Wafer cutting fluid hopper and wafer cutting machine

Abstract

This invention provides a wafer cutting fluid funnel and a wafer dicing machine, relating to the field of semiconductor wafer processing technology, to improve the technical problem in existing cutting fluid filtration funnels where the wire mesh is difficult to replace after damage. The wafer cutting fluid funnel includes a detachable funnel assembly and a filter element fixed within the detachable funnel assembly; the detachable funnel assembly includes a first funnel and a second funnel detachably connected to the first funnel, with a fixing space formed between the first and second funnels for fixing the filter element. The wafer cutting fluid funnel and wafer dicing machine provided by this invention enable quick and convenient replacement of the filter element, while also achieving high cutting fluid filtration efficiency.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer processing technology, and more specifically, to a wafer cutting fluid funnel and a wafer dicing machine. Background Technology

[0002] A wafer dicing machine is used to precisely divide a whole wafer that has completed front-end processes such as photolithography, etching, and doping into bare chip dies with independent circuit functions, laying the foundation for subsequent chip packaging.

[0003] During the wafer dicing process, cutting fluid needs to be continuously applied to the cutting zone to achieve cooling, chip removal, cleaning, and lubrication protection. For economic reasons, the used cutting fluid is collected through the cutting fluid discharge channel of the wafer dicing machine and filtered through a funnel before entering the cutting fluid circulation system.

[0004] In the prior art, as the cutting fluid is used for circulating filtration, the bottom stainless steel wire mesh of the funnel will be damaged by the scouring of the cutting fluid; and since the wire mesh is usually welded to the funnel, it is not easy to replace it after it is damaged. Utility Model Content

[0005] The purpose of this invention is to provide a wafer cutting fluid funnel and a wafer dicing machine to improve the technical problem in the prior art where the wire mesh of the funnel used for filtering cutting fluid is not easy to replace after the wire mesh is damaged.

[0006] The embodiments of this utility model can be implemented as follows: In a first aspect, this utility model provides a wafer cutting fluid funnel, suitable for connection to the cutting fluid discharge channel of a wafer dicing machine, and for filtering the cutting fluid, comprising: Filter components; A detachable funnel assembly includes a first funnel and a second funnel detachably connected to the first funnel; a fixing space for fixing a filter element is formed between the first funnel and the second funnel.

[0007] In an optional embodiment, the first funnel includes a first cylindrical member, and the second funnel includes a second cylindrical member; The first cylindrical component is sleeved on the outside of the second cylindrical component, and the fixed space is formed between the inner wall of the first cylindrical component and the outer wall of the second cylindrical component.

[0008] In an optional embodiment, the first cylindrical member is provided with a plurality of first flow holes, and the second cylindrical member is provided with a plurality of second flow holes; When the first cylindrical member is sleeved on the second cylindrical member, the projections of the plurality of second flow holes on the first cylindrical member coincide with at least a portion of the plurality of first flow holes to form a first filter channel.

[0009] In an optional implementation, the number of the first flow hole and the second flow hole is 5-10.

[0010] In an optional embodiment, one end of the first cylindrical member is provided with a plurality of first radial fixing brackets, and a third flow hole is defined between the plurality of first radial fixing brackets; The second cylindrical member has a plurality of second radial fixing brackets at one end near the first radial fixing bracket, and a fourth flow hole is defined between the plurality of second radial fixing brackets; With the first cylindrical component fitted onto the second cylindrical component, the projections of the plurality of fourth flow holes on the first radial fixed bracket at least partially overlap with the plurality of third flow holes to form a second filter channel.

[0011] In an optional embodiment, the first radial fixing bracket is provided with a plurality of first positioning holes, and the second radial fixing bracket is provided with a plurality of second positioning holes. The plurality of first positioning holes and the plurality of second positioning holes are positioned and connected by fasteners.

[0012] In an optional embodiment, the end of the first cylindrical member away from the first radial fixing bracket is provided with a connecting portion, which is used to connect to the cutting fluid discharge channel of the wafer dicing machine.

[0013] In an optional implementation, the number of the third and fourth flow holes is 4-6.

[0014] In an optional implementation, the fastener is a bolt.

[0015] Secondly, the present invention provides a wafer dicing machine, including a cutting fluid discharge channel connected to the wafer dicing machine, wherein the wafer cutting fluid funnel described in any of the foregoing embodiments is connected to the wafer dicing machine through the cutting fluid discharge channel.

[0016] The beneficial effects of the wafer cutting fluid funnel and wafer dicing machine provided in this embodiment of the invention include: This invention provides a wafer cutting fluid funnel and a wafer dicing machine having the wafer cutting fluid funnel. The wafer cutting fluid funnel can filter the cutting fluid generated by the wafer dicing machine. The wafer cutting fluid funnel includes a separable funnel assembly and a filter element fixed in the separable funnel assembly. The separable funnel assembly includes a first funnel and a second funnel detachably connected to the first funnel. A fixing space for fixing the filter element is formed between the first funnel and the second funnel. Since the filter element is disposed between the separable first funnel and the second funnel, the filter element can be easily replaced by separating the first funnel and the second funnel. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram of the wafer cutting fluid funnel provided in this embodiment from a first-view perspective (filter element omitted); Figure 2 This is a schematic diagram of the wafer cutting fluid funnel provided in this embodiment from a second perspective. Figure 3 This is a schematic diagram of the structure of the first funnel in the wafer cutting fluid funnel provided in this embodiment; Figure 4 This is a schematic diagram of the structure of the second funnel within the wafer cutting fluid funnel provided in this embodiment; Figure 5 This is a schematic diagram showing the connection relationship between the first funnel and the second funnel in the wafer cutting fluid funnel provided in this embodiment.

[0019] Icon: 100 - Filter; 200 - Separable funnel assembly; 210 - First funnel; 211 - First cylindrical component; 212 - First flow hole; 213 - First radial fixing bracket; 214 - Third flow hole; 215 - First positioning hole; 216 - Connecting part; 220 - Second funnel; 221 - Second cylindrical component; 222 - Second flow hole; 223 - Second radial fixing bracket; 224 - Fourth flow hole; 225 - Second positioning hole; 230 - Fixed space. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0021] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0022] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0023] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0024] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0025] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.

[0026] In the field of semiconductor wafer processing technology, wafer dicing machines are the core process equipment before back-end packaging. Their core function is to precisely divide the entire wafer, which has completed front-end processes such as photolithography, etching, and doping, into bare chip dies with independent circuit functions, laying the foundation for subsequent chip packaging (such as bonding and molding).

[0027] During wafer dicing, cutting fluid needs to be continuously applied to the cutting zone (i.e., the contact area between the cutting tool and the wafer) to achieve cooling, chip removal, cleaning, and lubrication protection. The cutting fluid primarily plays the following roles during wafer dicing: 1. Remove heat from the cutting zone promptly to avoid thermal damage; 2. Remove tiny debris generated during cutting promptly to avoid scratching the wafer; 3. Provide lubrication and protection to reduce cutting stress and tool wear.

[0028] Typically, for economic reasons, most cutting fluids are collected after being applied to the cutting zone, and then recycled after filtration and other treatments.

[0029] Currently, a funnel is installed at the cutting fluid discharge channel of the wafer dicing machine to achieve preliminary filtration of the cutting fluid. The funnel contains a wire mesh, which can initially filter out debris in the cutting fluid. However, as the wafer dicing machine continues to operate and the cutting fluid is circulated and filtered, the existing funnel will cause the bottom stainless steel wire mesh to break under the scouring of the cutting fluid. Since the wire mesh is usually welded to the funnel, it is not easy to replace it after it breaks.

[0030] This utility model provides a wafer cutting fluid funnel and a wafer dicing machine. The wafer cutting fluid funnel can filter the cutting fluid produced by the wafer dicing machine. The filter element 100 in the wafer cutting fluid funnel is fixed by a detachable funnel assembly 200 for easy replacement.

[0031] The following describes in detail the overall structure, working principle, and technical effects of the wafer cutting fluid funnel and wafer dicing machine provided by this utility model through embodiments and in conjunction with the accompanying drawings.

[0032] Please see Figure 1 and Figure 2 This embodiment provides a wafer cutting fluid funnel and a wafer dicing machine having the wafer cutting fluid funnel, wherein the wafer cutting fluid funnel is connected to the cutting fluid discharge channel of the wafer dicing machine and is used to filter the cutting fluid to initially filter out debris in the cutting fluid. It includes a separable funnel assembly 200 and a filter element 100 fixed in the separable funnel assembly 200.

[0033] In this embodiment, the detachable funnel assembly 200 includes a first funnel 210 and a second funnel 220 detachably connected to the first funnel 210.

[0034] Please see Figure 5 Furthermore, the first funnel 210 and the second funnel 220 are nested together, with the first funnel 210 fitted outside the second funnel 220; therefore, when the first funnel 210 and the second funnel 220 are nested together, a fixing space 230 for fixing the filter element 100 is formed between the first funnel 210 and the second funnel 220.

[0035] In actual operation, the operator needs to cut a filter element 100 of matching size according to the dimensions of the first funnel 210 and the second funnel 220 so that the cutting fluid entering the first funnel 210 and the second funnel 220 can be completely filtered by the filter element 100.

[0036] In some embodiments, the filter element 100 can be a variety of filter materials, as long as they are capable of filtering the corresponding type of cutting fluid, and no limitation is made here.

[0037] In this embodiment, the filter element 100 is a wire mesh.

[0038] Please see Figure 3 and Figure 4 In this embodiment, the first funnel 210 includes a first cylindrical member 211, and the second funnel 220 includes a second cylindrical member 221. When the first funnel 210 and the second funnel 220 are fitted together, the fixing space 230 for fixing the filter element 100 is formed between the inner wall of the first cylindrical member 211 and the outer wall of the second cylindrical member 221.

[0039] Furthermore, the first cylindrical member 211 has a plurality of first flow holes 212 arranged in an annular array, and correspondingly, the second cylindrical member 221 has a plurality of second flow holes 222. When the first cylindrical member 211 is fitted onto the second cylindrical member 221, the projections of the plurality of second flow holes 222 on the first cylindrical member 211 at least partially overlap with the plurality of first flow holes 212 to form a first filter channel.

[0040] Understandably, when the cutting fluid enters the wafer cutting fluid funnel provided in this embodiment, a portion of the cutting fluid passes through the second flow hole 222 and the first flow hole 212 in sequence, and is filtered by the filter element 100 fixed between the second flow hole 222 and the first flow hole 212; the degree of overlap between the second flow hole 222 and the first flow hole 212 in the circumferential direction is used to limit the opening of the first filter channel. When the projection of the second flow hole 222 on the first cylindrical member 211 completely overlaps with the first flow hole 212, the first filter channel has the maximum opening.

[0041] In normal conditions, in order to make the wafer cutting fluid funnel have the greatest possible filtration efficiency, when fixing the first cylindrical part 211 and the second cylindrical part 221, the projection of the second flow hole 222 on the first cylindrical part 211 should coincide with the first flow hole 212 as much as possible.

[0042] In some embodiments, the number of first flow holes 212 and second flow holes 222 is the same, which can be 5-10.

[0043] In this embodiment, the number of first flow holes 212 and second flow holes 222 are both 6.

[0044] Furthermore, one end of the first cylindrical member 211 is provided with a plurality of first radial fixing brackets 213, and a third flow hole 214 is defined between the plurality of first radial fixing brackets 213; one end of the second cylindrical member 221 near the first radial fixing brackets 213 is provided with a plurality of second radial fixing brackets 223, and a fourth flow hole 224 is defined between the plurality of second radial fixing brackets 223.

[0045] In this embodiment, the first radial fixing bracket 213 serves to provide axial support to the second cylindrical member 221 and the filter member 100, and also to improve the radial structural strength of the first cylindrical member 211. Similarly, the second radial fixing bracket 223 serves to provide axial support to the filter member 100, and also to improve the radial structural strength of the second cylindrical member 221. Simultaneously, a third flow hole 214 is defined between the plurality of first radial fixing brackets 213, and a fourth flow hole 224 is defined between the plurality of second radial fixing brackets 223. When the first cylindrical member 211 is fitted onto the second cylindrical member 221, the projections of the plurality of fourth flow holes 224 onto the first radial fixing brackets 213 at least partially overlap with the projections of the plurality of third flow holes 214, thus forming a second filtration channel.

[0046] Understandably, when the cutting fluid enters the wafer cutting fluid funnel provided in this embodiment, another portion of the cutting fluid passes through the fourth flow hole 224 and the third flow hole 214 in sequence, and is filtered by the filter element 100 fixed between the first radial fixing bracket 213 and the second radial fixing bracket 223; the degree of overlap between the projection of the fourth flow hole 224 on the first radial fixing bracket 213 and the plurality of third flow holes 214 is used to limit the opening of the second filtration channel. When the projection of the fourth flow hole 224 on the first radial fixing bracket 213 completely overlaps with the plurality of third flow holes 214, the second filtration channel has the maximum opening.

[0047] In normal conditions, in order to make the wafer cutting fluid funnel have the greatest possible filtration efficiency, when fixing the first cylindrical part 211 and the second cylindrical part 221, the projection of the fourth flow hole 224 on the first radial fixing bracket 213 should coincide as much as possible with the plurality of third flow holes 214.

[0048] In some embodiments, the number of third flow holes 214 and fourth flow holes 224 is the same, which can be 4-6.

[0049] In this embodiment, the number of third flow holes 214 and fourth flow holes 224 are both 4.

[0050] In order to enable the first cylindrical component 211 and the second cylindrical component 221 to be separably connected while having a relatively fixed installation angle, in this embodiment, the first radial fixing bracket 213 is provided with at least two first positioning holes 215, and the second radial fixing bracket 223 is provided with at least two corresponding second positioning holes 225; the multiple first positioning holes 215 and the multiple second positioning holes 225 are positioned and connected by fasteners.

[0051] For example, the fastener can be a bolt.

[0052] In this embodiment, when the first radial fixing bracket 213 and the second radial fixing bracket 223 are connected by fasteners, the first filter channel and the second filter channel should have the largest possible opening. It is understood that when the filter element 100 is installed, it should at least completely cover the first filter channel and the second filter channel.

[0053] In the wafer cutting fluid funnel provided in this embodiment, the second funnel 220 is detachably disposed inside the first funnel 210, and is connected to the cutting fluid discharge channel connected to the wafer dicing machine through the first funnel 210.

[0054] In order to facilitate the connection between the first funnel 210 and the cutting fluid discharge channel of the wafer dicing machine, in this embodiment, a connecting part 216 is provided at the end of the first cylindrical member 211 away from the first radial fixing bracket 213. The first funnel 210 can be connected to the cutting fluid discharge channel of the wafer dicing machine through the connecting part 216. The connecting part 216 is used to improve the convenience and sealing of the connection between the two.

[0055] This embodiment provides a wafer cutting fluid funnel and a wafer dicing machine incorporating the funnel. The funnel includes a detachable funnel assembly 200, where a filter element 100 is secured by a detachably connected first funnel 210 and second funnel 220. When the filter element 100 needs replacement, the fasteners are removed to separate the first and second funnels 210 and 220, allowing the original filter element 100 to be removed. The replaced filter element 100 is then repositioned between the first and second funnels 210 and 220, completely covering the first and second filtration channels. The first and second funnels 210 and 220 are then reconnected via fasteners and connected to the cutting fluid discharge channel of the wafer dicing machine via a connecting part 216. The wafer cutting fluid funnel provided in this embodiment facilitates the replacement of the filter element 100 and, due to the presence of the first and second filtration channels, achieves high cutting fluid filtration efficiency.

[0056] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.

Claims

1. A wafer cutting fluid hopper characterized by, Suitable for connection to the cutting fluid discharge channel of a wafer dicing machine and for filtering the cutting fluid, including: Filter element (100); A detachable funnel assembly (200) includes a first funnel (210) and a second funnel (220) detachably connected to the first funnel (210); a fixing space (230) is formed between the first funnel (210) and the second funnel (220) for fixing the filter element (100).

2. The wafer cutting fluid hopper of claim 1, wherein, The first funnel (210) includes a first cylindrical member (211), and the second funnel (220) includes a second cylindrical member (221). The first cylindrical member (211) is sleeved on the outside of the second cylindrical member (221), and the fixed space (230) is formed between the inner wall of the first cylindrical member (211) and the outer wall of the second cylindrical member (221).

3. The wafer cutting fluid funnel according to claim 2, wherein, The first cylindrical member (211) has a plurality of first flow holes (212), and the second cylindrical member (221) has a plurality of second flow holes (222). With the first cylindrical member (211) sleeved on the second cylindrical member (221), the projections of the plurality of second flow holes (222) on the first cylindrical member (211) coincide with at least a portion of the plurality of first flow holes (212) to form a first filter channel.

4. The wafer cutting fluid funnel according to claim 3, wherein, The number of the first flow hole (212) and the second flow hole (222) is 5-10.

5. The wafer cutting fluid funnel of claim 2, wherein, One end of the first cylindrical member (211) is provided with a plurality of first radial fixing brackets (213), and a third flow hole (214) is defined between the plurality of first radial fixing brackets (213). The second cylindrical member (221) is provided with a plurality of second radial fixing brackets (223) at one end near the first radial fixing bracket (213), and a fourth flow hole (224) is defined between the plurality of second radial fixing brackets (223). With the first cylindrical member (211) sleeved on the second cylindrical member (221), the projections of the plurality of fourth flow holes (224) on the first radial fixing bracket (213) at least partially overlap with the plurality of third flow holes (214) to form a second filter channel.

6. The wafer cutting fluid funnel of claim 5, wherein, The first radial fixing bracket (213) is provided with a plurality of first positioning holes (215), and the second radial fixing bracket (223) is provided with a plurality of second positioning holes (225). The plurality of first positioning holes (215) and the plurality of second positioning holes (225) are positioned and connected by fasteners.

7. The wafer cutting fluid funnel of claim 5, wherein, The first cylindrical member (211) has a connecting part (216) at one end away from the first radial fixing bracket (213), and the connecting part (216) is used to connect to the cutting fluid discharge channel of the wafer dicing machine.

8. The wafer cutting fluid funnel of claim 5, wherein, The number of the third flow hole (214) and the fourth flow hole (224) is 4-6.

9. The wafer cutting fluid funnel of claim 6, wherein, The fastener is a bolt.

10. A wafer dicing machine, characterized in that, A cutting fluid discharge passage connected to a wafer dicing machine, the wafer cutting fluid funnel according to any one of claims 1 to 9 is connected to the wafer dicing machine through the cutting fluid discharge passage.

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