Fast recovery diode device and electronic circuit

Abstract

The application provides a fast recovery diode device and an electronic circuit, and relates to the technical field of switch power supply protection, wherein the fast recovery diode device comprises a shell, a diode chip integrated in the shell, a bidirectional TVS chip, a cathode pin and an anode pin; the anode and the cathode of the diode chip are connected to the anode pin and the cathode pin respectively, the diode chip and the bidirectional TVS chip are packaged in parallel in the shell, and the cathode pin and the anode pin are both extended through the packaging shell. The fast recovery diode device integrates and packages the diode chip and the bidirectional TVS chip in the shell, realizes that the bidirectional TVS chip is connected in parallel to the diode chip in the shell to share and absorb the voltage between the two ends of the diode chip, replaces the RC absorption circuit containing short-life devices such as capacitors and resistors which is connected in parallel to the diode chip outside the shell, thereby simplifying the structure of the circuit where the diode is located, and improving the stability of the circuit where the diode is located.

Description

Technical Field

[0001] This utility model relates to the field of switching power supply protection technology, and in particular to a fast recovery diode device and electronic circuit. Background Technology

[0002] A diode is an electronic device made of semiconductor materials. In switching power supply circuits, diodes are usually used to achieve functions such as rectification, switching, and freewheeling. Due to the reverse recovery characteristics of diodes, high reverse voltages, or reverse spike voltages, may be generated in certain scenarios, which can easily lead to diode breakdown and burnout. Therefore, in practical applications, it is usually necessary to set up corresponding components to absorb the above-mentioned reverse spike voltages in order to protect the diodes.

[0003] Current diode reverse spike voltage absorption schemes mainly involve connecting an RC (Resistor Capacitor) absorption circuit in parallel across the diode. This RC absorption circuit contains a capacitor and a resistor connected in series to share and absorb the voltage across the diode, preventing the reverse spike voltage generated during the reverse recovery process from breaking down and burning out the diode.

[0004] However, the current diode reverse spike voltage absorption scheme has a complex RC absorption circuit structure, occupies a large space, is difficult to solder, and since capacitors and resistors are short-life devices, the failure rate is high after continuous voltage absorption, resulting in insufficient reliability of protection. Utility Model Content

[0005] The main objective of this invention is to propose a fast recovery diode device and electronic circuit to simplify the structure of the circuit containing the diode and improve the stability of the circuit containing the diode.

[0006] In a first aspect, this utility model provides a fast recovery diode device, the fast recovery diode device comprising: a housing, a diode chip integrated and packaged within the housing, a bidirectional TVS chip, a cathode pin, and an anode pin; The anode and cathode of the diode chip are respectively connected to the anode pin and the cathode pin. The diode chip and the bidirectional TVS chip are packaged in parallel in the housing. Both the cathode pin and the anode pin extend out through the housing.

[0007] In an optional embodiment, the housing further integrates a frame; the cathode of the diode chip and the bidirectional TVS chip are both integrated on the frame, the cathode of the diode chip and the bidirectional TVS chip are both connected to the cathode pin, and the anode of the diode chip and the bidirectional TVS chip are also connected to the anode pin.

[0008] In an optional embodiment, the cathode pin is integrally formed with the frame, and the cathode of the diode chip and the bidirectional TVS chip are connected to the cathode pin through the frame.

[0009] In an optional embodiment, the anode pin is separated from the frame, and the anode of the diode chip and the bidirectional TVS chip are respectively connected to the anode pin via corresponding bonding wires.

[0010] In an optional embodiment, the number of diode chips and the number of bidirectional TVS chips are both two; the two diode chips are respectively packaged in parallel with the two bidirectional TVS chips on the frame.

[0011] In an optional embodiment, one of the diode chips and one of the bidirectional TVS chips are disposed at a first position and a second position in a first region on the frame; another diode chip and another of the bidirectional TVS chips are disposed at a third position and a fourth position in a second region on the frame, wherein the second region and the first region are two mutually symmetrical regions on the frame; the third position is a position in the second region that is symmetrical to the first position, and the fourth position is a position in the second region that is symmetrical to the second position.

[0012] In an optional embodiment, the number of anode pins is two; the two anode pins are symmetrically arranged at positions corresponding to the first and second regions on the housing; In this configuration, the anode of each diode chip and a bidirectional TVS chip are connected to an anode pin, and the cathodes of both diode chips and both bidirectional TVS chips are connected to the cathode pin.

[0013] In an optional embodiment, the housing is a plastic-sealed housing.

[0014] In an optional implementation, the operating voltage of the bidirectional TVS chip is lower than the breakdown voltage of the diode chip.

[0015] Secondly, this utility model provides an electronic circuit, which includes at least the fast recovery diode device described in any of the foregoing embodiments.

[0016] The beneficial effects of this utility model are: The fast recovery diode device provided in this application includes: a housing, a diode chip integrated and packaged within the housing, a bidirectional TVS chip, a cathode pin, and an anode pin; the anode and cathode of the diode chip are respectively connected to the anode pin and the cathode pin, and the diode chip and the bidirectional TVS chip are packaged in parallel within the housing, with both the cathode pin and the anode pin extending through the housing. The fast recovery diode device integrates both a diode chip and a bidirectional TVS chip within the housing, enabling the bidirectional TVS chip inside the housing to share and absorb the voltage across the diode chip, replacing the RC snubber circuit containing short-life devices such as capacitors and resistors connected in parallel with the diode chip outside the housing. This simplifies the structure of the circuit containing the diode and improves its stability. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of a fast recovery diode device structure provided in an embodiment of this application.

[0019] Reference numerals: 1-Housing; 2-Diode chip; 3-Bidirectional TVS chip; 4-Cathode pin; 5-Anode pin; 6-Frame; 7-First position; 8-Second position; 9-Third position; 10-Fourth position; 11-Screw hole; 12-Recessed positioning part. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0024] In the description of this application, it should be noted that the terms "upper", "lower", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of this application is usually placed in. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0025] In the description of this application, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0027] Current diode reverse voltage spike absorption schemes mainly involve placing an RC snubber circuit with an internal capacitor and resistor connected in series outside the packaged diode device. This RC snubber circuit is connected in parallel with the diode in the diode device to share and absorb the voltage across the diode. However, using the current diode reverse voltage spike absorption scheme requires placing the above-mentioned RC snubber circuit outside the packaged diode device, which occupies a lot of space and is difficult to solder. In addition, the capacitor and resistor in the above-mentioned RC snubber circuit are short-life devices, and the failure rate is high after continuous voltage absorption, resulting in insufficient reliability of protection.

[0028] To address the aforementioned problems, the main objective of this application is to propose a fast recovery diode device to simplify the structure of the circuit containing the diode and improve the stability of the circuit.

[0029] Figure 1 For a schematic diagram of a fast recovery diode device structure provided in an embodiment of this application, please refer to... Figure 1 The fast recovery diode device includes: a housing 1, a diode chip 2 integrated and packaged within the housing 1, a bidirectional TVS (Transient Voltage Suppressor) chip 3, a cathode pin 4, and an anode pin 5.

[0030] The anode and cathode of the diode chip 2 are respectively connected to the anode pin 5 and the cathode pin 4. The diode chip 2 and the bidirectional TVS chip 3 are encapsulated in parallel in the housing 1. The cathode pin 4 and the anode pin 5 both extend through the housing 1.

[0031] For example, the aforementioned housing 1 can refer to a single-piece molded complete housing 1, or it can refer to a housing 1 formed by fastening two housing parts together with screws or the like. When the housing 1 is a housing 1 formed by fastening at least two housing parts together with screws or the like, each housing part can, for example, be provided with corresponding screw holes 11 and recessed positioning parts 12. The screw holes 11 and recessed positioning parts 12 on the two housing parts can be aligned when the two housing parts are fastened together. The aligned screw holes 11 can be used for screws to pass through to fix the two housing parts, and the recessed positioning parts 12 can be used for machines such as packaging machines to position the two housing parts. By aligning the recessed positioning parts 12 on the two housing parts, the two housing parts are aligned to ensure that the two housing parts are packaged and fixed in the correct relative position. It is understood that the type, form, size, shape, etc. of the aforementioned housing 1 can be adjusted and set according to different device models and different usage scenarios, etc., and are not limited here. Moreover, the size, quantity, position, etc. of the aforementioned screw holes 11 and recessed positioning parts 12 can be adjusted and determined according to the specific housing 1 situation, and are not limited to... Figure 1 The situations shown are limited.

[0032] Both the aforementioned anode pin 5 and cathode pin 4 may include a conductive core and an insulating layer. The conductive core may be, for example, a copper core, an aluminum core, or other similar material. The insulating layer may be, for example, a plastic layer, a rubber layer, or other insulating material, wrapped around the conductive core. Of course, the above is only one possible example. The actual structure, material, and size of the anode pin 5 and cathode pin 4 can be adjusted and determined according to specific circumstances and are not limited to the above examples. It is understood that each fast recovery diode device includes at least one cathode pin 4 and one anode pin 5, but is not limited to one cathode pin 4 and one anode pin 5. The specific number of cathode pins 4 and anode pins 5 can be adjusted and determined according to actual needs and is not limited here.

[0033] The connection between the anode and cathode of the diode chip 2 and the anode pin 5 and the cathode pin 4, as well as the parallel connection between the diode chip 2 and the bidirectional TVS chip 3, can be achieved, for example, through wires, conductive metal wires, conductive metal sheets, etc. The wires, conductive metal wires, conductive metal sheets, and the anode and cathode of the diode chip 2, the anode pin 5 and the cathode pin 4, and the bidirectional TVS chip 3 can be fixed, for example, through methods including but not limited to soldering, but not limited thereto. It is understood that the connection between the anode and cathode of the diode chip 2 and the anode pin 5 and the cathode pin 4, as well as the parallel connection between the diode chip 2 and the bidirectional TVS chip 3, is not limited to the above-mentioned electrical connection through wires, conductive metal wires, conductive metal sheets.

[0034] In order for both the cathode pin 4 and the anode pin 5 to extend through the housing 1, the housing 1 may be provided with a slit or through hole for the cathode pin 4 and the anode pin 5 to pass through. However, the specific way in which the cathode pin 4 and the anode pin 5 extend through the housing 1 is not limited to providing a slit or through hole in the housing 1. The specific size and shape of the slit or through hole are not limited here and can be adjusted and determined according to the specific situation of the cathode pin 4 and the anode pin 5.

[0035] The fast recovery diode device provided in this application includes: a housing 1, a diode chip 2 integrated and packaged within the housing 1, a bidirectional TVS chip, a cathode pin 4, and an anode pin 5. The anode and cathode of the diode chip 2 are respectively connected to the anode pin 5 and the cathode pin 4. The diode chip 2 and the bidirectional TVS chip 3 are connected in parallel and packaged within the housing 1. Both the cathode pin 4 and the anode pin 5 extend through the housing 1. The fast recovery diode device integrates both the diode chip 2 and the bidirectional TVS chip 3 within the housing 1, thereby sharing and absorbing the voltage across the diode chip 2 by connecting the bidirectional TVS chip 3 in parallel with the diode chip 2 inside the housing 1. This replaces the RC snubber circuit containing short-life devices such as capacitors and resistors that is connected in parallel with the diode chip 2 outside the housing 1, simplifying the structure of the circuit containing the diode and improving its stability.

[0036] Optionally, in the above Figure 1 Based on the embodiment, the housing 1 also integrates a frame 6. The cathode of the diode chip 2 and the bidirectional TVS chip 3 are both integrated on the frame 6. The cathode of the diode chip 2 and the bidirectional TVS chip 3 are both connected to the cathode pin 4. The anode of the diode chip 2 and the bidirectional TVS chip 3 are also connected to the anode pin 5.

[0037] For example, the frame 6 may be provided with recesses, snap-fit / welding positions, etc., for the integrated cathode of the diode chip 2 and the bidirectional TVS chip 3, but this is not a limitation. The cathode of the diode chip 2 and the bidirectional TVS chip 3 are both connected to the cathode pin 4, and the anode of the diode chip 2 and the bidirectional TVS chip 3 are also connected to the anode pin 5. For example, they can all be electrically connected by means including but not limited to wires, conductive metal wires, conductive metal sheets, etc. The wires, conductive metal wires, conductive metal sheets and the anode and cathode of the diode chip 2, the anode pin 5 and the cathode pin 4, and the bidirectional TVS chip 3 can be fixed by means including but not limited to welding, but this is not a limitation. It is understood that the connection between the cathode of the diode chip 2 and the bidirectional TVS chip 3 and the cathode pin 4, and the connection between the anode of the diode chip 2 and the bidirectional TVS chip 3 and the anode pin 5 are not limited to the above-mentioned electrical connection by wires, conductive metal wires, conductive metal sheets.

[0038] Furthermore, based on the above embodiments, the cathode pin 4 is integrally formed with the frame 6, and the cathode of the diode chip 2 and the bidirectional TVS chip 3 are connected to the cathode pin 4 through the frame 6.

[0039] For example, the frame 6 may include a region of conductive material, or a portion of conductive material may be fixedly disposed therein by means of welding, embedding, etc. The conductive material may be the same material as the core of the cathode pin 4, such as copper core or aluminum core, so as to realize that the cathode pin and the frame 6 are integrally disposed. The cathode of the diode chip 2 and the bidirectional TVS chip 3 are connected to the cathode pin 4 through the frame 6.

[0040] It is understood that the above descriptions of the materials and structure of frame 6 are merely possible examples, and the actual materials and structure of frame 6 may be the same as or different from those in the examples above.

[0041] Optionally, based on the foregoing embodiments, the anode pin 5 is separated from the frame 6, and the anode of the diode chip 2 and the bidirectional TVS chip 3 are respectively connected to the anode pin 5 through corresponding bonding wires.

[0042] Furthermore, based on the aforementioned embodiments, the number of diode chips 2 and the number of bidirectional TVS chips 3 are both two. The two diode chips 2 are respectively packaged in parallel with the two bidirectional TVS chips 3 on the frame 6.

[0043] For example, the number of diode chips 2 and the number of bidirectional TVS chips 3 are both two. The two diode chips 2 are respectively packaged in parallel with the two bidirectional TVS chips 3 on the frame 6. For example, it can mean that two circuits including diode chips 2 and bidirectional TVS chips 3 are simultaneously packaged in the housing 1 of the fast recovery diode device, so as to realize rectification, switching, freewheeling, etc. for two external switching power supplies, etc. The two diode chips 2 can be connected in parallel, and the two bidirectional TVS chips 3 are respectively connected in parallel across the corresponding diode chips 2.

[0044] Furthermore, based on the above embodiments, one of the diode chips 2 and one of the bidirectional TVS chips 3 are disposed at a first position 7 and a second position 8 in the first region of the frame 6. Another diode chip 2 and another bidirectional TVS chip 3 are disposed at a third position 9 and a fourth position 10 in the second region of the frame 6. The second region and the first region are two mutually symmetrical regions on the frame 6. The third position 9 is a position symmetrical to the first position 7 within the second region, and the fourth position 10 is a position symmetrical to the second position 8 within the second region.

[0045] For example, the first position 7, the second position 8, the third position 9, and the fourth position 10 may be the aforementioned groove, snap-fit / welding position, etc., but are not limited thereto. The first region is symmetrical to the second region, the third position 9 is symmetrical to the first position 7, and the fourth position 10 is symmetrical to the second position 8. For example, it may be to facilitate a more reasonable arrangement of the two circuits including the diode chip 2 and the bidirectional TVS chip 3, so that the diode chip 2 and the bidirectional TVS chip 3 included in each circuit can be easily connected to the anode pin 5 in parallel.

[0046] Furthermore, the number of anode pins 5 is two. The two anode pins 5 are symmetrically arranged at positions corresponding to the first and second regions on the housing 1.

[0047] In this configuration, the anode of each diode chip 2 and the bidirectional TVS chip 3 are connected to the anode pin 5, and the cathodes of the two diode chips 2 and the two bidirectional TVS chips 3 are all connected to the cathode pin 4.

[0048] For example, the number of anode pins 5 is two. For instance, it can be to correspond one anode pin 5 to each of the two circuits including diode chip 2 and bidirectional TVS chip 3, thereby facilitating the connection of the two circuits including diode chip 2 and bidirectional TVS chip 3 to different external switching power supplies through different anode pins 5, but this is not a limitation.

[0049] In addition, in the aforementioned Figure 1 Based on the embodiments, the above-mentioned housing 1 is a plastic-encapsulated housing 1.

[0050] The plastic-encapsulated housing 1 not only has a good sealing effect, but also has the advantages of easy material availability and easy processing. Of course, the housing 1 mentioned above can also be made of other materials or with other processes, and is not limited to the plastic-encapsulated housing 1.

[0051] Optionally, the operating voltage of the bidirectional TVS chip 3 is lower than the breakdown voltage of the diode chip 2.

[0052] For example, in a welding machine circuit, assuming the normal output voltage is 110V, and the breakdown voltage of the diode chip 2 with fast recovery function is 250V, the selected bidirectional TVS chip 3 could have a voltage range of 224-247V, slightly lower than the breakdown voltage of the diode chip 2. Thus, when the diode chip 2 is normally conducting, because the bidirectional TVS chip 3 is a bidirectional device, it will not operate when the diode chip 2's forward voltage is lower than its breakdown voltage. When the diode chip 2 reverses and generates a voltage spike higher than its breakdown voltage, the bidirectional TVS chip 3 will turn on before the diode chip 2 because its voltage is lower. This clamps the voltage spike, protecting the diode chip 2 from being damaged and burned out.

[0053] Of course, the above is only one possible scenario, and the actual protection scenarios of the bidirectional TVS chip 3 for the diode chip 2 are not limited to the examples above.

[0054] In addition, this application embodiment also provides an electronic circuit, which includes at least the fast recovery diode device described in any of the foregoing embodiments. Optionally, the electronic circuit may be, for example, the electronic circuit in which the switching power supply is located, but is not limited thereto.

[0055] It is understood that the above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A fast recovery diode device, characterized in that, The fast recovery diode device includes: a housing, a diode chip integrated and packaged within the housing, a bidirectional TVS chip, a cathode pin, and an anode pin; The anode and cathode of the diode chip are respectively connected to the anode pin and the cathode pin. The diode chip and the bidirectional TVS chip are packaged in parallel in the housing. Both the cathode pin and the anode pin extend out through the housing.

2. The fast recovery diode device according to claim 1, characterized in that, The housing also integrates a frame; the cathode of the diode chip and the bidirectional TVS chip are both integrated on the frame, the cathode of the diode chip and the bidirectional TVS chip are both connected to the cathode pin, and the anode of the diode chip and the bidirectional TVS chip are also connected to the anode pin.

3. The fast recovery diode device according to claim 2, characterized in that, The cathode pin is integrally formed with the frame, and the cathode of the diode chip and the bidirectional TVS chip are connected to the cathode pin through the frame.

4. The fast recovery diode device according to claim 2, characterized in that, The anode pin is separated from the frame, and the anode of the diode chip and the bidirectional TVS chip are respectively connected to the anode pin through corresponding bonding wires.

5. The fast recovery diode device according to claim 2, characterized in that, The number of diode chips and the number of bidirectional TVS chips are both two; the two diode chips are respectively packaged in parallel with the two bidirectional TVS chips on the frame.

6. The fast recovery diode device according to claim 5, characterized in that, One diode chip and one bidirectional TVS chip are disposed at a first position and a second position in a first region on the frame; another diode chip and another bidirectional TVS chip are disposed at a third position and a fourth position in a second region on the frame, wherein the second region and the first region are two mutually symmetrical regions on the frame; the third position is a position in the second region that is symmetrical to the first position, and the fourth position is a position in the second region that is symmetrical to the second position.

7. The fast recovery diode device according to claim 6, characterized in that, The number of anode pins is two; the two anode pins are symmetrically arranged at positions corresponding to the first and second regions on the housing. In this configuration, the anode of each diode chip and a bidirectional TVS chip are connected to an anode pin, and the cathodes of both diode chips and both bidirectional TVS chips are connected to the cathode pin.

8. The fast recovery diode device according to claim 1, characterized in that, The casing is a plastic-sealed casing.

9. The fast recovery diode device according to claim 1, characterized in that, The operating voltage of the bidirectional TVS chip is lower than the breakdown voltage of the diode chip.

10. An electronic circuit, characterized in that, The electronic circuit includes at least the fast recovery diode device as described in any one of claims 1-9.

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