Chip cooler with uniform heat exchange
By designing a meandering main channel and setting auxiliary and bypass channels in the chip cooler, the problems of insufficient heat exchange efficiency and uniformity of the cooler are solved, and uniform flow and efficient cooling of the refrigerant are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NINGBO HRALE PLATE HEAT EXCHANGER
- Filing Date
- 2025-07-21
- Publication Date
- 2026-07-24
AI Technical Summary
The existing refrigerant channel design of chip coolers results in poor heat exchange efficiency and uniformity, making it difficult for the refrigerant to effectively fill the cooler, and the uneven channel resistance length affects the uniformity of refrigerant flow.
Design at least two independent meandering main channels, and set auxiliary channels and bypass channels inside the cooler body to make the resistance length of all main channels the same. A complex channel structure is formed by sealing and welding the base plate and the mating plate to guide the uniform flow of refrigerant.
This improves the heat exchange efficiency and uniformity of the cooler, ensures the uniform flow of refrigerant in the main channel, and enhances the cooling effect.
Smart Images

Figure CN224556271U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip cooler technology, and in particular to a chip cooler with uniform heat exchange. Background Technology
[0002] Currently, most driver module chips are cooled using refrigerant coolers. These refrigerant (chip) coolers include refrigerant channels for receiving and guiding the flow of refrigerant. The refrigerant quickly removes heat from the chip, achieving rapid cooling and preventing the chip from overheating and burning out. Current refrigerant coolers generally consist of a substrate and a mating plate mounted on the substrate, with the two forming refrigerant channels to guide the flow of refrigerant. Existing chip coolers often have refrigerant channels that extend parallel to each other between the inlet and outlet. This makes it difficult for the refrigerant to effectively cover the cooler. Furthermore, the resistance length of the multiple channels gradually decreases from the outside to the inside, resulting in poor heat exchange efficiency and uniformity, indicating room for improvement. Utility Model Content
[0003] The present invention aims to overcome the defects in the prior art and provide a chip cooler with uniform heat exchange. It constructs at least two independent main channels between the liquid inlet and the liquid outlet, which can guide the refrigerant to better fill the cooler and improve the heat exchange efficiency. At the same time, all main channels have the same resistance length, which can improve the uniformity of refrigerant flow in the main channels and thus improve the heat exchange uniformity of the cooler.
[0004] To achieve the above objectives, this utility model provides a chip cooler with uniform heat exchange, including a cooler body. The cooler body is provided with an inlet and an outlet. Inside the cooler body, at least two non-parallel meandering main channels are constructed between the inlet and the outlet. Inside the cooler body, at least one auxiliary channel is provided on each main channel and / or at least one bypass channel is constructed between the main channels so that the resistance length of all main channels is the same.
[0005] The cooler body is further configured such that: the main body of the cooler includes a base plate and a mating plate disposed on the base plate; the base plate is a flat plate structure; the mating plate is stamped with an upwardly raised molding pattern; the base plate and the mating plate are sealed and welded together so that the molding pattern and the base plate cooperate to form a main channel having an auxiliary channel and / or a bypass channel; the molding pattern includes a main channel that cooperates to form the main channel, an auxiliary channel that cooperates to form the auxiliary channel, and / or a bypass channel that cooperates to form the bypass channel.
[0006] The auxiliary channel is further configured such that its width is less than that of the main channel. And / or, the width of the bypass channel is less than the width of the main channel.
[0007] The substrate is further configured such that: a lower flange is provided along its outer edge, the mating plate is embedded in the recess formed by the lower flange of the substrate, and the mating plate is provided with an upper flange along its outer edge that mates with the lower flange.
[0008] The further configuration is as follows: the mating plate is respectively punched with an upwardly raised liquid inlet and a liquid outlet at its edge, which are connected to the inside and outside of the plate body; The substrate has an inlet and an outlet respectively at the bottom edge corresponding to the liquid inlet and outlet.
[0009] Compared with the prior art, this utility model has a simple and reasonable structure. It has at least two main channels arranged independently and meanderingly on the cooler body, which can guide the refrigerant to better fill the cooler body and flow through dead corners, thereby greatly improving the heat exchange efficiency. At the same time, at least one auxiliary channel is provided on each main channel and / or at least one bypass channel is constructed between the corresponding main channels to ensure that the resistance length of all main channels is the same. This structure ensures that the resistance length of each main channel is the same, which can effectively improve the flow uniformity of the refrigerant in the main channels, thereby effectively improving the heat exchange uniformity of the cooler body. Attached Figure Description
[0010] Figure 1 This is a three-dimensional structural diagram of a chip cooler with uniform heat exchange according to the present invention. Figure 2 This is a schematic diagram of the separate structure of the chip cooler.
[0011] The following reference numerals are marked on the accompanying drawings: 10. Cooler body; 11. Liquid inlet pipe; 12. Liquid outlet pipe; 100. Substrate; 110. Lower flange; 120. Liquid inlet; 130. Liquid outlet; 200, mating plate; 210, main channel; 220, auxiliary channel; 230, bypass channel; 240, upper flange; 250, liquid inlet; 260, liquid outlet. Detailed Implementation
[0012] The following describes a specific embodiment of the present invention in detail with reference to the accompanying drawings. However, it should be understood that the scope of protection of the present invention is not limited to the specific embodiment.
[0013] This utility model provides a chip cooler with uniform heat exchange, such as... Figure 1As shown, the device includes a cooler body 10, which has an inlet 120 and an outlet 130 for refrigerant to flow in and out, respectively. Preferably, the cooler body 10 is connected to an inlet pipe 11 and an outlet pipe 12 for connecting to external pipelines, corresponding to the inlet 120 and outlet 130, respectively. Inside the cooler body 10, between the inlet 120 and outlet 130, at least two (three in this embodiment) main channels for guiding the refrigerant flow are arranged in a non-parallel manner. The at least two main channels are independent and meandering. Arranged on the cooler body 10, this allows the refrigerant to be better distributed throughout the cooler body 10 and flow through dead zones, thereby greatly improving heat exchange efficiency. At the same time, at least one auxiliary channel is provided on each main channel inside the cooler body and / or at least one bypass channel 230 is constructed between the corresponding main channels so that the resistance length of all main channels is the same. This construction ensures that the resistance length of each main channel is the same, which can effectively improve the flow uniformity of the refrigerant in the main channels, thereby effectively improving the heat exchange uniformity of the cooler body 10.
[0014] In this embodiment, as Figure 2 As shown, the cooler body 10 includes a substrate 100 and a mating plate 200 disposed on the substrate 100. The substrate 100 has a flat structure to facilitate better adhesion to the chip module for heat exchange. The mating plate 200 has an upwardly raised molding pattern. The substrate 100 and the mating plate 200 are sealed and welded together so that the molding pattern and the substrate 100 cooperate to form a main channel with an auxiliary channel and / or a bypass channel 230. The molding pattern includes a main channel 210 that cooperates to form the main channel, an auxiliary channel 220 that cooperates to form the auxiliary channel, and / or a bypass channel that cooperates to form the bypass channel 230. Preferably, the width of the auxiliary channel 220 is smaller than the width of the main channel 210, and / or the width of the bypass channel is smaller than the width of the main channel 210, so that the refrigerant in the cooler body 10 flows preferentially in the main channel.
[0015] In this embodiment, as Figure 2As shown, the substrate 100 has a lower flange 110 along its outer edge, and the mating plate 200 is fitted into the recess formed by the lower flange 110 of the substrate 100. This facilitates the positioning and assembly between the substrate 100 and the mating plate 200. Simultaneously, the mating plate 200 has an upper flange 240 along its outer edge that mates with the lower flange 110. The mating of the upper flange 240 and the lower flange 110 effectively increases the sealing area between them, thereby improving the sealing effect. The mating plate 200 has corresponding edges... The plate 200 has an upwardly protruding liquid inlet 250 and a liquid outlet 260 that connect the inside and outside of the plate. At least two main channels 210 on the plate 200 are connected between the liquid inlet 250 and the liquid outlet 260. The lower flange 110 of the substrate 100 is provided with a liquid inlet 120 and a liquid outlet 130 respectively in the area covered by the liquid inlet 250 and the liquid outlet 260. This makes it easy to construct the liquid inlet 120 and the liquid outlet 130 into a neat circle, thereby facilitating the insertion and connection of the liquid inlet pipe 11 and the liquid outlet pipe 12.
[0016] Compared with the prior art, this utility model has a simple and reasonable structure. It has at least two main channels arranged independently and meanderingly on the cooler body, which can guide the refrigerant to better fill the cooler body and flow through dead corners, thereby greatly improving the heat exchange efficiency. At the same time, at least one auxiliary channel is provided on each main channel and / or at least one bypass channel is constructed between the corresponding main channels to ensure that the resistance length of all main channels is the same. This structure ensures that the resistance length of each main channel is the same, which can effectively improve the flow uniformity of the refrigerant in the main channels, thereby effectively improving the heat exchange uniformity of the cooler body.
[0017] The above-disclosed embodiments are merely examples of the present utility model. However, the present utility model is not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present utility model.
Claims
1. A chip cooler with uniform heat exchange, characterized in that, The device includes a cooler body, which has an inlet and an outlet. Inside the cooler body, at least two non-parallel meandering main channels are constructed between the inlet and outlet. Inside the cooler body, at least one auxiliary channel is provided for each main channel and / or at least one bypass channel is constructed between the main channels so that the resistance length of all main channels is the same.
2. The chip cooler with uniform heat exchange according to claim 1, characterized in that, The cooler body includes a base plate and a mating plate disposed on the base plate. The base plate is a flat plate structure. The mating plate is stamped with an upwardly raised embossed pattern. The base plate and the mating plate are sealed and welded together so that the embossed pattern and the base plate cooperate to form a main channel with auxiliary channels and / or bypass channels. The embossed pattern includes a main channel that cooperates to form the main channel, an auxiliary channel that cooperates to form the auxiliary channel, and / or a bypass channel that cooperates to form the bypass channel.
3. A chip cooler with uniform heat exchange according to claim 2, characterized in that, The width of the auxiliary channel is smaller than the width of the main channel; And / or, the width of the bypass channel is less than the width of the main channel.
4. A chip cooler with uniform heat exchange according to claim 2, characterized in that, The substrate has a lower flange along its outer edge, and the mating plate is fitted into the recess formed by the lower flange of the substrate. The mating plate has an upper flange along its outer edge that mates with the lower flange.
5. A chip cooler with uniform heat exchange according to claim 4, characterized in that, The mating plate has upwardly raised liquid inlet and liquid outlet sections that connect the inside and outside of the plate, respectively, at its edge. The substrate has an inlet and an outlet respectively at the bottom edge corresponding to the liquid inlet and outlet.