 10 is relatively small, thus ensuring uniform solder melting during the soldering process and minimizing voids, thereby guaranteeing soldering quality and heat dissipation. Furthermore, by setting multiple first pads 10 surrounding the second pad 20 and the third pad 30 from both the inside and outside, the total area of ​​the heat dissipation pads is increased, thereby improving heat dissipation. The first pads 10 are arranged at unequal intervals, allowing for more flexible and adaptable layouts. Additionally, multiple second pads 20 and third pads 30 are also provided, facilitating the extraction of as many pin functions of the integrated circuit module as possible.

[0024] According to embodiments of this application, the integrated circuit module 1 is generally rectangular (i.e., a rectangle or a square), and its size can be designed according to actual needs. Preferably, the first portion 10A of the first pad is arranged in a rectangular array, the second pad 20 and the third pad 30 form one or more layers of intermediate rectangular frames surrounding the first portion 10A, and the second portion 10B of the first pad forms one or more layers of outer rectangular frames surrounding the intermediate rectangular frames.

[0025] exist Figure 1 In an exemplary embodiment, the first part 10A includes four groups, each group including four first pads, for a total of 16 first pads. The four pads in each group are spaced apart and arranged together to form a square. The four groups are also spaced apart and arranged together to form a larger square. The spacing between adjacent groups is greater than the spacing between the first pads in each group. A plurality of second pads 20 and third pads 30 surrounding the first part 10A form an inner and outer two-layer intermediate rectangular frame. Each side of the inner intermediate rectangular frame includes seven second pads 20, each side of the outer intermediate rectangular frame includes nine second pads 20, and each corner includes a third pad 30. The second part 10B surrounding the intermediate rectangular frame forms an inner and outer two-layer outer rectangular frame. Each side of the inner and outer outer rectangular frames includes eight first pads 10.

[0026] Furthermore, multiple third pads 30 can be provided at the four corners of the second side of the integrated circuit module 1 to expose more pin functions of the integrated circuit module. Figure 1 In an exemplary embodiment, a third pad is provided at each of the four corners of the second side of the integrated circuit module 1 (a pentagonal pad is provided at the corner with the anti-fooling chamfer, and a square pad is provided at each of the other three corners). In the area near each corner of the integrated circuit module 1, that is, at the corner of the outer rectangular frame enclosed by the aforementioned second part 10B, four third pads 30 are also provided. These four third pads 30 are spaced apart from each other and arranged together to form a square.

[0027] Preferably, the first pad 10 is a square with a side length of 1.6mm to 1.8mm, for example, 1.6mm, 1.7mm, or 1.8mm. Preferably, the second pad 20 is a rectangle with a short side of 0.7mm to 0.9mm and a long side of 1.1mm to 1.3mm, arranged at equal or unequal intervals, with a spacing of 1.4mm to 1.6mm between adjacent second pads 20, for example, 1.4mm, 1.5mm, or 1.6mm. Preferably, the third pad 30 is a square with a side length of 1.1mm to 1.3mm, for example, 1.1mm, 1.2mm, or 1.3mm, arranged at equal or unequal intervals, with a spacing of 1.4mm to 1.6mm between adjacent third pads 30, for example, 1.4mm, 1.5mm, or 1.6mm. According to one embodiment, the first pad 10 is a square with a side length of 1.7 mm, the second pad 20 is a rectangle with a long side of 1.2 mm and a short side of 0.8 mm, and the third pad 30 is a square with a side length of 1.2 mm.

[0028] It should be understood that those skilled in the art can design the specific positions, arrangements, quantities, shapes, and dimensions of the first pad 10, the second pad 20, and the third pad 30 according to specific needs, and are not limited to these designs. Figure 1 As shown.

[0029] This application also provides a POS terminal, which includes the integrated circuit module described above.

[0030] Unless otherwise defined, the technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The singular forms “a,” “an,” and “the” used herein are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as may be used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

[0031] Terms such as “upper,” “lower,” “left,” “right,” “front,” “back,” “thickness,” “radial,” and “axial,” used herein to describe the relationship of one feature relative to another, as shown in the accompanying drawings, are for illustrative purposes and are not limited to a single location or spatial orientation. It is understood that, depending on the product's placement, the terms describing spatial relative positions may be intended to include different orientations besides those shown in the figures, and should not be interpreted as limiting. Furthermore, the descriptive term “horizontal,” as used herein, is not entirely equivalent to being perpendicular to the direction of gravity and allows for a certain angle of inclination. The terms “including” or “comprising” as used herein mean that the elements or objects preceding “including” or “comprising” encompass the elements or objects listed following “including” or “comprising” and their equivalents, but do not exclude other elements or objects.

[0032] It should be understood that the terms "first," "second," and similar terms used in this application specification do not indicate any order, quantity, or importance, but are merely used to distinguish different components.

[0033] The above are merely preferred embodiments of this utility model and are not intended to limit this utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the scope of protection of this application.

Claims

1. An integrated circuit module, comprising a first side and a second side opposite to each other, the first side having a functional module, and the second side having a plurality of first pads for heat dissipation, a plurality of second pads and third pads for leading out pin functions of the integrated circuit module, characterized in that, The first portion of the first pad is located at the center of the second surface, and the second portion is located around the first portion. The second pad and the third pad are located between the first portion and the second portion. Each first pad is approximately rectangular, with each side of the rectangle having a length of 1.6 mm to 1.8 mm. The first pads are arranged at unequal intervals, and the area of ​​each first pad is greater than the area of ​​each second pad and the area of ​​each third pad.

2. The integrated circuit module as described in claim 1, characterized in that, The integrated circuit module is roughly rectangular. The first part of the first pad is arranged in a rectangular array. The second pad and the third pad form one or more intermediate rectangular frames surrounding the first part. The second part of the first pad forms one or more outer rectangular frames surrounding the intermediate rectangular frames.

3. The integrated circuit module as described in claim 1, characterized in that, Multiple third pads are also provided at each of the four corners of the second side.

4. The integrated circuit module as described in any one of claims 1-3, characterized in that, The first pad is square.

5. The integrated circuit module as described in any one of claims 1-3, characterized in that, The second pad is rectangular, with a short side of 0.7mm to 0.9mm and a long side of 1.1mm to 1.3mm. They are arranged at equal or unequal intervals, and the spacing between two adjacent second pads is 1.4mm to 1.6mm.

6. The integrated circuit module as described in any one of claims 1-3, characterized in that, The third pad is square with a side length of 1.1mm to 1.3mm, and is arranged at equal or unequal intervals. The distance between two adjacent third pads is 1.4mm to 1.6mm.

7. A POS terminal, characterized in that, Includes an integrated circuit module as described in any of the preceding claims.

Images