Integrated cooker
By installing a cooling fan inside the integrated stove's cavity, the problem of excessively high internal temperature of the lower unit is solved, achieving effective heat dissipation and protecting electronic components.
CN224551601UActive Publication Date: 2026-07-24HANGZHOU ROBAM APPLIANCES CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANGZHOU ROBAM APPLIANCES CO LTD
- Filing Date
- 2025-07-31
- Publication Date
- 2026-07-24
AI Technical Summary
Technical Problem
The internal temperature of the integrated stove's lower-level machine is high during operation, which can easily cause electronic components to fail.
Method used
A cooling fan is installed inside the cavity formed by the lower-level machine, the stove module, and the fume treatment module. The gas inside the cavity is discharged into the housing through the heat dissipation holes to increase the gas flow speed and reduce the temperature.
Benefits of technology
By accelerating gas flow, the heat dissipation effect is improved, the internal temperature of the lower-level machine is reduced, and the failure of electronic components is avoided.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224551601U_ABST
Abstract
The utility model provides a kind of integrated cooker, it is related to cooking equipment technical field.Integrated cooker includes lower computer, cooker module and oil fume processing module, cooker module is set in the top side of lower computer, oil fume processing module is set in the inside of lower computer, oil fume processing module includes shell and oil fume fan, oil fume fan is set in the inside of shell, lower computer, cooker module and oil fume processing module form containing cavity, shell is provided with the heat dissipation hole being communicated with containing cavity, containing cavity is provided with heat dissipation fan.The gas in containing cavity is discharged into shell by heat dissipation fan through heat dissipation hole, the gas flow in containing cavity can be accelerated, so that the heat dissipation effect can be improved, the temperature inside lower computer is reduced, and then the electronic components inside lower computer are not easy to fail.
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