A precision welding device for electronic chip processing

Abstract

This utility model relates to the field of electronic chip processing and welding technology, and in particular to a precision welding device for electronic chip processing. The device includes a welding station, a storage tank and a desoldering pump on the welding station, a desoldering pump connected to a suction pipe and a delivery pipe, a side plate and a support on the welding station, a first cylinder on the side plate, a first cylinder rod on the first cylinder, a second cylinder and a vertical cylinder on the support, a vertical cylinder rod on the vertical cylinder, a lifting plate on the vertical cylinder rod, a vacuum generator on the lifting plate, a second cylinder rod on the second cylinder, and a shifting bracket on the second cylinder rod. This device achieves uniform and comprehensive spraying of a tin plating layer onto the upper back surface of the chip package, effectively and uniformly melting and welding the tin plating layer between the upper back surface of the chip package and the heat sink, ensuring that the heat sink is accurately and stably attached downwards to the upper back surface of the lower chip package.

Description

Technical Field

[0001] This utility model relates to the field of electronic chip processing and welding technology, and in particular to a precision welding device for electronic chip processing. Background Technology

[0002] Electronic chips are a core component of modern electronic technology. There are many types of electronic chips, among which vertical high-power conductor chips are a commonly used type, widely used in power management, automotive electronics, industrial control and other fields.

[0003] Vertical high-power conductor chips generally consist of a chip package, pins, and a heat sink. High-power vertical high-power conductor chips generate a lot of heat during use. To ensure long-term stable thermal conductivity and mechanical strength, a heat sink is usually soldered directly to the back of the chip package.

[0004] Currently, the existing steps for soldering heat sinks used in the processing of vertical high-power conductor chips are as follows: first, tin is manually sprayed onto the back surface of the chip package to form a tin plating layer; then, the heat sink is manually placed on the tin plating layer; next, an electric soldering iron is used to heat the soldering area, melting the tin plating layer and soldering the heat sink onto the back surface of the chip package.

[0005] The uniformity of the above-mentioned manual tin spraying is poor, which affects the stability of the heat sink soldering later. Moreover, during soldering, since the soldering part of the soldering iron is a pointed position, the effective soldering area is limited, and the soldering iron needs to be moved constantly, which greatly reduces the soldering uniformity of the heat sink soldered on the back surface of the vertical high-power conductor chip.

[0006] To address this, we designed a vertical heat sink welding device for high-power conductor chip processing to meet the needs of practical applications. Utility Model Content

[0007] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a precision welding device for electronic chip processing.

[0008] To achieve the above objectives, the present invention adopts the following technical solution: Design a precision welding device for electronic chip processing, including a welding station with a fixed groove inside which a chip package shell is installed. The welding station is equipped with a storage tank and a desoldering pump. The desoldering pump is connected to a desoldering pipe and a delivery pipe. A spray nozzle is installed on the delivery pipe. The welding station is equipped with a side plate and a support. A first cylinder is installed on the side plate, and a first cylinder rod is installed on the first cylinder. A second cylinder and a vertical cylinder are installed on the support. A vertical cylinder rod is installed on the vertical cylinder, and a lifting plate is installed on the vertical cylinder rod. A vacuum generator is installed on the lifting plate. The lifting plate is provided with a connecting column and a card frame. The connecting column is provided with a suction cup, and the card frame is provided with a heat sink. The second cylinder is provided with a second cylinder rod, the second cylinder rod is provided with a shift frame, the shift frame is provided with a motor, the motor shaft of the motor is provided with a welding roller, and the welding roller is provided with a connecting shaft.

[0009] In detail, the spray hood is positioned facing the welding station, and a spray hole is provided on the lower end face of the spray hood. The spray hole is connected to the inner cavity of the spray hood, and the extraction tube is connected to the storage tank.

[0010] In detail, the conveying pipe has a corrugated pipe structure, and a connecting plate is provided between the first cylinder rod and the conveying pipe.

[0011] In detail, the welding roller has a hollow cavity inside, and a heating wire is installed in the inner cavity of the welding roller.

[0012] In detail, the moving frame is equipped with an embedded bearing, and the mounting hole of the bearing is fixedly connected to the connecting shaft.

[0013] In detail, an air pipe connects the vacuum generator and the suction cup, and the card frame has an L-shaped cross-section in plan view and consists of four symmetrically arranged elements.

[0014] In detail, the inner wall surface of the bracket is provided with ribs, and the ribs are triangular in shape and are two longitudinally symmetrical ribs.

[0015] The design scheme proposed in this utility model has the following beneficial effects in application: 1. This utility model achieves uniform and comprehensive tin plating on the upper back surface of the chip package before soldering by setting a horizontally movable spray nozzle structure on the soldering station, thus avoiding the poor uniformity of manual tin spraying and improving the effective soldering stability between the heat sink and the chip package in the later stage.

[0016] 2. This utility model, by setting an electrically controlled transfer frame on the welding station and an electrically driven rolling welding roller structure on the transfer frame, can achieve rolling high-temperature uniform heating and welding of the heat sink attached to the back end face of the chip package during welding. This enables the tin plating layer coated between the back end face of the chip package and the heat sink to be fully, effectively and uniformly melted and welded together, thereby improving the welding uniformity of the heat sink on the back end face of the vertical high-power conductor chip.

[0017] 3. This utility model, by setting a vacuum adsorption structure and a frame on the soldering station, can position and stably adsorb the heat sink before soldering, thereby ensuring that the heat sink is accurately and stably attached downward to the upper back surface of the chip package shell below, thus improving the subsequent soldering quality. Attached Figure Description

[0018] Figure 1 This is a first-view perspective perspective view of the overall structure of this utility model; Figure 2 This is a second-view perspective perspective view of the overall structure of this utility model; Figure 3 For the present utility model Figure 1 A three-dimensional schematic diagram of a spray hood with nozzles. Figure 4 For the present utility model Figure 1 A three-dimensional schematic diagram of a lifting plate with a card frame; Figure 5 For the present utility model Figure 1 A three-dimensional schematic diagram of a transfer frame with welding rollers; Figure 6 For the present utility model Figure 5 Top view cross section.

[0019] In the diagram: 1 Soldering station; 11 Fixed slot; 12 Chip package shell; 2 Storage tank; 21 Pull tube; 3 Solder pump; 31 Delivery pipe; 32 Spray cover; 33 Spray hole; 4 Side plate; 41 First cylinder; 42 First cylinder rod; 43 Connecting plate; 5 Bracket; 50 Rib plate; 51 Second cylinder; 52 Second cylinder rod; 53 Moving frame; 54 Motor; 55 Bearing; 6 Welding roller; 61 Heating wire; 62 Connecting shaft; 7 Vertical cylinder; 71 Vertical cylinder rod; 72 Lifting plate; 73 Clip frame; 8 Vacuum generator; 81 Air pipe; 9 Connecting column; 91 Suction cup; 92 Heat sink. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figures 1-6 A precision welding device for electronic chip processing includes a welding station 1, a fixed groove 11 on the welding station 1, a chip packaging shell 12 inside the fixed groove 11, a storage tank 2 and a desoldering pump 3 on the welding station 1, a desoldering pump 3 connected to a desoldering pipe 21 and a delivery pipe 31, a spray cover 32 on the delivery pipe 31, a side plate 4 and a bracket 5 on the welding station 1, a first cylinder 41 on the side plate 4, a first cylinder rod 42 on the first cylinder 41, a second cylinder 51 and a vertical cylinder 7 on the bracket 5, a vertical cylinder rod 71 on the vertical cylinder 7, a lifting plate 72 on the vertical cylinder rod 71, and a vacuum generator 8 on the lifting plate 72. The lifting plate 72 is provided with a connecting post 9 and a card frame 73. The connecting post 9 is provided with a suction cup 91, and the card frame 73 is provided with a heat sink 92. The second cylinder 51 is equipped with a second cylinder rod 52, the second cylinder rod 52 is equipped with a shift bracket 53, the shift bracket 53 is equipped with a motor 54, the motor shaft of the motor 54 is equipped with a welding roller 6, the welding roller 6 is equipped with a connecting shaft 62, the chip packaging shell 12 is the packaging shell of the vertical high-power conductor chip, and the heat sink 92 is made of aluminum alloy, all of which are existing technologies.

[0022] It should be further noted that the spray nozzle 32 is oriented towards the soldering station 1, and the outer walls of the spray nozzle 32, the extraction tube 21, and the delivery tube 31 are all provided with PUR heat insulation cotton to ensure that the solder paste is delivered in a molten state.

[0023] The desoldering pump 3 can extract and transport molten solder paste, as per existing technology.

[0024] The lower end face of the spray cover 32 is provided with spray holes 33, which are connected to the inner cavity of the spray cover 32. The suction tube 21 is connected to the storage tank 2. There are several spray holes 33 to ensure that the molten solder paste is evenly sprayed on the upper surface of the chip package shell 12.

[0025] It should be further explained that the conveying pipe 31 has a corrugated pipe structure. A connecting plate 43 is provided between the first cylinder rod 42 and the conveying pipe 31. The corrugated pipe structure is made of stainless steel. When the connecting plate 43 moves horizontally left and right, the conveying pipe 31 itself will expand and contract, but this will not affect the conveying of molten solder paste.

[0026] It should be further noted that the inside of the welding roller 6 is a hollow cavity, and a heating wire 61 is provided in the inner cavity of the welding roller 6. The heating wire 61 is a commonly used dry-burning type heating wire, which is in the prior art.

[0027] The welding roller 6 body is made of red copper, which has high heat conduction efficiency and is durable.

[0028] It should be further explained that a bearing 55 is embedded in the transfer frame 53. The mounting hole of the bearing 55 is fixedly connected to the connecting shaft 62. The bearing 55 is a ball bearing, which enables the connecting shaft 62 and the welding roller 6 to rotate, while preventing them from disengaging.

[0029] It should be further noted that an air pipe 81 connects the vacuum generator 8 and the suction cup 91. The top view of the frame 73 is an L-shaped structure with four symmetrically arranged components. The vacuum generator 8, air pipe 81, and suction cup 91 form a group. The structure and working principle are existing technologies and are commonly used pneumatic vacuum suction cup equipment in production.

[0030] It should be further noted that the inner wall of the bracket 5 is provided with ribs 50. The ribs 50 are triangular in shape and are two in a longitudinally symmetrical manner. The ribs 50 are made of hard alloy steel, which has high strength and strong triangular structure, thus improving the structural stability of the bracket 5.

[0031] Operating procedure: Before soldering, the first cylinder 41 is activated, and the first cylinder rod 42 extends to the right, driving the spray nozzle 32 to move horizontally to the right via the receiving plate 43. When the spray nozzle 32 moves to the upper left side of the chip package 12, the desoldering pump 3 is activated, and the molten solder paste pre-stored in the storage tank 2 is extracted through the extraction pipe 21 (the storage tank 2 has a pre-set heating structure to ensure the molten state of the solder paste, which is existing technology). The paste is then uniformly sprayed downwards through the delivery pipe 31 and the spray nozzle 32, and finally through each spray hole 33. At the same time, the spray nozzle 32 also moves horizontally to the right at a uniform speed. When the spray nozzle 32 moves to the upper right side of the chip package 12, the desoldering pump 3 is stopped, and the first cylinder 41 drives the spray nozzle 32 to move to the left to reset. This achieves uniform and comprehensive spraying of a tin plating layer on the upper back side of the chip package 12, avoiding the poor uniformity of manual soldering, and thus improving the effective soldering stability between the heat sink 92 and the chip package 12.

[0032] Furthermore, after the tin plating is completed, the molten solder paste will cool and form a solid tin layer. The heat sink 92 can be precisely placed on the chip package 12 using the suction cup 91 (see the operation below). Then, the soldering operation can be performed. The second cylinder 51 can be activated, and the motor 54 and heating wire 61 can be activated at the same time. The second cylinder rod 52 extends to the left, driving the transfer frame 53 and the soldering roller 6 to move to the left. At the same time, the motor 54 will drive the soldering roller 6 to rotate at a constant speed, and the heating wire 61 will also heat the soldering roller 6 itself to a high temperature. While rotating at a constant speed, the soldering roller 6, which is in a high temperature state, will move to the left along the upper end face of the heat sink 92. This will achieve a comprehensive, effective and uniform melting and soldering of the tin plating layer coated between the upper back end face of the chip package 12 and the heat sink 92, improving the soldering uniformity of the heat sink 92 on the back end face of the vertical high-power conductor chip.

[0033] In addition, before welding, the heat sink 92 can be attached to the lower end face of the suction cup 91. At the same time, the four corners of the heat sink 92 should be matched and engaged with the inner walls of the four L-shaped clip frames 73. Then, the vacuum generator 8 is activated, and the suction cup 91 is used to stably vacuum-adsorb and position the heat sink 92 through the air pipe 81. Later, the vertical cylinder 7 can be activated. The vertical cylinder rod 71 extends downward and drives the lifting plate 72, the receiving post 9, the suction cup 91, and the heat sink 92 to move downward and stably. When the heat sink 92 is accurately and stably attached to the upper back end face of the chip package shell 12 below, the vacuum generator 8 is turned off. The suction cup 91 no longer has suction force. Then, the vertical cylinder 7 drives the suction cup 91 to move upward and reset. At this time, the heat sink 92 body has been accurately attached to the upper back end face of the chip package shell 12, thereby improving the welding quality in the later stage.

[0034] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A precision welding device for electronic chip processing, comprising a welding table (1), characterized in that: The soldering station (1) is provided with a fixed slot (11), and a chip packaging shell (12) is provided in the fixed slot (11). The soldering station (1) is provided with a storage tank (2) and a desoldering pump (3). The desoldering pump (3) is connected to a desoldering pipe (21) and a delivery pipe (31). The delivery pipe (31) is provided with a spray cover (32). The soldering station (1) is provided with a side plate (4) and a bracket (5). The side plate (4) is provided with a first cylinder (41). The first cylinder (41) is provided with a first cylinder rod (42). The bracket (5) is provided with a second cylinder (51) and a vertical cylinder (7). The vertical cylinder (7) is provided with a vertical cylinder rod (71). The vertical cylinder rod (71) is provided with a lifting plate (72). The lifting plate (72) is provided with a vacuum generator (8). The lifting plate (72) is provided with a connecting post (9) and a card frame (73). The connecting post (9) is provided with a suction cup (91), and the card frame (73) is provided with a heat sink (92). The second cylinder (51) is provided with a second cylinder rod (52), the second cylinder rod (52) is provided with a shift frame (53), the shift frame (53) is provided with a motor (54), the motor shaft of the motor (54) is provided with a welding roller (6), and the welding roller (6) is provided with a connecting shaft (62).

2. The precision soldering device for electronic chip processing according to claim 1, characterized in that: The spray hood (32) is positioned facing the welding station (1). The lower end face of the spray hood (32) is provided with a spray hole (33). The spray hole (33) is connected to the inner cavity of the spray hood (32). The extraction tube (21) is connected to the storage tank (2).

3. The precision soldering device for electronic chip processing according to claim 1, characterized in that: The conveying pipe (31) has a corrugated pipe structure, and a connecting plate (43) is provided between the first cylinder rod (42) and the conveying pipe (31).

4. The precision soldering device for electronic chip processing according to claim 1, characterized in that: The welding roller (6) has a hollow cavity inside, and a heating wire (61) is provided in the inner cavity of the welding roller (6).

5. The precision soldering device for electronic chip processing according to claim 1, characterized in that: The moving frame (53) is fitted with a bearing (55), and the mounting hole of the bearing (55) is fixedly connected to the connecting shaft (62).

6. The precision soldering device for electronic chip processing according to claim 1, characterized in that: An air pipe (81) is connected between the vacuum generator (8) and the suction cup (91). The top view of the card frame (73) is an L-shaped structure and consists of four symmetrically arranged components.

7. The precision soldering device for electronic chip processing according to claim 1, characterized in that: The inner wall of the bracket (5) is provided with ribs (50), and the ribs (50) are triangular in shape and are two longitudinally symmetrical.

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