Metal heating disc for a gluing process

Abstract

This utility model relates to the field of coating equipment technology, specifically to a metal heating plate for adhesive coating processes, including a heating structure. The heating structure includes a heating part, and a support plate is arranged above the heating part. The support plate has a sandwich structure, which solves the problems of uneven temperature, slow response, and high energy consumption in the traditional heating plate using resistance wire heating in the prior art. This utility model adopts a sandwich structure of Si3N4 / Al-MoCu-porous titanium alloy, with a thermal deformation of only 6μm at 200℃. The V-shaped microgroove array design reduces the interlayer thermal stress from 180MPa to 50MPa, and it only takes 210 seconds to heat from room temperature to 200℃, which is 420 seconds shorter than the traditional 630 seconds.

Description

Technical Field

[0001] This utility model relates to the field of coating equipment technology, and specifically to a metal heating plate for adhesive coating processes. Background Technology

[0002] Coating processes are commonly used in semiconductor, photovoltaic, or electronics manufacturing, applications that demand high temperature uniformity and precise control. Metal heating plates are a frequently used device in coating processes to improve adhesive flow and curing efficiency. These plates are typically made of high thermal conductivity materials, such as aluminum alloys, providing uniform heating and rapid temperature rise. They are usually equipped with precise temperature control systems, allowing for accurate temperature control. Suitable for temperature-sensitive materials such as crystals, semiconductors, and ceramics, they are widely used in photolithography processes, including soft baking after coating, post-exposure baking, and hardening after development. They are also suitable for coating equipment in industries such as furniture fittings, where heating enhances adhesive flow.

[0003] Traditional heating plates use resistance wire heating, which has problems such as uneven temperature, slow response and high energy consumption. Utility Model Content

[0004] Based on the above shortcomings, the purpose of this utility model is to provide a metal heating plate for the coating process, which adopts a sandwich structure of Si3N4 / Al-MoCu-porous titanium alloy. The thermal deformation at 200℃ is only 6μm. The V-shaped microgroove array design reduces the interlayer thermal stress from 180MPa to 50MPa. It only takes 210 seconds to heat from room temperature to 200℃, which is 420 seconds shorter than the traditional 630 seconds.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a metal heating plate for adhesive coating process, comprising a heating structure, wherein the heating structure includes a heating part, and a support plate is disposed above the heating part, wherein the support plate has a sandwich structure.

[0006] Furthermore, the surface layer of the bearing plate is made of silicon nitride reinforced aluminum matrix composite material, the middle layer is made of molybdenum copper alloy transition layer, and the bottom layer is made of porous titanium alloy skeleton.

[0007] Furthermore, V-shaped microgrooves are processed at the interlayer interfaces of the surface layer, intermediate layer, and bottom layer.

[0008] Furthermore, the heating part includes a heating plate, which is a circular heating tube arranged in multiple concentric rings, and the heating tubes are interconnected.

[0009] Furthermore, the heating plate is covered with a ceramic layer.

[0010] Furthermore, a buffer layer is provided below the ceramic layer, and the structure of the buffer layer is the same as that of the support plate.

[0011] Furthermore, the heating structure is installed inside the lower plate, and the lower plate is fitted with an upper cover that works in conjunction with the lower plate via a shaft.

[0012] Compared with the prior art, this utility model has the following advantages: This utility model adopts a sandwich structure of Si3N4 / Al-MoCu-porous titanium alloy, with a thermal deformation of only 6μm at 200℃. The V-shaped microgroove array design reduces the interlayer thermal stress from 180MPa to 50MPa. It only takes 210 seconds to heat from room temperature to 200℃, which is 420 seconds less than the traditional 630 seconds. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of a metal heating plate for an adhesive coating process according to the present invention.

[0014] Figure 2 This is a three-dimensional structural diagram of the heating structure of a metal heating plate for adhesive coating process according to the present invention.

[0015] Figure 3 This is a cross-sectional schematic diagram of the heating structure of a metal heating plate for adhesive coating process according to the present invention.

[0016] Figure 4 This is a three-dimensional structural diagram of the heating part of a metal heating plate used in an adhesive coating process according to the present invention.

[0017] In the figure: lower plate 1; upper cover 2; heating structure 3; support plate 31; heating part 32; ceramic layer 321; heating plate 322; buffer layer 33. Detailed Implementation

[0018] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0019] Combination Figure 1 — Figure 4 As shown, a metal heating plate for an adhesive coating process includes a heating structure 3, which includes a heating part 32. A support plate 31 is disposed above the heating part 32, and the support plate 31 has a sandwich structure.

[0020] The surface layer of the bearing plate 31 is made of silicon nitride reinforced aluminum matrix composite material, which can be replaced with diamond-copper composite material. The surface layer has a thermal conductivity ≥600 W / m·K, a thickness of 2 mm, and a coefficient of thermal expansion of 7.5×10⁻⁶. -6The surface layer is prepared by plasma spraying, with a thickness of 2.0±0.1mm. It only takes 210 seconds to heat from 25℃ to 200℃. The temperature difference between the center and the edge is 0.5℃ in steady state. The middle layer is a molybdenum-copper alloy transition layer with a thickness of 5mm and a thermal conductivity of 220 W / m·K. The bottom layer is a porous titanium alloy skeleton with a porosity of 40% and embedded heating wire. The sandwich structure can effectively reduce thermal deformation. At the same time, it only takes 210 seconds to heat from room temperature to 200℃, which is 420 seconds shorter than the traditional 630 seconds.

[0021] The interlayer interfaces of the surface layer, intermediate layer and bottom layer are processed with V-shaped microgrooves. The depth of the V-shaped microgrooves is 0.3 mm, the spacing is 2 mm and the angle is 60°. The V-shaped microgroove array design reduces the interlayer thermal stress from 180 MPa to 50 MPa. The connection is made by vacuum brazing with Ag-Cu-Ti active solder at a brazing temperature of 820℃ and a shear strength ≥95 MPa.

[0022] The heating part 32 includes a heating plate 322, which is a circular heating tube arranged in multiple concentric rings, and the heating tubes are interconnected.

[0023] The heating plate 322 is covered with a ceramic layer 321.

[0024] A buffer layer 33 is provided below the ceramic layer 321, and the structure of the buffer layer 33 is the same as that of the bearing plate 31.

[0025] The heating structure 3 is installed inside the lower plate 1. The lower plate 1 is equipped with an upper cover 2 that works with the lower plate 1 via a shaft. A copper compensation ring with a width of 8mm is provided outside the heating structure and is connected by a spring.

[0026] The above description is a preferred embodiment of the present utility model. For those skilled in the art, any changes, modifications, substitutions and variations made to the implementation methods without departing from the principles and spirit of the present utility model, based on the teachings of the present utility model, still fall within the protection scope of the present utility model.

Claims

1. A metal heating disc for a gluing process, comprising a heating structure (3), characterized in that, The heating structure (3) includes a heating part (32), and a support plate (31) is provided above the heating part (32). The support plate (31) has a sandwich structure. The surface layer of the bearing plate (31) is made of silicon nitride reinforced aluminum matrix composite material, the middle layer is made of molybdenum copper alloy transition layer, and the bottom layer is made of porous titanium alloy skeleton.

2. A metal heating tray for a gluing process according to claim 1, characterized in that: The interfaces between the surface layer, intermediate layer, and bottom layer are processed with V-shaped microgrooves.

3. A metal heating tray for a gluing process according to claim 1, characterized in that: The heating part (32) includes a heating plate (322), which is a circular heating tube arranged in multiple concentric rings, and the heating tubes are interconnected.

4. A metal heating tray for a gluing process according to claim 3, characterized in that: The heating plate (322) is covered with a ceramic layer (321).

5. A metal heating tray for a gluing process according to claim 4, characterized in that: A buffer layer (33) is provided below the ceramic layer (321), and the structure of the buffer layer (33) is the same as that of the bearing disk (31).

6. A metal heating pan for a gluing process according to claim 1, characterized in that: The heating structure (3) is installed inside the lower plate (1), and the lower plate (1) is equipped with an upper cover (2) that works with the lower plate (1) via a shaft.

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