A chip package structure

Abstract

The chip packaging structure provided by the embodiment of the present disclosure comprises a substrate, a chip, a passive element, a reinforcing sheet and a heat dissipation cover; the chip and the passive element are arranged on the substrate, and the passive element is located outside the chip; the reinforcing sheet is fixed to an edge region of the substrate; the heat dissipation cover is arranged on a side of the chip and the reinforcing sheet away from the substrate; the substrate, the reinforcing sheet and the heat dissipation cover jointly form a containing cavity, and the chip is contained in the containing cavity; a containing groove is arranged on a side of the reinforcing sheet facing the substrate, and the containing groove contains the passive element; the reinforcing sheet is provided with at least one exhaust passage communicating with the containing groove. The exhaust passage can meet the demand of the passive element for high-temperature water vapor exhaust, and can serve as a good heat dissipation passage, thereby ensuring that the water vapor and heat are dissipated in time, so as to avoid problems such as cracking or delamination of the passive element. The reinforcing sheet is reused as a protective cover for the passive element, and an additional passive element protective cover is not needed, thereby simplifying the packaging process.

Description

Technical Field

[0001] This disclosure pertains to the field of semiconductor packaging technology, specifically relating to a chip packaging structure. Background Technology

[0002] Flip-chip ball grid array (FCBGA) packages are suitable for high-pin-count and high-performance chip packaging. In practical applications of FCBGA, due to heat dissipation requirements, an external heat sink needs to be added to the hardened chip. Its function is to dissipate heat into the environment through natural convection or forced air cooling (such as fan-assisted cooling), which significantly reduces the chip junction temperature (the junction temperature is reduced by about 6.3°C after using an indium chip).

[0003] Before product encapsulation, components and encapsulation materials may absorb some moisture. During the high-temperature encapsulation process of FCBGA, moisture turns into water vapor. If it cannot be discharged in time, it will cause an increase in internal pressure of the encapsulation, which may lead to problems such as cracking and delamination of the encapsulation.

[0004] Furthermore, given the current greater heat dissipation requirements and the need for additional heat sinks, to enhance heat dissipation, indium sheets or other metals are typically used to solder the metal on the chip to the metal on the heat sink using flux. However, during high-temperature reflow, the flux carries molten liquid metal that evaporates and splashes. When this splashed metal falls onto passive components, it can cause a short circuit. To prevent this, protective components are usually added to protect components from solder splashing and subsequent failure. In existing processes, protective covers are used, but these covers are prone to warping or deformation. In subsequent processes, or even during reliability testing, the protective covers may detach, causing components to lose protection and resulting in reliability or product failure. When using protective covers, the surface mount adhesive needs to leave vents to allow for air venting while attaching the reinforcing sheet. However, in actual operation, the surface mount adhesive application needs to meet a certain coverage rate to avoid the risk of delamination in the later stages of product development.

[0005] To address the aforementioned issues, it is necessary to propose a reasonably designed chip packaging structure that can effectively improve these problems. Utility Model Content

[0006] The present disclosure aims to at least solve one of the technical problems existing in the prior art and provide a chip packaging structure.

[0007] This disclosure provides a chip packaging structure, including a substrate, a chip, a passive component, a ruggedized sheet, and a heat sink.

[0008] Both the chip and the passive component are disposed on the substrate, and the passive component is located outside the chip;

[0009] The reinforcing sheet is fixed to the edge region of the substrate;

[0010] The heat dissipation cover is disposed on the side of the chip and the reinforcing sheet facing away from the substrate; wherein the substrate, the reinforcing sheet and the heat dissipation cover together form an accommodating cavity, and the accommodating cavity contains the chip;

[0011] The reinforcing sheet is provided with a receiving groove on the side facing the substrate and corresponding to the passive element, and the passive element is accommodated in the receiving groove.

[0012] The reinforcing plate is provided with at least one exhaust channel that communicates with the receiving tank.

[0013] Optionally, the receiving tank includes a top wall and a first side wall and a second side wall respectively connected to the top wall;

[0014] The top wall is connected to the heat dissipation cover;

[0015] The first sidewall is located between the chip and the passive element;

[0016] The second sidewall is disposed on the outside of the passive element; wherein,

[0017] The second sidewall is provided with at least one exhaust passage that extends through its wall thickness.

[0018] Optionally, the thickness of the second sidewall is greater than the thickness of the first sidewall.

[0019] Optionally, there may be multiple exhaust channels, which are spaced apart on the second sidewall.

[0020] Optionally, the multiple exhaust channels are distributed at equal intervals.

[0021] Optionally, the exhaust channel is horizontally connected to the upper part of the receiving tank.

[0022] Optionally, the cross-section of the exhaust passage is circular or elliptical.

[0023] Optionally, the exhaust channel is formed using a punching process.

[0024] Optionally, the reinforcing sheet can be reused as a protective cover for passive components.

[0025] Optionally, an adhesive layer may also be included;

[0026] The reinforcing sheet is fixed to the substrate by the adhesive layer.

[0027] The chip packaging structure of this disclosure, by providing at least one venting channel connected to the receiving groove on the reinforcing sheet, can meet the high-temperature moisture venting requirements of the passive component itself. The venting channel can serve as a good heat dissipation channel, thereby ensuring timely dissipation of moisture and heat, thus preventing problems such as cracking or delamination of the passive component, improving the reliability of the passive component, and consequently improving the reliability of the chip. A receiving groove is provided on the side of the reinforcing sheet facing the substrate and corresponding to the passive component. An accommodating space is formed between the receiving groove and the substrate, and the receiving groove houses the passive component, providing comprehensive protection. The reinforcing sheet is reused as a protective cover for the passive component. While ensuring the coverage requirements of the product's surface mount adhesive, the mounting step of the passive component protective cover can be eliminated, thereby simplifying the packaging process and preventing abnormal delamination of the reinforcing sheet. Attached Figure Description

[0028] Figure 1 This is a cross-sectional view of a chip packaging structure according to one embodiment of the present disclosure;

[0029] Figure 2 This is a schematic diagram of the planar structure of a reinforcing sheet according to another embodiment of this disclosure;

[0030] Figure 3 This is a cross-sectional schematic diagram of an exhaust passage according to another embodiment of this disclosure. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solutions of the embodiments of this disclosure, the embodiments of this disclosure will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0032] like Figure 1 As shown, this embodiment of the present disclosure provides a chip packaging structure 100, including a substrate 110, a chip 120, a passive component 130, a reinforcing sheet 140, and a heat sink 150.

[0033] Both chip 120 and passive component 130 are disposed on the substrate, with passive component 130 located outside chip 120. Specifically, as shown... Figure 1 and Figure 2 As shown, in this embodiment, the chip 120 is flip-chip disposed in the central region of the substrate 110, and the passive element 130 is located on the outside of the chip 120. The passive element 130 can be a capacitor or an inductor, etc., and this embodiment does not make specific limitations.

[0034] The reinforcing sheet 140 is fixed to the edge region of the substrate 110. Specifically, in this embodiment, the reinforcing sheet 140 is fixed to the edge region of the substrate 110 by an adhesive layer 160. The reinforcing sheet 140 can fix the edge region of the substrate 110 and prevent warping of the edge region of the substrate 110.

[0035] A heat sink 150 is disposed on the side of the chip 120 and the reinforcing sheet 140 facing away from the substrate 110. The substrate 110, the reinforcing sheet 140 and the heat sink 150 together form a receiving cavity, and the receiving cavity contains the chip 120.

[0036] Specifically, such as Figure 1 As shown, the central region of the heat sink 150 is connected to the back of the chip 120, and the edge region of the heat sink 150 is connected to the top of the reinforcing sheet 140. A heat dissipation metal layer 170 is disposed between the heat sink 150 and the chip 120, and the heat dissipation metal layer 170 can be made of indium, etc. Figure 1 As shown, in this embodiment, the heat sink 150 is an external heat sink.

[0037] The reinforcing plate 140 has a receiving groove 141 on the side facing the substrate and corresponding to the passive component 130, and the receiving groove 141 contains the passive component 130.

[0038] Specifically, a receiving groove 141 and a substrate 110 form a receiving space, within which the passive component 130 is disposed. The receiving groove 141 provides all-around protection for the passive component 130. In other words, the reinforcing sheet 140 is reused as a protective cover for the passive component, providing all-around protection for the passive component 130. This eliminates the need for additional passive component protection structures and the mounting of such structures, simplifying the packaging process.

[0039] like Figure 1 and Figure 2 As shown, the reinforcing plate 140 is provided with at least one venting channel 142 that communicates with the receiving groove 141. One end of the venting channel 142 is connected to the receiving groove 141, and the other end of the venting channel 142 is connected to the outer side of the reinforcing plate 140. The high-temperature moisture generated by the mounted passive component 130 and the reinforcing plate 140 can be discharged through the venting channel 142. In addition, the venting channel 142 can also serve as a heat dissipation channel to ensure that moisture and heat are dissipated in a timely manner, thereby avoiding problems such as cracking or delamination of the components themselves.

[0040] The chip packaging structure of this disclosure, by providing at least one venting channel connected to the receiving groove on the reinforcing sheet, can meet the high-temperature moisture venting requirements of the passive component itself. The venting channel can also serve as a good heat dissipation channel, thereby ensuring timely dissipation of moisture and heat, thus preventing problems such as cracking or delamination of the passive component, improving the reliability of the passive component, and consequently improving the reliability of the chip. A receiving groove is provided on the side of the reinforcing sheet facing the substrate and corresponding to the passive component. An accommodating space is formed between the receiving groove and the substrate, and the passive component is housed within the receiving groove, providing comprehensive protection for the passive component. The reinforcing sheet is reused as a protective cover for the passive component. While ensuring the coverage requirements of the product's surface mount adhesive, the mounting step of the passive component protective cover can be eliminated, thereby simplifying the packaging process and preventing abnormal delamination of the reinforcing sheet.

[0041] For example, such as Figure 1 As shown, the receiving tank 141 includes a top wall A and a first side wall B and a second side wall C respectively connected to the top wall A. The top wall A is connected to the heat sink 150. The first side wall B is located between the chip 120 and the passive component 130. The second side wall C is disposed on the outside of the passive component 130.

[0042] The top wall A, the first side wall B, and the second side wall C form an accommodating space with the substrate 110. The passive element 130 is disposed in the accommodating space, which can achieve all-round protection for the passive element 130. In other words, in this embodiment, the reinforcing sheet 140 can be reused as a protective cover for the passive element, and at the same time, it plays an all-round protection role for the passive element 130.

[0043] The second sidewall C is provided with at least one exhaust channel 142 that penetrates its wall thickness, so as to discharge the high-temperature water vapor in the containing tank 141 through the exhaust channel 142.

[0044] For example, such as Figure 1 and Figure 2 As shown, in this embodiment, the thickness of the second sidewall C is greater than the thickness of the first sidewall B. The first sidewall B can protect the passive component 130 from solder sputtering, while the thicker second sidewall C can provide good fixation for the substrate 110.

[0045] For example, such as Figure 2 As shown, in this embodiment, there are multiple exhaust channels 142, which are spaced apart on the second sidewall C. Preferably, in this embodiment, the multiple exhaust channels 142 can be evenly distributed. It should be noted that this embodiment does not specifically limit the number and distribution of exhaust channels 142, and can be selected according to actual needs.

[0046] For example, such as Figure 1As shown, the exhaust channel 142 is horizontally connected to the upper part of the receiving tank 141. Since the high-temperature water vapor is mainly distributed in the upper part of the receiving tank 141, the horizontal connection of the exhaust channel 142 to the upper part of the receiving tank 141 can better exhaust the high-temperature water vapor from the receiving tank 141 and improve the reliability of the packaging structure.

[0047] For example, in this embodiment, the cross-section of the exhaust channel 142 can be circular or elliptical, etc. The cross-sectional shape of the exhaust channel 142 can be selected according to actual needs, and this embodiment does not impose a specific limitation. In addition, this embodiment does not impose a specific limitation on the size of the exhaust channel 142, and it can be limited according to actual needs.

[0048] For example, such as Figure 3 As shown in Figure a, the cross-section of the exhaust passage 142 can be a large-sized ellipse; as... Figure 3 As shown in b, the cross-section of the exhaust channel 142 can also be a small-sized ellipse; such as Figure 3 As shown in c and 3d, the cross-section of the exhaust channel 142 can also be a series of small elliptical shapes connected in sequence.

[0049] For example, in this embodiment, the exhaust channel 142 can be formed by a punching process. The exhaust channel 142 is formed by punching through the wall thickness of the second sidewall C.

[0050] The packaging process of the chip packaging structure 100 in this embodiment can be as follows:

[0051] First, the passive component 130 is mounted on the substrate 110, and then the chip 120 is flip-chip mounted on the central area of ​​the substrate 110. An underfill layer is filled between the chip 120 and the substrate 110. Adhesive is applied to the edge area of ​​the substrate 110 corresponding to the reinforcing sheet 140. The reinforcing sheet 140 is fixed to the edge area of ​​the substrate 110 by the adhesive layer 160 and then baked and cured. Balls are placed on the back side of the substrate 110 and reflowed. The central area of ​​the heat sink 150 is mounted on the back side of the chip 120, and the edge area of ​​the heat sink 150 is mounted on the top of the reinforcing sheet 140 and then reflowed and soldered.

[0052] The packaging process of the chip packaging structure 100 in this embodiment can also be as follows:

[0053] First, the passive component 130 is mounted on the substrate 110, and then the chip 120 is flip-chip mounted on the central area of ​​the substrate 110. An underfill layer is filled between the chip 120 and the substrate 110. Adhesive is applied to the edge area of ​​the substrate 110 corresponding to the reinforcing sheet 140. The reinforcing sheet 140 is fixed to the edge area of ​​the substrate 110 by the adhesive layer 160 and then baked and cured. The central area of ​​the heat sink 150 is mounted on the back of the chip 120, and the edge area of ​​the heat sink 150 is mounted on the top of the reinforcing sheet 140 and then reflow soldered. Balls are placed on the back of the substrate 110 and then reflowed.

[0054] Compared to the original process, the chip structure packaging process of this embodiment reduces the application of adhesive and bonding of the passive component protective cover. While simplifying the process, it achieves the following effects: the reinforcing sheet is reused as a passive component protective cover, realizing full-enclosed protection for the passive component 130. While ensuring the coverage of the product's surface mount adhesive, the exhaust channel 142 exhausts the moisture from the high-temperature packaging process. The exhaust channel 142 serves as a good heat dissipation channel, ensuring that moisture and heat are dissipated in a timely manner, thereby avoiding problems such as cracking or delamination of the passive component 130 itself, or product failure or delamination during the reliability period.

[0055] It is understood that the above embodiments are merely exemplary implementations used to illustrate the principles of the embodiments of this disclosure, and the embodiments of this disclosure are not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the embodiments of this disclosure, and these modifications and improvements are also considered to be within the protection scope of the embodiments of this disclosure.

Claims

1. A chip packaging structure, characterized in that, This includes the substrate, chip, passive components, ruggedized sheet, and heat sink; Both the chip and the passive component are disposed on the substrate, and the passive component is located outside the chip; The reinforcing sheet is fixed to the edge region of the substrate; The heat dissipation cover is disposed on the side of the chip and the reinforcing sheet facing away from the substrate; wherein the substrate, the reinforcing sheet and the heat dissipation cover together form an accommodating cavity, and the accommodating cavity contains the chip; The reinforcing sheet is provided with a receiving groove on the side facing the substrate and corresponding to the passive element, and the passive element is accommodated in the receiving groove. The reinforcing plate is provided with at least one exhaust channel that communicates with the receiving tank.

2. The chip packaging structure according to claim 1, characterized in that, The receiving tank includes a top wall and a first side wall and a second side wall respectively connected to the top wall; The top wall is connected to the heat dissipation cover; The first sidewall is located between the chip and the passive element; The second sidewall is disposed on the outside of the passive element; wherein, The second sidewall is provided with at least one exhaust passage that extends through its wall thickness.

3. The chip packaging structure according to claim 2, characterized in that, The thickness of the second sidewall is greater than the thickness of the first sidewall.

4. The chip packaging structure according to claim 2, characterized in that, The number of exhaust channels is multiple, and the multiple exhaust channels are spaced apart on the second side wall.

5. The chip packaging structure according to claim 4, characterized in that, The multiple exhaust channels are distributed at equal intervals.

6. The chip packaging structure according to any one of claims 1 to 5, characterized in that, The exhaust channel is horizontally connected to the upper part of the receiving tank.

7. The chip packaging structure according to any one of claims 1 to 5, characterized in that, The cross-section of the exhaust channel is circular or elliptical.

8. The chip packaging structure according to any one of claims 1 to 5, characterized in that, The exhaust channel is formed using a punching process.

9. The chip packaging structure according to any one of claims 1 to 5, characterized in that, The reinforcing sheet is reused as a protective cover for passive components.

10. The chip packaging structure according to any one of claims 1 to 5, characterized in that, It also includes the adhesive layer; The reinforcing sheet is fixed to the substrate by the adhesive layer.

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