Liquid cooling heat dissipation package structure
By designing a liquid-cooled heat dissipation packaging structure, the problem of insufficient chip heat dissipation is solved by using coolant to transfer heat, achieving efficient heat dissipation and stable operation, preventing chip burnout, and reducing manufacturing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JCET GROUP CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-07-21
AI Technical Summary
The heat dissipation performance of chips in existing packaged devices is insufficient, resulting in excessively high chip temperatures, which can easily cause the chips to burn out and affect their stable operation.
It adopts a liquid-cooled heat dissipation packaging structure, including a substrate, chip, upper cover, lower support and heat dissipation channel. Heat is transferred through coolant. The inlet of the heat dissipation channel is larger than the outlet. The coolant flows in the channel to absorb the heat of the chip and quickly discharge it.
It improves the chip's heat dissipation efficiency, prevents the chip from burning out due to overheating, simplifies the manufacturing process, and reduces manufacturing costs.
Smart Images
Figure CN224538726U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a liquid-cooled heat dissipation packaging structure. Background Technology
[0002] Chips are crucial components in electronic devices, significantly impacting their performance. As electronic devices become increasingly functional, the demands on chip performance rise, leading to increased power consumption. This increased power consumption exacerbates the problem of chip overheating, which can cause chip burnout. Therefore, heat dissipation has become one of the bottlenecks restricting chip development.
[0003] When a chip doesn't reach 100% efficiency, power consumption is transferred as heat. The purpose of heat dissipation design in packaged devices is to ensure the chip has a low thermal resistance, increasing heat flow and maintaining the chip's operating temperature within an appropriate range to prevent burnout. Currently, heat in packaged devices is mainly generated at the interface, transferred upwards via the molding compound to the chip surface, and finally dissipated into the air through the heat sink. However, as chip functionality increases, the heat generated during operation also increases. Relying solely on heat sinks to dissipate heat is insufficient to effectively remove the heat generated by the chip, thus still affecting chip performance and, in severe cases, even causing burnout.
[0004] Therefore, improving the heat dissipation performance of chips in packaged devices, maintaining stable operation of chips within packaged devices, and preventing chips from burning out due to excessive temperature are urgent technical problems that need to be solved. Summary of the Invention
[0005] This invention provides a liquid-cooled heat dissipation packaging structure to improve the heat dissipation performance of chips in packaged devices, maintain stable operation of chips within packaged devices, and prevent chips from burning out due to excessive temperature.
[0006] According to some embodiments, this utility model provides a liquid-cooled heat dissipation packaging structure, including:
[0007] The substrate includes a front side and a back side that are distributed opposite to each other along a first direction;
[0008] A chip is mounted on the front side of the substrate, the chip including a first surface facing the substrate and a second surface opposite to the first surface along the first direction;
[0009] The liquid cooling structure includes an upper cover, a lower support, and a heat dissipation channel for transmitting coolant. The upper cover is located above the chip along the first direction. The lower support is attached to the side of the chip and connected to the end of the upper cover. The upper cover, the lower support, and the chip together form the heat dissipation channel. The opposite ends of the heat dissipation channel are a liquid inlet and a liquid outlet, respectively, and the size of the liquid inlet is larger than the size of the liquid outlet.
[0010] In some embodiments, the surface of the top cover facing the substrate has a cavity extending through the top cover in a second direction, the second direction being parallel to the front surface of the substrate;
[0011] The cavity, the lower support, and the chip enclose the heat dissipation channel, and the liquid inlet and the liquid outlet are distributed opposite to each other along the second direction.
[0012] In some embodiments, the cavity includes a central cavity located above the chip and a first end cavity and a second end cavity distributed at opposite ends of the central cavity along the second direction, wherein the central cavity is in communication with both the first end cavity and the second end cavity;
[0013] The central cavity and the chip enclose to form a main channel, the first end cavity and one end of the lower support to form the liquid inlet, and the second end cavity and the other end of the lower support to form the liquid outlet. The main channel, the liquid inlet and the liquid outlet together constitute the heat dissipation channel.
[0014] In some embodiments, the width of the first end cavity and the width of the second end cavity are both smaller than the width of the middle cavity.
[0015] In some embodiments, the width of the first end cavity is greater than the width of the second end cavity.
[0016] In some embodiments, the depth of the first end cavity along the first direction is greater than the depth of the second end cavity along the first direction.
[0017] In some embodiments, the depth of the cavity gradually decreases along the first direction in the direction from the first end cavity to the second end cavity.
[0018] In some embodiments, the coolant is deionized water.
[0019] In some embodiments, it also includes:
[0020] A barrier layer is applied to the second surface of the chip to prevent the coolant from penetrating the chip.
[0021] In some embodiments, the barrier layer is a metal material layer.
[0022] In some embodiments, the lower support includes a bottom surface facing the substrate and a top surface opposite the bottom surface along the first direction, the top surface of the lower support being flush with the second surface of the chip;
[0023] The heat dissipation channel is located only above the chip and above the lower support.
[0024] In some embodiments, the lower support is an injection molded part, which is distributed around the outer periphery of the chip and directly attached to the side of the chip.
[0025] In some embodiments, the lower support includes a bottom surface facing the substrate and a top surface opposite the bottom surface along the first direction, the top surface of the lower support being flush with the second surface of the chip;
[0026] The lower support has a recess on its top surface, which communicates with the cavity. The recess, the cavity, and the chip together form the heat dissipation channel.
[0027] In some embodiments, the recess includes a first recess and a second recess that are distributed opposite to each other along the second direction, wherein the first recess and the first end cavity enclose the liquid inlet, and the second recess and the second end cavity enclose the liquid outlet.
[0028] In some embodiments, the depth of the first recess along the first direction is greater than the depth of the second recess along the first direction.
[0029] In some embodiments, the central cavity has a first groove on its inner wall facing the chip, and the first groove communicates with the central cavity.
[0030] In some embodiments, the second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.
[0031] The liquid-cooled heat dissipation packaging structure provided by this utility model involves mounting a chip and a liquid-cooled heat dissipation structure on the front side of a substrate. The liquid-cooled heat dissipation structure includes an upper cover, a lower support, and a heat dissipation channel for transmitting coolant. The upper cover is located above the chip along a first direction, and the lower support is attached to the side of the chip and connected to the end of the upper cover. The upper cover, the lower support, and the chip enclose the heat dissipation channel to form the heat dissipation channel. This allows the coolant transmitted through the heat dissipation channel to perform liquid cooling heat dissipation on the chip, enhancing the chip's heat dissipation performance, maintaining stable operation of the chip within the packaged device, and preventing the chip from burning out due to excessive temperature. Furthermore, the opposite ends of the heat dissipation channel are an inlet and an outlet, respectively. The size of the inlet is larger than the size of the outlet, facilitating the flow of coolant within the heat dissipation channel. This allows the coolant to absorb the heat generated by the chip and promptly flow out from the outlet, quickly carrying the heat generated by the chip to the outside of the packaging structure. This improves the heat dissipation efficiency of the liquid-cooled heat dissipation packaging structure and prevents the accumulation of heat generated by the chip inside the liquid-cooled heat dissipation packaging structure. In addition, the heat dissipation channel is formed by the upper cover, the lower support and the chip, which not only shortens the distance between the coolant and the chip, thereby further improving the heat dissipation efficiency of the chip, but also eliminates the need to set a channel embedded in the upper cover, thereby simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the liquid cooling heat dissipation packaging structure. Attached Figure Description
[0032] To more clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.
[0033] Figure 1 This is a schematic diagram of the first structure of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model;
[0034] Figure 2 yes Figure 1 A schematic diagram of the cross-section at position AA;
[0035] Figure 3 This is a schematic diagram of the structure of the upper cover facing the substrate in a specific embodiment of this utility model;
[0036] Figure 4 This is another structural schematic diagram of the surface of the upper cover facing the substrate in a specific embodiment of this utility model;
[0037] Figure 5This is a schematic diagram of the second structure of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model;
[0038] Figure 6 yes Figure 5 A top view of the lower support component in the liquid cooling heat dissipation packaging structure;
[0039] Figure 7 This is a schematic diagram of the third structure of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model;
[0040] Figure 8 This is a schematic diagram of the fourth structure of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model;
[0041] Figure 9 This is a schematic diagram of the fifth structure of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model;
[0042] Figure 10 This is a schematic diagram of the sixth structure of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model. Detailed Implementation
[0043] The specific embodiments of the liquid-cooled heat dissipation packaging structure provided by this utility model will be described in detail below with reference to the accompanying drawings.
[0044] This specific embodiment provides a liquid-cooled heat dissipation packaging structure. Figure 1 This is a schematic diagram of the first structural embodiment of the liquid cooling heat dissipation packaging structure in this utility model. Figure 2 yes Figure 1 A schematic diagram of the cross-section at position AA. (See diagram below.) Figure 1 and Figure 2 As shown, the liquid-cooled heat dissipation packaging structure includes:
[0045] The substrate 10 includes a front side 101 and a back side 102 that are relatively distributed along a first direction D1;
[0046] Chip 11 is mounted on the front side 101 of the substrate 10. Chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1.
[0047] The liquid cooling structure includes an upper cover 12, a lower support 13, and a heat dissipation channel 17 for transmitting coolant. The upper cover 12 is located above the chip 11 along the first direction D1. The lower support 13 is attached to the side of the chip 11 and connected to the end of the upper cover 12. The upper cover 12, the lower support 13, and the chip 11 enclose the heat dissipation channel 17. The opposite ends of the heat dissipation channel 17 are a liquid inlet 18 and a liquid outlet 19, respectively, and the size of the liquid inlet 18 is larger than the size of the liquid outlet 19.
[0048] For example, the substrate 10 may be, but is not limited to, a PCB circuit board. The substrate 10 includes a front side 101 and a back side 102 that are distributed opposite to each other along the first direction D1, and the substrate 10 has a high-density wiring layer inside. The chip 11 is mounted on the front side 101 of the substrate 10, and the chip 11 includes a first surface facing the substrate 10 and a second surface opposite to the first surface along the first direction D1. In one example, the first surface of the chip 11 is the functional surface of the chip 11, that is, the chip 11 is flip-chip mounted on the front side 101 of the substrate 10. The first surface of the chip 11 has a plurality of conductive bumps 15, and one end of the conductive bumps 15 is electrically connected to the chip 11, and the other end is electrically connected to the high-density wiring layer in the substrate 10. A plurality of solder balls 16 are spaced apart on the back surface 102 of the substrate. The solder balls 16 are electrically connected to the high-density wiring layer inside the substrate 10, thereby enabling the transmission of control signals to the chip 11 or the extraction of signals from the chip 11 through the solder balls 16 and the conductive bumps 15. An underfill adhesive 14 is also filled between the chip 11 and the substrate 10 to enhance the connection strength between the chip 11 and the substrate 10.
[0049] The liquid cooling structure is disposed on the front side 101 of the substrate 10. The upper cover 12 of the liquid cooling structure includes a lower surface facing the substrate 10 and an upper surface opposite to the lower surface along the first direction D1. The lower support 13 is vertically connected to the end of the lower surface of the upper cover 12, thereby forming a receiving cavity together with the upper cover 12. The chip 11 is located within the receiving cavity, and the lower support 13 is attached to the side of the chip 11, i.e., the side of the chip 11 is in close contact with the inner wall of the receiving cavity, thereby preventing the coolant from flowing between the chip 11 and the substrate 10, thus avoiding any impact on the electrical connection performance between the chip 11 and the substrate 10. The upper cover 12, the lower support 13, and the chip 11 together form the heat dissipation channel 17, thereby enabling the transfer of coolant to the heat dissipation channel 17 and achieving liquid cooling of the chip 11. This enhances the heat dissipation performance of the chip 11, maintains stable operation of the chip within the packaged device, and prevents the chip from burning out due to overheating. Furthermore, the opposite ends of the heat dissipation channel 17 are an inlet 18 and an outlet 19, respectively. The coolant enters the heat dissipation channel 17 through the inlet 18, absorbs the heat generated by the chip 11, and then flows out through the outlet 19. In other words, the coolant continuously flows within the heat dissipation channel 17 along its extension direction. The size of the inlet 18 is larger than the size of the outlet 19, which facilitates the flow of coolant within the heat dissipation channel 17. This allows the coolant to quickly exit from the outlet 19 after absorbing heat generated by the chip 11, thereby rapidly carrying the heat generated by the chip 11 to the outside of the packaging structure. This improves the heat dissipation efficiency of the liquid-cooled heat dissipation packaging structure and prevents the accumulation of heat generated by the chip 11 inside the liquid-cooled heat dissipation packaging structure. The size of the inlet 18 being larger than the outlet 19 means that the cross-sectional area of the inlet 18 is larger than the cross-sectional area of the outlet 19, or the inner diameter of the inlet 18 is larger than the inner diameter of the outlet 19.
[0050] In addition, the heat dissipation channel 17 is formed by the upper cover 12, the lower support member 13 and the chip 11, which not only shortens the distance between the coolant and the chip 11, thereby further improving the heat dissipation efficiency of the chip 11, but also eliminates the need to set a channel embedded in the upper cover 12, thereby simplifying the manufacturing process of the upper cover 12 and reducing the manufacturing cost of the liquid cooling heat dissipation packaging structure.
[0051] Figure 3 This is a schematic diagram of the structure of the upper cover facing the substrate in a specific embodiment of this utility model. In some embodiments, such as Figure 1 , Figure 2 and Figure 3 As shown, the surface of the upper cover 12 facing the substrate 10 has a cavity extending through the upper cover 12 along a second direction D2, and the second direction D2 is parallel to the front surface 101 of the substrate 10.
[0052] The cavity, the lower support 13, and the chip 11 enclose the heat dissipation channel 17, and the liquid inlet 18 and the liquid outlet 19 are distributed relative to each other along the second direction D2.
[0053] In some embodiments, the cavity includes a central cavity 30 located above the chip 11 and a first end cavity 31 and a second end cavity 32 distributed at opposite ends of the central cavity 30 along the second direction D2, wherein the central cavity 30 is in communication with both the first end cavity 31 and the second end cavity 32.
[0054] The central cavity 30 and the chip 11 enclose to form a main channel, the first end cavity 31 and one end of the lower support member 13 enclose to form the liquid inlet 18, and the second end cavity 32 and the other end of the lower support member 13 enclose to form the liquid outlet 19. The main channel, the liquid inlet 18 and the liquid outlet 19 together constitute the heat dissipation channel 17.
[0055] For example, such as Figure 1 , Figure 2 and Figure 3 As shown, the upper cover 12 includes a lower surface facing the substrate 10 and an upper surface opposite to the lower surface along the first direction D1. The upper cover 12 also includes a cavity extending from the lower surface along the first direction D1 into the interior of the upper cover 12. The cavity penetrates the upper cover 12 along the second direction D2, and the cavity includes a central cavity 30 located above the chip 11 and a first end cavity 31 and a second end cavity 32 distributed at opposite ends of the central cavity 30 along the second direction D2. The central cavity 30 and the chip 11 enclose to form a main channel. The first end cavity 31 and one end of the lower support member 13 enclose to form the liquid inlet 18. The second end cavity 32 and the other end of the lower support member 13 enclose to form the liquid outlet 19, thereby forming the heat dissipation channel 17 including the main channel, the liquid inlet, and the liquid outlet 19.
[0056] In some embodiments, the width of the first end cavity 31 and the width of the second end cavity 32 are both smaller than the width of the middle cavity 30.
[0057] Specifically, the cavity extends along the second direction D2. The width of the first end cavity 31 can be the width of the first end cavity 31 along the third direction D3. The width of the second end cavity 32 can be the width of the second end cavity 32 along the third direction D3. The width of the middle cavity 30 is the width of the middle cavity 30 along the third direction D3. The third direction D3 is parallel to the front surface of the substrate 10 and intersects the second direction D2 perpendicularly. By setting the width of the middle cavity 30 to be greater than the width of the first end cavity 31 and the width of the second end cavity 32, the width of the main channel in the heat dissipation channel 17 (e.g., the width along the third direction D3) is increased, thereby increasing the contact area between the coolant and the chip 11, and further improving the heat dissipation effect of the chip.
[0058] In some embodiments, the depth of the first end cavity 31 along the first direction D1 is greater than the depth of the second end cavity 32 along the first direction D1.
[0059] Specifically, by setting the depth of the first end cavity 31 along the first direction D1 to be greater than the depth of the second end cavity 32 along the first direction D1, the size (e.g., cross-sectional area) of the liquid inlet 18 formed by the first end cavity 31 and one end of the lower support member 13 is greater than the size (e.g., cross-sectional area) of the liquid outlet 19 formed by the second end cavity 32 and the other end of the lower support member 13. This not only allows the coolant to flow smoothly in the heat dissipation channel 17, but also simplifies the manufacturing process by requiring only adjustments to the depths of the first end cavity 31 and the second end cavity 32, thus improving the manufacturing efficiency of the liquid cooling heat dissipation packaging structure.
[0060] In some embodiments, the depth of the cavity gradually decreases along the first direction D1 in the direction from the first end cavity 31 to the second end cavity 32.
[0061] Specifically, by making the depth of the cavity gradually increase along the first direction D1 in the direction from the first end cavity 31 to the second end cavity 32, the inner diameter of the heat dissipation channel 17 gradually decreases in the direction from the liquid inlet 18 to the liquid outlet 19, thereby helping to further simplify the manufacturing process of the top cover and further improve the smoothness of the flow of the coolant in the heat dissipation channel 17.
[0062] Figure 4 This is another structural schematic diagram of the surface of the upper cover facing the substrate in a specific embodiment of this utility model. In other embodiments, such as... Figure 4As shown, the width of the first end cavity 31 is greater than the width of the second end cavity 32.
[0063] In one example, the width of the first end cavity 31 is greater than the width of the second end cavity 32, and the depth of the first end cavity 31 along the first direction D1 is greater than the depth of the second end cavity 32 along the first direction D1, thereby facilitating flexible adjustment of the size difference between the liquid inlet 18 and the liquid outlet 19 and improving the manufacturing flexibility of the liquid cooling heat dissipation packaging structure.
[0064] In some embodiments, the coolant is deionized water.
[0065] Specifically, since the heat dissipation channel 17 is formed by the upper cover 12, the lower support 13, and the second surface of the chip 11, the coolant within the heat dissipation channel 17 directly contacts the second surface of the chip 11. The resistivity of the deionized water is less than 10 ohms. -10 This ensures that even if the deionized water comes into contact with the second surface of the chip 11, it will not cause an electrical short circuit in the chip 11, thus ensuring the normal operation of the chip 11.
[0066] In some embodiments, the liquid-cooled heat dissipation packaging structure further includes:
[0067] A barrier layer is applied to the second surface of the chip 11 to prevent the coolant from penetrating the chip.
[0068] In some embodiments, the barrier layer is a metal material layer.
[0069] Specifically, by covering the entire second surface of the chip 11 with the barrier layer, the barrier layer can prevent the coolant from penetrating to the chip 11, thereby further avoiding the impact of the coolant on the performance of the chip 11. The barrier layer being a metallic material layer means that the material of the barrier layer is a metallic material. Using this metallic material to make the barrier layer allows it to not only prevent the coolant (e.g., deionized water) from penetrating but also prevent oxygen penetration. Furthermore, the metallic material also has good thermal conductivity, thereby further contributing to improving the heat dissipation effect of the chip 11. In one example, the material of the barrier layer is titanium.
[0070] In some embodiments, the lower support member 13 includes a bottom surface facing the substrate 10 and a top surface opposite the bottom surface along the first direction D1, and the top surface of the lower support member 13 is flush with the second surface of the chip 11.
[0071] The heat dissipation channel 17 is located only above the chip 11 and above the lower support member 13.
[0072] In some embodiments, the lower support 13 is an injection molded part, which is distributed around the outer periphery of the chip 11 and directly attached to the side surface of the chip 11.
[0073] For example, after mounting the chip 11 onto the front side 101 of the substrate 10, an injection molding process can be used to form an injection molded part that surrounds the outer periphery of the chip 11 and is directly attached to the side surface of the chip 11. The surface of the injection molded part facing away from the substrate 10 is flush with the second surface of the chip 11, and the injection molded part serves as the lower support 13 of the liquid cooling structure. By using the injection molded part as the lower support 13 and directly attaching it to the side surface of the chip 11, gaps can be avoided between the lower support 13 and the side surface of the chip 11, thereby preventing coolant leakage between the lower support 13 and the side surface of the chip 11, thus protecting the chip 11. The material of the injection molded part can be epoxy resin molding compound.
[0074] Figure 5 This is a schematic diagram of the second structure of the liquid-cooled heat dissipation packaging structure in a specific embodiment of this utility model. Figure 6 yes Figure 5 A top view of the lower support component in a liquid-cooled heat dissipation packaging structure. In other embodiments, such as... Figure 5 and Figure 6 As shown, the lower support member 13 includes a bottom surface facing the substrate 10 and a top surface opposite the bottom surface along the first direction D1. The top surface of the lower support member 13 is flush with the second surface of the chip 11.
[0075] The lower support member 13 has a recess on its top surface, which is connected to the cavity. The recess, the cavity, and the chip 11 together form the heat dissipation channel 17.
[0076] In some embodiments, the recess includes a first recess 131 and a second recess 132 that are relatively distributed along the second direction D2. The first recess 131 and the first end cavity 31 enclose the liquid inlet 18, and the second recess 132 and the second end cavity 32 enclose the liquid outlet 19.
[0077] In some embodiments, the depth of the first recess 131 along the first direction D1 is greater than the depth of the second recess 132 along the first direction D1.
[0078] For example, such as Figure 5 and Figure 6As shown, the top surface of the lower support member 13 is provided with a first recess 131 aligned with the first end cavity 31 and a second recess 132 aligned with the second end cavity 32, such that the first recess 131 and the first end cavity 31 enclose the liquid inlet 18, and the second recess 132 and the second end cavity 32 enclose the liquid outlet 19. The depth of the first recess 131 along the first direction D1 is greater than the depth of the second recess 132 along the first direction D1, thereby making the size of the liquid inlet 18 larger than the size of the liquid outlet 19. The liquid inlet 18 is formed by the first recess 131 and the first end cavity 31. On the one hand, it facilitates precise adjustment of the size of the liquid inlet 18 and the liquid outlet 19, thereby enabling flexible adjustment of the flow rate of the coolant in the heat dissipation channel 17 according to the operating conditions of the chip 11 (e.g., high-speed or low-speed operation), improving the flexibility of the use and manufacturing of the liquid-cooled heat dissipation packaging structure. On the other hand, it also helps to increase the contact area between the coolant and the chip 11, thereby further improving the heat dissipation efficiency of the chip 11.
[0079] Figure 7 This is a schematic diagram of the third structural embodiment of the liquid-cooled heat dissipation packaging structure of this utility model. In other embodiments, such as... Figure 7 As shown, the depth of the first recess 131 along the first direction D1 is greater than the depth of the second recess 132 along the first direction D1. Therefore, the size of the liquid inlet 18 can be adjusted by adjusting the size of the first end cavity 31, and the size of the liquid outlet 19 can be adjusted by adjusting the size of the second end cavity 31, which simplifies the manufacturing process of the lower support 13 and the liquid cooling heat dissipation packaging structure.
[0080] Figure 8 This is a schematic diagram of the fourth structure of the liquid-cooled heat dissipation packaging structure in a specific embodiment of this utility model. In some other embodiments, such as... Figure 8 As shown, the lower support member 13 has the recess only at the position corresponding to the first end cavity 31, so that the first end cavity 31 and the recess form the liquid inlet 18, and the second end cavity 32 and the top surface of the lower support member 13 form the liquid outlet 19, so that the size of the liquid inlet 18 is larger than the size of the liquid outlet 19.
[0081] Figure 9 This is a schematic diagram of the fifth structure of the liquid-cooled heat dissipation packaging structure in a specific embodiment of this utility model. In some embodiments, such as Figure 4 and Figure 9As shown, the central cavity 30 has a first groove 90 on its inner wall facing the chip 11, and the first groove 90 is in communication with the central cavity 30.
[0082] For example, such as Figure 4 and Figure 9 As shown, the central cavity 30 has a first groove 90 on its bottom wall facing the chip 11 along the first direction D1, and the first groove 90 is connected to the central cavity 30. This allows the coolant to enter the first groove 90 from the heat dissipation channel 17, thereby increasing the amount of coolant that the liquid-cooled heat dissipation packaging structure can hold, and further improving the heat dissipation effect. Moreover, after the coolant absorbs the heat generated during the operation of the chip 11, some of the heat can be transferred upward to the outside through the top cover 12. The setting of the first groove 90 is equivalent to increasing the heat dissipation area of the chip 11, thereby further improving the heat dissipation effect of the chip 11. In one example, the central cavity 30 has a plurality of first grooves 90 arranged at intervals along the second direction D2 on its inner wall facing the chip 11, and all of the first grooves 90 are connected to the central cavity 30. The cross-sectional shape of the first groove 90 is arc-shaped, quadrilateral, or triangular.
[0083] Figure 10 This is a sixth structural schematic diagram of the liquid cooling heat dissipation packaging structure in a specific embodiment of this utility model. In some embodiments, the second surface of the chip 11 has a second groove 100, and the second groove 100 is connected to the heat dissipation channel 17.
[0084] For example, by etching the second surface of the chip 11, a second groove 100 is formed on the second surface of the chip 11, and the second groove 100 communicates with the heat dissipation channel 17. The provision of the second groove 100 can further increase the contact area between the chip 11 and the coolant, that is, increase the heat dissipation area of the chip 11, thereby further improving the heat dissipation effect of the chip 11. In one example, the second surface of the chip 11 has a plurality of second grooves 100 arranged at intervals along the second direction D2, and all the second grooves 100 communicate with the heat dissipation channel 17.
[0085] The liquid-cooled heat dissipation packaging structure provided in this specific embodiment mounts a chip and a liquid-cooled heat dissipation structure on the front side of a substrate. The liquid-cooled heat dissipation structure includes an upper cover, a lower support, and a heat dissipation channel for transmitting coolant. The upper cover is located above the chip along the first direction, and the lower support is attached to the side of the chip and connected to the end of the upper cover. The upper cover, the lower support, and the chip enclose the heat dissipation channel to form the heat dissipation channel. This allows the coolant transmitted through the heat dissipation channel to perform liquid cooling heat dissipation on the chip, enhancing the chip's heat dissipation performance, maintaining stable operation of the chip within the packaged device, and preventing the chip from burning out due to excessive temperature. Furthermore, the opposite ends of the heat dissipation channel are an inlet and an outlet, respectively. The size of the inlet is larger than the size of the outlet, facilitating the flow of coolant within the heat dissipation channel. This allows the coolant to absorb the heat generated by the chip and promptly flow out from the outlet, quickly carrying the heat generated by the chip to the outside of the packaging structure. This improves the heat dissipation efficiency of the liquid-cooled heat dissipation packaging structure and prevents the accumulation of heat generated by the chip inside the liquid-cooled heat dissipation packaging structure. In addition, the heat dissipation channel is formed by the upper cover, the lower support and the chip, which not only shortens the distance between the coolant and the chip, thereby further improving the heat dissipation efficiency of the chip, but also eliminates the need to set a channel embedded in the upper cover, thereby simplifying the manufacturing process of the upper cover and reducing the manufacturing cost of the liquid cooling heat dissipation packaging structure.
[0086] It should be noted that the terms "comprising" and "having," and their variations, used in this utility model document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context; it should be understood that such use of data can be interchanged where appropriate. The term "one or more" depends at least in part on the context and can be used to describe features, structures, or characteristics in a singular sense, or in a plural sense to describe combinations of features, structures, or characteristics. The term "based on" can be understood as not necessarily intended to express an exclusive set of factors, but can instead, also at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, embodiments and features in embodiments of this utility model can be combined with each other without conflict. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this utility model. In the various embodiments described above, each embodiment focuses on the differences from other embodiments; similar / identical parts between embodiments can be referred to mutually.
[0087] The above description is only a preferred embodiment of the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.
Claims
1. A liquid cooling heat dissipation package structure, characterized in that, The application relates to a substrate, a chip and a liquid cooling heat dissipation structure. The substrate comprises a front surface and a back surface oppositely distributed along a first direction; The chip is attached to the front surface of the substrate, and comprises a first surface facing the substrate and a second surface opposite to the first surface along the first direction; The liquid cooling heat dissipation structure comprises an upper cover, a lower support and a heat dissipation channel for transmitting cooling liquid, the upper cover is located above the chip along the first direction, the lower support is attached to the side surface of the chip and connected to the end of the upper cover, the upper cover, the lower support and the chip enclose the heat dissipation channel, and opposite ends of the heat dissipation channel are an inlet and an outlet respectively, and the size of the inlet is larger than that of the outlet.
2. The liquid-cooled thermal dissipation package structure of claim 1, wherein, The surface of the upper cover facing the substrate has a cavity penetrating through the upper cover along a second direction, and the second direction is parallel to the front surface of the substrate; The cavity, the lower support and the chip enclose the heat dissipation channel, and the inlet and the outlet are oppositely distributed along the second direction.
3. The liquid-cooled thermal dissipation package structure of claim 2, wherein, The cavity comprises a middle cavity located above the chip and first and second end cavities oppositely distributed along the second direction at opposite ends of the middle cavity, and the middle cavity communicates with the first and second end cavities; The middle cavity and the chip enclose a main channel, the first end cavity and one end of the lower support enclose the inlet, the second end cavity and the other end of the lower support enclose the outlet, and the main channel, the inlet and the outlet jointly constitute the heat dissipation channel.
4. The liquid-cooled thermal dissipation package structure of claim 3, wherein, The width of the first end cavity and the width of the second end cavity are both smaller than the width of the middle cavity.
5. The liquid-cooled thermal dissipation package structure of claim 3, wherein, The width of the first end cavity is larger than the width of the second end cavity.
6. The liquid-cooled thermal dissipation package structure of claim 3, wherein, The depth of the first end cavity along the first direction is larger than the depth of the second end cavity along the first direction.
7. The liquid-cooled thermal dissipation package structure of claim 6, wherein, In the direction from the first end cavity to the second end cavity along the first direction, the depth of the cavity along the first direction gradually decreases.
8. The liquid-cooled thermal dissipation package structure of claim 1, wherein, The cooling liquid is deionized water.
9. The liquid-cooled thermal dissipation package structure of claim 1, wherein, Further comprising: A barrier layer covering the second surface of the chip, and the barrier layer is used for blocking the cooling liquid from penetrating to the chip.
10. The liquid-cooled thermal dissipation package structure of claim 9, wherein, The barrier layer is a metal material layer.
11. The liquid-cooled thermal dissipation package structure of claim 1, wherein, The lower support comprises a bottom surface facing the substrate and a top surface opposite to the bottom surface along the first direction, and the top surface of the lower support is flush with the second surface of the chip; The heat dissipation channel is only located above the chip and above the lower support.
12. The liquid-cooled thermal dissipation package structure of claim 11, wherein, The lower support is an injection molding part, and the injection molding part is distributed around the outer periphery of the chip and directly attached to the side surface of the chip.
13. The liquid-cooled thermal dissipation package structure of claim 3, wherein, The lower support comprises a bottom surface facing the substrate and a top surface opposite to the bottom surface along the first direction, and the top surface of the lower support is flush with the second surface of the chip; The top surface of the lower support has a recess, the recess communicates with the cavity, and the recess, the cavity and the chip enclose the heat dissipation channel.
14. The liquid-cooled thermal dissipation package structure of claim 13, wherein, The recesses include a first recess and a second recess oppositely distributed along the second direction, the first recess and the first end cavity form the liquid inlet, and the second recess and the second end cavity form the liquid outlet.
15. The liquid-cooled thermal dissipation package structure of claim 14, wherein, The depth of the first recess along the first direction is greater than the depth of the second recess along the first direction.
16. The liquid-cooled thermal dissipation package structure of claim 3, wherein, The middle cavity has a first groove on the inner wall facing the chip, and the first groove is in communication with the middle cavity.
17. The liquid-cooled thermal dissipation package structure of claim 3, wherein, The second surface of the chip has a second groove, and the second groove is in communication with the heat dissipation channel.