Die lip wiping mechanism and die coating apparatus
By designing a V-shaped wiping and cleaning structure for the die head lip wiping mechanism, combined with a flexible wiping layer and an ultrasonic nozzle, efficient cleaning of the die head lip is achieved, solving the problem of complex structure in existing technologies and improving the coating quality and production efficiency of solar cells.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ANHUI HUASUN ENERGY CO LTD
- Filing Date
- 2025-06-06
- Publication Date
- 2026-07-31
AI Technical Summary
The existing die lip wiping mechanism has a complex structure, making it difficult to achieve uniform and consistent cleaning, which affects the coating quality of solar cells.
A wiping mechanism for the lip of a mold head is designed, including a V-shaped wiping structure and a cleaning structure. It combines a flexible wiping layer and an ultrasonic nozzle. The automatic cleaning and wiping of the lip of the mold head is achieved through a moving drive component. A cleaning fluid recovery tank is used to recover the cleaning fluid, which simplifies the structure and improves the cleaning efficiency.
This technology enables efficient cleaning of the die head lip, simplifies the structure, improves the uniformity and consistency of cleaning, reduces labor intensity, and enhances the quality and efficiency of solar cell production.
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Figure CN224573973U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of die coating equipment, and more specifically, to a die lip wiping mechanism and a die coating equipment. Background Technology
[0002] With the increasing global demand for clean energy, solar cells, as a highly efficient and environmentally friendly energy conversion technology, have been widely applied and rapidly developed. In the production process of solar cells, the coating process is one of the key steps, especially in the preparation of electrodes, passivation layers, and encapsulation layers. The coating quality directly affects the photoelectric conversion efficiency and lifespan of the cell. The importance of the die lip in solar cell production: In the coating process of solar cells, the die lip is the core component of the coating equipment. Its function is to uniformly coat the slurry onto the substrate to form the required thin film layer. The precision and cleanliness of the die lip are crucial to the coating quality. If the die lip is contaminated or accumulates residue, it will lead to problems such as uneven coating, inconsistent coating thickness, and surface defects, thereby reducing the performance and quality of the solar cell.
[0003] Some existing technologies employ manual wiping, which makes it difficult to guarantee uniformity and consistency. To address this issue, mechanical wiping methods have also been adopted, such as the invention entitled "Automatic Wiping Device for Coating Die Lips" (application number 202411279204.3). However, existing mechanical wiping methods suffer from complex wiping and cleaning structures, requiring a dedicated cleaning chamber. Utility Model Content
[0004] This application provides a die head lip wiping mechanism and a die head coating device to solve the problem that the structure of the die head lip wiping mechanism in the prior art is relatively complex.
[0005] According to the present application, a wiping mechanism for a mold lip includes a wiping assembly, which includes a wiping seat structure, a cleaning structure, and a wiping structure. The wiping seat structure includes an inlet channel, a cleaning fluid recovery tank, and an outlet channel. The inlet channel is connected to the cleaning structure, and the outlet channel is connected to the cleaning fluid recovery tank. The cleaning structure, the wiping structure, and the cleaning fluid recovery tank are all located on the first side of the wiping seat structure.
[0006] Furthermore, the wiping structure is V-shaped, with the opening of the wiping structure facing the direction of the mold lip.
[0007] Furthermore, the wiping structure includes a flexible wiping layer located on the side facing the die lip.
[0008] Furthermore, the cleaning structure is V-shaped and is lower than the wiping structure.
[0009] Furthermore, the cleaning fluid recovery tank is located between the cleaning structure and the wiping structure, both of which are higher than the height of the cleaning fluid recovery tank.
[0010] Furthermore, the lip wiping mechanism also includes a first moving drive component, and the wiping component is connected to the first moving drive component.
[0011] Furthermore, the first moving drive assembly includes a mounting base, a first drive motor, a first lead screw, a first slider, and a first limiting block. The first drive motor is mounted on the mounting base, the first lead screw is rotatably mounted on the mounting base, the first drive motor is connected to the first lead screw, the first limiting block is mounted on the mounting base, the first slider passes through the first lead screw and cooperates with the first limiting block, and the first slider is connected to the wiping seat structure.
[0012] Furthermore, the die lip wiping mechanism also includes a second moving drive assembly, which is disposed on the die coating body.
[0013] According to another aspect of this application, a die coating device is also provided, which includes a die coating device body and a die lip wiping mechanism disposed on the die coating device body, wherein the die lip wiping mechanism is the aforementioned die lip wiping mechanism.
[0014] Furthermore, the die coating equipment also includes an image acquisition component, which is mounted on the main body of the die coating equipment and is positioned corresponding to the die lip of the main body of the die coating equipment.
[0015] The technical solution of this application places the cleaning structure and the wiping structure on the same side of the wiping seat structure, which enables the cleaning and wiping of the mold head lip, making the cleaning of the mold head lip easier. After cleaning, the cleaning fluid flows into the cleaning fluid recovery tank for further processing. The above structure is simple to set up and easy to use, and can complete the wiping and cleaning of the mold head lip without the need for other complex structures. The technical solution of this application effectively solves the problem of the relatively complex structure of the existing mold head lip wiping mechanism. Attached Figure Description
[0016] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.
[0017] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 A three-dimensional structural schematic diagram of Embodiment 1 of the lip wiping mechanism of this application is shown;
[0019] Figure 2 It shows Figure 1 A schematic diagram of the die head lip wiping mechanism from another angle;
[0020] Figure 3 It shows Figure 1 A three-dimensional structural diagram of the installation of the mold head lip wiping mechanism;
[0021] Figure 4 It shows Figure 3 A front view schematic diagram of the lip wiping mechanism of the mold head;
[0022] Figure 5 It shows Figure 3 Rear view schematic diagram of the lip wiping mechanism of the mold head;
[0023] Figure 6 It shows Figure 3 A top view of the lip wiping mechanism of the mold head.
[0024] The above figures include the following reference numerals:
[0025] 10. Wiping assembly; 11. Wiping seat structure; 111. Liquid inlet channel; 112. Cleaning fluid recovery tank; 113. Liquid outlet channel; 12. Cleaning structure; 13. Wiping structure; 20. First moving drive assembly; 21. Mounting base; 22. First drive motor; 23. First lead screw; 24. First slider; 25. First limit block; 30. Second moving drive assembly; 31. Second drive motor; 32. Second lead screw; 33. Second slider; 40. Waste liquid recovery container; 100. Main body of die coating equipment; 110. Die lip; 120. Pressure sensor; 200. Image acquisition assembly. Detailed Implementation
[0026] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. This application will now be described in detail with reference to the accompanying drawings and embodiments.
[0027] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.
[0028] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways, rotated 90 degrees, or in other orientations, and the spatial relative descriptions used herein will be interpreted accordingly.
[0029] like Figures 1 to 6 As shown, the lip wiping mechanism of Embodiment 1 includes a wiping assembly 10. The wiping assembly 10 includes a wiping seat structure 11, a cleaning structure 12, and a wiping structure 13. The wiping seat structure 11 includes an inlet channel 111, a cleaning fluid recovery tank 112, and an outlet channel 113. The inlet channel 111 is connected to the cleaning structure 12, and the outlet channel 113 is connected to the cleaning fluid recovery tank 112. The cleaning structure 12, the wiping structure 13, and the cleaning fluid recovery tank 112 are all located on the first side of the wiping seat structure 11.
[0030] In this embodiment, the cleaning structure 12 and the wiping structure 13 are located on the same side of the wiping seat structure 11, which enables the cleaning and wiping of the mold head lip 110, making it easier to clean. After cleaning, the cleaning fluid flows into the cleaning fluid recovery tank 112 for further processing. The above structure is simple and easy to use, eliminating the need for other complex structures to clean the mold head lip. This application effectively solves the problem of complex structures in existing mold head lip wiping mechanisms.
[0031] It should be noted that in the technical solution of Embodiment 1, the cleaning structure 12 uses an ultrasonic atomizing nozzle. The cleaning fluid sprayed from the nozzle is selected according to the different contaminants on the die lip 110. For example, there are multiple cleaning fluid receiving tanks, each connected to the main pipe through corresponding branch pipes. A pump is installed on the main pipe, and each branch pipe is equipped with a solenoid valve. The cleaning fluid that is easiest to clean for the contaminated substance on the die lip is used for cleaning. The cleaning fluid can be an organic solvent or deionized water. The cleaning structure 12 has a certain tilt angle, with the side of the cleaning structure 12 away from the cleaning fluid recovery tank 112 slightly higher. The tilt angle used in this embodiment is 1°, which facilitates the recovery of the cleaning fluid and reduces the risk of cleaning fluid leakage or even environmental pollution. If the tilt angle is too large, the pressure difference of the cleaning fluid sprayed onto the die lip 110 will be large, which may lead to uneven cleaning.
[0032] like Figure 3 As shown, in the technical solution of Embodiment 1, the wiping structure 13 is V-shaped, and the opening of the wiping structure 13 faces the direction of the mold lip 110. The wiping structure 13 is adapted to the contour of the mold lip 110, thus achieving higher wiping efficiency. For example, after the wiping assembly 10 and the mold lip 110 are aligned, the wiping structure 13 only needs to move back and forth along the extension direction of the mold lip 110 to achieve cleaning and wiping of the mold lip 110, without any other actions.
[0033] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the wiping structure 13 includes a flexible wiping layer located on the side facing the die lip 110. The flexible wiping layer prevents damage to the die lip 110 and avoids scratches and other problems. It should be noted that the flexible wiping layer can be made of materials that do not damage the die lip, such as non-woven fabric or silicone. Taking non-woven fabric as an example, the non-woven fabric can be adhered to the wiping seat structure 11 to form the wiping structure 13.
[0034] like Figure 1 and Figure 2 As shown, in the technical solution of Embodiment 1, the cleaning structure 12 is V-shaped and lower than the wiping structure 13. The V-shape of the cleaning structure 12 allows for better adaptation to the shape of the mold lip 110, resulting in better cleaning effect and higher cleaning efficiency. The lower position of the cleaning structure 12 below the wiping structure 13 avoids interference and collision between the mold lip 110 and the cleaning structure 12. Because the cleaning fluid sprayed from the cleaning structure 12 carries a certain pressure, it overcomes gravity and other factors to spray onto the mold lip 110 for cleaning.
[0035] like Figure 1 and Figure 2As shown, in the technical solution of Embodiment 1, the cleaning fluid recovery tank 112 is located between the cleaning structure 12 and the wiping structure 13, both of which are higher than the height of the cleaning fluid recovery tank 112. According to the natural law that liquid flows downwards under gravity, the sprayed cleaning fluid flows into the cleaning fluid recovery tank 112 under gravity. The outlet channel 113 provides negative pressure to recover the liquid in the cleaning fluid recovery tank 112 into the waste liquid recovery container 40. It should be noted that negative pressure adsorption structures are provided on both sides of the upper part of the wiping assembly 10. This effectively adsorbs substances evaporated from the cleaning fluid, such as organic solvents, during cleaning, effectively protecting the health of operators and contributing to environmental protection.
[0036] like Figures 1 to 4 As shown, in the technical solution of Embodiment 1, the mold lip wiping mechanism further includes a first moving drive component 20, and the wiping component 10 is connected to the first moving drive component 20. The moving direction of the first moving drive component 20 is the length extension direction of the mold lip 110, which ensures that the wiping component 10 moves along the X-axis direction (i.e., the extension direction of the mold lip 110).
[0037] like Figure 3 and Figure 4 As shown, in the technical solution of Embodiment 1, the first moving drive assembly 20 includes a mounting base 21, a first drive motor 22, a first lead screw 23, a first slider 24, and a first limiting block 25. The first drive motor 22 is mounted on the mounting base 21, the first lead screw 23 is rotatably mounted on the mounting base 21, the first drive motor 22 is connected to the first lead screw 23, the first limiting block 25 is mounted on the mounting base 21, the first slider 24 passes through the first lead screw 23 and cooperates with the first limiting block 25, and the first slider 24 is connected to the wiping seat structure 11. The above structure is convenient to set, easy to operate, and runs smoothly. It should be noted that the structure of the first slider 24 is U-shaped, and the first limiting block 25 is located inside the U-shaped opening. In this way, the first limiting block 25 can limit the first slider 24 without the need for a separate limiting structure. Specifically, the lower end of the first slider 24 has a threaded hole that matches the first lead screw 23. The upper end of the first slider 24 is connected to a downward-facing first extension plate, and the lower end of the first extension plate is connected to an inward-facing second extension plate. The second extension plate is connected to the wiping seat structure 11. The above structure is compact and operates smoothly. The first slider 24 moves along the length direction of the first limiting block 25, and the extension direction of the first limiting block 25 is the same as the extension direction of the first lead screw 23.
[0038] like Figures 3 to 6As shown, in the technical solution of Embodiment 1, the die head lip wiping mechanism further includes a second moving drive assembly 30, which is disposed on the die head coating body. The second moving drive assembly 30 allows the wiping assembly 10 to be adjusted vertically, i.e., adjusted along the Z-axis. It should be noted that the die head lip 110's own structure allows for movement along the Y-axis. Thus, through the driving structure of the wiping assembly 10 and the driving structure of the die head lip 110, omnidirectional adjustment in the X, Y, and Z directions can be achieved. The second moving drive assembly 30 includes a second drive motor 31, a second lead screw 32, and a second slider 33. The second drive motor 31 is disposed on the die head coating body, the second lead screw 32 is connected to the second drive motor 31, and the second slider 33 cooperates with the second lead screw 32. The second slider 33 and the mounting base 21 have a mutually cooperating slide rail structure. The above structure operates smoothly, is compact, and is easy to control.
[0039] As described above, the working process of the die head lip wiping mechanism is as follows: Multiple sets of data are collected by detecting dirt on the die head lip using a camera, and a cleaning formula is edited. During the coating process, when the die head passes the camera, the lip is sampled and compared with the stored formula data. When the sample exceeds a set threshold, the wiping process is automatically initiated. The wiping time is adjustable from 5 to 30 seconds. The number of wiping cycles can also be edited using the formula. The wiping steps are as follows: When the dirt on the die head lip exceeds the set threshold, the die head moves to the top of the wiping mechanism via a linear motor. The die head lifting servo motor then moves the die head downwards, causing the V-shaped die head lip to enter and align with the V-shaped groove of the wiping device (wiping structure 13). When the flexible lip seal on the wiping device completely covers the die head lip, the ultrasonic atomizing nozzle is activated for cleaning, and the wiping seat structure 11 moves synchronously. The pressure sensor 120 on the mold head contacts the confirmation stop on the wiping device (the exact timing of the contact between the pressure sensor on the wiping device and the confirmation stop on the mold head varies depending on the design). When the detection distance is greater than the set value, the wiping device is lifted to a certain height (range 10 micrometers to 800 micrometers) by the wiping lifting motor, with the distance calculated based on the feedback value from the pressure sensor. Conversely, when the detection distance is less than the set value, the wiping device is lowered to a certain height by the wiping lifting motor to ensure consistent wiping force and effectively prevent excessive wiping force on the lip, which could damage the flatness of the lip.
[0040] The wiping assembly 10 incorporates a pressure sensor, and the movement of the wiping seat structure 11 is achieved through a multi-axis drive mechanism. The vision detection module acquires real-time images of the lip surface and feeds them back to the control system to generate cleaning instructions.
[0041] This embodiment can also control the temperature of the cleaning fluid. The wiping head does not have an integrated temperature control and detection unit. The cleaning fluid supply pipeline is covered with a heating belt for heating and temperature control. Alternatively, the cleaning agent storage tank in the supply cabinet is used for heating and temperature control, which is then supplied to the wiping assembly 10.
[0042] The axial deviation between the ball screw and the support assembly is permissible at less than 20 μm. The first and second leads mentioned above are ball screws. The parallelism between the ball screw and the linear guide refers to the vertical or horizontal tilt of the ball screw relative to a reference point such as the linear guide. The permissible tilt is less than 1 / 2000. psi (absolute pressure) is pounds per square inch; a unit of pressure. 1 bar = 100,000 Pa = 10 Newtons per square centimeter = 0.1 MPa; 1 psi = 6.895 kPa = 0.0689476 bar; 1 bar ≈ 14.5 psi. The structure is sealed with flexible material around its perimeter to ensure that the ultrasonic atomizing nozzles of the cleaning agent spraying unit can spray a high-pressure water jet of 1 bar to 8 bar during cleaning. The ultrasonic fluid water is used to clean the lip and edges of the mold head to the maximum extent. The center uses negative pressure to absorb and recover foreign matter and waste liquid. Finally, the flexible material on the adjacent side is wiped clean to ensure the cleanliness of the lip and reduce scratches and marks during coating.
[0043] This embodiment can achieve the following beneficial effects:
[0044] The wiping head integrates temperature control, softening high-viscosity residues through a heating unit to improve cleaning efficiency. Its modular design allows the wiping head and drive mechanism to connect via a quick-change interface, adapting to different mold sizes. The control system incorporates machine learning algorithms to optimize the wiping path and pressure parameters based on historical cleaning data. It offers continuous online cleaning: eliminating downtime and increasing production efficiency by over 20%; precise control: closed-loop pressure and temperature regulation prevents lip damage; and strong adaptability: dynamically adjusting the cleaning strategy through visual feedback, suitable for nanoscale high-precision coating scenarios. The recovery, filtration, and reuse of the cleaning fluid, as well as the mold drying structure, are not detailed here.
[0045] Embodiment two can be an interference fit. The first side of the wiping seat structure 11 has a V-shaped wiping structure 13 mounting platform. This mounting platform has multiple frustoconical holes with smaller inner diameters and larger outer diameters. The flexible wiping layer includes a silicone plate and multiple insertion posts, with each insertion post corresponding to one of the multiple frustoconical holes. The inner wall of the V-shape of the mounting platform has frustoconical holes, and the outer edge of the V-shape of the mounting platform also has multiple frustoconical holes. The flexible wiping layer is pressed onto the wiping seat structure 11. The flexible wiping layer of the above structure is easy to disassemble and replace.
[0046] According to another aspect of this application, a die coating device is also provided. The die coating device includes a die coating device body 100 and a die lip wiping mechanism disposed on the die coating device body 100. The die lip wiping mechanism is the aforementioned die lip wiping mechanism. The die coating device also includes an image acquisition component 200, which is disposed on the die coating device body 100 and correspondingly disposed with respect to the die lip 110 of the die coating device body. There are multiple image acquisition components 200, which are respectively disposed on both sides of the horizontal movement direction of the die head. The technical solution of this application also includes a control component, which includes a controller, a memory, etc. Each control device, such as a valve, a motor, and the image acquisition component 200 (image acquisition is performed by a camera in the above embodiment 1), is electrically connected to the control component and is automatically controlled by setting a program. This greatly reduces labor intensity and improves labor efficiency, which will not be described in detail here.
[0047] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0048] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.
[0049] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A lip wiping mechanism for a mold head, characterized in that, include: Wiping assembly (10), the wiping assembly (10) includes wiping seat structure (11), cleaning structure (12) and wiping structure (13). The wiping seat structure (11) includes liquid inlet channel (111), cleaning fluid recovery tank (112) and liquid outlet channel (113). The liquid inlet channel (111) is connected to the cleaning structure (12). The liquid outlet channel (113) is connected to the cleaning fluid recovery tank (112). The cleaning structure (12), the wiping structure (13) and the cleaning fluid recovery tank (112) are all arranged on the first side of the wiping seat structure (11).
2. The lip wiping mechanism according to claim 1, characterized in that, The wiping structure (13) is V-shaped, and the opening of the wiping structure (13) faces the direction of the mold lip (110).
3. The lip wiping mechanism according to claim 2, characterized in that, The wiping structure (13) includes a flexible wiping layer located on the side facing the mold lip (110).
4. The lip wiping mechanism according to claim 2, characterized in that, The cleaning structure (12) is V-shaped and is lower than the wiping structure (13).
5. The lip wiping mechanism according to claim 1, characterized in that, The cleaning fluid recovery tank (112) is located between the cleaning structure (12) and the wiping structure (13), and both the cleaning structure (12) and the wiping structure (13) are higher than the height of the cleaning fluid recovery tank (112).
6. The lip wiping mechanism according to any one of claims 1 to 5, characterized in that, The lip wiping mechanism of the mold head also includes a first moving drive component (20), and the wiping component (10) is connected to the first moving drive component (20).
7. The lip wiping mechanism according to claim 6, characterized in that, The first moving drive assembly (20) includes a mounting base (21), a first drive motor (22), a first lead screw (23), a first slider (24), and a first limiting block (25). The first drive motor (22) is mounted on the mounting base (21), the first lead screw (23) is rotatably mounted on the mounting base (21), the first drive motor (22) is connected to the first lead screw (23), the first limiting block (25) is mounted on the mounting base (21), the first slider (24) passes through the first lead screw (23) and cooperates with the first limiting block (25), and the first slider (24) is connected to the wiping seat structure (11).
8. The lip wiping mechanism according to claim 6, characterized in that, The die head lip wiping mechanism further includes a second moving drive component (30), which is disposed on the die head coating body.
9. A die-coating device, characterized in that, The die coating equipment includes a die coating equipment body (100) and a die lip wiping mechanism disposed on the die coating equipment body (100), wherein the die lip wiping mechanism is the die lip wiping mechanism as described in any one of claims 1 to 8.
10. The die-coating equipment according to claim 9, characterized in that, The die coating device also includes an image acquisition component (200), which is disposed on the main body (100) of the die coating device and is disposed corresponding to the die lip (110) of the main body of the die coating device.