A heat dissipation packaging structure for a memory chip

Abstract

The utility model provides a kind of heat dissipation packaging structure for storage chip, it is related to chip packaging technical field, including packaging bottom plate, the upper of packaging bottom plate is provided with joint packaging mechanism;Joint packaging mechanism includes lower packaging frame, the bottom surface of lower packaging frame is fixedly connected with the upper surface of packaging bottom plate, the upper surface of packaging bottom plate is fixedly connected with two mounting blocks, the side surface of two mounting blocks mutually close is respectively fixedly connected with the front of lower packaging frame and the back of lower packaging frame.This kind of heat dissipation packaging structure for storage chip, can make storage chip main body install between lower packaging frame and upper packaging frame, by the extension block fixed in the both sides of upper packaging frame is clamped to the L type card slot inside that is set up on mounting block, while can make telescopic spring and telescopic guide rod push joint block to extend to L type card slot inside, it is convenient to operate simple structure, to facilitate the repair of this packaging structure, to improve the packaging effect of this heat dissipation packaging structure to storage chip.

Description

Technical Field

[0001] This utility model relates to a heat dissipation packaging structure, specifically a heat dissipation packaging structure for memory chips, and belongs to the field of chip packaging technology. Background Technology

[0002] Packaging is the process of assembling integrated circuits into the final chip product. Simply put, it involves placing the bare integrated circuit die produced by the foundry onto a substrate that serves as a support, bringing out the pins, and then fixing and packaging it into a whole. Memory chips need to be packaged before they can be put into use.

[0003] A memory chip packaging structure disclosed in Chinese Patent Application Publication CN219979550U includes a memory chip body with a packaging mechanism disposed on the outside of the memory chip body. The packaging mechanism includes an upper packaging cover disposed on the top of the memory chip body. This technical solution allows for rapid packaging of the memory chip body, is simple and convenient to operate, and has a good packaging effect. It also avoids the use of thin-film adhesive, thus preventing temperature-related effects on the adhesive's bonding effect. The quick-locking method provides even better packaging results. However, this technical solution involves a complex packaging structure with many components, making it prone to malfunction and causing the memory chip packaging to fail, thus affecting the use of the memory chip. Furthermore, the numerous components make it difficult to easily repair the packaging structure, thus affecting the heat dissipation and packaging of the memory chip.

[0004] Therefore, a heat dissipation packaging structure for memory chips is proposed here. Utility Model Content

[0005] This invention proposes a heat dissipation packaging structure for memory chips to solve the problem that the packaging structure in the prior art contains many complex parts and is prone to damage.

[0006] This utility model is achieved through the following technical solution: a heat dissipation packaging structure for memory chips, including a packaging base plate, and a snap-fit ​​packaging mechanism is provided on the top of the packaging base plate;

[0007] The snap-fit ​​sealing mechanism includes a lower sealing frame, the bottom surface of which is fixedly connected to the upper surface of a sealing base plate. Two mounting blocks are fixedly connected to the upper surface of the sealing base plate. The sides of the two mounting blocks that are close to each other are fixedly connected to the front and back of the lower sealing frame, respectively. Each mounting block has an L-shaped slot on its upper surface. An upper sealing frame is provided above the lower sealing frame. An extension block is fixedly connected to the front and back of the upper sealing frame. The two extension blocks are snapped into the interior of the two L-shaped slots. The sides of the two extension blocks that are far apart from each other have mounting grooves. A telescopic spring and a telescopic guide rod are fixedly connected to the inner wall of each mounting groove. The inner walls of the two telescopic springs are in contact with the outer surfaces of the two telescopic guide rods. A snap-fit ​​block is fixedly connected to the far ends of the two telescopic springs and the telescopic ends of the two telescopic guide rods. The two snap-fit ​​blocks are slidably connected to the interior of the two L-shaped slots.

[0008] The snap-fit ​​packaging mechanism and the packaging base plate are both equipped with a compression packaging component, and the snap-fit ​​packaging mechanism is equipped with a mounting and fixing component on the outside.

[0009] The extrusion packaging assembly includes a memory chip body. The outer surface of the memory chip body is in contact with the inner wall of the lower packaging frame and the inner wall of the upper packaging frame. An extrusion plate is fixedly connected to the inner wall of the packaging base plate and the inner wall of the upper packaging frame. Two sets of support columns are fixedly connected to the sides of the two extrusion plates that are close to each other. The outer surfaces of the two sets of support columns are fixedly connected to the inner walls of the lower packaging frame and the upper packaging frame, respectively. The ends of the two sets of support columns that are close to each other are in contact with the upper surface and the bottom surface of the memory chip body, respectively.

[0010] The mounting and fixing assembly includes two sets of fixing bolts. Each set of fixing bolts is threaded into the interior of the encapsulation base plate, and the bottom end of each set of fixing bolts penetrates the encapsulation base plate and extends into the interior of the encapsulation base plate.

[0011] Each set of fixing bolts has a compression ring fitted on its outer surface, and the bottom surface of each set of compression rings is in contact with the upper surface of the encapsulation base plate.

[0012] Each of the two extension blocks has an extension hole on one side that is close to each other, and the two extension holes are respectively connected to the interior of the two telescopic guide rods.

[0013] Each of the extrusion plates has heat dissipation holes arranged at equal intervals on its upper surface, and there are at least two sets of heat dissipation holes.

[0014] This utility model provides a heat dissipation packaging structure for memory chips, which has the following beneficial effects:

[0015] 1. This heat dissipation packaging structure for memory chips utilizes the cooperation of a lower and upper packaging frame on a packaging base plate to mount the memory chip body between the lower and upper packaging frames. Extension blocks fixed on both sides of the upper packaging frame can engage with L-shaped slots on the mounting block. A mounting groove on one side of the mounting block allows for the installation of a telescopic spring, a telescopic guide rod, and a locking block. The telescopic spring and guide rod push the locking block into the L-shaped slot, facilitating the packaging of the memory chip. The structure is simple and easy to operate, making maintenance convenient and improving the packaging effect of the heat dissipation packaging structure on the memory chip.

[0016] 2. This heat dissipation packaging structure for memory chips can encapsulate the memory chip body using a lower packaging frame and an upper packaging frame. Furthermore, through the packaging base plate and the extrusion plate fixed inside the upper packaging frame, and with two sets of support pillars set between the extrusion plate and the memory chip body, the memory chip body can be stably encapsulated inside the lower and upper packaging frames, and the heat generated by the memory chip body during operation can be dissipated, thereby further improving the packaging effect of the heat dissipation packaging structure for memory chips. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the packaging base plate of this utility model;

[0018] Figure 2 This is a schematic diagram of the main structure of the memory chip of this utility model;

[0019] Figure 3 This is a bottom view of the upper packaging frame of this utility model.

[0020] Figure 4 This is a cross-sectional view of the extension block of this utility model.

[0021] Explanation of reference numerals in the attached figures

[0022] 1. Packaging base plate;

[0023] 2. Snap-fit ​​sealing mechanism; 201. Lower sealing frame; 202. Upper sealing frame; 203. Mounting block; 204. L-shaped slot; 205. Extension block; 206. Mounting groove; 207. Telescopic spring; 208. Telescopic guide rod; 209. Snap-fit ​​block;

[0024] 3. Extrusion encapsulation assembly; 301. Memory chip body; 302. Extrusion plate; 303. Support column;

[0025] 4. Install and fix the components; 401. Fixing bolts; 402. Compression ring;

[0026] 5. Extension holes; 6. Heat dissipation holes. Detailed Implementation

[0027] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this application.

[0028] Please see Figures 1-4 This utility model provides a heat dissipation packaging structure for a memory chip, including a packaging base plate 1, and a snap-fit ​​packaging mechanism 2 is provided on the top of the packaging base plate 1.

[0029] Please refer to this carefully. Figure 1 , Figure 2 , Figure 3 and Figure 4 The snap-fit ​​sealing mechanism 2 includes a lower sealing frame 201, the bottom surface of which is fixedly connected to the upper surface of the sealing base plate 1. Two mounting blocks 203 are fixedly connected to the upper surface of the sealing base plate 1. The sides of the two mounting blocks 203 that are close to each other are fixedly connected to the front and back of the lower sealing frame 201, respectively. Each mounting block 203 has an L-shaped slot 204 on its upper surface. An upper sealing frame 202 is positioned above the lower sealing frame 201. Extension blocks 205 are fixedly connected to both the front and back of the upper sealing frame 202. The two extension blocks 205 are snapped into the interior of the two L-shaped slots 204. Mounting grooves 206 are provided on the sides of the two extension blocks 205 that are far apart from each other. A telescopic spring 207 and a telescopic guide rod 208 are fixedly connected to the inner wall of each mounting groove 206. Rod 208 is a telescopic structure comprising a fixed cylinder and a telescopic rod. The inner walls of two telescopic springs 207 are in contact with the outer surfaces of two telescopic guide rods 208. The ends of the two telescopic springs 207 that are far apart from each other and the telescopic ends of the two telescopic guide rods 208 are fixedly connected to snap-fit ​​blocks 209. The two snap-fit ​​blocks 209 are slidably connected to the interiors of two L-shaped slots 204. The sides of the two extension blocks 205 that are close to each other are provided with extension holes 5. The two extension holes 5 are respectively connected to the interiors of the two telescopic guide rods 208. By providing extension holes 5 on one side of the extension blocks 205, it is easy to connect the extension holes 5 with the fixed cylinder of the telescopic guide rod 208, thereby allowing the snap-fit ​​blocks 209 to slide into the interior of the mounting slot 206, so that the telescopic rod of the telescopic guide rod 208 extends into the interior of the extension holes 5, thus facilitating the use of this structure.

[0030] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3The snap-fit ​​packaging mechanism 2 and the packaging base plate 1 are both equipped with a compression packaging assembly 3. The snap-fit ​​packaging mechanism 2 is equipped with a mounting and fixing assembly 4. The compression packaging assembly 3 includes a memory chip body 301. The outer surface of the memory chip body 301 is in contact with the inner wall of the lower packaging frame 201 and the inner wall of the upper packaging frame 202. Compression plates 302 are fixedly connected to the inner walls of the packaging base plate 1 and the upper packaging frame 202. Two sets of support columns 30 are fixedly connected to the sides of the two compression plates 302 that are close to each other. 3. The outer surfaces of the two sets of support columns 303 are fixedly connected to the inner walls of the lower encapsulation frame 201 and the upper encapsulation frame 202, respectively. The ends of the two sets of support columns 303 that are close to each other are in contact with the upper surface and the bottom surface of the memory chip body 301, respectively. By the cooperation of the extrusion plate 302 and the support columns 303, the memory chip body 301 that is snapped into the lower encapsulation frame 201 and the upper encapsulation frame 202 can be extruded and positioned, thereby improving the installation stability of the memory chip body 301.

[0031] Please refer to this carefully. Figure 1 and Figure 3 Each extrusion plate 302 has heat dissipation holes 6 arranged at equal intervals on its upper surface. There are at least two sets of heat dissipation holes 6. The heat dissipation holes 6 on the extrusion plate 302 are used to dissipate the heat generated by the memory chip body 301 during operation, thereby improving the working environment of the memory chip body 301 that is snapped into the lower packaging frame 201 and the upper packaging frame 202.

[0032] Please refer to this carefully. Figure 1 and Figure 2 The mounting and fixing component 4 includes two sets of fixing bolts 401. Each set of fixing bolts 401 is threaded into the interior of the packaging base plate 1. The bottom end of each set of fixing bolts 401 penetrates the packaging base plate 1 and extends into the interior of the packaging base plate 1. By manually using the two sets of fixing bolts 401, the packaging base plate 1 can be installed and fixed in the required position, thereby enabling a part of the heat dissipation packaging structure to be installed and fixed in the required position for the circuit board.

[0033] Please refer to this carefully. Figure 1 and Figure 2 Each set of fixing bolts 401 has a compression ring 402 fitted on its outer surface. The bottom surface of each set of compression rings 402 is in contact with the upper surface of the packaging base plate 1. By using the compression rings 402, the contact area between the fixing bolts 401 and the packaging base plate 1 is increased, thereby improving the installation stability of the heat dissipation packaging structure for the memory chip.

[0034] When using this utility model: When it is necessary to use the heat dissipation packaging structure of the memory chip to heat dissipate and package the memory chip body 301, the packaging base plate 1 is first placed manually at the position required for the installation circuit board, and threaded holes corresponding to the fixing bolts 401 are drilled at the position. Two sets of fixing bolts 401 can be threaded through the packaging base plate 1 and connected to the threaded holes, so that a part of the heat dissipation packaging structure can be installed and fixed at the position required for the installation circuit board.

[0035] Next, the memory chip body 301 is manually installed into the lower packaging frame 201. The top of the two sets of support pillars 303 securely attaches the memory chip body 301 into the lower packaging frame 201. At the same time, the upper packaging frame 202 is manually placed over the lower packaging frame 201, securing the memory chip body 301 into the upper packaging frame 202. The bottom of the two sets of support pillars 303 securely attaches the memory chip body 301 into both the lower packaging frame 201 and the upper packaging frame 202.

[0036] Then, the extension blocks 205 fixed on both sides of the upper encapsulation frame 202 can be slidably engaged into the L-shaped slots 204 fixed on both sides of the lower encapsulation frame 201. Since mounting slots 206 are opened on one side of the two extension blocks 205, the telescopic spring 207 and the telescopic guide rod 208 can be installed into the inner wall of the mounting slot 206. Thus, the compression action of the telescopic spring 207 and the guiding action of the telescopic guide rod 208 can be used to make the engaging block 209 slide out of the mounting slot 206 until the engaging block 209 can slide out. The extension block 205 is moved into the L-shaped slot 204, thereby using two extended snap-fit ​​blocks 209 to prevent the extension block 205 from being pulled out of the L-shaped slot 204 opened in the mounting block 203. This allows for the installation and limiting of the lower encapsulation frame 201 and the upper encapsulation frame 202, thus encapsulating the memory chip body 301. The heat dissipation holes 6 opened in the two extrusion plates 302 can dissipate the heat generated by the memory chip body 301 during operation, thereby facilitating the heat dissipation encapsulation of the memory chip body 301.

[0037] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation packaging structure for a memory chip, comprising a packaging substrate (1), characterized in that: A snap-fit ​​packaging mechanism (2) is provided above the packaging base plate (1); The snap-fit ​​sealing mechanism (2) includes a lower sealing frame (201), the bottom surface of which is fixedly connected to the upper surface of the sealing base plate (1). Two mounting blocks (203) are fixedly connected to the upper surface of the sealing base plate (1). The two mounting blocks (203) are fixedly connected to the front and back sides of the lower sealing frame (201) respectively on their sides. Each mounting block (203) has an L-shaped slot (204) on its upper surface. An upper sealing frame (202) is provided above the lower sealing frame (201). An extension block (204) is fixedly connected to both the front and back sides of the upper sealing frame (202). 5) The two extension blocks (205) are respectively snapped into the interior of the two L-shaped slots (204). The two extension blocks (205) are provided with mounting slots (206) on the side away from each other. The inner wall of each mounting slot (206) is fixedly connected with a telescopic spring (207) and a telescopic guide rod (208). The inner wall of the two telescopic springs (207) is in contact with the outer surface of the two telescopic guide rods (208). The ends of the two telescopic springs (207) away from each other and the telescopic ends of the two telescopic guide rods (208) are fixedly connected with snap-fit ​​blocks (209). The two snap-fit ​​blocks (209) are slidably connected to the interior of the two L-shaped slots (204). The snap-fit ​​sealing mechanism (2) and the sealing base plate (1) are both provided with a compression sealing component (3), and the snap-fit ​​sealing mechanism (2) is provided with an installation and fixing component (4) on the outside.

2. The heat dissipation packaging structure for a memory chip according to claim 1, characterized in that: The extrusion packaging assembly (3) includes a memory chip body (301). The outer surface of the memory chip body (301) is in contact with the inner wall of the lower packaging frame (201) and the inner wall of the upper packaging frame (202). The inner wall of the packaging base plate (1) and the inner wall of the upper packaging frame (202) are both fixedly connected with extrusion plates (302). Two sets of support columns (303) are fixedly connected to the side of the two extrusion plates (302) that are close to each other. The outer surfaces of the two sets of support columns (303) are fixedly connected to the inner wall of the lower packaging frame (201) and the inner wall of the upper packaging frame (202), respectively. The ends of the two sets of support columns (303) that are close to each other are in contact with the upper surface of the memory chip body (301) and the bottom surface of the memory chip body (301), respectively.

3. The heat dissipation packaging structure for a memory chip according to claim 1, characterized in that: The mounting and fixing assembly (4) includes two sets of fixing bolts (401). Each set of fixing bolts (401) is threaded into the interior of the encapsulation base plate (1). The bottom end of each set of fixing bolts (401) penetrates the encapsulation base plate (1) and extends into the interior of the encapsulation base plate (1).

4. The heat dissipation packaging structure for a memory chip according to claim 3, characterized in that: Each set of fixing bolts (401) has a compression ring (402) fitted on its outer surface, and the bottom surface of each set of compression rings (402) is in contact with the upper surface of the encapsulation base plate (1).

5. The heat dissipation packaging structure for a memory chip according to claim 1, characterized in that: The two extension blocks (205) are provided with extension holes (5) on their sides that are close to each other, and the two extension holes (5) are respectively connected to the interior of the two telescopic guide rods (208).

6. The heat dissipation packaging structure for a memory chip according to claim 2, characterized in that: Each of the extrusion plates (302) has heat dissipation holes (6) arranged at equal intervals on its upper surface, and there are at least two sets of heat dissipation holes (6).

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