Semiconductor ceramic sheet positioning platform

Abstract

The utility model provides a kind of semiconductor ceramic sheet positioning platform, including positioning assembly, drive assembly, positioning assembly includes fixed angle plate, moving angle plate, the inside of fixed angle plate is equipped with two positioning side edges along the corner of ceramic sheet No. 1 setting, the inside of moving angle plate is equipped with two positioning side edges along the corner of ceramic sheet No. 2 setting, corner No. 1 and corner No. 2 are diagonally arranged on ceramic sheet, the output end of drive assembly is connected with moving angle plate, for driving moving angle plate moves relative to fixed angle plate, moving angle plate moves along the diagonal line connecting corner No. 1 and corner No. 2 under the action of drive assembly.The utility model completes the positioning of multiple ceramic sheets and the simultaneous positioning of ceramic sheet XY direction by one driving part, simple structure, compact, small space occupation, saves equipment cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a semiconductor ceramic wafer positioning platform. Background Technology

[0002] Ceramic semiconductor chips are electronic components made by combining ceramic materials and semiconductor technology. They utilize the excellent physical properties of ceramics (such as high thermal conductivity, high temperature resistance, and corrosion resistance) and the electrical properties of semiconductor materials to construct components with specific functions. In the production process of ceramic semiconductor chips, especially during the assembly of ceramic wafers, positioning of the ceramic wafers is necessary. In existing technologies, positioning is generally achieved using two sets of X / Y positioning elements, which in turn require two driving elements to drive the two sets of positioning elements to position the ceramic wafer. This results in a relatively complex structure and increases equipment costs. Utility Model Content

[0003] The present invention aims to provide a semiconductor ceramic wafer positioning platform to overcome the shortcomings of the prior art.

[0004] To solve the above-mentioned technical problems, the technical solution of this utility model is: a semiconductor ceramic wafer positioning platform, including a positioning component and a driving component. The positioning component includes a fixed corner plate and a movable corner plate arranged opposite to each other. The inner side of the fixed corner plate is provided with two positioning sides arranged along a corner 1 of the ceramic wafer, and the inner side of the movable corner plate is provided with two positioning sides arranged along a corner 2 of the ceramic wafer. The corner 1 and corner 2 are arranged diagonally on the ceramic wafer. The output end of the driving component is connected to the movable corner plate and is used to drive the movable corner plate to move relative to the fixed corner plate. Under the action of the driving component, the movable corner plate moves along the diagonal connecting corner 1 and corner 2.

[0005] Furthermore, in the aforementioned semiconductor ceramic wafer positioning platform, multiple positioning components are provided, and the multiple positioning components are arranged side by side on the positioning seat. The fixed corner plate is fixedly connected to the positioning seat, and the movable corner plate is movably connected to the positioning seat.

[0006] Furthermore, in the aforementioned semiconductor ceramic wafer positioning platform, the fixed corner plate and the positioning seat are integrally formed.

[0007] Furthermore, in the aforementioned semiconductor ceramic wafer positioning platform, the positioning component further includes an adsorption hole and an adsorption connector. The adsorption hole is located between the fixed corner plate and the movable corner plate, and the adsorption connector is located on the rear side of the positioning seat and communicates with the adsorption hole.

[0008] Furthermore, in the aforementioned semiconductor ceramic wafer positioning platform, the driving component includes a cylinder, a driving plate, and a mounting base. The cylinder is located in the middle of the mounting base, and its output end is provided with a driving plate. The driving plate is located above the mounting base and is connected to the moving corner plate of each positioning component.

[0009] Furthermore, in the aforementioned semiconductor ceramic wafer positioning platform, the driving assembly also includes a slide rail fixed on the mounting base. Two slide rails are provided, symmetrically arranged on both sides of the cylinder. A slider that is slidably connected to the slide rail is provided below the driving plate.

[0010] Furthermore, in the aforementioned semiconductor ceramic wafer positioning platform, the mounting base has a groove in the middle, the cylinder is located in the groove, and multiple mounting parts 1 extending toward the positioning base are provided on both sides of the groove. The lower end of the positioning base has multiple mounting parts 2 corresponding to the mounting parts 1. The mounting parts 2 and the main body of the positioning base form a right-angle groove. The mounting parts 1 are inserted into the right-angle groove and are fixedly connected to the mounting parts 2.

[0011] Compared with the prior art, the advantages of this utility model are: the utility model has a compact structure, occupies little space, is easy to install and maintain; the utility model also completes the positioning of multiple ceramic pieces and the simultaneous positioning of ceramic pieces in the XY direction through a single driving component, which simplifies the structure, saves equipment costs, and increases vacuum adsorption to ensure the stability after positioning. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a three-dimensional structural diagram of the semiconductor ceramic wafer positioning platform of this utility model. Figure 1 ;

[0014] Figure 2 This is a three-dimensional structural diagram of the semiconductor ceramic wafer positioning platform of this utility model. Figure 2 ;

[0015] Figure 3 This is a front view of the semiconductor ceramic sheet positioning platform of this utility model;

[0016] In the diagram: Positioning component; 11. Fixed corner plate; 12. Moving corner plate; 13. Adsorption hole; 14. Adsorption connector;

[0017] 2. Drive assembly; 21. Cylinder; 22. Drive plate; 23. Mounting base; 231. Groove; 232. Mounting part one; 24. Slide rail;

[0018] 3. Positioning seat; 31. Installation part two. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example 1

[0021] like Figure 1-3 As shown, a semiconductor ceramic wafer positioning platform includes a positioning component 1 and a driving component 2. Multiple positioning components 1 are arranged side-by-side on a positioning base 3. In this embodiment, five positioning components 1 are provided. Each positioning component 1 includes a fixed corner plate 11 and a movable corner plate 12 arranged opposite each other. The inner side of the fixed corner plate 11 has two positioning sides arranged along a corner of the ceramic wafer, and the inner side of the movable corner plate 12 has two positioning sides arranged along a corner of the ceramic wafer. The four positioning sides correspond to the four sides of the ceramic wafer. Corner 1 and Corner 2 are diagonally arranged on the ceramic wafer. The output end of the driving component 2 is connected to the movable corner plate 12 and is used to drive the movable corner plate 12 to move relative to the fixed corner plate 11. Under the action of the driving component 2, the movable corner plate 12 moves along the diagonal connecting corner 1 and corner 2, so that the movable corner plate 12 is movably connected to the positioning base 3.

[0022] like Figure 1 , 2 As shown, the fixed angle plate 11 is fixedly connected to the positioning seat 3. It can be fixedly connected to the positioning seat 3 by fasteners, or the fixed angle plate 11 and the positioning seat 3 can be integrally formed by processing, which improves the convenience of disassembly and assembly and saves costs.

[0023] like Figure 1 , 2 As shown, the positioning assembly 1 also includes an adsorption hole 13 and an adsorption connector 14. The adsorption hole 13 is located between the fixed angle plate 11 and the movable angle plate 12, and the adsorption connector 14 is located on the rear side of the positioning seat 3 and communicates with the adsorption hole 13. The adsorption connector 14 is connected to a vacuum generator (not shown in the figure) through a connecting pipe.

[0024] like Figure 1 , 3As shown, the drive assembly 2 includes a cylinder 21, a drive plate 22, and a mounting base 23. The cylinder 21 is located in the middle of the mounting base 23, and its output end is provided with the drive plate 22. The drive plate 22 is located above the mounting base 23 and is connected to the moving corner plate 12 of each positioning assembly 1.

[0025] The drive assembly 2 also includes two slide rails 24 fixed on the mounting base 23. Two slide rails 24 are symmetrically arranged on both sides of the cylinder 21. A slider that is slidably connected to the slide rails 24 is located below the drive plate 22. The cylinder 21 and slide rails 24 are tilted in the direction of movement of the corresponding moving corner plates, with the tilt direction being the same as the diagonal of the connecting corner one and corner two. This drives each moving corner plate 12 to move along the diagonal direction of the connecting corner one and corner two, allowing the ceramic sheet to be positioned against the edge in the XY direction.

[0026] To make the overall structure more compact, such as Figure 1 , 3 As shown, the mounting base 23 has a groove 231 in the middle, and the cylinder 21 is located in the groove 231. Multiple mounting portions 232 extending towards the positioning seat 3 are provided on both sides of the groove 231. Multiple mounting portions 31 corresponding to the mounting portions 232 are provided at the lower end of the positioning seat 3. The mounting portions 31 and the main body of the positioning seat 3 form a right-angle groove. The mounting portions 232 are inserted into the right-angle groove and fixedly connected to the mounting portions 31. The overall structure of this utility model is more compact and rationally arranged, facilitating installation and maintenance.

[0027] The working principle of this invention is as follows: Ceramic pieces are placed on the corresponding positioning positions of each positioning component 1. The cylinder 21 is activated, driving the drive plate 22 to move diagonally, thereby moving each moving corner plate 12 diagonally. The moving corner plate 12 presses the ceramic piece against the fixed corner plate 11 for edge positioning in the XY direction. After positioning, the suction hole 13 holds the ceramic piece in place, ensuring its position does not shift. Then, the cylinder resets, completing the positioning process accurately and quickly. This invention uses one drive to position multiple ceramic pieces simultaneously in the XY direction, simplifying the structure, saving equipment costs, and increasing vacuum adsorption to ensure stability after positioning.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor ceramic wafer positioning platform, characterized in that: The device includes a positioning component and a driving component. The positioning component includes a fixed corner plate and a movable corner plate arranged opposite to each other. The inner side of the fixed corner plate has two positioning sides arranged along a first corner of the ceramic piece, and the inner side of the movable corner plate has two positioning sides arranged along a second corner of the ceramic piece. The first and second corners are arranged diagonally on the ceramic piece. The output end of the driving component is connected to the movable corner plate and is used to drive the movable corner plate to move relative to the fixed corner plate. Under the action of the driving component, the movable corner plate moves along the diagonal line connecting the first and second corners.

2. The semiconductor ceramic wafer positioning platform according to claim 1, characterized in that: The positioning components are provided in multiple ways, and the multiple positioning components are arranged side by side on the positioning base. The fixed angle plate is fixedly connected to the positioning base, and the movable angle plate is movably connected to the positioning base.

3. The semiconductor ceramic wafer positioning platform according to claim 2, characterized in that: The fixed angle plate and the positioning seat are integrally formed.

4. The semiconductor ceramic wafer positioning platform according to claim 1, characterized in that: The positioning component also includes an adsorption hole and an adsorption connector. The adsorption hole is located between the fixed corner plate and the movable corner plate, and the adsorption connector is located on the rear side of the positioning seat and communicates with the adsorption hole.

5. The semiconductor ceramic wafer positioning platform according to claim 1, characterized in that: The drive assembly includes a cylinder, a drive plate, and a mounting base. The cylinder is located in the middle of the mounting base, and its output end is provided with a drive plate. The drive plate is located above the mounting base and is connected to the moving corner plate of each positioning assembly.

6. The semiconductor ceramic wafer positioning platform according to claim 5, characterized in that: The drive assembly also includes a slide rail fixed on the mounting base. There are two slide rails, symmetrically arranged on both sides of the cylinder. A slider that is slidably connected to the slide rail is provided below the drive plate.

7. The semiconductor ceramic wafer positioning platform according to claim 5, characterized in that: The mounting base has a groove in the middle, the cylinder is located in the groove, and multiple mounting parts 1 extending toward the positioning base are provided on both sides of the groove. The lower end of the positioning base has multiple mounting parts 2 corresponding to the mounting parts 1. The mounting parts 2 and the main body of the positioning base form a right-angle groove. The mounting parts 1 are inserted into the right-angle groove and are fixedly connected to the mounting parts 2.

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