Automatic annular cutting mechanism for silicon wafer back adhesive film

Abstract

The utility model provides a kind of automatic annular cutting mechanism of silicon wafer back adhesive film, belong to annular cutting technical field, including base and its top is connected with limiting piece, base top is connected with support bracket, support bracket top is connected with ring cutting component, the ring cutting component includes with the support bracket top connection electric telescopic handle, electric telescopic handle bottom telescopic end is connected with connecting bracket, support bracket top bottom surface is connected with telescopic connecting rod, telescopic connecting rod telescopic end is connected with connecting bracket, the connecting bracket top is connected with motor bracket, motor bracket is connected with rotating motor, rotating motor bottom output end is connected with driving pulley and is connected with connecting bracket, driving pulley and connecting bracket side surface rotationally connected, for the problem that traditional device cannot carry out circular cutting to silicon wafer, the utility model can realize the annular cutting effect of silicon wafer by the mode of gear transmission combination, to ensure the accurate cutting processing effect of the device.

Description

Technical Field

[0001] This utility model relates to the field of ring cutting technology, specifically to an automatic ring cutting mechanism for silicon wafer adhesive film. Background Technology

[0002] Silicon wafers are the primary production material in the semiconductor and photovoltaic industries. Multi-wire silicon wafer dicing is currently one of the most advanced silicon wafer processing technologies in the world. It differs from traditional saw blades, grinding wheels, and other cutting methods, as well as advanced laser cutting and internal circular cutting. Its principle involves a high-speed moving steel wire driving a cutting blade attached to the wire to rub against the silicon rod, thus achieving the cutting effect.

[0003] Chinese patent CN210616985U discloses an automatic circulating spray silicon wafer cutting machine for cutting silicon wafers.

[0004] However, the above-mentioned disclosed solutions have the following shortcomings: In actual use, the above-mentioned solutions can only perform linear cutting of silicon wafers using the above-mentioned wire cutting processing method, which results in the above-mentioned device being unable to cut circular silicon wafers, thus leading to low cutting compatibility of the above-mentioned device.

[0005] This invention proposes an automatic circular cutting mechanism for silicon wafer adhesive film to solve the problem. Utility Model Content

[0006] The purpose of this invention is to achieve the effect of circumferential cutting of silicon wafers by means of a symmetrically rotating cutting component structure, thereby ensuring the accuracy of silicon wafer cutting and overcoming the problems mentioned in the background art.

[0007] Based on the above technical concept, the technical solution adopted by this utility model is as follows: An automatic circular cutting mechanism for silicon wafer adhesive film includes a base and a limiting component connected to its top. A support bracket is connected to the top of the base, and a circular cutting component is connected to the top of the support bracket for circular cutting of silicon wafers.

[0008] Further defining the above technical solution, the circumferential cutting component includes an electric telescopic rod connected to the top of the support bracket. The telescopic end of the electric telescopic rod is connected to a connecting bracket. A telescopic connecting rod is connected to the bottom surface of the top of the support bracket. The telescopic end of the telescopic connecting rod is connected to the connecting bracket. Two telescopic connecting rods are provided at the bottom of the support bracket. The two telescopic connecting rods are symmetrically arranged on both sides of the electric telescopic rod. The telescopic connecting rods can ensure that the connecting bracket will not tilt during the lifting and lowering process.

[0009] Further defining the above technical solution, the top of the connecting bracket is connected to a motor bracket, the motor bracket is connected to a rotating motor, the bottom output end of the rotating motor passes through the connecting bracket and is connected to a drive pulley, the drive pulley is rotatably connected to the side of the connecting bracket, and the drive pulley and the driven pulley are provided with protrusions on both sides, the protrusions having a limiting effect on the transmission belt.

[0010] Further defining the above technical solution, a driven pulley is rotatably connected to the bottom of the connecting bracket. The driven pulley and the driving pulley are connected by a transmission belt. An internal gear ring is connected to the inner arc surface of the driven pulley. The internal gear ring is rotatably connected to the side of the connecting bracket. By using the internal gear ring to drive multiple sets of driven gears to revolve, the number of driven gears can be increased or decreased according to the actual cutting and processing needs during actual use, thereby achieving the effect of cutting several cutting parts simultaneously.

[0011] Further defining the above technical solution, a fixed gear is connected inside the bottom of the connecting bracket at the center of the driven pulley. The fixed gear meshes with two driven gears, which mesh with the internal gear ring. A connecting plate is connected to the side of the fixed gear away from the connecting bracket. The bottom of the connecting bracket is provided with an annular groove, and a protrusion is provided at the center of the top of the driven gear. The protrusion is slidably connected inside the annular groove. The combination of the annular groove and the protrusion can limit the movement trajectory of the driven gear during its revolution, thereby preventing the driven gear from tilting or other problems during its revolution.

[0012] Further defining the above technical solution, the diameter of the connecting plate is larger than the outer diameter of the fixed gear, and an elastic telescopic rod is connected to the bottom of the driven gear. The other end of the elastic telescopic rod is connected to a cutting component. The structure of the elastic telescopic rod ensures that the cutting component is in full contact with the silicon wafer surface during the downward pressing process of the electric telescopic rod, thereby achieving a stable cutting processing effect of the device.

[0013] Further defining the above technical solution, a suction cup is connected to the end of the connecting plate away from the fixed gear, the suction cup being located directly below the center of the fixed gear. The bottom of the cutting component is conical, and a wear-resistant layer is provided on the outer surface of the cutting component. An installation groove is provided at the bottom of the elastic telescopic rod, and a docking joint is provided at the top of the cutting component. The docking joint is connected to the installation groove. Through the docking installation combination, the device can replace the corresponding cutting component according to the actual cutting requirements of the silicon wafer, ensuring that the cutting processing effect of the device is stable and efficient.

[0014] Compared with the prior art, the beneficial effects of this utility model are: 1. Simple operation: This device can achieve automated processing by combining an electric telescopic rod with a motor. 2. The silicon wafer is subjected to uniform force. This device uses two sets of symmetrical cutting components to perform synchronous ring cutting, which can prevent the silicon wafer from tilting during the cutting process, thereby reducing the risk of the silicon wafer breaking during the cutting process. 3. Easy to adjust: By using fixed gears and driven gears of different diameters, this device can achieve ring cutting effects of different diameters. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the base in an automatic circular cutting mechanism for silicon wafer adhesive film according to this utility model; Figure 2 This is a schematic diagram of the electric telescopic rod in an automatic annular cutting mechanism for silicon wafer adhesive film according to this utility model; Figure 3 This is a schematic diagram of the fixed gear in an automatic annular cutting mechanism for silicon wafer adhesive film according to this utility model.

[0017] The components include: 1. Base; 2. Limiting component; 3. Support bracket; 4. Ring cutting component; 401. Electric telescopic rod; 402. Telescopic connecting rod; 403. Motor bracket; 404. Rotating motor; 405. Connecting bracket; 406. Drive pulley; 407. Transmission belt; 408. Driven pulley; 409. Internal gear ring; 410. Fixed gear; 411. Driven gear; 412. Connecting plate; 413. Suction cup; 414. Elastic telescopic rod; 415. Cutting component. Detailed Implementation

[0018] The following is in conjunction with the appendix Figures 1-3 The present invention will be described in further detail below.

[0019] Example 1: This example provides an automatic circular cutting mechanism for silicon wafer adhesive film, such as... Figures 1-3 As shown, it includes a base 1 and a limiting member 2 connected to its top. A support bracket 3 is connected to the top of the base 1, and a ring-cutting member 4 is connected to the top of the support bracket 3 for ring-cutting of the silicon wafer.

[0020] The ring-cutting component 4 includes an electric telescopic rod 401 connected to the top of the support bracket 3. The bottom telescopic end of the electric telescopic rod 401 is connected to a connecting bracket 405. The top bottom surface of the support bracket 3 is connected to a telescopic connecting rod 402. The telescopic end of the telescopic connecting rod 402 is connected to the connecting bracket 405.

[0021] A motor bracket 403 is connected to the top of the connecting bracket 405. A rotating motor 404 is connected to the motor bracket 403. The bottom output end of the rotating motor 404 passes through the connecting bracket 405 and is connected to a drive pulley 406. The drive pulley 406 is rotatably connected to the side of the connecting bracket 405.

[0022] A driven pulley 408 is rotatably connected to the bottom of the connecting bracket 405. The driven pulley 408 and the driving pulley 406 are connected by a transmission belt 407. An internal toothed ring 409 is connected to the inner arc surface of the driven pulley 408.

[0023] The bottom of the connecting bracket 405 is located at the center of the driven pulley 408 and is internally connected to a fixed gear 410. The fixed gear 410 is meshed with two driven gears 411. The driven gears 411 are meshed with the internal gear ring 409. A connecting plate 412 is connected to the side of the fixed gear 410 away from the connecting bracket 405.

[0024] The electric telescopic rod 401 can drive the connecting bracket 405 to rise and move. During the process of the connecting bracket 405 rising and moving, the telescopic connecting rod 402 structure can prevent the connecting bracket 405 from tilting.

[0025] The rotating motor 404 drives the driving pulley 406 to rotate, thereby causing the driven pulley 408 to rotate along with the driving pulley 406 through the transmission belt 407 structure. The driving pulley 408 rotates horizontally, thereby driving the internal gear 409 inside it to rotate. The internal gear 409, through its cooperation with the fixed gear 410, can drive several driven gears 411 to rotate on their own axis and revolve around the sun, thus achieving the circular cutting effect of this device.

[0026] The diameter of the connecting plate 412 is larger than the outer diameter of the fixed gear 410. The bottom of the driven gear 411 is connected to an elastic telescopic rod 414, and the other end of the elastic telescopic rod 414 is connected to a cutting piece 415. The structure of the connecting plate 412 can support the driven gear 412. The bottom of the driven pulley 408 is provided with a support ring, which contacts the bottom of the driven gear 411. There is a gap between the driven ring and the connecting plate 412, and the gap width is the same as the outer diameter of the elastic telescopic rod 414.

[0027] The connecting plate and the supporting ring support the driven gear 411. At the same time, the gap ensures that the elastic telescopic rod 414 can revolve. The gap also limits the rotation of the elastic telescopic rod 414. The elastic telescopic rod 414 ensures that the cutting part 415 makes stable and full contact with the silicon wafer surface for cutting.

[0028] The specific working principle is as follows: This device can effectively improve the accuracy and stability of circular cutting of silicon wafers. Compared with traditional wire cutting devices, this device can achieve arc cutting by rotating the cutting method.

[0029] Example 2: This example provides an automatic circular cutting mechanism for silicon wafer adhesive film, such as... Figures 1-3 As shown, a suction cup 413 is connected to the end of the connecting plate 412 away from the fixed gear 410. The suction cup 413 is located directly below the center of the fixed gear 410. The bottom of the cutting piece 415 is conical, and a wear-resistant layer is provided on the outer side of the cutting piece 415. The symmetrical structure of the two sets of cutting pieces 415 can make the two ends of the silicon wafer evenly and symmetrically stressed during actual use, thereby avoiding the risk of the silicon wafer breaking due to asymmetrical stress during the cutting process caused by the single cutting structure.

[0030] The specific working principle is as follows: This device achieves circular cutting of silicon wafers through rotational cutting. When in use, the silicon wafer material is placed inside the groove of the limiting member 2, thereby limiting and fixing the silicon wafer material and improving the processing and cutting accuracy of the device. After the silicon wafer material is placed, the electric telescopic rod 401 is activated, which drives the connecting bracket 405 to move downward. At this time, the telescopic connecting rod 402 extends downward, ensuring that the connecting bracket 405 does not tilt. By activating the rotating motor 404, the drive pulley 406 can be driven. The rotation of the drive belt 407 drives the driven pulley 408 to rotate, which in turn drives the internal gear ring 409 connected to its inner arc surface to rotate. With the cooperation of the fixed gear 410, the driven gear 411 rotates on its own axis and revolves around the central axis. The connecting plate 412, which has a diameter larger than that of the fixed gear 410, supports the bottom of the driven gear 411 to prevent it from falling off. The suction cup 413 at the center can adsorb the center position of the silicon wafer during the cutting process, preventing the silicon wafer from moving due to cutting vibration and improving the accuracy of the annular cutting of this device.

[0031] The above description is a further detailed explanation of the present invention in conjunction with specific preferred embodiments, which is intended to enable those skilled in the art to understand and apply the present invention. However, it should not be assumed that the specific implementation of the present invention is limited to these descriptions.

Claims

1. An automatic circular cutting mechanism for silicon wafer adhesive film, comprising a base (1) and a limiting member (2) connected to its top, wherein a support bracket (3) is connected to the top of the base (1), characterized in that, The support bracket (3) is connected to the top of the ring-cutting component (4) for ring-cutting the silicon wafer.

2. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 1, characterized in that, The ring-cutting component (4) includes an electric telescopic rod (401) connected to the top of the support bracket (3). The bottom telescopic end of the electric telescopic rod (401) is connected to a connecting bracket (405). The top bottom surface of the support bracket (3) is connected to a telescopic connecting rod (402). The telescopic end of the telescopic connecting rod (402) is connected to the connecting bracket (405).

3. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 2, characterized in that, The top of the connecting bracket (405) is connected to a motor bracket (403), the motor bracket (403) is connected to a rotating motor (404), the bottom output end of the rotating motor (404) passes through the connecting bracket (405) and is connected to a drive pulley (406), and the drive pulley (406) is rotatably connected to the side of the connecting bracket (405).

4. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 3, characterized in that, The bottom of the connecting bracket (405) is rotatably connected to a driven pulley (408), which is connected to the driving pulley (406) via a transmission belt (407). An internal toothed ring (409) is connected to the inner arc surface of the driven pulley (408).

5. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 4, characterized in that, The bottom of the connecting bracket (405) is located at the center of the driven pulley (408) and is internally connected to a fixed gear (410). The fixed gear (410) is meshed with two driven gears (411). The driven gears (411) are meshed with the internal gear ring (409). A connecting plate (412) is connected to the side of the fixed gear (410) away from the connecting bracket (405).

6. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 5, characterized in that, The diameter of the connecting plate (412) is larger than the outer diameter of the fixed gear (410). The bottom of the driven gear (411) is connected to an elastic telescopic rod (414), and the other end of the elastic telescopic rod (414) is connected to a cutting piece (415).

7. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 6, characterized in that, The end of the connecting plate (412) away from the fixed gear (410) is connected to a suction cup (413), which is located directly below the center of the fixed gear (410).

8. The automatic circular cutting mechanism for silicon wafer adhesive film according to claim 7, characterized in that, The bottom of the cutting part (415) is conical, and the outer side of the cutting part (415) is provided with a wear-resistant layer.

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