A welding device for flip-chip LEDs

Abstract

This utility model discloses a flip-chip LED chip welding device, belonging to the field of chip welding technology. It includes a frame, a base plate fixedly connected inside the frame, a conveying device fixedly connected to the base plate, bases fixedly connected to both symmetrical ends of the frame, and receiving boxes fixedly connected to each base. Feeding and receiving elevators are fixedly connected to the two receiving boxes respectively, corresponding to the two ends of the conveying device. Guide frames are fixedly connected to both feeding and receiving elevators, and limited-slip cylinders are fixedly connected to each guide frame, with the output ends of the two limited-slip cylinders extending movably through the inner sides of the two guide frames. In this utility model, the welding device directly heats and pressurizes the LED chip and substrate during the conveying process, enabling the LED chip to be quickly flip-chip welded onto the substrate without frequent flipping and calibration positioning of the LED chip, effectively improving work efficiency.

Description

Technical Field

[0001] This utility model relates to the field of chip welding technology, and more specifically, to a welding device for flip-chip LEDs. Background Technology

[0002] Flip-chip LEDs are a packaging technology that connects chips with their electrical surfaces facing down. The core feature is that the electrode layout is the opposite of that of traditional upright chips. Traditional upright chips achieve electrical connection through metal wire bonding, with the electrodes located above the light-emitting layer. In contrast, flip-chips design the electrodes on the bottom of the chip and bond them directly to the substrate, eliminating the need for gold wire lead structures, thereby reducing light shading and optimizing the heat dissipation path.

[0003] Currently, flip-chip LEDs are welded to the substrate by heating a soldering flux with a soldering device. However, most existing soldering devices require flipping the LED chip with the soldering flux to align the flux with the solder joints on the substrate before heating and soldering can be performed. Frequent flipping of the LED chip not only wastes working time but also requires calibration of the LED chip and substrate each time, resulting in low soldering efficiency. Therefore, this invention proposes a flip-chip LED welding device. Utility Model Content

[0004] 1. Technical problems to be solved

[0005] To address the problems existing in the prior art, the purpose of this utility model is to provide a welding device for flip-chip LEDs. The aim is to solve the problem that in the prior art, when welding flip-chip LEDs, the LED chip with welding flux needs to be flipped so that the welding flux corresponds to the welding point on the substrate before heating and welding can be performed. Frequent flipping of the LED chip not only wastes working time, but also requires the LED chip and substrate to be aligned each time, resulting in low welding efficiency.

[0006] 2. Technical Solution

[0007] To solve the above problems, the present invention adopts the following technical solution:

[0008] A welding device for flip-chip LEDs includes a frame, a base plate fixedly connected inside the frame, a conveying device fixedly connected to the base plate, bases fixedly connected to both symmetrical ends of the frame, and receiving boxes fixedly connected to each of the two bases. Feeding elevators and receiving elevators are fixedly connected to each of the two receiving boxes, respectively, and the feeding elevators and receiving elevators correspond to the two ends of the conveying device. Guide frames are fixedly connected to each of the feeding elevators and receiving elevators. Limiting cylinders are fixedly connected to each of the two guide frames, and the output ends of the two limiting cylinders extend movably through the inner sides of the two guide frames. Telescopic cylinders are fixedly connected inside each of the two receiving boxes, and their output ends are fixedly connected to... The device includes two pull-out rod assemblies, each located on the lower side of a guide frame corresponding to the feeding elevator and the receiving elevator. A material-picking cylinder is fixedly connected to the base plate, located inside the conveying device. A material-picking claw is fixedly connected to the output end of the material-picking cylinder, corresponding to the feeding elevator. A lifting cylinder is fixedly connected to the base plate, located inside the conveying device. A heating plate is fixedly connected to the output end of the lifting cylinder. A fixing plate assembly is fixedly connected to the base plate, located outside the conveying device and corresponding to the heating plate. A positioning cylinder is fixedly connected to one of the guide frames, with a positioning head fixedly connected to the output end, corresponding to the receiving elevator.

[0009] As a preferred embodiment of this utility model, a first limiting cylinder is fixedly connected to the base plate, and the first limiting cylinder is located between the heating plate and the picking claw.

[0010] As a preferred embodiment of this utility model, a second limiting cylinder is fixedly connected to the base plate, and the second limiting cylinder is located on one side of the heating plate, corresponding to the material receiving elevator.

[0011] As a preferred embodiment of this utility model, a conveying sensor is fixedly connected to the base plate, and the conveying sensor is located inside the conveying device and corresponds to the second limiting cylinder.

[0012] As a preferred embodiment of this utility model, both the feeding elevator and the receiving elevator are fixedly connected to a material box sensor, and the two material box sensors correspond to the two guide frames respectively. Both receiving boxes are fixedly connected to a stacking sensor.

[0013] As a preferred embodiment of this utility model, both guide frames are rotatably connected to pulley assemblies.

[0014] As a preferred embodiment of this utility model, a baffle is fixedly connected to one end of the receiving box away from the frame.

[0015] As a preferred embodiment of this utility model, the conveying device is rotatably connected with two sets of material-stopping rollers, and the two sets of material-stopping rollers correspond to the two ends of the conveying device and are respectively opposite to the feeding elevator and the receiving elevator.

[0016] 3. Beneficial effects

[0017] Compared with existing technologies, the advantages of this utility model are:

[0018] (1) In this solution, the feeding elevator feeds the product after the LED chip and substrate are combined, and the receiving elevator collects the welded product. Between feeding and receiving, the product is taken out by the picking cylinder and picking claw and conveyed by the conveying device. During the conveying process, the conveying device makes the product correspond to the heating plate and the fixed plate assembly. The lifting cylinder controls the heating plate to rise. The heating plate and the fixed plate assembly heat and pressurize the product, so that the welding flux on the LED chip melts on the solder joint of the substrate. Under the pressure, the LED chip is flip-welded onto the substrate. The welding equipment directly heats and pressurizes the LED chip and the substrate during the conveying process, so that the LED chip can be quickly flip-welded onto the substrate without frequent flipping and calibration positioning of the LED chip, which effectively improves the work efficiency. Attached Figure Description

[0019] Figure 1 This is the front view of the present invention;

[0020] Figure 2 This is a partial structural diagram of the present invention;

[0021] Figure 3 This is a structural diagram of the frame in this utility model;

[0022] Figure 4 In this utility model Figure 3 Exploded view;

[0023] Figure 5 This is a structural diagram of one side of the frame in this utility model;

[0024] Figure 6 In this utility model Figure 5 Exploded view;

[0025] Figure 7 This is a structural diagram of the other side of the frame in this utility model.

[0026] Explanation of the labels in the diagram:

[0027] 1. Frame; 2. Base plate; 3. Conveying device; 4. Base; 5. Receiving box; 6. Feeding elevator; 7. Receiving elevator; 8. Guide frame; 9. Limited slip cylinder; 10. Telescopic cylinder; 11. Pulling box rod assembly; 12. Picking cylinder; 13. Picking claw; 14. Lifting cylinder; 15. Heating plate; 16. Fixing plate assembly; 17. Positioning cylinder; 18. Positioning head; 19. First limit cylinder; 20. Second limit cylinder; 21. Conveying sensor; 22. Material box sensor; 23. Stacking sensor; 24. Pulley assembly; 25. Baffle; 26. Material blocking roller. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0029] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "top / bottom," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] Example:

[0032] Please see Figure 1-7A welding device for flip-chip LEDs includes a frame 1, a base plate 2 fixedly connected inside the frame 1, a conveying device 3 fixedly connected to the base plate 2, bases 4 fixedly connected to both symmetrical ends of the frame 1, and receiving boxes 5 fixedly connected to both bases 4. Feeding elevators 6 and receiving elevators 7 are fixedly connected to the two receiving boxes 5 respectively, and the feeding elevators 6 and receiving elevators 7 correspond to the two ends of the conveying device 3. Guide frames 8 are fixedly connected to both feeding elevators 6 and receiving elevators 7, and limiting cylinders 9 are fixedly connected to both guide frames 8. The output ends of the two limiting cylinders 9 respectively extend through the inner sides of the two guide frames 8. Telescopic cylinders 10 are fixedly connected to both receiving boxes 5, and pull-box rod assemblies 11 are fixedly connected to the output ends of the two telescopic cylinders 10. The box rod assembly 11 is located on the lower side of the two guide frames 8, corresponding to the feeding elevator 6 and the receiving elevator 7. The bottom plate 2 is fixedly connected to the picking cylinder 12, which is located inside the conveying device 3. The output end of the picking cylinder 12 is fixedly connected to the picking claw 13, which corresponds to the feeding elevator 6. The bottom plate 2 is fixedly connected to the lifting cylinder 14, which is located inside the conveying device 3. The output end of the lifting cylinder 14 is fixedly connected to the heating plate 15. The bottom plate 2 is fixedly connected to the fixing plate assembly 16, which is located outside the conveying device 3 and corresponds to the heating plate 15. A positioning cylinder 17 is fixedly connected to one guide frame 8. The output end of the positioning cylinder 17 is fixedly connected to the positioning head 18, which corresponds to the receiving elevator 7.

[0033] In this embodiment, LED chips are flip-chip mounted on a substrate, aligning the soldering flux with the solder joints. The substrate with the LED chips is placed in a hopper. During flip-chip LED chip soldering, the hopper containing the product is placed in the guide frame 8 corresponding to the feeding elevator 6, and the empty hopper is placed in the guide frame 8 corresponding to the receiving elevator 7. Two limited-slip cylinders 9 respectively control the extension of their output ends to position the two types of hoppers, fixing the upper hopper within the two guide frames 8. The feeding elevator 6 and the receiving elevator 7 respectively drive the lowermost hopper to move downward within the two guide frames 8, feeding... As the elevator 6 moves the material box downwards, the products inside the box sequentially align with the picking cylinder 12. The picking cylinder 12 controls the picking claw 13 to extend into the material box to pick up the products. Then, the products in the material box are pulled into the conveying device 3 inside the frame 1. The conveying device 3 transports the products, causing them to align with the heating plate 15 as they pass through the inner side of the fixed plate assembly 16. The lifting cylinder 14 controls the heating plate 15 to rise. The heating plate 15, in conjunction with the fixed plate assembly 16, heats and pressurizes the products, causing the soldering flux on the LED chip to melt at the solder joints of the substrate. The LED chip is then soldered... During the melting process, the product is pressure-welded onto the substrate. After welding, the lifting cylinder 14 drives the heating plate 15 to reset, and the product is transported again in the conveying device 3. The conveying device 3 moves the product towards the receiving elevator 7. The receiving elevator 7 moves the lowest empty material box down to pick up the products in sequence. At the same time, the positioning cylinder 17 controls the positioning head 18 to extend and position one end of the product to prevent the product from moving too much in the material box and affecting placement. When the product in the material box is transported by the feeding elevator 6 and an empty material box is generated, at this time, the empty material box has been fed multiple times and has been lowered. The empty material box falls onto a receiving box 5, corresponding to a pull-box rod assembly 11. A telescopic cylinder 10 controls the pull-box rod assembly 11 to pull the empty material box onto a receiving box 5 for easy removal by the staff. When the empty material box on the receiving elevator 7 is full of products, the material box has fallen onto a receiving box 5 after multiple receiving operations, corresponding to a pull-box rod assembly 11. A telescopic cylinder 10 controls the pull-box rod assembly 11 to pull the full material box onto a receiving box 5 for easy removal by the staff.

[0034] Specifically, a first limiting cylinder 19 is fixedly connected to the base plate 2, and the first limiting cylinder 19 is located between the heating plate 15 and the picking claw 13.

[0035] In this embodiment, when the LED chip is flip-chip soldered on the substrate by heating and pressurizing the heating plate 15, the picking cylinder 12 controls the picking claw 13 to pull the unsoldered product and move it into the conveying device 3. The first limiting cylinder 19 extends its output end to block the unsoldered product to prevent the unsoldered product from affecting the LED chip being soldered.

[0036] Specifically, a second limiting cylinder 20 is fixedly connected to the base plate 2, and the second limiting cylinder 20 is located on one side of the heating plate 15, corresponding to the material receiving elevator 7.

[0037] In this embodiment, after welding, the product is conveyed by the conveying device 3 to the empty material box on the receiving elevator 7. During the process of the product entering the empty material box, the output end of the second limiting cylinder 20 extends to block the subsequent products, so that the subsequent products can accurately enter the placement position in the empty material box in sequence.

[0038] Specifically, a conveying sensor 21 is fixedly connected to the base plate 2, and the conveying sensor 21 is located inside the conveying device 3 and corresponds to the second limit cylinder 20.

[0039] In this embodiment, the conveying sensor 21 is used to detect the welded product and determine the position of the product, so as to facilitate the precise control of the second limit cylinder 20 to block subsequent products.

[0040] Specifically, both the feeding elevator 6 and the receiving elevator 7 are fixedly connected to a material box sensor 22, and the two material box sensors 22 are respectively corresponding to the two guide frames 8. Both receiving boxes 5 are fixedly connected to a stacking sensor 23.

[0041] In this embodiment, two material box sensors 22 are used to detect the material boxes on the upper layer inside the two guide frames 8. They can work with the limited-slip cylinder 9 to fix the material boxes on the upper side, so that the feeding elevator 6 and the receiving elevator 7 can accurately drive one material box to rise and fall for feeding and receiving. Two stacking sensors 23 are used to detect the material boxes carried on the two receiving boxes 5, so that the staff is reminded to take them out when the two receiving boxes 5 are full.

[0042] Specifically, both guide frames 8 are rotatably connected to pulley assemblies 24.

[0043] In this embodiment, the two pulley assemblies 24 are respectively arranged in the two guide frames 8, which can make the material box slide more smoothly in the two guide frames 8 and avoid the material box getting stuck.

[0044] Specifically, a baffle 25 is fixedly connected to one end of a receiving box 5 away from the frame 1.

[0045] In this embodiment, the baffle 25 corresponds to the receiving elevator 7. When the receiving elevator 7 carries the empty material box to be filled with products and placed on the receiving box 5, the baffle 25 is located on one side of the receiving box 5 to protect the material box and prevent the products from falling and causing damage.

[0046] Specifically, two sets of material-stopping rollers 26 are rotatably connected to the conveying device 3, and the two sets of material-stopping rollers 26 correspond to the two ends of the conveying device 3 and are respectively opposite to the feeding elevator 6 and the receiving elevator 7.

[0047] In this embodiment, the two sets of second limit cylinders 20 correspond to the inlet and outlet of the conveying device 3, respectively, so that the product can be stably conveyed between the conveying device 3 and the material box, ensuring the stability of product loading and unloading.

[0048] Working Principle: During flip-chip LED chip soldering, the product-containing cassette is placed in the guide frame 8 on the feeding elevator 6. A limited-slip cylinder 9 fixes the upper product-containing cassette in the guide frame 8, causing the feeding elevator 6 to move the lower product-containing cassette downwards. The empty cassette is placed in the guide frame 8 on the receiving elevator 7. Another limited-slip cylinder 9 fixes the upper empty cassette in the guide frame 8, causing the receiving elevator 7 to move the lower empty cassette downwards. During the downward movement of the cassette with the product, the picking cylinder 12 controls the extension and retraction of the picking claw 13. The picking claw 13 sequentially pulls the product from the cassette, allowing the product to enter... The product is conveyed on the conveyor 3 inside the frame 1. The conveyor 3 first moves the product between the heating plate 15 and the fixed plate assembly 16. The lifting cylinder 14 controls the heating plate 15 to rise. The heating plate 15, together with the fixed plate assembly 16, heats and pressurizes the product, causing the soldering flux on the LED chip to melt on the solder joints of the substrate. During the melting of the soldering flux, the LED chip is flip-welded onto the substrate by pressure. After the welding is completed, the conveyor 3 conveys the product to the receiving elevator 7. The receiving elevator 7 moves the empty material box down to collect the products in sequence. During the collection process, the positioning cylinder 17 controls the positioning head 18 to extend and retract. 8. Position one end of the product to ensure it is neatly placed in the material box. When the product in the material box on the feeding elevator 6 is empty, the feeding elevator 6 lowers the material box to a receiving box 5 during the material retrieval process, corresponding to a box-pulling rod assembly 11. A telescopic cylinder 10 controls the box-pulling rod assembly 11 to pull the empty material box onto a receiving box 5. Simultaneously, the feeding elevator 6 rises to receive the material box containing the product at the bottom of the guide frame 8. The limited-slip cylinder 9 releases the fixation of the material box. After the feeding elevator 6 receives the material box, the limited-slip cylinder 9 fixes the upper material box containing the product again, causing the feeding elevator 6 to move... One material box descends to load products. When the empty material box on the receiving elevator 7 is full of products, the receiving elevator 7 lowers the material box to another receiving box 5 during the receiving process, corresponding to another box pulling rod assembly 11. Another telescopic cylinder 10 controls another box pulling rod assembly 11 to pull the material box and stack it on the other receiving box 5. At the same time, the receiving elevator 7 rises to pick up the empty material box located at the bottom of the guide frame 8. The limited slip cylinder 9 releases the fixation of the empty material box. After the receiving elevator 7 picks up the material box, the limited slip cylinder 9 fixes the upper empty material box again, causing the receiving elevator 7 to drive an empty material box down to collect products.

[0049] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model based on the technical solution and its improved concept should be covered within the protection scope of the present utility model.

Claims

1. A welding device for flip-chip LEDs, comprising a frame (1), characterized in that: A base plate (2) is fixedly connected inside the frame (1), and a conveying device (3) is fixedly connected on the base plate (2). Bases (4) are fixedly connected to both symmetrical ends of the frame (1), and receiving boxes (5) are fixedly connected to both bases (4). Feeding elevators (6) and receiving elevators (7) are fixedly connected to the two receiving boxes (5), respectively, with the feeding elevators (6) and receiving elevators (7) corresponding to the two ends of the conveying device (3). Guide frames (8) are fixedly connected to both the material elevator (6) and the receiving elevator (7). Limited sliding cylinders (9) are fixedly connected to both guide frames (8), and the output ends of the two limited sliding cylinders (9) respectively extend through the inner side of the two guide frames (8). Telescopic cylinders (10) are fixedly connected to both receiving boxes (5), and pull box rod assemblies (11) are fixedly connected to the output ends of the two telescopic cylinders (10). The two pull box rod assemblies (11) are respectively located in the two... The lower side of the guide frame (8) corresponds to the feeding elevator (6) and the receiving elevator (7). A picking cylinder (12) is fixedly connected to the base plate (2), and the picking cylinder (12) is located inside the conveying device (3). A picking claw (13) is fixedly connected to the output end of the picking cylinder (12), and the picking claw (13) corresponds to the feeding elevator (6). A lifting cylinder (14) is fixedly connected to the base plate (2), and the lifting cylinder (14) is located inside the conveying device (7). Inside the 3), the output end of the lifting cylinder (14) is fixedly connected to a heating plate (15), and a fixing plate assembly (16) is fixedly connected to the bottom plate (2). The fixing plate assembly (16) is located outside the conveying device (3) and corresponds to the heating plate (15). A positioning cylinder (17) is fixedly connected to one of the guide frames (8). The output end of the positioning cylinder (17) is fixedly connected to a positioning head (18), and the positioning head (18) corresponds to the receiving elevator (7).

2. The welding equipment for flip-chip LEDs according to claim 1, characterized in that: A first limiting cylinder (19) is fixedly connected to the base plate (2), and the first limiting cylinder (19) is located between the heating plate (15) and the picking claw (13).

3. The welding equipment for flip-chip LEDs according to claim 2, characterized in that: A second limiting cylinder (20) is fixedly connected to the base plate (2), and the second limiting cylinder (20) is located on one side of the heating plate (15) and corresponds to the material receiving elevator (7).

4. The welding equipment for flip-chip LEDs according to claim 3, characterized in that: A conveying sensor (21) is fixedly connected to the base plate (2), and the conveying sensor (21) is located inside the conveying device (3) and corresponds to the second limiting cylinder (20).

5. The flip-chip bonding equipment according to claim 4, characterized in that: Material box sensors (22) are fixedly connected to both the feeding elevator (6) and the receiving elevator (7), and the two material box sensors (22) are respectively corresponding to the two guide frames (8). Stacking sensors (23) are fixedly connected to both receiving boxes (5).

6. The bonding equipment for flip-chip LEDs according to claim 5, characterized in that: Both of the guide frames (8) are rotatably connected to pulley assemblies (24).

7. The bonding equipment for flip-chip LEDs according to claim 6, characterized in that: A baffle (25) is fixedly connected to one end of the receiving box (5) away from the frame (1).

8. The bonding equipment for flip-chip LEDs according to claim 7, characterized in that: Two sets of material-blocking rollers (26) are rotatably connected to the conveying device (3), and the two sets of material-blocking rollers (26) correspond to the two ends of the conveying device (3) and are respectively opposite to the feeding elevator (6) and the receiving elevator (7).

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