wire bonding head

Abstract

The application provides a wire bonding head, which comprises a head portion having a front bottom surface and a rear bottom surface, the front bottom surface and the rear bottom surface are connected to form a tip, the head portion is used for bonding a wire on a connection pad, and the tip is used for cutting the wire, so that the cut surface of the wire is completely bonded on the connection pad. When the wire bonding head is used for wire bonding, the tip can cut the wire bonded on the connection pad, so that the cut surface of the wire is completely bonded on the connection pad, and the signal (for example, an optical signal) transmitted in the wire can be prevented from leaking, so that the problem of light loss does not occur.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, specifically to a wire bonding method. Background Technology

[0002] When existing photonic wires are wire-bonded to the pads, the waveguide area is exposed due to the bonding angle, resulting in light loss.

[0003] refer to Figure 1 This diagram illustrates how an optical waveguide 02 is bonded to a connecting pad 03 using a bonding head 01; Reference Figure 2 This shows a schematic diagram of the structure of the optical waveguide 02 and the connecting pad 03 after wire bonding. Figure 2 As shown, the end of the optical waveguide 02 extends forward along the connecting pad 03 for a short distance and then curves upward at an angle, causing the optical waveguide region of the optical waveguide 02 (which can be understood as a cross-section, such as...) to... Figure 2 (As shown by the dashed circle) Part of it is exposed and not fully bonded to the connecting pad 03. Therefore, when the optical signal is transmitted to the connecting pad 03 through the optical waveguide 02 (as shown by the dashed circle), some of it is exposed and not fully bonded to the connecting pad 03. Figure 2 As indicated by the solid arrow in the middle, some optical signal will leak out from the end of the optical waveguide 03 (e.g., Figure 2 (As shown by the dashed arrow in the middle), this results in light loss. Utility Model Content

[0004] This application proposes a wire-punching method to avoid light loss after the optical waveguide and the connecting pad are joined.

[0005] This application discloses a bonding head, which includes a head having a front bottom surface and a rear bottom surface, the front bottom surface and the rear bottom surface being connected to form a tip. The head is used to bond a wire to a bonding pad, and the tip is used to cut the wire so that the cut surface of the wire is fully bonded to the bonding pad.

[0006] In some alternative embodiments, the head also has a wiring hole for securing a wire, the wiring hole having a wiring outlet located on the rear bottom surface.

[0007] In some alternative embodiments, the head further includes a front surface in contact with the front bottom surface and a rear surface in contact with the rear bottom surface, the wiring hole having a wiring inlet located on the rear surface.

[0008] In some alternative embodiments, the head further includes a guide groove for guiding the wire, the guide groove being formed at the junction of the front surface and the front bottom surface.

[0009] In some alternative implementations, the distance between the front surface and the rear surface is smaller as they get closer to the tip.

[0010] In some optional embodiments, when the wire tip is in a vertical position, the angle between the front surface and the horizontal plane is 15°-85°, and the angle between the rear surface and the horizontal plane is 20°-85°.

[0011] In some optional embodiments, when the punch head is in a vertical position, the angle between the front bottom surface and the horizontal plane is 5°-85°, and the angle between the rear bottom surface and the horizontal plane is 5°-85°.

[0012] In some optional embodiments, when the wire tap is in a vertical position, the angle between the axis of the wiring hole and the horizontal plane is 15°-85°.

[0013] In some alternative implementations, the width of the head is 5mm-50mm.

[0014] In some optional embodiments, the width of the wiring outlet is 20μm-200μm, and the width of the wiring inlet is 20μm-200μm.

[0015] In some alternative embodiments, the punch head further includes a body located above the head and a wire delivery hole located within the body for delivering the wire.

[0016] In some alternative embodiments, the cable pass has a cable inlet located above the body and a cable outlet located at the rear of the body.

[0017] In some alternative implementations, the cable aperture includes a first stage near the cable inlet, the width of which gradually narrows from top to bottom.

[0018] In some optional implementations, when the wire tip is in a vertical position, the angle between the sidewall of the first stage and the horizontal plane is 5°-85°.

[0019] In some alternative implementations, the cable hole further includes a second stage connecting the first stage, the second stage having a diameter of 10μm-150μm.

[0020] In some alternative embodiments, the punch head further includes a transition portion located between the head and the body, the surface of which is curved.

[0021] As mentioned above, in order to solve the problem of light loss after the optical waveguide is bonded to the connecting pad, this application proposes a wire bonding head, which has a front bottom surface and a rear bottom surface that are connected to each other to form a tip. When used for wire bonding, its head can bond the wire to the connecting pad, and its tip can cut the wire bonded to the connecting pad, so that the cut surface of the wire is fully bonded to the connecting pad. Since the cut surface of the wire is not exposed, the leakage of the signal (such as optical signal) transmitted in the wire can be avoided, thus preventing the problem of light loss. Attached Figure Description

[0022] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0023] Figure 1 This is a schematic diagram of an existing wire bonding structure using wire-head bonding.

[0024] Figure 2 yes Figure 1 A schematic diagram of the optical waveguide and connecting pad that have completed wire bonding;

[0025] Figure 3 This is a three-dimensional perspective structural diagram of one embodiment of the wire-tapping method according to this application;

[0026] Figure 4 This is a three-dimensional perspective structural diagram of an embodiment of the wire-connecting end with a conductor according to this application;

[0027] Figure 5 This is a schematic diagram of a longitudinal cross-sectional structure of one embodiment of the wire tapping according to this application;

[0028] Figure 6 yes Figure 5 A partially enlarged structural diagram;

[0029] Figure 7 This is a longitudinal cross-sectional structural schematic diagram of an embodiment of the wire-connecting end with conductor according to this application;

[0030] Figure 8 This is a schematic diagram of the wire bonding structure of this application;

[0031] Figure 9 yes Figure 8 A schematic diagram of the wire and connecting pad used for wire bonding;

[0032] Figure 10-17 This is a schematic diagram of the manufacturing steps of one embodiment of the wire-tapping method according to this application.

[0033] Explanation of reference numerals / symbols in the attached diagram:

[0034] 01-Wire end; 02-Optical waveguide; 03-Connecting pad;

[0035] 10-Wire tip; 100-Head; 101-Front bottom surface; 102-Rear bottom surface; 103-Tip; 104-Front surface; 105-Rear surface; 106-Guide groove; 200-Wiring hole; 201-Wiring outlet; 202-Wiring inlet; 300-Body; 400-Wire transmission hole; 401-Wire transmission inlet; 402-Wire transmission outlet; 403-First stage; 404-Second stage; 405-Third stage; 500-Transition section;

[0036] 20 - Wire; 30 - Connecting pad;

[0037] 81-Lower mold; 810-Lower cavity; 82-First temporary component; 83-Second temporary component; 84-Upper mold; 840-Upper cavity; 85-Injection port; 86-Nozzle; 87-Slurry; 88-First grinding component; 89-Second grinding component;

[0038] α1 - Angle of the rear bottom surface; α2 - Angle of the front bottom surface; β2 - Angle of the front surface; β1 - Angle of the wiring hole; γ - Angle of the rear surface; SO - Width of the wiring inlet; TO - Width of the wiring outlet; TW - Width of the head; φ - Angle of the first stage; ID - Diameter of the second stage. Detailed Implementation

[0039] The specific embodiments of this application will be described below with reference to the accompanying drawings and examples. Those skilled in the art can easily understand the technical problems solved by this application and the resulting technical effects through the content described herein. It is understood that the specific embodiments described herein are merely illustrative of the relevant invention and are not intended to limit the invention. Furthermore, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings.

[0040] It should be readily understood that the meanings of “on,” “above,” and “on top of” in this application should be interpreted in the broadest sense, such that “on” means not only “directly on something,” but also “on something” including intermediate components or layers existing between the two.

[0041] Furthermore, for ease of description, spatial relative terms such as “below,” “under,” “lower,” “above,” and “upper” may be used herein to describe the relationship of one element or component to another element or component shown in the accompanying drawings. In addition to the orientations described in the figures, spatial relative terms are also intended to cover different orientations of the device during use or operation. The device may be oriented in other ways (rotated 90° or otherwise), and the spatial relative descriptive terms used herein may be interpreted accordingly.

[0042] As used herein, the term "layer" refers to a portion of material comprising a region of a certain thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a homogeneous or heterogeneous continuous structure, with a thickness less than that of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure, or between any pair of horizontal planes therebetween. A layer may extend horizontally, vertically, and / or along a tapered surface. A substrate may be a single layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A single layer may include multiple layers. For example, a semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

[0043] As used herein, the terms “substantially,” “materially,” “approximately,” and “about” are used to indicate and explain minor variations. For example, when used in conjunction with numerical values, the above terms may refer to a range of variation less than or equal to ±10% of the corresponding numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. As another embodiment, the thickness of a film or layer being “substantially uniform” may refer to the average thickness of the film or layer being less than or equal to ±10% of the standard deviation, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces that lie within 50 μm along the same plane (such as within 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm along the same plane). If, for example, two components overlap or overlap within 200 μm, 150 μm, 100 μm, 50 μm, 40 μm, 30 μm, 20 μm, 10 μm, or 1 μm, then the two components can be considered "substantially aligned." If the angle between two surfaces or components is, for example, 90° ± 10° (such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°), then the two surfaces or components can be considered "substantially perpendicular." When used in conjunction with an event or situation, the terms "substantially," "substantially," "approximately," and "about" can refer to the exact occurrence of the event or situation as well as the very close approximation of its occurrence.

[0044] It should be noted that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading of the contents described in the specification. They are not intended to limit the scope of this application and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives of this application, should still fall within the scope of the technical content disclosed in this application. Furthermore, terms such as "above," "first," "second," and "a" used in this specification are merely for clarity of description and are not intended to limit the scope of this application. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of this application's implementation.

[0045] It should also be noted that the longitudinal section corresponding to the embodiment of this application can be the section corresponding to the front view direction, the transverse section can be the section corresponding to the right view direction, and the horizontal section can be the section corresponding to the top view direction.

[0046] Furthermore, where there is no conflict, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.

[0047] refer to Figure 3-9 , Figure 3 This is a three-dimensional perspective structural diagram of one embodiment of the thread-tapping method according to this application. Figure 4 This is a three-dimensional perspective structural diagram of an embodiment of the wire-connecting end with a conductor according to this application; Figure 5 This is a longitudinal cross-sectional structural diagram of one embodiment of the wire-tapping method according to this application. Figure 6 yes Figure 5 A partially enlarged structural diagram. Figure 7 This is a longitudinal cross-sectional structural schematic diagram of an embodiment of the wire-connecting end with conductor according to this application; Figure 8 This is a schematic diagram of the wire bonding structure of this application. Figure 9 yes Figure 8 A schematic diagram of the wire and connecting pad used for wire bonding.

[0048] like Figure 3-9 As shown, the wire bonding head 10 of this application includes a head 100. The head 100 has a front bottom surface 101 and a rear bottom surface 102, which are joined together to form a tip 103. During wire bonding, the head 100 (mainly its front bottom surface 101) is used to bond the wire 20 to the connecting pad 30, and the tip 103 is used to cut the wire 20 so that the cut surface of the wire 20 is fully bonded to the connecting pad 30.

[0049] Here, the wire bonding head 10 can be a wedge-shaped wire bonding head. Wire bonding includes ball bonding and wedge bonding. Wedge bonding uses a wedge-shaped wire bonding head. The energy generated by the ultrasonic generator is transmitted through a transducer under an ultra-high frequency electric field, causing rapid expansion and contraction to produce elastic vibrations. This causes the wedge-shaped wire bonding head to vibrate accordingly. Simultaneously, a certain pressure is applied to the wire bonding head, causing the wedge-shaped wire bonding head to rapidly rub against the surface of the bonding area. This causes plastic deformation between the wire and the surface of the bonding area. This deformation brings the wire and the surface of the bonding area into close contact, achieving atomic bonding and thus forming a bond.

[0050] Here, the wire 20 can be an optical waveguide (e.g., optical fiber) used to transmit optical signals, and correspondingly, the connecting pad 30 can be a light-guiding connecting pad (e.g., transparent inorganic material such as glass or other transparent organic material) corresponding to the optical waveguide. Alternatively, the wire 20 can be a metal wire (e.g., copper, silver, or gold wire) used to transmit electrical signals, and correspondingly, the connecting pad 30 can be a metal connecting pad (e.g., copper solder pad) corresponding to the metal wire.

[0051] Here, the angle of the bottom surface of the head 100 of the wire connector 10 is specially designed, that is, the front bottom surface 101 and the rear bottom surface 102 form a certain angle, so that they can meet to form a tip 103. In this way, when the wire 20 is bonded to the connecting pad 30 using the front bottom surface 101, the tip 103 can cut off the wire 20, so that the cut surface (light guiding area) of the wire 20 is not exposed, but is completely bonded to the connecting pad 30. In this way, the leakage of signals (such as optical signals) transmitted in the wire 20 can be avoided, thus preventing the problem of light loss.

[0052] Here, the wire tip 10 can be a metallic material, such as copper, aluminum, iron, stainless steel, etc.; it can also be a non-metallic material, such as ceramic, glass, etc.; or it can be a mixture of metallic and non-metallic materials. In some optional embodiments, the wire tip 10 can be made of a metallic material and coated with a non-metallic material, such as ceramic, glass, etc.

[0053] In some alternative embodiments, the head of 100 also has a wiring hole 200 for securing the conductor 20, the wiring hole 200 having a wiring outlet 201 located on the rear bottom surface 102. Here, the wiring hole 200 is used to guide and secure the conductor 20 during wire bonding.

[0054] In some alternative embodiments, the head 100 also includes a front surface 104 that contacts the front bottom surface 101 and a rear surface 105 that contacts the rear bottom surface 102. The wiring hole 200 may have a wiring inlet 202 located on the rear surface 105. That is, the wiring hole connects the rear surface 105 and the rear bottom surface 102.

[0055] In some alternative embodiments, the head 100 also includes a guide groove 106 for guiding the wire 20, the guide groove 106 being formed at the junction of the front surface 104 and the front bottom surface 101. The guide groove 106 is used to guide and limit the wire 20, ensuring that the wire 20 is correctly positioned and does not shift during wire bonding.

[0056] In some alternative implementations, such as Figure 5As shown, the distance between the front surface 104 and the rear surface 105 is smaller as they approach the tip 103. For example, the upper half of the head 100 has a trapezoidal cross-sectional shape (wider at the top and narrower at the bottom), while the lower half has an inverted triangle cross-sectional shape with the apex of the inverted triangle pointing downwards; the upper base of the inverted triangle is the lower base of the trapezoid. This design makes the width of the head 100 narrower towards the bottom, which is beneficial for wire bonding.

[0057] In some alternative embodiments, the wire tap 10 of this application also includes a body 300 located above the head 100 and a wire delivery hole 400 located within the body 300, the wire delivery hole 400 being used to deliver wires to the wiring hole 200.

[0058] In some alternative embodiments, the cable aperture 400 has a cable inlet 401 located above the body 300 and a cable outlet 402 located at the rear of the body 300. The wire 20 can enter the cable aperture 400 from the cable inlet 401 and exit from the cable outlet 402.

[0059] In some alternative embodiments, the cable aperture 400 includes a first stage 403 near the cable inlet 401, the width of which gradually narrows from top to bottom. This facilitates the entry of the conductor 20. Further, the cable aperture 400 may also include a second stage 404 connected to the first stage 403, the second stage 404 extending vertically, and the diameters (widths) of the portions of the second stage 404 being approximately equal. Further, the cable aperture 400 may also include a third stage 405 near the cable outlet 402, the third stage 405 being connected to the second stage 404 and laterally bent relative to the second stage 404.

[0060] In some alternative embodiments, the wire tap 10 of this application also includes a transition portion 500 located between the head 100 and the body 300, and the surface of the transition portion 500 may be curved.

[0061] In some alternative embodiments, the head 100, the transition portion 500, and the body 300 are integrally formed to constitute the wire-punching head 10.

[0062] In some alternative implementations, Figure 5-6 The specifications of the wire-punch head 10 of this application are shown. For example... Figure 5-6 As shown, when the wire end 10 is in a vertical position:

[0063] The angle between the front surface 104 and the horizontal plane is called the front surface angle β2, which ranges from 15° to 85°.

[0064] The angle between the rear surface 105 and the horizontal plane is called the rear surface angle γ, which is 20°-85°, preferably 65°-75°, to smoothly support the guide wire 20.

[0065] The angle between the front bottom surface 101 and the horizontal plane is called the front bottom surface angle α2, which is 5°-85°, preferably 30°-45°, to facilitate stringing.

[0066] The angle between the back bottom surface 102 and the horizontal plane is called the back bottom surface angle α1, which is 5°-85°, preferably 30°-45°, to facilitate stringing.

[0067] The angle between the axis of the wiring hole 200 and the horizontal plane is called the wiring hole angle β1, which is 15°-85°, and optionally, β1>α1, so as to smoothly support the guide wire 20.

[0068] The width TO of the wiring outlet 201 is 20μm-200μm;

[0069] The width SO of the wiring inlet 202 is 20μm-200μm;

[0070] The width of the head (TW) is 5mm-50mm;

[0071] The angle between the sidewall of the first stage 403 and the horizontal plane is called the first stage angle φ, which is 5°-85°, preferably 5°-20°.

[0072] The diameter ID of the second-stage 404 is 10μm-150μm.

[0073] The working principle of the wire-pin 10 in this application is further explained below:

[0074] refer to Figure 4 and Figure 7 As shown, the conductor 20 can enter the transmission hole 400 from the transmission inlet 401, exit from the transmission outlet 402, enter the wiring hole 200 from the wiring inlet 202, exit from the wiring outlet 201, then bend forward around the tip 103, pass under the front bottom surface 101, and then pass through the guide groove 106. The guide groove 106 guides and limits the conductor 20 to prevent it from shifting left or right.

[0075] refer to Figure 8 The wire bonding head 10 presses the wire 20 onto the connecting pad 30 downwards to perform wire bonding, so that the wire 20 is bonded to the connecting pad 30, and the wire 20 is cut off by the tip 103.

[0076] refer to Figure 9 The diagram shows the structure of the completed wire bonding, where the wire 20 is bonded to the connecting pad 30 at a certain angle (acute angle). The cut surface of the wire 20 is not exposed and is fully bonded to the connecting pad 30. From a top view, the bonding surface of the two will be circular or elliptical.

[0077] refer to Figure 10-17 , Figure 10-17 This is a schematic diagram of the manufacturing steps of one embodiment of the wire-pinning 10 according to this application.

[0078] like Figure 10-17 As shown, the manufacturing steps of the wire tip 10 in this application may include:

[0079] refer to Figure 10 A lower mold 81 is provided, which has a lower cavity 810. In this step, a first temporary component 82 and a second temporary component 83 are embedded in the lower cavity 810.

[0080] refer to Figure 11 An upper mold 84 is provided, which has an upper cavity 840 and an injection port 85 communicating with the upper cavity 840; the upper mold 84 is joined above the lower mold 81, and the upper cavity 840 and the lower cavity 810 are merged into a closed cavity communicating with the injection port 85.

[0081] refer to Figure 12 The slurry 87 is injected into the closed cavity through the injection port 85 using the nozzle 86. The injected slurry 87 fills the closed cavity and covers the first temporary member 82 and the second temporary member 83, and then the slurry 87 is allowed to solidify. Here, the slurry 87 can be a ceramic slurry, which can be made by mixing ceramic powder and a binder.

[0082] refer to Figure 13 Separate the upper mold 84 and the lower mold 81 to obtain the prototype of the wire-punching head 10. At this time, the wire-punching head 10 still retains the first temporary part 82 and the second temporary part 83, and is not yet fully formed.

[0083] refer to Figure 14 By heating and sintering at high temperature, the binder in the slurry 87 is removed, and the remaining ceramic powder is sintered into a dense body. The first temporary part 82 and the second temporary part 83 are also removed, thereby making the wire head 10 basically formed. At this time, since the first temporary part 82 and the second temporary part 83 are removed, two holes are formed in the wire head 10. The sintered wire head 10 is a dense ceramic material.

[0084] refer to Figure 15-17 The wire-punching head 10 has been initially formed. The first grinding part 88 and the second grinding part 89 can be used to polish the wire-punching head 10, for example, to polish the opening of the hole, so that the wire-punching head 10 is finally formed.

[0085] refer to Figure 17 The diagram shows a cross-sectional view of the final formed wire tip 10.

[0086] Although this application has been described and illustrated with reference to specific embodiments thereof, such description and illustration are not limiting of this application. It will be readily understood by those skilled in the art that various changes can be made and equivalent elements can be substituted within embodiments without departing from the true spirit and scope of this application as defined by the appended claims. Illustrations may not be drawn to scale. Differences may exist between the technical representation in this application and actual implementation due to variables in the manufacturing process, etc. Other embodiments of this application may exist that are not specifically described. The description and illustrations should be considered illustrative rather than restrictive. Modifications can be made to adapt particular circumstances, materials, composition, methods, or processes to the objectives, spirit, and scope of this application. All such modifications fall within the scope of the appended claims. While the methods disclosed herein have been described with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or reordered to form equivalent methods without departing from the teachings of this application. Therefore, unless specifically indicated herein, the order and grouping of operations do not limit this application.

Claims

1. A method for finishing thread ends, characterized in that, Includes a head having a front bottom surface and a rear bottom surface, the front bottom surface and the rear bottom surface being joined together to form a tip, the head being used to bond a wire to a connecting pad, and the tip being used to cut the wire so that the cut surface of the wire is fully bonded to the connecting pad.

2. The wire-end tapping method according to claim 1, characterized in that, The head also includes a front surface that contacts the front bottom surface, a rear surface that contacts the rear bottom surface, and a wiring hole for fixing wires, the wiring hole having a wiring inlet located on the rear surface and a wiring outlet located on the rear bottom surface.

3. The wire-end tapping method according to claim 2, characterized in that, The head also includes a guide groove for guiding the wire, the guide groove being formed at the junction of the front surface and the front bottom surface.

4. The wire-end tapping method according to claim 2, characterized in that, The closer the front surface and the rear surface are to the tip, the smaller the distance between them.

5. The wire-end tapping method according to claim 2, characterized in that, When the wire tip is in a vertical position, the angle between the front surface and the horizontal plane is 15°-85°, and the angle between the rear surface and the horizontal plane is 20°-85°.

6. The wire-end tapping method according to claim 1, characterized in that, When the wire tip is in a vertical position, the angle between the front bottom surface and the horizontal plane is 5°-85°, and the angle between the rear bottom surface and the horizontal plane is 5°-85°.

7. The wire-end tapping method according to claim 1, characterized in that, The width of the head is 5mm-50mm.

8. The wire-end tapping method according to claim 2, characterized in that, The width of the wiring outlet is 20μm-200μm, and the width of the wiring inlet is 20μm-200μm.

9. The wire-end tapping method according to claim 1, characterized in that, It also includes a body located above the head and a wire feed hole located within the body, the wire feed hole having a wire feed inlet located above the body and a wire feed outlet located at the rear of the body.

10. The wire-end tapping according to claim 9, characterized in that, The cable delivery hole includes a first stage near the cable delivery inlet. When the cable tap is in a vertical position, the angle between the sidewall of the first stage and the horizontal plane is 5°-85°.

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