A cycle cooling device for a press die
By using a heat-conducting structure of fins, a circulation shroud, and guide vanes in the stamping die cooling device, the problem of water stratification in the water tank was solved, resulting in better cooling effect and stability, and improving the cooling efficiency of the die.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- ZHEJIANG HUAJIN MACHINERY CO LTD
- Filing Date
- 2025-07-07
- Publication Date
- 2026-07-31
AI Technical Summary
In existing stamping die cooling devices, the water in the water tank is prone to stratification and cannot fully contact the cooling plates, affecting the cooling effect.
The heat-conducting structure employs fins, a circulation shroud, and guide vanes. The heat exchange bridge between the fins and the cold end of the semiconductor cooling chip increases the contact surface area, and the circulation shroud forms a sealed space. Combined with the design of the water intake pipe and the water suction pipe, it ensures uniform cooling and water flow.
It improves the cooling effect of water, avoids water stratification, ensures uniform cooling of the mold, and improves cooling efficiency and stability.
Smart Images
Figure CN224574515U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of mold cooling technology, and in particular to a circulating cooling device for stamping dies. Background Technology
[0002] Stamping dies are tools used for forming and processing metal sheets. They apply external force to cause the metal sheets to undergo plastic deformation or separation. During the stamping process, heat is generated, which causes the temperature of the stamping die to rise. This accelerates the wear and softening of the die material and causes thermal fatigue cracks. Therefore, water molds are needed to cool the die.
[0003] A search revealed a prior art cooling device for a stamping die and the stamping die itself (Publication No.: CN119634578A). The cooling device for the stamping die includes a cooling assembly; the cooling assembly includes a first manifold, a second manifold, a third manifold, a fourth manifold, a connector, a connecting pipe, a return hose, a first water pump, a water tank, and a refrigeration mechanism; the punch moves down to stamp the workpiece in the die, the connecting pipe moves down and inserts into the connector to connect, and the first water pump, the first manifold, multiple first cooling channels, the second manifold, the connector, the connecting pipe, the third manifold, multiple second cooling channels, the fourth manifold, the return hose, and the water tank form a complete cooling water circulation channel.
[0004] Existing technology uses cooling plates to cool the water in the tank. However, the surface area of the cooling plates in contact with the water is limited. When the water pump draws water from the tank for circulation, the discharged water is at a low temperature, while the returned water is at a higher temperature. The water is prone to stratification due to the temperature difference, which affects the cooling effect of the water on the mold. Therefore, it is necessary to ensure that the water in the tank fully contacts the cooling plates and is mixed evenly.
[0005] Therefore, we propose a circulating cooling device for stamping dies. Utility Model Content
[0006] The present invention mainly addresses the technical problem that water in the water tank is prone to stratification and cannot fully contact the cooling element, and provides a circulating cooling device for stamping dies.
[0007] To achieve the above objectives, this utility model adopts the following technical solution: a circulating cooling device for a stamping die, comprising: A water tank, which forms a sealed chamber, has an outlet pipe and a return pipe for water circulation fixedly installed on the front wall of the water tank. The outlet pipe is fixedly connected to a water pump. A valve for water replenishment is fixedly installed on the side wall of the water tank. A semiconductor cooling chip is fixedly installed on the back of the water tank. A fan for cooling the semiconductor cooling chip is also fixedly installed on the back of the water tank. A heat-conducting structure is installed inside the water tank to cool the water inside. The heat-conducting structure includes fins, a circulation shroud, and guide vanes. Several fins are fixedly installed on the back of the circulation shroud. The fins are fixedly connected to the cold end of the semiconductor cooling chip. The circulation shroud is fixedly connected to the inner wall of the water tank. The circulation shroud is hollow inside. Several guide vanes are fixedly installed on the inner wall of the circulation shroud. The front wall of the circulation shroud has an opening for water to enter. The inlet of the water pump is connected to the chamber of the circulation shroud.
[0008] In a preferred embodiment of this utility model, the circulation cover forms a sealed cylinder, the guide vane is a spiral metal plate, and the guide vane is fixedly installed on the inner rear wall surface of the fin.
[0009] In a preferred embodiment of this invention, the fin is a bent metal sheet, one end of which is fixedly connected to the rear wall of the circulation cover, and the other end of which is coupled to the cold end of the semiconductor cooling chip.
[0010] In a preferred embodiment of this utility model, the heat-conducting structure further includes a water intake pipe, and the outer circumferential surface of the circulation cover is provided with a window for water intake. The water intake pipe is fixedly installed inside the window, and the water inlet of the water pump is fixedly connected to the water pump port.
[0011] In a preferred embodiment of this utility model, the water intake pipe is a bent pipe, and the lower end of the water intake pipe bends and extends toward the inner bottom surface of the water tank.
[0012] In a preferred embodiment of this utility model, the heat-conducting structure further includes a cover and a water-absorbing pipe. The cover is fixedly connected to the circulation cover, and several water-absorbing pipes are fixedly installed on the cover, with the water-absorbing pipes extending into the opening.
[0013] In a preferred embodiment of this utility model, the cover is funnel-shaped, with the smaller port of the cover fixedly connected to the front wall of the circulation cover and facing the window. The water suction pipe is an L-shaped bend, with one end of the water suction pipe extending toward the inner rear wall of the circulation cover and the other end of the water suction pipe located outside the cover. Several identical water suction pipes are distributed in a ring array inside the cover.
[0014] This invention provides a circulating cooling device for stamping dies. It has the following beneficial effects: 1. A circulating cooling device for a stamping die, which uses fins to build a heat exchange bridge between water and the cold end of a semiconductor cooling chip. The fins and guide vanes can increase the contact surface area between the cold end of the semiconductor cooling chip and the water, thereby improving the cooling effect on the water. A relatively sealed space is formed by the circulation shroud. When the water pump draws water from the circulation shroud, the water is drawn in from the opening at the center of the front wall of the circulation shroud. The water impacts the guide vanes and is dispersed to the surrounding area, allowing for more complete contact with the guide vanes and the circulation shroud, ensuring that the water is fully cooled. The extraction method can make the water in the tank flow better and the temperature more uniform, avoiding water stratification caused by hot and cold temperatures.
[0015] 2. The circulating cooling device for a stamping die connects the water pump inlet to the circulating shroud chamber via a water intake pipe. When the water pump draws water from the circulating shroud, the water flows towards the inner wall of the circulating shroud as guided by multiple guide vanes. The curved and extended water intake pipe, combined with the vortex-shaped water flow inside the circulating shroud, ensures the stability of the water pump's water intake.
[0016] 3. This circulating cooling device for a stamping die guides water from a water tank into a circulating shroud through a shroud. Multiple suction pipes are located at the center of multiple guide vanes. When water enters the center of the circulating shroud from the shroud, it forms a bundle of water columns. The end of the suction pipe inside the circulating shroud is in a low-pressure area, while the other end is in a relatively high-pressure area inside the water tank. Thus, the suction pipes can spray water from the water tank to the center of the circulating shroud, further promoting the mixing of water inside and outside the circulating shroud and further ensuring the uniformity of water temperature. Attached Figure Description
[0017] Figure 1 This is one of the overall perspective views of this utility model; Figure 2 This is the second overall perspective view of the present utility model; Figure 3 This is a partial sectional view of the water tank of this utility model; Figure 4 This is a partial sectional view of the circulation cover of this utility model; Figure 5 This is a perspective view of the circulation cover, fins, and guide vanes of this utility model.
[0018] Legend: 10. Water tank; 11. Outlet pipe; 12. Return pipe; 13. Valve; 14. Semiconductor cooling chip; 15. Water pump; 20. Fin; 21. Circulation shroud; 22. Guide plate; 23. Cover body; 24. Suction pipe; 25. Water intake pipe. Detailed Implementation
[0019] A circulating cooling device for a stamping die, such as Figure 1 and Figure 2 As shown, it includes: Water tank 10 forms a sealed chamber. Water outlet pipe 11 and return pipe 12 for water circulation are fixedly installed on the front wall of water tank 10. Water pump 15 is fixedly connected to water outlet pipe 11. Valve 13 for water replenishment is fixedly installed on the side wall of water tank 10. Semiconductor cooling chip 14 is fixedly installed on the back of water tank 10. Fan for cooling semiconductor cooling chip 14 is also fixedly installed on the back of water tank 10. Specifically, the fan faces the hot end of semiconductor cooling chip 14 to dissipate heat from the hot end of semiconductor cooling chip 14, and the cold end of semiconductor cooling chip 14 is used to cool the water inside water tank 10. Water outlet pipe 11 is used for draining water, return pipe 12 is used for returning water, and valve 13 is used to replenish water or drain sewage into water tank 10. Water outlet pipe 11 and return pipe 12 are respectively connected to the water inlet and water outlet of the mold to achieve circulating cooling.
[0020] like Figure 3 , Figure 4 and Figure 5 As shown, a heat-conducting structure is installed inside the cavity of the water tank 10 to cool the water inside the water tank 10. The heat-conducting structure includes fins 20, a circulation cover 21, and guide vanes 22. Several fins 20 are fixedly installed on the back of the circulation cover 21. The fins 20 are fixedly connected to the cold end of the semiconductor cooling chip 14. The circulation cover 21 is fixedly connected to the inner wall of the water tank 10. The inside of the circulation cover 21 is hollow. Several guide vanes 22 are fixedly installed on the inner wall of the circulation cover 21. The front wall of the circulation cover 21 has an opening for water to enter. The inlet of the water pump 15 is connected to the cavity of the circulation cover 21. The circulation cover 21 forms a sealed cylinder. The guide vanes 22 are spiral metal plates. The guide vanes 22 are fixedly installed on the inner rear wall of the fins 20. The fins 20 are bent metal plates. One end of the fins 20 is fixedly connected to the rear wall of the circulation cover 21, and the other end of the fins 20 is coupled to the cold end of the semiconductor cooling chip 14. In this design, the fins 20, circulation shroud 21, and guide vanes 22 can be made of copper to ensure good thermal conductivity. Silicon grease is applied between the ends of the fins 20 and the cold ends of the water tank 10. The fins 20 form a heat exchange bridge between the water and the cold ends of the thermoelectric cooler 14. The fins 20 and guide vanes 22 can increase the contact surface area between the cold ends of the thermoelectric cooler 14 and the water, improving the cooling effect on the water. Secondly, the circulation shroud 21 forms a relatively sealed space. When the water pump 15 draws water from the circulation shroud 21, the water is drawn in from the opening at the center of the front wall of the circulation shroud 21. The water impacts the guide vanes 22 and is dispersed to the surrounding area, allowing for more thorough contact with the guide vanes 22 and the circulation shroud 21, ensuring that the water is fully cooled. Furthermore, the extraction method allows for better water flow and more uniform temperature in the water tank 10, preventing water stratification caused by temperature changes.
[0021] like Figure 5As shown, the heat-conducting structure also includes a water intake pipe 25. A window for water intake is opened on the outer circumferential surface of the circulation cover 21. The water intake pipe 25 is fixedly installed inside the window. The water inlet of the water pump 15 is fixedly connected to the port of the water pump 15. The water intake pipe 25 is a bent pipe, and the lower end of the water intake pipe 25 bends and extends towards the inner bottom surface of the water tank 10. In this scheme, the water inlet of the water pump 15 is connected to the chamber of the circulation cover 21 through the water intake pipe 25. When the water pump 15 draws water from the circulation cover 21, the water will flow towards the inner wall of the circulation cover 21 as guided by multiple guide vanes 22. The curved and extended water intake pipe 25, together with the vortex-shaped water flow in the circulation cover 21, can ensure the stability of the water pump 15's water intake.
[0022] like Figure 4 and Figure 5 As shown, the heat-conducting structure also includes a cover 23 and a water suction pipe 24. The cover 23 is fixedly connected to the circulation cover 21. Several water suction pipes 24 are fixedly installed on the cover 23. The water suction pipes 24 extend into the opening. The cover 23 is funnel-shaped. The smaller port of the cover 23 is fixedly connected to the front wall of the circulation cover 21 and faces the window. The water suction pipe 24 is an L-shaped bend. One end of the water suction pipe 24 extends toward the inner rear wall of the circulation cover 21, and the other end of the water suction pipe 24 is located outside the cover 23. Several identical water suction pipes 24 are distributed in a ring array inside the cover 23. In this solution, as a supplement to the above solution, the water in the water tank 10 is guided into the circulation hood 21 by the cover 23. Multiple suction pipes 24 are located at the center of multiple guide vanes 22. When the water enters the center of the circulation hood 21 from the cover 23, it forms a bundle of water columns. The port of the suction pipe 24 inside the circulation hood 21 is in a low-pressure area, while the other port of the suction pipe 24 is in a relatively high-pressure area inside the water tank 10. Thus, the suction pipe 24 can spray the water in the water tank 10 to the center of the circulation hood 21, further promoting the flow and mixing of water inside and outside the circulation hood 21, and further ensuring the uniformity of water temperature.
[0023] The working principle of this invention is as follows: A heat exchange bridge is built between water and the cold end of the semiconductor cooling chip 14 via fins 20. The fins 20 and guide vanes 22 increase the contact surface area between the cold end of the semiconductor cooling chip 14 and the water, improving the cooling effect. Secondly, a relatively sealed space is formed by the circulation shroud 21. When the water pump 15 draws water from the circulation shroud 21, the water is drawn in through the opening at the center of the front wall of the circulation shroud 21. The water impacts the guide vanes 22 and is dispersed outwards, allowing for more thorough contact with the guide vanes 22 and the circulation shroud 21, ensuring sufficient cooling of the water. The shroud 23 guides the water from the water tank 10 into the circulation shroud 21. Multiple suction pipes... 24 is located at the center of multiple guide vanes 22, so that when water enters the center of the circulation hood 21 from the cover 23, it will form a bundle of water columns. The port of the suction pipe 24 inside the circulation hood 21 is in a low-pressure area, and the other port of the suction pipe 24 is in a relatively high-pressure area inside the water tank 10. Thus, the suction pipe 24 can spray the water in the water tank 10 to the center of the circulation hood 21, further promoting the flow and mixing of water inside and outside the circulation hood 21. The outlet pipe 11 is used for drainage, the return pipe 12 is used for return water, and the valve 13 is used to replenish water or discharge sewage into the water tank 10. The outlet pipe 11 and the return pipe 12 are respectively connected to the water inlet and outlet of the mold to realize the circulating cooling of the mold.
[0024] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A cycle cooling device for a press die, characterized by, include: Water tank (10), the water tank (10) forms a sealed chamber, the front wall of the water tank (10) is fixedly installed with an outlet pipe (11) and a return pipe (12) for water circulation, the outlet pipe (11) is fixedly connected to a water pump (15), the side wall of the water tank (10) is fixedly installed with a valve (13) for water replenishment, the back of the water tank (10) is fixedly installed with a semiconductor cooling chip (14), and the back of the water tank (10) is also fixedly installed with a fan for cooling the semiconductor cooling chip (14); A heat-conducting structure is installed inside the cavity of the water tank (10) to cool the water in the water tank (10). The heat-conducting structure includes fins (20), a circulation cover (21), and guide vanes (22). Several fins (20) are fixedly installed on the back of the circulation cover (21). The fins (20) are fixedly connected to the cold end of the semiconductor cooling chip (14). The circulation cover (21) is fixedly connected to the inner wall of the water tank (10). The circulation cover (21) is hollow inside. Several guide vanes (22) are fixedly installed on the inner wall of the circulation cover (21). The front wall of the circulation cover (21) is provided with an opening for water to enter. The inlet of the water pump (15) is connected to the cavity of the circulation cover (21).
2. The cycle cooling device for a press die according to claim 1, characterized by: The circulation cover (21) forms a sealed cylinder, and the guide plate (22) is a spiral metal plate. The guide plate (22) is fixedly installed on the inner rear wall of the circulation cover (21).
3. The cycle cooling device of a press mold according to claim 1, characterized by: The fin (20) is a bent metal sheet. One end of the fin (20) is fixedly connected to the rear wall of the circulation cover (21), and the other end of the fin (20) is coupled to the cold end of the semiconductor cooling chip (14).
4. The cycle cooling device for a press mold according to claim 1, characterized by: The heat-conducting structure also includes a water intake pipe (25). The outer circumferential surface of the circulation cover (21) is provided with a window for water intake. The water intake pipe (25) is fixedly installed inside the window. The water inlet of the water pump (15) is fixedly connected to the port of the water pump (15).
5. The cycle cooling device of a press mold according to claim 4, characterized by: The water intake pipe (25) is a bent pipe, and the lower end of the water intake pipe (25) bends and extends toward the inner bottom surface of the water tank (10).
6. The cycle cooling device for a press mold according to claim 1, characterized by: The heat-conducting structure also includes a cover (23) and a water suction pipe (24). The cover (23) is fixedly connected to the circulation cover (21). Several water suction pipes (24) are fixedly installed on the cover (23). The water suction pipes (24) extend into the opening.
7. The cycle cooling device of a press die according to claim 6, wherein: The cover (23) is funnel-shaped. The smaller port of the cover (23) is fixedly connected to the front wall of the circulation cover (21) and faces the window. The water suction pipe (24) is an L-shaped bend. One end of the water suction pipe (24) extends toward the inner rear wall of the circulation cover (21), and the other end of the water suction pipe (24) is located outside the cover (23). Several identical water suction pipes (24) are distributed in a ring array inside the cover (23).