Integrated desiccant MEMS micromirror modular moisture protection assembly

Abstract

The utility model provides a kind of integrated desiccant's MEMS micro mirror modularization moisture-proof assembly, comprising: micro mirror module, the moisture-proof assembly for being used to carry out moisture-proof is fixed in micro mirror module outside, the micro mirror module includes circuit board, micro mirror frame is fixed in circuit board upside, and the micro mirror frame upside is sealed and fixed with package, micro mirror body is movably mounted in the micro mirror frame inside by micro mirror drive, multiple desiccant particles are filled in the transverse hole, longitudinal hole and vertical hole for absorbing the water vapor around micro mirror module, compared with prior art, the utility model has the beneficial effects as follows: by setting moisture-proof assembly, and filling desiccant particles in its inside, it helps to avoid external water vapor intrusion micro mirror module, ensure the stability and service life of micro mirror module in subsequent use, and micro mirror module only needs normal package structure, without additional moisture-proof packaging.

Description

Technical Field

[0001] This utility model belongs to the field of MEMS micromirror technology, and specifically relates to a modular moisture-proof component for MEMS micromirrors with integrated desiccant. Background Technology

[0002] Existing MEMS micromirrors exhibit insufficient moisture resistance in humid environments, primarily manifesting as device failure, performance degradation, and decreased reliability. Due to their tiny size and large surface-to-volume ratio, moisture easily penetrates the encapsulation material, leading to oxidation of metal electrodes and swelling of the dielectric layer, subsequently causing adhesion, short circuits, or drive voltage drift. Simultaneously, the cyclic coupling effect of moisture and temperature exacerbates interfacial stress mismatch, causing delamination, warping, and even structural fracture, particularly pronounced in automotive or outdoor applications. These drawbacks stem from their high-precision micro / nano fabrication characteristics and reliance on hermetic encapsulation. Conventional solutions include using ceramic or metal hermetic packaging, introducing moisture-absorbing and inhibiting coatings, and using low-absorption epoxy materials for potting. Furthermore, some manufacturers reduce internal humidity and improve long-term stability by filling the encapsulation with inert gases or adding desiccants. However, these methods have obvious drawbacks: hermetic sealing is expensive and complex, making it difficult to popularize on a large scale; organic coatings and potting materials are cheaper, but their long-term moisture-proof effect is limited and there is still a risk of slow moisture permeation; and the capacity of desiccant is limited and it needs to maintain its effectiveness throughout its lifespan, otherwise it will lose its protective function. Therefore, we hope to design a modular moisture-proof component for MEMS micromirrors with a novel structure to solve this problem. Utility Model Content

[0003] To address the shortcomings of existing technologies, the purpose of this invention is to provide a modular moisture-proof component for MEMS micromirrors that integrates a desiccant, thereby solving the problems mentioned in the background section.

[0004] This utility model is achieved through the following technical solution: a modular moisture-proof component for MEMS micromirrors with integrated desiccant, comprising: a micromirror module, a moisture-proof component for moisture absorption and prevention fixed on the outside of the micromirror module, the micromirror module including a circuit board, a micromirror frame fixed on the upper side of the circuit board, an encapsulation sealed and fixed on the upper side of the micromirror frame, a micromirror body being movably mounted inside the micromirror frame via a micromirror drive, multiple vertical holes formed downward through the upper end of the moisture-proof component, and multiple holes formed to the right on the front and rear sides of the left end of the moisture-proof component. The moisture-proof component has multiple vertically equidistant holes at equal intervals on the left and right sides of its front end. A blower hole is formed at the middle of the left, right, front, and rear sides of the top of the moisture-proof component. A MEMS micro-fan for blowing air is installed at the bottom of each blower hole. Multiple desiccant particles are filled in the horizontal, vertical, and lateral holes to absorb moisture around the micromirror module. In actual use, the desiccant particles are silica gel desiccant particles, and the encapsulation is a transparent protective cover.

[0005] In a preferred embodiment, the plurality of vertical holes are distributed in a rectangular structure, and the vertical holes located at the four corners of the moisture-proof component all penetrate downwards simultaneously through the horizontal and vertical holes at that position.

[0006] In a preferred embodiment, the plurality of transverse holes located on the left and right sides of the moisture-proof component are arranged in a parallel structure, and the plurality of transverse holes located at the four corners of the moisture-proof component simultaneously penetrate the vertical holes and longitudinal holes at those positions.

[0007] In a preferred embodiment, the plurality of longitudinal holes located on the front and rear sides of the moisture-proof component are arranged in a parallel structure, and the plurality of longitudinal holes located at the four corner positions of the moisture-proof component simultaneously penetrate the vertical holes and horizontal holes at that position.

[0008] In a preferred embodiment, the two air vents located at the middle of the left side and the middle of the right side of the moisture-proof component extend downward through multiple longitudinal holes, and the two air vents located at the middle of the front side and the middle of the front side of the moisture-proof component extend downward through multiple transverse holes.

[0009] In a preferred embodiment, the MEMS micro fan is designed as an all-silicon device and driven by a piezoelectric crystal, which is integrated on a circuit board and driven by the circuit board supplying power to the piezoelectric crystal.

[0010] In a preferred embodiment, the desiccant particles penetrate in the horizontal direction to form a through hole one, the desiccant particles penetrate in the vertical direction to form a through hole two, and the desiccant particles penetrate in the front-back direction to form a through hole three. The through holes one, two, and three are located at the center of the desiccant particles and penetrate each other perpendicularly.

[0011] In a preferred embodiment, the front, rear, left, and right surfaces of the moisture-proof component are all recessed inward to form micropores. The numerous micropores are connected to the horizontal, vertical, and longitudinal holes on their respective surfaces. The diameters of the horizontal, vertical, and longitudinal holes are all the same, and the diameter of the micropores is one-tenth that of the horizontal holes. In actual use, the numerous micropores are used for the built-in desiccant particles to absorb moisture.

[0012] After adopting the above technical solution, the beneficial effects of this utility model are: 1. By setting a moisture-proof component and filling it with desiccant particles, the setting of the moisture-proof component helps to prevent external moisture from entering the micromirror module, ensuring the stability and service life of the micromirror module in subsequent use. Moreover, the micromirror module only needs a normal packaging structure and does not need to be additionally moisture-proofed.

[0013] 2. The arrangement of vertical holes, horizontal holes, air blowing holes, longitudinal holes, and a MEMS micro fan, along with desiccant particles with through holes one, two, and three, allows for multi-directional airflow within the moisture-proof component. The MEMS micro fan, driven by a voltage crystal, agitates the airflow within the air blowing holes, further propelling the airflow through the vertical, horizontal, and longitudinal holes. Since numerous micropores connect with the horizontal, vertical, and longitudinal holes on their surface, moisture near the moisture-proof component is absorbed by the desiccant particles inside. When the device continuously operates and generates heat, this heat heats the desiccant particles, releasing the absorbed moisture. Driven by the MEMS micro fan, this moisture continuously leaks out through the vertical, horizontal, air blowing, and longitudinal holes and the micropores, and is expelled by the overall heat dissipation structure of the device. This eliminates the need for periodic replacement of the moisture-proof component, providing long-term protection for the micromirror module. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of a modular moisture-proof component for MEMS micromirrors that integrates a desiccant, according to this utility model.

[0016] Figure 2 This is a schematic diagram of the micromirror module structure of a modular moisture-proof MEMS micromirror assembly with integrated desiccant according to the present invention.

[0017] Figure 3 This is a schematic diagram of the moisture-proof component structure of a modular moisture-proof component for MEMS micromirrors with integrated desiccant according to this utility model.

[0018] Figure 4 This is a schematic diagram of the cross-sectional structure of a modular moisture-proof component for MEMS micromirrors that integrates a desiccant, according to this utility model.

[0019] Figure 5 This is a schematic diagram of the desiccant particle structure of a modular moisture-proof component for MEMS micromirrors with integrated desiccant according to this utility model.

[0020] In the diagram, 100-moisture-proof component, 110-vertical hole, 120-horizontal hole, 130-air blowing hole, 140-vertical hole, 150-MEMS micro fan, 160-desiccant particles, 161-through hole one, 162-through hole two, 163-through hole three; 200 - Micromirror module, 210 - Package, 220 - Circuit board, 230 - Micromirror body, 240 - Micromirror driver. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] As the first embodiment of this utility model: Please see Figures 1 to 5A MEMS micromirror module 200 with integrated desiccant and a moisture-proof component 100 are disclosed, comprising: a micromirror module 200, a moisture-proof component 100 for moisture absorption and prevention fixed on the outside of the micromirror module 200, a circuit board 220, a micromirror frame fixed on the upper side of the circuit board 220, a package 210 sealed and fixed on the upper side of the micromirror frame, a micromirror body 230 movably mounted inside the micromirror frame via a micromirror drive 240, a plurality of vertical holes 110 extending downward through the upper end of the moisture-proof component 100, and a plurality of vertically equidistantly distributed transverse holes 120 extending to the right from the left front and left rear sides of the moisture-proof component 100. The front left and front right sides of the moisture-proof component 100 are both extended backward to form multiple vertically distributed longitudinal holes 140. The top left middle, right middle, front middle and rear middle of the moisture-proof component 100 are all extended downward to form a blower hole 130. Each blower hole 130 is equipped with a MEMS micro fan 150 for blowing air. The horizontal hole 120, the longitudinal hole 140 and the vertical hole 110 are filled with multiple desiccant particles 160 to absorb moisture around the micromirror module 200. In actual use, the desiccant particles 160 are silica gel desiccant particles 160, and the encapsulation 210 is a transparent protective cover.

[0023] Specifically, by setting up a moisture-proof component 100 and filling it with desiccant particles 160, in actual use, when the micromirror module 200 is working, if the working environment is relatively humid, some water vapor will approach the micromirror module 200. At this time, the moisture-proof component 100 surrounding the micromirror module 200 will come into contact with the water vapor first. Since the upper part of the micromirror module 200 is sealed by the encapsulation 210, water vapor will not enter. The water vapor approaching the moisture-proof component 100 will be intercepted by the moisture-proof component 100 and will not directly contact the micromirror module 200. The horizontal hole 120, the vertical hole 140, and the vertical hole 110 are all filled with multiple desiccant particles 160. The front, rear, left, and right surfaces of the moisture-proof component 100 are all... The recessed area forms micropores, which are connected to the horizontal holes 120, vertical holes 110, and longitudinal holes 140 on the surface. This allows moisture around the micromirror module 200 to be absorbed by the desiccant particles 160 inside the moisture-proof component 100. The side of the moisture-proof component 100 closest to the micromirror module 200 is not penetrated, so it only absorbs moisture inside the desiccant particles 160 and does not transfer moisture into the micromirror module 200. The moisture-proof component 100 helps to prevent external moisture from invading the micromirror module 200, ensuring the stability and service life of the micromirror module 200 in subsequent use. Moreover, the micromirror module 200 only needs the normal encapsulation structure 210 and does not require additional moisture-proof encapsulation 210.

[0024] As a second embodiment of this utility model: Please see Figures 1 to 5Multiple vertical holes 110 are distributed in a rectangular structure, and the vertical holes 110 located at the four corners of the moisture-proof component 100 all penetrate downwards simultaneously through the horizontal holes 120 and the vertical holes 140 at that position.

[0025] Multiple horizontal holes 120 located on the left and right sides of the moisture-proof component 100 are arranged in a parallel structure, and the multiple horizontal holes 120 located at the four corners of the moisture-proof component 100 simultaneously penetrate the vertical holes 110 and the longitudinal holes 140 at that position.

[0026] Multiple longitudinal holes 140 located on the front and rear sides of the moisture-proof component 100 are arranged in a parallel structure, and the multiple longitudinal holes 140 located at the four corners of the moisture-proof component 100 simultaneously penetrate the vertical holes 110 and the horizontal holes 120 at that position.

[0027] Two air vents 130 located in the middle of the left and right sides of the moisture-proof component 100 extend downward through multiple longitudinal holes 140, and two air vents 130 located in the middle of the front side of the moisture-proof component 100 extend downward through multiple transverse holes 120.

[0028] The MEMS micro fan 150 is designed with all-silicon devices and uses a piezoelectric crystal driver, which is integrated on circuit board 220 and powered by circuit board 220 to drive the piezoelectric crystal.

[0029] The desiccant particle 160 forms a through hole 161 in the horizontal direction, a through hole 162 in the vertical direction, and a through hole 163 in the front-back direction. The through holes 161, 162, and 163 are located at the center of the desiccant particle 160 and penetrate each other perpendicularly.

[0030] The front, rear, left, and right surfaces of the moisture-proof component 100 are all recessed to form micropores. Numerous micropores are connected to the horizontal holes 120, vertical holes 110, and longitudinal holes 140 on their respective surfaces. The diameters of the horizontal holes 120, vertical holes 110, and longitudinal holes 140 are all the same, and the diameter of the micropores is one-tenth that of the horizontal holes 120. In actual use, the numerous micropores are used by the built-in desiccant particles 160 to absorb moisture.

[0031] Based on the first embodiment described above, further, the arrangement of the vertical hole 110, horizontal hole 120, air blowing hole 130, vertical hole 140, and MEMS micro fan 150, in conjunction with the desiccant particles 160 having through holes 161, 162, and 163, allows for multi-directional airflow within the moisture-proof component 100 in actual use. The MEMS micro fan 150, driven by a voltage crystal, agitates the airflow within the air blowing hole 130, thereby promoting airflow through the vertical hole 110, horizontal hole 120, and vertical hole 140. Airflow, coupled with the numerous micropores connected to the horizontal holes 120, vertical holes 110, and longitudinal holes 140 on their surface, allows moisture near the moisture-proof component 100 to be absorbed by the desiccant particles 160 inside. When the device continuously operates and generates heat, the heat can heat the desiccant particles 160, thereby releasing the absorbed moisture. Driven by the MEMS micro fan 150, the moisture continuously leaks out from the vertical holes 110, horizontal holes 120, air blowing holes 130, longitudinal holes 140, and micropores, and is discharged under the drive of the entire device's heat dissipation structure. This eliminates the need for periodic replacement of the moisture-proof component 100, providing long-term protection for the micromirror module 200.

[0032] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A modular moisture-proof component for MEMS micromirrors with integrated desiccant, comprising: A micromirror module (200) is characterized in that a moisture-proof component for absorbing moisture is fixed on the outside of the micromirror module (200), the micromirror module (200) includes a circuit board (220), a micromirror frame is fixed on the upper side of the circuit board (220), and an encapsulation (210) is sealed and fixed on the upper side of the micromirror frame. A micromirror body (230) is movably installed inside the micromirror frame through a micromirror drive (240). The moisture-proof component has multiple vertical holes (110) extending downward through its upper end, and multiple vertically spaced holes (110) extending to the right through its left front and left rear sides. The fabric has horizontal holes (120), and the front left and front right sides of the moisture-proof component extend backward to form multiple vertically distributed holes (140). The top left middle, right middle, front middle and rear middle of the moisture-proof component extend downward to form a blower hole (130). Each blower hole (130) has a MEMS micro fan (150) installed at the bottom for blowing air. The horizontal holes (120), vertical holes (140) and vertical holes (110) are filled with multiple desiccant particles (160) to absorb water vapor around the micromirror module (200).

2. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 1, characterized in that: The multiple vertical holes (110) are distributed in a rectangular structure, and the vertical holes (110) located at the four corners of the moisture-proof component all penetrate downwards simultaneously through the horizontal holes (120) and vertical holes (140) at that position.

3. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 2, characterized in that: The multiple transverse holes (120) located on the left and right sides of the moisture-proof component are arranged in a parallel structure, and the multiple transverse holes (120) located at the four corners of the moisture-proof component simultaneously penetrate the vertical hole (110) and the longitudinal hole (140) at that position.

4. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 3, characterized in that: The multiple longitudinal holes (140) located on the front and rear sides of the moisture-proof component are arranged in a parallel structure, and the multiple longitudinal holes (140) located at the four corners of the moisture-proof component simultaneously penetrate the vertical hole (110) and the horizontal hole (120) at that position.

5. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 1, characterized in that: The two air vents (130) located in the middle of the left and right sides of the moisture-proof component penetrate downward through multiple longitudinal holes (140), and the two air vents (130) located in the middle of the front side of the moisture-proof component penetrate downward through multiple transverse holes (120).

6. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 1, characterized in that: The MEMS micro fan (150) is designed as an all-silicon device and is driven by a piezoelectric crystal. It is integrated on a circuit board (220) and the circuit board (220) powers the piezoelectric crystal to achieve the drive.

7. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 1, characterized in that: The desiccant particles (160) form a through hole one (161) in the horizontal direction, a through hole two (162) in the vertical direction, and a through hole three (163) in the front-back direction. The through holes one (161), two (162), and three (163) are located at the center of the desiccant particles (160) and penetrate each other perpendicularly.

8. The modular moisture-proof component for MEMS micromirrors with integrated desiccant as described in claim 1, characterized in that: The front, rear, left and right surfaces of the moisture-proof component are all recessed inward to form micropores. The numerous micropores are connected to the horizontal holes (120), vertical holes (110) and longitudinal holes (140) on their respective surfaces. The diameters of the horizontal holes (120), vertical holes (110) and longitudinal holes (140) are all the same, and the diameter of the micropores is one-tenth that of the horizontal holes (120).

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