Chip frame glue curing device

Abstract

This utility model provides a chip frame adhesive curing device, comprising: a stage having a mounting position for mounting a chip, and the stage having a plurality of exhaust holes penetrating the stage along the edge of the mounting position; an air duct plate disposed at the bottom of the stage, having an exhaust chamber connected to each exhaust hole, and the exhaust chamber having a connection hole for exhaust; and a top cover fastened to the stage, covering the mounting position and each exhaust hole. A plurality of through exhaust holes are provided at the edge of the mounting position on the stage, and an exhaust chamber connecting all the exhaust holes is provided at the bottom. After the chip is bonded, it is placed in the mounting position, and then a transparent film is covered on top of the chip. When an external negative pressure device evacuates the exhaust chamber through the connection hole, the negative pressure formed by the plurality of exhaust holes will act evenly on the entire frame adhesive area covering the chip on the mounting position, ensuring a uniform negative pressure adsorption plane and ensuring that the extrusion pressure on the frame adhesive is uniform and controllable throughout the curing process.

Description

Technical Field

[0001] This utility model relates to the field of chip curing device technology, and in particular to a chip frame adhesive curing device. Background Technology

[0002] After the frame of the LCD and LCoS chips is drawn using frame adhesive, it needs to be cured. Currently, the main frame adhesives used are divided into two categories: thermosetting adhesives and UV-curing adhesives. UV curing requires curing under UV light irradiation, and a certain pressure is needed during curing to cause the frame adhesive to expand under pressure, accompanied by heating at a certain temperature, to ensure high reliability of the chip after curing. Specifically, the bonded chips are placed in a transparent bag, and the air in the bag is extracted using a negative pressure device. Under atmospheric pressure, the frame adhesive expands under pressure, and then the frame adhesive is irradiated with a UV light source to cure. After curing, it is placed in an oven and baked at the required temperature for a certain period of time. However, the above method relies on manual operation, the chip's position inside the bag is random, and the bag deformation during vacuuming causes uneven pressure distribution on different parts of the chip, affecting the curing effect. Utility Model Content

[0003] To address the shortcomings of existing technologies, this invention provides a chip frame adhesive curing device, which solves the problem of low pressure uniformity in various parts of the chip caused by placing the bonded chip in a transparent bag and then vacuuming it.

[0004] According to the embodiments of this utility model, the following technical solution is adopted:

[0005] A chip frame adhesive curing apparatus, comprising:

[0006] The shelf has mounting positions for installing chips, and the shelf has several air vents penetrating the shelf along the edge of the mounting positions.

[0007] An air duct plate is located at the bottom of the platform and has an air extraction chamber. The air extraction chamber is connected to each air extraction hole and has a connection hole for air extraction.

[0008] The top cover snaps onto the shelf and covers the mounting position and all air vents.

[0009] Compared with the prior art, the present invention has the following beneficial effects:

[0010] In this solution, several through-holes are made at the edge of the mounting position on the platform, and a vacuum chamber connecting all the holes is set at the bottom. After the chip is bonded, it is placed in the mounting position and then covered with a transparent film. When the external negative pressure device evacuates the vacuum chamber through the connection hole, the negative pressure formed by the several vacuum holes will act evenly on the entire frame adhesive area covering the chip on the mounting position, ensuring a uniform negative pressure adsorption plane. This ensures that the extrusion pressure on the frame adhesive is uniform and controllable throughout the curing process, improving the density and uniformity of the curing.

[0011] Preferably, a UV light source is provided on the inside of the top cover.

[0012] Preferably, the end of the air duct plate near the table is recessed downward to form a mounting groove, and a heating mechanism is provided in the mounting groove.

[0013] Preferably, the connection hole of the air extraction chamber is equipped with a quick-release connector.

[0014] Preferably, one end of the top cover is provided with a mounting base, which is rotatably connected to the shelf.

[0015] Preferably, the end of the top cover away from the mounting base is provided with a mounting plate, the mounting plate is rotatably provided with a clamping handle, and the shelf is provided with a limiting seat. When the top cover is fastened to the shelf, the clamping handle is engaged with the limiting seat.

[0016] Preferably, the shelf is equipped with a sealing strip, which corresponds to the top cover.

[0017] Preferably, each corner of the shelf is provided with mounting holes. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the upper cover fastened to the shelf in an embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the open structure of the top cover in an embodiment of this utility model.

[0020] Figure 3 for Figure 1 A schematic diagram of the cross-sectional structure.

[0021] In the above attached figures: 1. Display platform; 101. Mounting hole; 102. Limiting seat; 103. Air extraction hole; 104. Mounting position; 2. Top cover; 201. UV light source; 202. Mounting seat; 203. Mounting plate; 3. Clamping handle; 4. Heating mechanism; 5. Sealing strip; 6. Air duct plate; 601. Mounting groove; 602. Air extraction chamber; 7. Quick-release connector. Detailed Implementation

[0022] The technical solution of this utility model will be further described below with reference to the accompanying drawings and embodiments.

[0023] This utility model embodiment proposes a chip frame adhesive curing device, comprising:

[0024] The shelf 1 has a mounting position 104 for mounting chips, and the shelf 1 has a plurality of air extraction holes 103 through the edge of the mounting position 104.

[0025] An air duct plate 6 is located at the bottom of the platform 1 and has an air extraction chamber 602. The air extraction chamber 602 is connected to each air extraction hole 103 and has a connection hole for air extraction.

[0026] The top cover 2 is fastened to the shelf 1 and covers the mounting position 104 and each air extraction hole 103.

[0027] In traditional manual vacuum bagging, the chip is randomly positioned inside the bag, and bag deformation can lead to uneven pressure distribution. In the embodiments of this invention, such as... Figure 2 As shown, a number of air extraction holes 103 are arranged to form a rectangular surface structure. The inner side of the number of air extraction holes 103 is the chip mounting position 104, and the outer side of the number of air extraction holes 103 is the fastening area of ​​the upper cover 2. When the upper cover 2 is fastened on the platform 1, the mounting position 104 and the number of air extraction holes 103 are both located in the internal space of the upper cover 2.

[0028] The air duct plate 6 is fixedly installed at the bottom of the platform 1, and the air extraction chamber 602 in the air duct plate 6 is connected to all the air extraction holes 103. When in use, the external negative pressure device is connected to the connection hole of the air extraction chamber 602, and then the bonded chip is placed in the mounting position 104 and a transparent film is covered on top of the chip. The external negative pressure device is turned on, and the external negative pressure device evacuates the air extraction chamber 602 through the connection hole. The negative pressure formed by the several air extraction holes 103 and the transparent film will act evenly on the entire frame adhesive area covering the chip on the mounting position 104, ensuring a uniform negative pressure adsorption plane and ensuring that the extrusion pressure on the frame adhesive during the entire curing process is uniform and controllable, thereby improving the density and uniformity of curing.

[0029] Specifically, such as Figure 2 and Figure 3As shown, a UV light source 201 is provided on the inner side of the upper cover 2. The UV light source 201 can be selected according to requirements, such as an ultraviolet high-pressure mercury lamp. By placing the UV light source 201 on the inner side of the upper cover 2, the upper cover 2 is already fastened to the stage 1 during chip curing. The upper cover 2 can shield the emitted light source, effectively preventing operators from being exposed to the UV light source 201 for a long time. At the same time, the end of the air duct plate 6 near the stage 1 is recessed downward to form a mounting groove 601. A heating mechanism 4 is provided in the mounting groove 601. The heating mechanism 4 can be turned on in advance to heat the stage 1 to a specified value before placing the bonded chip on the stage 1. This integrated design improves the efficiency of chip frame adhesive curing. The heating mechanism 4 is preferably a heating tube. At the same time, a cooling structure can be provided in the mounting groove 601 to assist in rapid cooling inside the mounting groove 601.

[0030] Specifically, such as Figure 3 As shown, the connection hole of the suction chamber 602 is equipped with a quick-release connector 7. With the help of the quick-release connector 7, it can be connected to an external negative pressure device through a pipeline for easy installation and disassembly. Alternatively, the negative pressure device can be directly connected to the quick-release connector 7 for easy overall transportation.

[0031] Specifically, such as Figure 1 As shown, one end of the upper cover 2 is provided with a mounting base 202, which is rotatably connected to the shelf 1. The upper cover 2 can be fastened to the shelf 1 by lifting it up and down. To facilitate the operation of the upper cover 2, the operation mode of the upper cover 2 can be changed by rotating it to fasten it to the shelf 1 or to open it. When open, the upper cover 2 is located on one side of the shelf 1 and will not occupy other space. To ensure the stability of the upper cover 2 fastened to the shelf 1, the end of the upper cover 2 away from the mounting base 202 is provided with a mounting plate 203. The mounting plate 203 is rotatably provided with a clamping handle 3. The shelf 1 is provided with a limiting seat 102. When the upper cover 2 is fastened to the shelf 1, the clamping handle 3 is engaged with the limiting seat 102. The upper cover 2 is fixed by the action of the clamping handle 3 and the limiting seat 102. After the upper cover 2 is fastened on the table 1, the clamping handle 3 is rotated so that the end of the clamping handle 3 is engaged in the limiting seat 102, thereby limiting the upper cover 2 and pressing the upper cover 2 on the table 1 to ensure the stability of the transparent film between the table 1 and the upper cover 2. When the clamping handle 3 is rotated again, the clamping handle 3 can be separated from the limiting seat 102, releasing the limitation on the upper cover 2.

[0032] Furthermore, the shelf 1 is equipped with a sealing strip 5, which corresponds to the upper cover 2. A groove is provided on the shelf 1, and the sealing strip 5 is installed in the groove. The sealing strip 5 has a rectangular surface structure, which is larger than the rectangular surface structure formed by several air extraction holes 103. When the transparent film is laid, it completely covers the sealing strip 5. After the upper cover 2 is fastened, the upper cover 2 presses the transparent film onto the sealing strip 5, further ensuring the airtightness. Specifically, in the installation of the air duct plate 6, it is also necessary to ensure the airtightness between the air duct plate 6 and the bottom surface of the shelf 1. For example, a sealing structure can be set between the air duct plate 6 and the shelf 1 to prevent air leakage.

[0033] Specifically, such as Figure 1 As shown, each corner of the shelf 1 is provided with a mounting hole 101. The entire shelf 1 can be installed on the designated work surface by screws passing through each mounting hole 101, ensuring the stability of the entire shelf 1 during use.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this utility model without departing from the spirit and scope of the technical solutions of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A chip frame adhesive curing device, characterized by, include: The platform (1) has a mounting position (104) for mounting chips, and the platform (1) has a plurality of air extraction holes (103) through the platform (1) along the edge of the mounting position (104). An air duct plate (6) is provided at the bottom of the platform (1) and has an air extraction chamber (602). The air extraction chamber (602) is connected to each of the air extraction holes (103) and has a connection hole for air extraction. The top cover (2) is fastened to the shelf (1) and covers the mounting position (104) and each of the air extraction holes (103).

2. The chip frame adhesive curing device according to claim 1, characterized in that, The inner side of the top cover (2) is provided with a UV light source (201).

3. The device of claim 1, wherein the device is configured to cure the die attach adhesive. The end face of the air duct plate (6) near the table (1) is recessed downward to form a mounting groove (601), and a heating mechanism (4) is provided in the mounting groove (601).

4. The device for curing the chip frame adhesive according to any one of claims 1-3, characterized in that, The connection hole of the air extraction chamber (602) is equipped with a quick-release connector (7).

5. The device of claim 1, wherein the device is configured to cure the die attach adhesive. One end of the upper cover (2) is provided with a mounting base (202), which is rotatably connected to the shelf (1).

6. The chip frame adhesive curing device according to claim 5, characterized in that, The upper cover (2) is provided with a mounting plate (203) at one end away from the mounting base (202). The mounting plate (203) is provided with a pressing handle (3) for rotation. The shelf (1) is provided with a limiting seat (102). When the upper cover (2) is fastened to the shelf (1), the pressing handle (3) is engaged with the limiting seat (102).

7. The device of claim 1, wherein the device is configured to cure the die attach adhesive. The shelf (1) is provided with a sealing strip (5), which corresponds to the upper cover (2).

8. The device of claim 1, wherein the device is configured to cure the die attach adhesive. Each corner of the shelf (1) is provided with a mounting hole (101).

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