A temperature stimulation device

Abstract

This utility model relates to the field of medical device technology, specifically to a temperature stimulation device, comprising: a temperature stimulation rod, the first end of which is a temperature stimulation head, and the temperature stimulation rod having a first cavity communicating with the temperature stimulation head; a housing, the second end of which extends into the housing; a temperature control component, which is installed in the upper space of the housing and connected to the second end of the temperature stimulation rod, and is configured to regulate the temperature of the temperature stimulation head to a preset temperature by introducing a liquid medium of a preset temperature into the first cavity of the temperature stimulation rod; and a heat exchange component, which is used to cool or heat the temperature control component, and includes a heat-conducting pipe unit and a cooling unit or heating unit located in the lower space of the housing. This device enables the temperature stimulation head to operate at a constant temperature for an extended period and reduces the area of ​​the device obstructing the oral cavity, making it easier to observe the affected area.

Description

Technical Field

[0001] This utility model relates to the field of medical device technology, and in particular to a temperature stimulation device. Background Technology

[0002] Dysphagia refers to an obstruction in the transport of food or liquid from the mouth to the stomach, which may be caused by neurological disorders, muscle dysfunction, or structural abnormalities. Timely rehabilitation training can effectively improve symptoms. Common rehabilitation training includes hot and cold stimulation of the oral cavity to improve the swallowing reflex. In current technology, most cold stimulation devices stimulate by changing the cryo-fluid, but changing the cryo-fluid each time is inconvenient, and the thawing time is fast, so it cannot be used for a long time. Some temperature stimulation devices that can be used for a long time and have a relatively constant temperature have the problem of being large, especially in the lateral dimension along the oral cavity. When using temperature stimulation devices to stimulate the oral cavity, they almost cover the entire oral cavity, affecting the observation of the affected area. Utility Model Content

[0003] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a temperature stimulation device that can maintain a constant temperature for a long time, and has a small area obstructed by the oral cavity during use, making it easy to observe the affected area.

[0004] To achieve the above and other related objectives, this utility model provides a temperature stimulation device, comprising:

[0005] A temperature stimulation rod, wherein the first end of the temperature stimulation rod is a temperature stimulation head, and the temperature stimulation rod has a first cavity communicating with the temperature stimulation head;

[0006] The housing, with the second end of the temperature stimulation rod extending into the housing;

[0007] A temperature control component is installed in the upper space of the housing and connected to the second end of the temperature stimulation rod. The temperature control component is configured to regulate the temperature of the temperature stimulation head to a preset temperature by inputting a liquid medium of a preset temperature into the first cavity of the temperature stimulation rod.

[0008] A heat exchange assembly is provided for cooling or heating the temperature control assembly. The heat exchange assembly includes a heat pipe unit and a cooling unit or a heating unit. The heat pipe unit includes one or more heat pipes. The upper end of the heat pipe is connected to the temperature control assembly. The cooling unit or the heating unit is located in the lower space of the housing. The lower end of the heat pipe extends downward into the lower space of the housing and is connected to the cooling unit or the heating unit.

[0009] Preferably, the temperature control component includes:

[0010] The liquid storage unit includes a liquid storage tank and a hydraulic pump. The liquid storage tank is connected to the second end of the temperature stimulation rod. The liquid storage tank can pump a liquid medium at a preset temperature into the first cavity through the hydraulic pump.

[0011] A semiconductor temperature control unit includes at least one semiconductor temperature control chip. The cooling or heating surface of the semiconductor temperature control chip is in contact with the outer wall of the liquid storage tank, and the heating or cooling surface of the semiconductor temperature control chip away from the liquid storage tank is connected to the upper part of the heat pipe.

[0012] More preferably, the heat exchange assembly further includes a heat-conducting plate unit, which is connected between the upper part of the heat-conducting pipe and the heating or cooling surface of the semiconductor temperature control chip away from the liquid storage tank.

[0013] More preferably, the heat-conducting plate unit includes one or more sets of heat-conducting plates, each set of heat-conducting plates including a first heat-conducting plate and a second heat-conducting plate arranged opposite to each other, the inner side of the first heat-conducting plate being in contact with the heating or cooling surface of the semiconductor temperature control chip away from the liquid storage tank, and the upper part of one or more heat-conducting pipes being clamped between the outer side of the first heat-conducting plate and the inner side of the second heat-conducting plate.

[0014] Preferably, the cooling surface of the semiconductor temperature control chip is in contact with the outer wall of the liquid storage tank, and the heat exchange assembly includes a heat pipe unit and a cooling unit. The cooling unit includes a heat sink mechanism, which is connected to the lower part of the one or more heat pipes.

[0015] More preferably, the heat sink mechanism includes a connecting part and a plurality of heat sinks. The connecting part is a cylindrical structure located directly below the liquid storage tank. The connecting part has a connecting slot for inserting the lower end of the heat pipe therein. The axis of the connecting slot is parallel to the axis of the connecting part. The plurality of heat sinks are evenly spaced along the radial direction of the connecting part and connected to the outer wall surface of the connecting part.

[0016] Preferably, the cooling unit further includes a cooling fan, the air outlet of which is located directly below the heat sink mechanism, and the housing has a vent hole that connects the air inlet of the cooling fan to the outside atmosphere.

[0017] More preferably, the cooling fan is an axial cooling fan, and the axis of the axial cooling fan is on the same straight line as the axis of the connecting part.

[0018] Preferably, the temperature stimulation rod further has a second cavity surrounding the first cavity, the first end of the first cavity is connected to the temperature stimulation head, the first end of the second cavity is connected to the first end of the first cavity, the second end of the second cavity is connected to the inlet of the hydraulic pump, and the second end of the first cavity is connected to the outlet of the hydraulic pump through the storage tank.

[0019] Preferably, the temperature stimulation device further includes an electrical stimulation rod, which is coaxially sleeved on the temperature stimulation rod. The end of the electrical stimulation rod is a thermoelectric stimulation head, which is insulated and thermally connected to the temperature stimulation head.

[0020] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0021] The temperature of the temperature stimulation head is controlled by introducing a liquid medium at a preset temperature into the first cavity of the temperature stimulation rod through a temperature control component. This avoids the problem of frequent changes in the coolant and, more importantly, allows the temperature of the temperature stimulation head to remain at a constant preset operating temperature for a long time. The heat exchange component replenishes heat to the temperature control component or removes heat from the temperature control component through a heat pipe unit to ensure the reliability of the temperature control component. The cooling or heating unit of the heat exchange component is located in the lower space of the housing, which effectively reduces the volume of the upper part of the housing, thereby reducing the area of ​​the temperature stimulation device that is obstructed from the patient's oral cavity, making it easier for doctors or patients to observe the oral cavity through a mirror.

[0022] By using a semiconductor temperature control chip as the temperature control component, the liquid tank that supplies the temperature stimulation rod with the preset temperature medium can be quickly and efficiently cooled or heated while minimizing the space occupied by the housing. The hydraulic pump can quickly pump the liquid medium at the preset temperature into the temperature stimulation rod, accelerating the response speed of the temperature stimulation device. The heat exchange assembly, consisting of heat pipes, heat plates, heat sinks, and cooling fans, can quickly and efficiently cool down the temperature control component, ensuring its reliability and efficiency. Attached Figure Description

[0023] Figure 1 A schematic diagram of the overall structure of the temperature stimulation device provided by this utility model in one embodiment.

[0024] Figure 2 A schematic diagram of the component structure of the temperature stimulation device provided by this utility model, with the shell removed, in one embodiment.

[0025] Figure 3 for Figure 2 Enlarged diagram in section A.

[0026] Figure 4A schematic diagram of the structure of the liquid storage tank, hydraulic pump, temperature stimulation rod, and electric stimulation rod in one embodiment of the temperature stimulation device provided by this utility model.

[0027] Figure 5 for Figure 4 A sectional view.

[0028] Figure 6 for Figure 5 Enlarged diagram in section B.

[0029] Figure 7 for Figure 5 Enlarged diagram in section C.

[0030] Label Explanation

[0031] 100. Temperature stimulation rod; 110. Temperature stimulation head; 120. Inner temperature stimulation rod; 121. First cavity; 130. Outer temperature stimulation rod; 131. Second cavity; 200. Shell; 210. Vent hole; 310. Liquid storage tank; 320. Hydraulic pump; 321. Liquid inlet; 322. Liquid outlet; 330. Semiconductor temperature control plate; 410. Heat pipe; 420. First heat conduction plate; 430. Second heat conduction plate; 423. Heat conduction plate connection hole; 440. Heat sink mechanism; 441. Connecting part; 4411. Connecting hole; 442. Heat sink; 450. Cooling fan; 500. Electrical stimulation rod; 510. Thermoelectric stimulation head. Specific Implementation

[0032] The following specific examples illustrate the implementation of this utility model. Those skilled in the art can easily understand other advantages and effects of this utility model from the content disclosed in this specification. This utility model can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this utility model. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0033] It should be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of the present invention. Therefore, the illustrations only show the components related to the present invention and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0034] This utility model provides a temperature stimulation device for providing oral hot and cold stimulation rehabilitation training for patients with swallowing disorders. It includes a temperature stimulation rod, a temperature control component, and a heat exchange component. The temperature control component can input a liquid medium of a preset temperature into the first cavity of the temperature stimulation rod, providing a device that can maintain a constant temperature for a long time, minimizes the obstruction of the oral cavity area, and facilitates observation of the affected area. The technical solution of this utility model is described in detail below with reference to specific embodiments:

[0035] Please see Figures 1-7 This utility model provides a temperature stimulation device, comprising: a temperature stimulation rod 100, the first end of which is a temperature stimulation head 110, and the temperature stimulation rod 100 having a first cavity 121 communicating with the temperature stimulation head 110. In a specific embodiment, the temperature stimulation rod 100 may be made of metal materials such as stainless steel, copper, aluminum, or silver; a housing 200, the second end of which extends into the housing 200. In a specific embodiment, to facilitate the patient or doctor to grasp the housing 200 and place the temperature stimulation head 110 of the temperature stimulation rod 100 against the oral cavity for hot and cold stimulation, the housing 200 and the temperature stimulation rod 100 can be arranged in a perpendicular gun-like structure; and a temperature control component, which is installed in the upper space of the housing 200 and connected to the second end of the temperature stimulation rod 100. The temperature control component is configured to deliver [temperature information] into the first cavity 121 of the temperature stimulation rod 100. The temperature of the temperature stimulation head 110 is adjusted to the preset temperature by introducing a liquid medium at a preset temperature. In a specific embodiment, in order to facilitate real-time monitoring of the temperature at the end of the temperature stimulation head 110, a temperature sensor can be set at the temperature stimulation rod 100 or the temperature control component, and a refrigerant such as medical-grade silicone oil, pure water, or a mixture of water can be selected. A heat exchange component is used to cool or heat the temperature control component. The heat exchange component includes a heat pipe 410 unit and a cooling unit or a heating unit. The heat pipe 410 unit includes one or more heat pipes 410. The upper end of the heat pipe 410 is connected to the temperature control component. The cooling unit or the heating unit is located in the lower space of the housing 200. The lower end of the heat pipe 410 extends downward into the lower space of the housing 200 and is connected to the cooling unit or the heating unit. In a specific embodiment, the cooling unit or the heating unit can be a heat exchange coil or an air-cooled / air-heated unit.

[0036] The temperature of the temperature stimulation head 110 is controlled by inputting a liquid medium at a preset temperature into the first cavity 121 of the temperature stimulation rod 100 through the temperature control component. This avoids the problem of frequent replacement of the coolant and, more importantly, allows the temperature of the temperature stimulation head 110 to be maintained at a constant preset operating temperature for a long time. The heat exchange component supplements heat to the temperature control component or removes heat from the temperature control component through the heat pipe 410 unit to ensure the reliability of the temperature control component. The cooling unit or heating unit of the heat exchange component is set in the lower space of the housing 200, which effectively reduces the volume of the upper part of the housing 200, thereby reducing the area of ​​the temperature stimulation device that is obstructed by the patient's oral cavity, making it easier for doctors or patients to observe the oral cavity through a mirror.

[0037] Please see Figures 2-5 In an optional embodiment of this utility model, the temperature control component includes: a liquid storage unit, which includes a liquid storage tank 310 and a hydraulic pump 320. The liquid storage tank 310 is connected to the second end of the temperature stimulation rod 100. The temperature stimulation rod 100 has a first cavity 121. The liquid storage tank 310 can pump a liquid medium at a preset temperature into the first cavity 121 through the hydraulic pump 320; and a semiconductor temperature control chip 330 unit, which includes at least one semiconductor temperature control chip 330. The cooling or heating surface of the semiconductor temperature control chip 330 is attached to the outer wall of the liquid storage tank 310, and the heating or cooling surface of the semiconductor temperature control chip 330 away from the liquid storage tank 310 is connected to the upper part of the heat pipe 410. For a specific embodiment, please refer to... Figure 2 , Figure 3 The liquid storage tank 310 can be made into a cuboid with a thickness slightly larger than the diameter of the second end of the temperature stimulation rod 100, so as to minimize the lateral dimension of the shell 200 along the oral cavity direction. In order to enhance the temperature control effect, semiconductor temperature control plates 330 can be set on the two large-area walls of the liquid storage tank 310. In a specific embodiment, in order to accurately control the temperature at the temperature stimulation head 110, a temperature sensor can be set at the temperature stimulation head 110, or a temperature sensor can be set on the pipe connecting the hydraulic pump 320 and the first cavity 121.

[0038] The semiconductor temperature control chip 330 has a flat structure, which minimizes its space occupation. At the same time, it can efficiently and reliably heat or cool the liquid storage tank 310. The hydraulic pump 320 can quickly pump the liquid medium in the liquid storage tank 310 into the first cavity 121 of the temperature stimulation rod 100, so that the temperature adjustment of the temperature stimulation head 110 has a faster response speed, reducing the patient's waiting time. At the same time, the switching between heating and cooling can be performed simply by changing the positive and negative terminals of the semiconductor temperature control chip 330, which increases the flexibility of the device. The heat pipe 410 efficiently conducts the waste heat / waste cold of the semiconductor temperature control chip 330 to the lower heat exchange component for processing, maintaining the system's thermal balance and the upper temperature control efficiency.

[0039] Please see Figure 2 , Figure 3 In an optional embodiment of this utility model, the heat exchange assembly further includes a heat-conducting plate unit. The heat-conducting plate unit is connected between the upper part of the heat-conducting pipe 410 and the heating or cooling surface of the semiconductor temperature control chip 330 away from the liquid storage tank 310. The heat-conducting plate unit can indirectly increase the contact area between the heating or cooling surface of the semiconductor temperature control chip 330 and the upper part of the heat-conducting pipe 410, so that the waste heat or waste cold on the heating or cooling surface of the semiconductor temperature control chip 330 can be more comprehensively and quickly transferred to the cooling unit or heating unit connected to the lower part of the heat-conducting pipe 410, further ensuring the reliability and efficiency of the device.

[0040] Please see Figure 2 , Figure 3 In an optional embodiment of this utility model, the heat-conducting plate unit includes one or more sets of heat-conducting plates. Each set of heat-conducting plates includes a first heat-conducting plate 420 and a second heat-conducting plate 430 disposed opposite to each other. The inner side of the first heat-conducting plate 420 is in contact with the heating or cooling surface of the semiconductor temperature control chip 330 away from the liquid storage tank 310. The upper part of one or more heat-conducting pipes 410 is sandwiched between the outer side of the first heat-conducting plate 420 and the inner side of the second heat-conducting plate 430. In a specific embodiment, the outer side of the first heat-conducting plate 420 may be... A semi-circular arc groove adapted to the heat-conducting pipe 410 is formed between the side surface and the inner surface of the second heat-conducting plate 430 to better fit them together. Heat-conducting plate connection holes 423 for bolt connection are formed on the first heat-conducting plate 420 and the second heat-conducting plate 430. The heat-conducting plate connection holes 423 can be through holes or threaded holes to reliably clamp the heat-conducting pipe 410 between them. In a specific embodiment, a vent hole 210 can also be formed on the upper part of the housing 200 to allow the first heat-conducting plate 420 and the second heat-conducting plate 430 to exchange heat with the outside atmosphere.

[0041] The first heat-conducting plate 420 and the second heat-conducting plate 430 not only further increase the contact area between the heating or cooling surface of the semiconductor temperature control chip 330 and the upper part of the heat-conducting pipe 410, but also ensure the reliability of the heat-conducting pipe 410 installation and reduce the installation difficulty.

[0042] Please see Figure 2 In an optional embodiment of this utility model, the cooling surface of the semiconductor temperature control chip 330 is in contact with the outer wall of the liquid storage tank 310. At this time, the semiconductor temperature control chip 330 cools the liquid storage tank 310, and the temperature stimulation head 110 provides cold stimulation to the patient's oral cavity. The heat exchange component includes a heat pipe 410 unit and a cooling unit. The cooling unit includes a heat sink mechanism 440, which is connected to the lower part of one or more heat pipes 410. In a specific embodiment, the heat sink 442 can be configured to abut against the inner wall of the housing 200 so that the heat sink 442 can dissipate heat through the housing 200. It can also be used in conjunction with other cooling components for heat dissipation. The heat sink 442 can be made of materials with good thermal conductivity such as aluminum alloy or copper. In this embodiment, considering cost and weight issues, an aluminum alloy heat sink 442 is used.

[0043] Compared to liquid cooling methods that use heat exchange coils, the 440 heat sink mechanism is simpler and more reliable, eliminating the need to consider issues such as the design and sealing of liquid piping.

[0044] Please see Figure 2 In an optional embodiment of this utility model, the heat sink mechanism 440 includes a connecting part 441 and a plurality of heat sinks 442. The connecting part 441 is a cylindrical structure located directly below the liquid storage tank 310. The connecting part 441 has a connecting hole 4411 groove for inserting the lower end of the heat conduction pipe 410 therein. In a specific embodiment, in order to minimize the space occupied by the connecting part 441, the lower part of the heat conduction pipe 410 can be set as a curved structure that bends towards the middle of the housing 200. In the case of multiple heat conduction pipes 410, the connecting holes 4411 grooves should be evenly distributed around the circumference of the connecting part 441. The axis of the connecting holes 4411 grooves is parallel to the axis of the connecting part 441. The plurality of heat sinks 442 are evenly spaced along the radial direction of the connecting part 441 on the outer wall surface of the connecting part 441.

[0045] The cylindrical connecting part 441 allows the heat pipe 410 to be conveniently and reliably connected to the heat sink 442 structure. On the other hand, the cylindrical structure has good symmetry and heat diffusion ability, which can quickly and evenly distribute the concentrated heat flow to the multiple heat sinks 442 connected to it, greatly improving the overall efficiency and temperature uniformity of the heat dissipation system.

[0046] Please see Figure 2In an optional embodiment of this utility model, the cooling unit further includes a cooling fan 450, the air outlet of the cooling fan 450 being located directly below the heat sink mechanism 440, and the housing 200 having a vent 210 that connects the air inlet of the cooling fan 450 to the outside atmosphere.

[0047] The cooling fan 450 provides forced airflow, and the high-speed airflow can quickly dissipate heat from the heat sink mechanism 440, thereby achieving rapid cooling and heat exchange, and further accelerating the response speed of the temperature regulation of the temperature stimulation device.

[0048] In an optional embodiment of this utility model, the cooling fan 450 is an axial cooling fan 450, and the axis of the axial cooling fan 450 is on the same straight line as the axis of the connecting part 441, so that the forced airflow provided by the cooling fan 450 blows directly and powerfully onto the surface of the heat sink 442, thereby quickly removing the heat from the heat sink 442.

[0049] Please participate Figures 5-7 In an optional embodiment of this utility model, the temperature stimulation rod 100 further has a second cavity 131 surrounding the first cavity 121. The first end of the first cavity 121 is connected to the temperature stimulation head 110, the first end of the second cavity 131 is connected to the first end of the first cavity 121, and the second end of the second cavity 131 is connected to the inlet 321 of the hydraulic pump 320. The second end of the first cavity 121 is connected to the outlet 322 of the hydraulic pump 320 through the liquid storage tank 310. That is, the liquid medium at a preset temperature in the liquid storage tank 310 is pumped into the first cavity 121 through the outlet 322 of the liquid pump and flows into the temperature stimulation head 110. After a period of time, the liquid medium can flow from the second cavity 131 to the inlet 321 of the liquid pump, thus forming a cycle. In a specific embodiment, the temperature stimulation rod 100 can be configured as a hollow outer temperature stimulation rod 130 and an inner temperature stimulation rod 120 coaxially sleeved. The first cavity 121 is located in the inner temperature stimulation rod 120, and one end of the inner temperature stimulation rod 120 extends into the liquid storage tank 310 and is connected to the outlet 322 of the hydraulic pump 320. The second cavity 131 is the radial gap between the inner wall of the outer temperature stimulation rod 130 cavity and the outer wall of the inner temperature stimulation rod 120, which can further insulate the temperature stimulation head 110 at the end of the outer temperature stimulation rod 130 to ensure thermal conductivity and insulation performance.

[0050] Since the return channel of the liquid medium surrounds the outside of the inlet channel of the liquid medium, this arrangement can achieve a certain heat insulation effect, ensuring that the temperature difference between the liquid medium flowing into the temperature stimulation head 110 and the liquid medium in the storage tank 310 is small, thereby ensuring the reliability of the device.

[0051] Please see Figures 5-7 In an optional embodiment of this utility model, the temperature stimulation device further includes an electrical stimulation rod 500, which is coaxially sleeved on the temperature stimulation rod 100. The end of the electrical stimulation rod 500 is a thermoelectric stimulation head 510, which is insulated and thermally connected to the temperature stimulation head 110, so that the temperature stimulation device can not only provide hot and cold stimulation to the patient's oral cavity, but also provide electrical stimulation.

[0052] In summary, the temperature stimulation device provided in this application controls the temperature of the temperature stimulation head 110 by inputting a liquid medium at a preset temperature into the first cavity 121 of the temperature stimulation rod 100 through a temperature control component. This avoids the problem of frequent changes in the coolant and, more importantly, allows the temperature of the temperature stimulation head 110 to be maintained at a constant preset operating temperature for a long time. The heat exchange component supplements heat to the temperature control component or removes heat from the temperature control component through the heat pipe 410 unit, ensuring the reliability of the temperature control component. By placing the cooling unit or heating unit of the heat exchange component in the lower space of the housing 200, the volume of the upper part of the housing 200 is effectively reduced, thereby reducing the obstruction of the patient's oral cavity by the temperature stimulation device. The obstructed area makes it easier for doctors or patients to observe the oral cavity through a mirror; the use of a semiconductor temperature control chip 330 as the temperature control component allows for rapid and efficient cooling or heating of the liquid storage tank 310, which supplies the temperature stimulation rod 100 with the preset temperature medium, while minimizing the space occupied by the housing 200; the hydraulic pump 320 can quickly pump the preset temperature liquid medium into the temperature stimulation rod 100, accelerating the response speed of the temperature stimulation device; the heat exchange assembly consisting of a heat pipe 410, a first heat conduction plate 420, a second heat conduction plate 430, a heat sink mechanism 440, and a cooling fan 450 can quickly and efficiently cool down the temperature control component, ensuring the reliability and efficiency of the temperature control component.

[0053] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

[0054] Throughout this description, numerous specific details, such as examples of components and / or methods, are provided to provide a complete understanding of embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more of these specific details or by other devices, systems, components, methods, parts, materials, components, etc. In other instances, well-known structures, materials, or operations have not been specifically shown or described in detail to avoid obscuring aspects of embodiments of the present invention.

Claims

1. A temperature stimulation device, characterized in that, include: A temperature stimulation rod, wherein the first end of the temperature stimulation rod is a temperature stimulation head, and the temperature stimulation rod has a first cavity communicating with the temperature stimulation head; The housing, with the second end of the temperature stimulation rod extending into the housing; A temperature control component is installed in the upper space of the housing and connected to the second end of the temperature stimulation rod. The temperature control component is configured to regulate the temperature of the temperature stimulation head to a preset temperature by inputting a liquid medium of a preset temperature into the first cavity of the temperature stimulation rod. A heat exchange assembly is provided for cooling or heating the temperature control assembly. The heat exchange assembly includes a heat pipe unit and a cooling unit or a heating unit. The heat pipe unit includes one or more heat pipes. The upper end of the heat pipe is connected to the temperature control assembly. The cooling unit or the heating unit is located in the lower space of the housing. The lower end of the heat pipe extends downward into the lower space of the housing and is connected to the cooling unit or the heating unit.

2. The temperature stimulation device of claim 1, wherein, The temperature control component includes: The liquid storage unit includes a liquid storage tank and a hydraulic pump. The liquid storage tank is connected to the second end of the temperature stimulation rod. The liquid storage tank can pump a liquid medium at a preset temperature into the first cavity through the hydraulic pump. A semiconductor temperature control unit includes at least one semiconductor temperature control chip. The cooling or heating surface of the semiconductor temperature control chip is in contact with the outer wall of the liquid storage tank, and the heating or cooling surface of the semiconductor temperature control chip away from the liquid storage tank is connected to the upper part of the heat pipe.

3. The temperature stimulation device of claim 2, wherein, The heat exchange assembly also includes: A heat-conducting plate unit is connected between the upper part of the heat-conducting pipe and the heating or cooling surface of the semiconductor temperature control chip away from the liquid storage tank.

4. The temperature stimulation device of claim 3, wherein, The heat-conducting plate unit includes one or more sets of heat-conducting plates. Each set of heat-conducting plates includes a first heat-conducting plate and a second heat-conducting plate arranged opposite to each other. The inner side of the first heat-conducting plate is in contact with the heating or cooling surface of the semiconductor temperature control chip away from the liquid storage tank. The upper part of one or more heat-conducting pipes is clamped between the outer side of the first heat-conducting plate and the inner side of the second heat-conducting plate.

5. The temperature stimulation device of claim 2, wherein, The cooling surface of the semiconductor temperature control chip is in contact with the outer wall of the liquid storage tank. The heat exchange assembly includes a heat pipe unit and a cooling unit. The cooling unit includes: A heat sink mechanism is connected to the lower part of the one or more heat pipes.

6. The temperature stimulation device of claim 5, wherein, The heat sink mechanism includes a connecting part and multiple heat sinks. The connecting part is a cylindrical structure located directly below the liquid storage tank. The connecting part has a connecting slot for inserting the lower end of the heat pipe. The axis of the connecting slot is parallel to the axis of the connecting part. Multiple heat sinks are evenly spaced along the radial direction of the connecting part and connected to the outer wall surface of the connecting part.

7. The temperature stimulation device of claim 6, wherein, The cooling unit also includes: A cooling fan, the air outlet of which is located directly below the heat sink mechanism, and a vent on the housing that connects the air inlet of the cooling fan to the outside atmosphere.

8. The temperature stimulation device of claim 7, wherein, The cooling fan is an axial flow cooling fan, and the axis of the axial flow cooling fan and the axis of the connecting part are on the same straight line.

9. The temperature stimulation device of claim 2, wherein, The temperature stimulation rod also has a second cavity surrounding the first cavity. The first end of the first cavity is connected to the temperature stimulation head, the first end of the second cavity is connected to the first end of the first cavity, the second end of the second cavity is connected to the inlet of the hydraulic pump, and the second end of the first cavity is connected to the outlet of the hydraulic pump through the storage tank.

10. The temperature stimulation device of claim 1, wherein, It also includes an electrical stimulation rod, which is coaxially sleeved on the temperature stimulation rod. The end of the electrical stimulation rod is a temperature stimulation head, which is insulated and thermally connected to the temperature stimulation head.

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