A heat-dissipating and wear-resistant card protector

By designing a high thermal conductivity honeycomb structure and an active airflow circulation channel inside the card protector, combined with a U-shaped elastic card slot and an asymmetric arc-shaped spring, the problems of low heat dissipation efficiency and complex card removal operation of the card protector are solved, achieving efficient heat dissipation and convenient card removal, and reducing the risk of wear and tear.

CN224572343UActive Publication Date: 2026-07-31YIXING YULONG PLASTIC PACKAGE PROD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
YIXING YULONG PLASTIC PACKAGE PROD
Filing Date
2025-07-30
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Existing card protectors have limited heat dissipation efficiency, and the card removal process is cumbersome and complex, which affects the user experience and is not conducive to the thinning and lightening of electronic devices.

Method used

The card protector is designed with a high thermal conductivity honeycomb structure inside, which, combined with inclined heat dissipation grooves and through-hole heat dissipation holes, forms an active airflow circulation channel. Moving parts are eliminated, and a U-shaped elastic card slot and asymmetrical arc-shaped spring are used to enable one-handed card removal.

Benefits of technology

It improves heat dissipation efficiency, simplifies card removal, reduces the thickness of the card protector and the risk of wear, and enhances the user experience.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model discloses a heat-dissipating and wear-resistant card protector, which includes a card protector body. The sidewalls of the card protector body are nested with elastic card slots, and a spring sheet is fixedly connected to the top of the card protector body. This heat-dissipating and wear-resistant card protector features a high thermal conductivity honeycomb structure internally, which quickly disperses heat through thermal conduction. Multiple heat dissipation slots are opened at a 45° angle on the top of the outer layer, combined with through-hole heat dissipation holes on the sidewalls, forming an active airflow circulation channel to effectively improve heat dissipation efficiency. Simultaneously, an asymmetrical arc-shaped spring sheet is fixed at the bottom, which, when pressed, uses leverage to lift one corner of the card, enabling one-handed, damage-free card removal. Furthermore, the card protector body is designed as a three-layer composite structure consisting of an outer layer, an inner layer, and a heat dissipation layer. Rollers, springs, and other moving parts are eliminated, and a U-shaped elastic card slot replaces the complex mechanism, effectively reducing the thickness of the card protector and eliminating the risk of wear from moving parts. Multiple hemispherical anti-wear contacts are arranged on the contact surface between the card protector and the elastic card slot to further reduce friction loss.
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Description

Technical Field

[0001] This utility model relates to the field of card protection film technology, specifically a heat dissipation and wear-resistant card protection film. Background Technology

[0002] Card protector, also known as laminating film or coated film, is a transparent plastic film material mainly used to protect paper or card items such as photos, ID cards, bank cards, and menu cards. In order to be used in electronic devices and meet the requirements of heat dissipation and wear resistance, a heat dissipation and wear-resistant card protector has been designed.

[0003] The prior art patent document with publication number CN221785565U provides a heat-dissipating and wear-resistant card protector, including a card protector body and a card sleeve frame. The card sleeve frame has a placement groove inside, and positioning components are symmetrically installed in the placement groove. The card protector body is symmetrically fixedly installed on the inner wall of the card sleeve frame. One side of the card sleeve frame has an opening and a baffle is fixedly installed thereon. The baffle has a card inlet hole. A pushing component is installed in the placement groove on the side furthest from the baffle. This device can prevent the card from contacting and rubbing against the card protector body, thus preventing wear. At the same time, it facilitates the limiting, fixing, and removal of the card, improving practicality and functionality.

[0004] Although the device has many beneficial effects, it still has the following problems: heat dissipation is limited by ventilation holes, and card removal requires the use of tools such as needles to insert into the push rod, which is cumbersome and results in a poor user experience. Secondly, the existing design contains multiple moving parts, which makes assembly and maintenance difficult and prone to failure due to mechanical fatigue or wear. At the same time, the multi-component design increases the thickness of the card protection film, which is not conducive to the requirement of making electronic devices thinner and lighter. Utility Model Content

[0005] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0006] 1. Technical problems to be solved: In order to solve the problems of heat dissipation structure defects, inconvenient operation, large operating force and complex structure in the above-mentioned structures, this utility model is proposed.

[0007] Therefore, the purpose of this utility model is to provide a heat-dissipating and wear-resistant card protector. A high thermal conductivity honeycomb structure is designed inside the card protector body to quickly disperse heat through thermal conduction. Multiple heat dissipation grooves are opened at a 45° angle on the top of the outer layer of the card protector, combined with through-hole heat dissipation holes on the side walls, forming an active airflow circulation channel to effectively improve heat dissipation efficiency. Simultaneously, an asymmetrical arc-shaped spring is fixed at the bottom of the card protector. When pressed, it uses leverage to lift one corner of the card, enabling one-handed, damage-free card removal and reducing operating force. Furthermore, the card protector body is designed as a three-layer composite structure consisting of an outer layer, an inner layer, and a heat dissipation layer. Rollers, springs, and other moving parts are eliminated, and a U-shaped elastic card groove replaces the complex mechanism, effectively reducing the thickness of the card protector and eliminating the risk of wear from moving parts. Multiple hemispherical anti-wear contacts are arranged on the contact surface between the card protector and the elastic card groove to further reduce friction loss.

[0008] 2. Technical Solution: To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: A heat-dissipating and wear-resistant card protector includes a card protector body, which includes an outer layer, an inner layer and a heat dissipation layer. The sidewall of the card protector body is nested with an elastic card slot, and a spring sheet is fixedly connected to the top of the card protector body.

[0009] As a preferred embodiment of the heat dissipation and wear-resistant protective film of this utility model, the top of the outer layer has a plurality of heat dissipation grooves with an inclination angle of 45 degrees, and the inner layer is bonded to the inner sidewall of the outer layer.

[0010] As a preferred embodiment of the heat dissipation and wear-resistant card protector of this utility model, the outer circumferential wall of the heat dissipation layer is bonded to the inner layer, and the side wall of the heat dissipation layer is provided with a plurality of heat dissipation holes. The heat dissipation holes have a hexagonal honeycomb structure. In addition to increasing the heat dissipation area, the heat dissipation holes can also effectively improve the support performance of the card protector through the honeycomb structure.

[0011] As a preferred embodiment of the heat-dissipating and wear-resistant protective film of this utility model, the outer sidewall has a plurality of heat dissipation holes, the heat dissipation holes penetrate the outer layer and the inner layer, and the heat dissipation holes have a triangular structure.

[0012] As a preferred embodiment of the heat dissipation and wear-resistant protective film of this utility model, multiple anti-wear contacts are bonded to the top and bottom of both ends of the outer layer. The anti-wear contacts are hemispherical in shape. In addition to reducing the contact area and reducing friction and wear, the anti-wear contacts can also disperse concentrated stress at multiple points.

[0013] As a preferred embodiment of the heat dissipation and wear-resistant card protector of this utility model, the inner sidewall of the elastic card groove is in close contact with the wear-resistant contact point. The elastic card groove has a U-shaped structure. In addition to clamping and fixing the card protector body, the elastic card groove can also effectively improve the pressure resistance and drop resistance of the sidewall of the card protector body.

[0014] As a preferred embodiment of the heat dissipation and wear-resistant protective film of this utility model, the spring sheet has an arc-shaped structure, and one end of the spring sheet is suspended.

[0015] 3. Beneficial effects: Compared with the prior art, the beneficial effects of this utility model are: This heat-dissipating and wear-resistant card protector features a high thermal conductivity honeycomb structure inside the main body, which quickly disperses heat through thermal conduction. Multiple heat dissipation grooves are opened at a 45° angle on the top of the outer layer of the card protector, which, together with the through-hole heat dissipation holes on the side wall, connect the honeycomb heat dissipation layer to form an active airflow circulation channel, effectively improving heat dissipation efficiency. At the same time, an asymmetrical arc-shaped spring is fixed at the bottom of the card protector. When pressed, it lifts one corner of the card through the lever principle, enabling one-handed card removal without damage and reducing the operating force. This heat-dissipating and wear-resistant card protector is designed as a three-layer composite structure consisting of an outer layer, an inner layer, and a heat dissipation layer. It eliminates moving parts such as rollers and springs, and replaces the complex mechanism with a U-shaped elastic card groove, effectively reducing the thickness of the card protector and eliminating the risk of wear from moving parts. Multiple hemispherical anti-wear contacts are arranged on the contact surface between the card protector and the elastic card groove to further reduce friction loss. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them: Figure 1 This is a schematic diagram of the overall structure of a heat-dissipating and wear-resistant protective film of this utility model; Figure 2 This is a bottom view of the overall structure of a heat-dissipating and wear-resistant protective film of this utility model; Figure 3 This is a schematic diagram of the internal structure of the main body of the heat dissipation and wear-resistant card protector of this utility model; Figure 4 This is a schematic diagram of the elastic card slot and anti-wear contact structure of a heat dissipation and wear-resistant card protector of this utility model; Figure 5 This is a side view of the overall structure of a heat-dissipating and wear-resistant protective film of this utility model.

[0017] The numbers in the diagram are as follows: 100, main body of the card protector; 110, outer layer; 111, heat dissipation groove; 112, anti-wear contact; 120, inner layer; 130, heat dissipation layer; 140, heat dissipation hole; 200, elastic card slot; 300, spring. Detailed Implementation

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0019] This utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not be construed as limiting the scope of protection of this utility model. In actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0020] The orientation or positional relationship indicated in the terminology is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing the present invention and simplifying the description. It is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0021] The term "connection method" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The embodiments of this utility model will now be described in further detail with reference to the accompanying drawings.

[0023] This utility model provides an overall structural diagram of one embodiment of a heat-dissipating and wear-resistant card protector, including: Please see Figures 1-5 This embodiment of a heat dissipation and wear-resistant card protector includes a card protector body 100, which includes an outer layer 110, an inner layer 120, and a heat dissipation layer 130. The outer layer 110 is made of PC plastic, the inner layer 120 is made of graphene composite material, and the heat dissipation layer 130 is made of graphene composite material. The side wall of the card protector body 100 is nested with an elastic card groove 200, and the top of the card protector body 100 is fixedly connected with a spring piece 300.

[0024] It is worth noting that, in order to facilitate passive heat dissipation of the outer layer 110, specifically, multiple heat dissipation slots 111 are opened on the top of the outer layer 110, and the heat dissipation slots 111 are tilted at an angle of 45 degrees. Passive heat dissipation is achieved without weakening the structural strength of the outer layer 110. The inner layer 120 is bonded to the inner sidewall of the outer layer 110.

[0025] Next, in order to actively dissipate heat from the card protector body 100, specifically, the inner layer 120 is bonded to the outer circumference of the heat dissipation layer 130. The side wall of the heat dissipation layer 130 is provided with multiple heat dissipation holes, which are hexagonal honeycomb structures to expand the heat dissipation area. When the user moves the card protector body 100, heat dissipation airflow is formed through the heat dissipation holes to actively dissipate heat from the inner layer 120.

[0026] Meanwhile, in order to further improve heat dissipation efficiency, specifically, multiple heat dissipation holes 140 are opened on the side wall of the outer layer 110. The heat dissipation holes 140 penetrate the outer layer 110 and the inner layer 120, and together with the heat dissipation layer 130, they form an airflow loop to further improve heat dissipation efficiency. The heat dissipation holes 140 have a triangular structure to accelerate airflow.

[0027] Furthermore, in order to reduce frictional damage between the outer layer 110 and the elastic slot 200, specifically, multiple anti-wear contacts 112 are bonded to the top and bottom of both ends of the outer layer 110. The anti-wear contacts 112 are ceramic bumps with a hemispherical structure, which rigidly support the elastic slot 200 and reduce the contact area, thereby reducing wear on the outer layer 110.

[0028] It is worth noting that, in order to facilitate clamping and fixing the card protector body 100, specifically, the inner sidewall of the elastic card groove 200 is tightly attached to the anti-wear contact 112. The elastic card groove 200 and the anti-wear contact 112 are tightly fitted to stably clamp the card protector body. The elastic card groove 200 has a U-shaped structure and is an elastic steel sheet. The card protector body 100 is clamped by the U-shaped structure, and the card is fixed by the natural rebound force of the elastic steel sheet, replacing the spring or roller structure.

[0029] Finally, to improve the convenience of card retrieval, the spring 300 has an arc-shaped structure with one end suspended for easy pressing by the user. When the suspended end of the spring 300 is pressed, the center of the arc-shaped structure fits against the outer layer 110 and forms a lever fulcrum. The bottom output end of the spring 300 lifts up the position that is fixedly connected to the card protection film body 100, realizing the convenient operation of retrieving the card with one hand.

[0030] In addition, the circuits, electronic components and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this utility model does not involve any improvement to the internal structure and method. Combination Figures 1-5The specific usage process of the heat dissipation and wear-resistant card protector according to this embodiment is as follows: 1: When this heat dissipation and wear-resistant protective film is installed and connected, heat is transferred between the outer layer 110 and the inner layer 120. Then, the heat dissipation grooves 111 on the surface of the outer layer perform passive heat dissipation, while the airflow flows through the heat dissipation holes 140 to the heat dissipation layer 130 and performs active heat dissipation on the inner layer 120. 2: The elastic card slot 200 clamps and fixes the card protector body 100 by natural rebound from both sides, while the multiple anti-wear contacts 112 on the outer layer effectively reduce the contact area between the outer layer 110 and the elastic card slot 200, effectively reducing the frictional wear of the outer layer. 3: When the card protector body 100 is removed from the equipment slot, press the raised end of the spring piece 300 with one hand, and use the arc-shaped structure to make lever movement, thereby lifting the bottom of the card protector body 100 so that it is suspended in the air and makes contact with the equipment slot, thus making it easy to pull out.

[0031] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A heat-dissipating wear-resistant card protection film, characterized in that, The card protector body (100) includes an outer layer (110), an inner layer (120), a heat dissipation layer (130), a heat dissipation groove (111), and a heat dissipation hole (140). The side wall of the card protector body (100) is nested with an elastic card groove (200), and a spring piece (300) is fixedly connected to the top of the card protector body (100).

2. The heat dissipating wear resistant card protection film of claim 1, wherein, The outer layer (110) has multiple heat dissipation grooves (111) on its top, the heat dissipation grooves (111) have an inclination angle of 45 degrees, and the inner layer (120) is bonded to the inner sidewall of the outer layer (110).

3. The heat dissipating wear resistant card protection film of claim 1, wherein, The outer circumference of the heat dissipation layer (130) is bonded to the inner layer (120), and the sidewall of the heat dissipation layer (130) is provided with a plurality of heat dissipation holes, which are hexagonal honeycomb structures.

4. The heat dissipating wear resistant card film of claim 1, wherein, The outer layer (110) has a plurality of heat dissipation holes (140) on its sidewall. The heat dissipation holes (140) penetrate the outer layer (110) and the inner layer (120). The heat dissipation holes (140) have a triangular structure.

5. The heat dissipating wear resistant card protection film of claim 1, wherein, The outer layer (110) has multiple anti-wear contacts (112) bonded to its top and bottom ends, and the anti-wear contacts (112) are hemispherical structures.

6. The heat dissipating wear resistant card protection film of claim 5, wherein, The inner sidewall of the elastic groove (200) is in close contact with the anti-wear contact (112), and the elastic groove (200) has a U-shaped structure.

7. The heat dissipating wear resistant card protection film of claim 3, wherein, The spring piece (300) has an arc-shaped structure, and one end of the spring piece (300) is suspended.