Electrode lead structure and ultrasonic transducer
By setting staggered conductive strips and lead-out units between the circuit board and the array elements, the problem of efficient lead-out of array element electrodes in ultrasonic transducers is solved, reducing manufacturing complexity and improving production efficiency.
CN224556192UActive Publication Date: 2026-07-24SHANGHAI SHENGYI ELECTRONIC TECH CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHANGHAI SHENGYI ELECTRONIC TECH CO LTD
- Filing Date
- 2025-08-04
- Publication Date
- 2026-07-24
AI Technical Summary
Technical Problem
传统焊接或粘接方案难以满足超声换能器中阵元电极的高效引出需求，导致制造过程复杂度高，焊接操作复杂且效率低，电极材料易损坏，电路板粘接无法独立引出阵元电极。
Method used
Multiple lead-out units and conductive strips are set between the circuit board and the array elements. The conductive strips are arranged in an alternating pattern in different directions to form a conductive strip isolation area. Signals are led out by connecting the conductive strips to the circuit board pads, reducing the pad width requirement.
Benefits of technology
This reduces the difficulty of circuit board processing, improves production efficiency and device reliability, solves the problem of insufficient soldering space caused by small array element spacing, and realizes the efficient manufacturing of high-frequency ultrasonic transducers.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure CN224556192U_ABST
Abstract
The application discloses an electrode leading-out structure and an ultrasonic transducer. The electrode leading-out structure is used for leading out electrodes of an array element to the outside in a plurality of array elements, and comprises: a plurality of leading-out units arranged in a first direction on a circuit board; a plurality of conductive strips including a first conductive strip and a second conductive strip, the conductive strips being arranged through the leading-out units, and the plurality of conductive strips being staggered arranged in a second direction, the first direction being different from the second direction; the plurality of leading-out units comprising: a first leading-out unit and a second leading-out unit, the first conductive strip being arranged on the first leading-out unit, and the second conductive strip being arranged on the second leading-out unit; and at least one conductive strip isolation area arranged on the lower surface of the plurality of leading-out units in the first direction, and the plurality of conductive strips being arranged on both sides of the conductive strip isolation area in the second direction. The application has the technical effects of facilitating the leading-out of the electrodes of the array element, reducing the complexity of the circuit manufacturing process, and improving the manufacturing efficiency of the integrated circuit.
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