A silicon wafer laser film opening assembly and a laser film opening device

Abstract

This application provides a silicon wafer laser decoupling assembly and a laser decoupling device. The silicon wafer laser decoupling assembly includes a turntable assembly, multiple laser heads, and a camera assembly. The turntable is mounted on a first base and can rotate relative to the first base. The rotation of the turntable causes a first adsorption fixture to move in a circumferential direction. The multiple laser heads are spaced apart and can perform laser decoupling on the external silicon wafer adsorbed by the first adsorption fixture when corresponding to the first adsorption fixture. This allows the external silicon wafer adsorbed by the first adsorption fixture to be processed sequentially by multiple laser heads under the drive of the turntable, thereby improving the processing efficiency of the silicon wafer laser decoupling assembly on the external silicon wafer. The camera can take pictures of the external silicon wafer adsorbed by the first adsorption fixture when corresponding to the first adsorption fixture, so that the camera can transmit the surface of the external silicon wafer to the screen, thereby facilitating the user to inspect the surface condition of the external silicon wafer on the screen.

Description

Technical Field

[0001] This utility model relates to the technical field of laser film-opening equipment, and in particular to a silicon wafer laser film-opening component and laser film-opening equipment. Background Technology

[0002] Laser wafer forming equipment uses lasers to perform wafer forming on external silicon wafers. As part of the laser wafer forming equipment, the silicon wafer laser wafer forming assembly specifically includes a base and multiple laser heads. The multiple laser heads are connected to the base, and the multiple laser heads sequentially perform laser forming on different positions on the surface of the external silicon wafer. However, the external silicon wafer needs to be moved from one laser head to another under human intervention, resulting in low processing efficiency of existing silicon wafer laser wafer forming assemblies. Utility Model Content

[0003] The purpose of this invention is to provide a silicon wafer laser decoupling assembly and a laser decoupling device. The turntable assembly includes a first base, a turntable, and a first adsorption fixture. The turntable is disposed on the first base and can rotate relative to the first base. The first adsorption fixture is disposed on the turntable, and the rotation of the turntable causes the first adsorption fixture to move along the circumferential direction. The first adsorption fixture can be used to adsorb or release external silicon wafers. Multiple laser heads are spaced apart, and the first adsorption fixture corresponds to each of the multiple laser heads one by one by moving along the circumferential direction. When corresponding to the first adsorption fixture, the laser head can laser-drive the external silicon wafer adsorbed by the first adsorption fixture. The laser wafer opening mechanism allows the external silicon wafer, held by the first adsorption fixture, to be processed sequentially by multiple laser heads under the drive of the turntable. This avoids the need for manual handling of the external silicon wafer and improves the processing efficiency of the silicon wafer laser opening assembly. Simultaneously, the camera assembly is equipped with at least one camera. The first adsorption fixture moves along the circumferential direction and passes the position corresponding to the camera. The camera can take pictures of the external silicon wafer held by the first adsorption fixture when it is in contact with the first adsorption fixture. This allows the camera to transmit the image of the external silicon wafer's surface to the screen, making it convenient for the user to inspect the surface condition of the external silicon wafer on the screen.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a silicon wafer laser film-opening assembly, comprising:

[0005] A turntable assembly includes a first base, a turntable, and a first suction fixture; the turntable is disposed on the first base and can rotate relative to the first base; the first suction fixture is disposed on the turntable, and the first suction fixture moves circumferentially by rotating the turntable; the first suction fixture can be used to adsorb or release an external silicon wafer.

[0006] Multiple laser heads are arranged at intervals. The first adsorption fixture moves along the circumferential direction to correspond one by one with the multiple laser heads. The laser heads can laser-open the outer silicon wafer adsorbed by the first adsorption fixture when corresponding to the first adsorption fixture.

[0007] The camera assembly includes at least one camera. The first adsorption fixture moves in a circumferential direction to pass a position corresponding to the camera. The camera is capable of taking pictures of the external silicon wafer adsorbed by the first adsorption fixture when corresponding to the first adsorption fixture.

[0008] Optionally, the silicon wafer laser film-opening assembly further includes a feeding assembly located on the outer periphery of the turntable; the feeding assembly is used to transport the external silicon wafer to the first adsorption fixture, and can also remove the external silicon wafer in the first adsorption fixture from the first adsorption fixture.

[0009] Optionally, the feeding assembly includes a second base, a movable seat, a second suction fixture, and a third suction fixture;

[0010] The second base is disposed on one side of the first base;

[0011] The movable seat is movably connected to the second base. The second and third suction fixtures are both mounted on the movable seat and move relative to the second base together with the movable seat. The movement of the movable seat causes the second and third suction fixtures to alternately correspond to the same first suction fixture. The movement rhythm of the movable seat is 1-3 seconds per cycle.

[0012] Optionally, the silicon wafer laser film-opening assembly further includes a conveyor line disposed on one side of the feeding assembly for receiving external silicon wafers released by the second adsorption fixture.

[0013] Optionally, the movement of the first suction fixture along the circumferential direction further includes an alternating position, and the movement of the movable seat relative to the second base includes a first preset position and a second preset position.

[0014] When the first adsorption fixture is located at the alternating position and the movable seat is located at the first preset position, the second adsorption fixture corresponds to the first adsorption fixture at the alternating position, so that the second adsorption fixture obtains the external silicon wafer from the corresponding first adsorption fixture, and the third adsorption fixture corresponds to the external conveying line for outputting the external silicon wafer, so that the third adsorption fixture obtains the external silicon wafer from the external conveying line.

[0015] When the first adsorption fixture is located at the alternating position and the movable seat is located at the second preset position, the second adsorption fixture corresponds to the conveyor line, thereby causing the second adsorption fixture to release an external silicon wafer to the conveyor line. The third adsorption fixture corresponds to the first adsorption fixture at the alternating position, thereby causing the third adsorption fixture to release the external silicon wafer to the corresponding first adsorption fixture.

[0016] Optionally, the feeding assembly further includes a linear motion module located between the second base and the movable seat; the linear motion module has a fixed end and a movable end, the fixed end being connected to the second base and the movable end being connected to the movable seat; and / or

[0017] Both the second and third suction fixtures include a support plate and a plurality of suction cups. The support plate is connected to the movable seat. The plurality of suction cups are connected to the same support plate and are distributed at intervals.

[0018] Optionally, the camera assembly includes a first bracket, a first lifting base, a camera moving base, and a fill light;

[0019] The first bracket is disposed on the outside of the first base;

[0020] The first lifting seat is vertically connected to the first bracket and can move up and down in the vertical direction;

[0021] The camera moving base is connected to the first lifting base and its position is adjusted as the first lifting base moves up and down;

[0022] The camera is mounted on the camera moving base and can be adjusted in position along the length of the camera moving base;

[0023] The fill light is located on the lower side of the camera and is used to illuminate the external silicon wafer.

[0024] Optionally, the silicon wafer laser film-opening assembly further includes a second support and a laser module.

[0025] The second bracket is disposed on the outside of the first base; the laser module is mounted on the second bracket and connected to the laser head; when the laser head corresponds to the first adsorption fixture, the laser head is positioned above the external silicon wafer adsorbed by the corresponding first adsorption fixture and performs laser film opening on the external silicon wafer.

[0026] Optionally, the turntable is provided with at least one first fixture station, the first adsorption fixture is disposed on the first fixture station, one side surface of the first adsorption fixture is arranged opposite to the first fixture station, and a plurality of adsorption holes are distributed at intervals on the side surface of the first adsorption fixture facing away from the first fixture station, the adsorption holes being used for the first adsorption fixture to draw air; the side wall of the first adsorption fixture is provided with an air nozzle, and the first adsorption fixture is provided with an internal flow channel communicating with the adsorption holes, the air nozzle communicating with the internal flow channel;

[0027] Alternatively, a rotating component is provided between the turntable and the first base, the rotating component connecting the turntable and the first base; the rotating component is connected to a power motor and rotates under the drive of the power motor, so that the turntable rotates relative to the first base;

[0028] The turntable rotates at a rate of 4 to 8 seconds per revolution.

[0029] To achieve the above objectives, the present invention provides the following technical solution: a laser film-opening device, comprising the aforementioned silicon wafer laser film-opening component.

[0030] Compared with the prior art, the beneficial effects of this utility model are:

[0031] This invention provides a silicon wafer laser decoupling assembly and a laser decoupling device. The turntable assembly includes a first base, a turntable, and a first suction fixture. The turntable is disposed on the first base and can rotate relative to the first base. The first suction fixture is disposed on the turntable, and the rotation of the turntable causes the first suction fixture to move along the circumferential direction. The first suction fixture can be used to adsorb or release external silicon wafers. Multiple laser heads are spaced apart, and the first suction fixture corresponds to each of the multiple laser heads one by one by moving along the circumferential direction. When corresponding to the first suction fixture, the laser head can perform laser decoupling on the external silicon wafer adsorbed by the first suction fixture. This allows the external silicon wafers adsorbed by the first adsorption fixture to be processed sequentially by multiple laser heads under the drive of the turntable, avoiding manual handling of the external silicon wafers and improving the processing efficiency of the silicon wafer laser film-opening assembly. At the same time, the camera assembly is equipped with at least one camera. The first adsorption fixture moves along the circumferential direction and passes through the position corresponding to the camera. The camera can take pictures of the external silicon wafers adsorbed by the first adsorption fixture when they are in contact with the first adsorption fixture, so that the camera can transmit the surface of the external silicon wafers to the screen, thereby facilitating the user to check the surface condition of the external silicon wafers on the screen. Attached Figure Description

[0032] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0033] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0034] Figure 1 A schematic diagram of a silicon wafer laser-cutting assembly according to an embodiment of this application is shown.

[0035] Figure 2 A schematic diagram of a turntable assembly of a silicon wafer laser film-opening assembly according to an embodiment of this application is shown.

[0036] Figure 3 A schematic diagram of a camera assembly of a silicon wafer laser-cutting assembly according to an embodiment of this application is shown.

[0037] Figure 4 A schematic diagram of a laser component of a silicon wafer laser opening assembly according to an embodiment of this application is shown.

[0038] Figure 5 A schematic diagram of a feeding assembly for a silicon wafer laser film-opening assembly according to an embodiment of this application is shown.

[0039] Figure label:

[0040] 100. Silicon wafer laser film-opening assembly;

[0041] 10. Turntable assembly; 11. First base; 12. Turntable; 121. First fixture station; 13. First suction fixture; 13a. Alternating position; 13b. Suction hole; 131. Air nozzle; 14. Rotating component; 15. Power motor;

[0042] 20. Laser assembly; 21. Second support; 22. Laser module; 23. Laser head;

[0043] 30. Camera assembly; 31. Camera; 32. First support; 33. First lifting base; 34. Camera moving base; 35. Fill light;

[0044] 40. Feeding assembly; 41. Second base; 42. Movable seat; 42a. First preset position; 42b. Second preset position; 43. Second suction fixture; 431. Support plate; 432. Suction cup; 44. Third suction fixture; 45. Linear movement module;

[0045] 50. Conveyor line. Detailed Implementation

[0046] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] Please refer to the attached document. Figures 1-5 This application provides a silicon wafer laser decoupling assembly 100, which is applied to a laser decoupling device and is used to perform laser decoupling on different positions on the surface of an external silicon wafer.

[0048] Please refer to the attached document. Figures 1-5 In this embodiment, the silicon wafer laser film-opening assembly 100 includes a turntable assembly 10, a laser assembly 20, and a camera assembly 30. The turntable assembly 10 includes a first base 11, a turntable 12, and a first suction fixture 13. The turntable 12 is disposed on the first base 11 and can rotate relative to the first base 11. The first suction fixture 13 is disposed on the turntable 12, and the first suction fixture 13 moves in a circumferential direction by rotating the turntable 12. The first suction fixture 13 can be used to adsorb or release external silicon wafers. The laser assembly 20 includes a plurality of laser heads 23, which are spaced apart. The first suction fixture 13 corresponds to each of the plurality of laser heads 23 by moving in a circumferential direction. The laser heads 23 can be positioned to correspond to the first suction fixture 13. The laser-engraved outer silicon wafers held by the first adsorption fixture 13 are laser-engraved so that the outer silicon wafers held by the first adsorption fixture 13 can be continuously processed by multiple laser heads 23 under the drive of the turntable 12, avoiding the need for manual handling of the outer silicon wafers and improving the processing efficiency of the silicon wafer laser engraving assembly 100 on the outer silicon wafers; at the same time, the camera assembly 30 is provided with at least one camera 31. The first adsorption fixture 13 moves along the circumferential direction and passes through the position corresponding to the camera 31. The camera 31 can take pictures of the outer silicon wafers held by the first adsorption fixture 13 when corresponding to the first adsorption fixture 13, so that the camera 31 can transmit the surface of the outer silicon wafers to the screen, thereby making it convenient for the user to check the surface condition of the outer silicon wafers on the screen.

[0049] Please refer to the attached document. Figures 1-5In this embodiment, the turntable assembly 10 includes a first base 11, a turntable 12, and a first suction fixture 13. The turntable 12 is disposed on the first base 11 and can rotate relative to the first base 11 to facilitate adjustment of the position of the turntable 12 relative to the first base 11. The first suction fixture 13 is disposed on the turntable 12, and the first suction fixture 13 moves in a circumferential direction by rotating the turntable 12. The first suction fixture 13 can adsorb external silicon wafers under negative pressure, so that the external silicon wafers adsorbed by the first suction fixture 13 can rotate under the drive of the turntable 12, thereby facilitating adjustment of the position of the external silicon wafers and avoiding the external silicon wafers from being moved by human intervention.

[0050] Multiple laser heads 23 are spaced apart. The first adsorption fixture 13 moves along the circumferential direction to correspond one by one with the multiple laser heads 23. When corresponding to the first adsorption fixture 13, the laser head 23 can laser-open the outer silicon wafer adsorbed by the first adsorption fixture 13, so that the outer silicon wafer adsorbed by the first adsorption fixture 13 can be continuously processed by the multiple laser heads 23 in sequence under the drive of the turntable 12. This avoids the outer silicon wafer being moved by human intervention and improves the processing efficiency of the silicon wafer laser opening component 100 for the outer silicon wafer.

[0051] The camera assembly 30 is disposed on the outer periphery of the turntable assembly 10. The camera assembly 30 is provided with at least one camera 31. The first adsorption fixture 13 moves along the circumferential direction and passes through the position corresponding to the camera 31. The camera 31 can take pictures of the external silicon wafer adsorbed by the first adsorption fixture 13 when corresponding to the first adsorption fixture 13, so that the camera 31 can transmit the surface of the external silicon wafer to the screen, thereby making it convenient for the user to check the surface condition of the external silicon wafer on the screen.

[0052] Please refer to the attached document. Figures 1-5 In this embodiment, the silicon wafer laser decoupling assembly 100 further includes a feeding assembly 40, which is located on the outer periphery of the turntable 12. The feeding assembly 40 is used to transport the external silicon wafer to the first adsorption fixture 13, and can also remove the external silicon wafer from the first adsorption fixture 13. When the external silicon wafer to be laser decoupled is transported to the first adsorption fixture 13 via the feeding assembly 40, the first adsorption fixture 13 adsorbs the external silicon wafer to be laser decoupled and, driven by the turntable 12, sequentially passes through multiple laser heads 23 and camera assembly 30. When the laser-decoupled external silicon wafer is removed from the first adsorption fixture 13 via the feeding assembly 40, it prevents the laser-decoupled external silicon wafer from being removed from the first adsorption fixture 13 by human intervention.

[0053] Please refer to the attached document. Figure 1 and 5In this embodiment, the feeding assembly 40 includes a second base 41, a movable seat 42, a second suction fixture 43, and a third suction fixture 44. The second base 41 is disposed on the front side of the first base 11. The movable seat 42 is movably connected to the second base 41. The second suction fixture 43 and the third suction fixture 44 are both mounted on the movable seat 42 and move relative to the second base 41 together with the movable seat 42. The movement of the movable seat 42 causes the second suction fixture 43 and the third suction fixture 44 to alternately correspond to the same first suction fixture 13, so as to facilitate the second suction fixture... The positions of fixture 43 and the third adsorption fixture 44 are adjusted as the moving seat 42 moves. When the moving seat 42 moves relative to the second base 41, the second adsorption fixture 43 adsorbs the external silicon wafer on the first adsorption fixture 13 and takes it away, so that the external silicon wafer is detached from the first adsorption fixture 13. At this time, the first adsorption fixture 13 is in a non-negative pressure state, so as to facilitate the transfer of the external silicon wafer after laser film opening on the first adsorption fixture 13 to the second adsorption fixture 43, so as to achieve the transfer effect of the external silicon wafer after laser film opening. The moving rhythm of the moving seat 42 is 1-3 seconds / time.

[0054] Simultaneously, the external silicon wafer adsorbed by the third adsorption fixture 44 is transferred to the first adsorption fixture 13. The first adsorption fixture 13 adsorbs the external silicon wafer detached from the third adsorption fixture 44. At this time, the third adsorption fixture 44 is in a non-negative pressure state, so as to facilitate the transfer of the external silicon wafer to be laser-etched from the third adsorption fixture 44 to the first adsorption fixture 13, thereby achieving the transfer effect of the external silicon wafer to be laser-etched. By reasonably switching the adsorption state, the external silicon wafer to be laser-etched and the external silicon wafer after laser-etching can be flexibly handled, improving the transfer efficiency of the external silicon wafer and the operating efficiency of the silicon wafer laser-etching assembly 100.

[0055] Please refer to the attached document. Figure 1 In this embodiment of the application, the silicon wafer laser decoction assembly 100 further includes a conveyor line 50, which is disposed on one side of the feeding assembly 40. The conveyor line 50 is used to receive the external silicon wafer released by the second adsorption fixture 43, so that the external silicon wafer after laser decoction can be transferred from the first adsorption fixture 13 to the conveyor line 50 via the second adsorption fixture 43. This facilitates the conveyor line 50 to transport the external silicon wafer after laser decoction to the designated position, avoiding the external silicon wafer after laser decoction from being transferred to the designated position by human intervention.

[0056] Please refer to the attached document. Figures 1-2 and Figure 5 In this embodiment of the application, the movement of the first adsorption fixture 13 along the circumferential direction also includes an alternating position 13a, and the movement of the movable seat 42 relative to the second base 41 includes a first preset position 42a and a second preset position 42b.

[0057] When the first adsorption fixture 13 is located at the alternating position 13a and the movable seat 42 is located at the first preset position 42a, the second adsorption fixture 43 corresponds to the first adsorption fixture 13 at the alternating position 13a, so that the second adsorption fixture 43 picks up the external silicon wafer from the corresponding first adsorption fixture 13. The third adsorption fixture 44 corresponds to the external conveying line 50 for outputting the external silicon wafer, so that the third adsorption fixture 44 picks up the external silicon wafer from the external conveying line 50. This allows the second adsorption fixture 43 and the third adsorption fixture 44 to simultaneously transfer the external silicon wafer picked up from the first adsorption fixture 13 and the external silicon wafer picked up from the external conveying line 50, respectively.

[0058] When the first adsorption fixture 13 is located at the alternating position 13a and the movable seat 42 is located at the second preset position 42b, the second adsorption fixture 43 corresponds to the conveyor line 50, so that the second adsorption fixture 43 releases the external silicon wafer to the conveyor line 50. The third adsorption fixture 44 corresponds to the first adsorption fixture 13 at the alternating position 13a, so that the third adsorption fixture 44 releases the external silicon wafer to the corresponding first adsorption fixture 13. This allows the second adsorption fixture 43 and the third adsorption fixture 44 to simultaneously transfer the external silicon wafer to the conveyor line 50 and the first adsorption fixture 13, respectively, thus flexibly handling the external silicon wafer to be laser-etched and the external silicon wafer after laser etch.

[0059] Please refer to the attached document. Figure 1 and 5 In this embodiment, the feeding assembly 40 further includes a linear motion module 45, which is located between the second base 41 and the movable seat 42. The linear motion module 45 is arranged in a horizontal direction. The linear motion module 45 has a fixed end and a movable end. The fixed end is connected to the second base 41, and the movable end is connected to the movable seat 42. The movable end drives the movable seat 42 to move along the length direction of the second base 41, so that the movable seat 42 can move automatically relative to the second base 41 through the linear motion module 45, thus ensuring the movement effect of the movable seat 42.

[0060] The linear motion module 45 includes a motor, a transmission module, a guide rail, and a slider. The guide rail is connected to the second base 41, and the slider is movably connected to the guide rail and supports the movable seat 42. The fixed end of the motor is connected to the guide rail, and the two ends of the transmission module are respectively connected to the motor slider and drive the slider to move, so that the movable seat 42 can move relative to the second base 41 with the cooperation of the guide rail and the slider, ensuring the horizontal movement effect of the movable seat 42.

[0061] Please refer to the attached document. Figure 1 and 5In this embodiment, both the second adsorption fixture 43 and the third adsorption fixture 44 include a support plate 431 and multiple suction cups 432. The support plate 431 is disposed on the lower side of the movable seat 42 and is connected to the movable seat 42 so that the second adsorption fixture 43 and the third adsorption fixture 44 can be connected to the lower side of the movable seat 42 through the support plate 431. The multiple suction cups 432 are connected to the same support plate 431 and are distributed at intervals to adsorb external silicon wafers at different positions, so as to increase the number of external silicon wafers adsorbed by arranging multiple suction cups 432, thereby facilitating the adsorption of multiple external silicon wafers.

[0062] Please refer to the attached document. Figure 1 and 3 In this embodiment, the camera assembly 30 includes a first bracket 32, a first lifting seat 33, a camera moving seat 34, and a fill light 35. The first bracket 32 ​​is disposed on the outside of the first base 11. The first lifting seat 33 is vertically connected to the first bracket 32 ​​and moves up and down to adjust the height of the first lifting seat 33 relative to the first bracket 32. The camera moving seat 34 is connected to the first lifting seat 33 and its position is adjusted as the first lifting seat 33 moves up and down to adjust the height of the camera moving seat 34.

[0063] Please refer to the attached document. Figure 1 and 3 The camera 31 is mounted on the camera moving base 34 and can be adjusted along the length of the camera moving base 34 to adjust the height and left-right position of the camera 31 relative to the first lifting base 33, thereby facilitating the camera 31 to move closer to or further away from the external silicon wafer located in the first adsorption fixture 13. Optionally, the camera moving base 34 is provided with an elongated hole, and the camera 31 can be adjusted relative to the camera moving base 34 by adjusting the position of the elongated hole with screws, ensuring the position adjustment effect of the camera 31. The supplementary light 35 is located on the lower side of the camera 31 and is used to illuminate the external silicon wafer, ensuring the shooting effect of the camera 31 relative to the external silicon wafer and improving the shooting clarity of the camera 31.

[0064] Please refer to the attached document. Figure 1 and 4In this embodiment, the laser assembly 20 further includes a second bracket 21 and a laser module 22. The second bracket 21 is disposed on the outside of the first base 11. The laser module 22 is mounted on the second bracket 21 and connected to the laser head 23. When the laser head 23 corresponds to the first adsorption fixture 13, the laser head 23 is positioned above the external silicon wafer adsorbed by the corresponding first adsorption fixture 13, and laser delamination is performed on the external silicon wafer. At this time, the laser head 23 is positioned above the external silicon wafer, ensuring that the laser head 23 faces the external silicon wafer, so that the laser assembly 20 can perform laser delamination on the external silicon wafer through the cooperation of the laser module 22 and the laser head 23, thus ensuring the laser delamination effect of the external silicon wafer.

[0065] Please refer to the attached document. Figures 1-2 In this embodiment, at least one first fixture station 121 is provided on the turntable 12, and a first adsorption fixture 13 is provided on the first fixture station 121. The surface of one side of the first adsorption fixture 13 is arranged opposite to the first fixture station 121 to ensure the position of the first adsorption fixture 13 relative to the turntable 12. A plurality of adsorption holes 13b are distributed at intervals on the side surface of the first adsorption fixture 13 facing away from the first fixture station 121. The adsorption holes 13b are used for the first adsorption fixture 13 to absorb air, so that the first adsorption fixture 13 can fix the external silicon wafer by negative pressure through the adsorption holes 13b during the air absorption process, ensuring that the external silicon wafer remains stable during the adsorption process.

[0066] The first adsorption fixture 13 has an air nozzle 131 on its side wall. The first adsorption fixture 13 has an internal flow channel that communicates with the adsorption holes 13b. The air nozzle 131 is connected to the internal flow channel and is used to connect to an external air source so that the gas output from the external air source can flow through the air nozzle 131 to the internal flow channel of the first adsorption fixture 13. This facilitates the distribution of the gas in the internal flow channel of the first adsorption fixture 13 to each adsorption hole 13b, enabling the first adsorption fixture 13 to respond quickly and achieve rapid adsorption and release of silicon wafers.

[0067] A rotating component 14 is provided between the turntable 12 and the first base 11. This rotating component 14 connects the turntable 12 and the first base 11. The rotating component 14 is connected to a power motor 15 and rotates under the drive of the power motor 15, causing the turntable 12 to rotate relative to the first base 11. This allows the turntable 12 to achieve automated rotation via the rotating component 14 and the power motor 15, ensuring the effective rotation of the turntable 12. Optionally, the rotating component 14 is a rotating shaft; the rotation cycle of the turntable 12 is 4 to 8 seconds per revolution.

[0068] In a second application embodiment, a laser film-forming device includes a silicon wafer laser film-forming component 100, which is part of the laser film-forming device.

[0069] Compared with the prior art, the beneficial effects of this utility model are:

[0070] This utility model provides a silicon wafer laser decoupling assembly 100 and a laser decoupling device. The turntable assembly 10 includes a first base 11, a turntable 12, and a first adsorption fixture 13. The turntable 12 is rotatably connected to the first base 11. The turntable 12 is provided with a plurality of first fixture stations 121, and the first adsorption fixture 13 is arranged relative to the corresponding first fixture station 121 and its position is adjusted as the turntable 12 rotates. The first adsorption fixture 13 can adsorb external silicon wafers under negative pressure. A camera assembly 30 is disposed on the outer periphery of the turntable assembly 10, and the camera assembly 30 is provided with... At least one camera 31 is provided for photographing the surface of an external silicon wafer; multiple laser heads 23 are disposed on the outer periphery of the turntable assembly 10 and at different positions on the turntable assembly 10; the multiple laser heads 23 are arranged sequentially along the outer periphery of the turntable assembly 10 and sequentially perform laser film opening on different positions on the surface of the external silicon wafer, so that the external silicon wafer adsorbed by the first adsorption fixture 13 can be continuously processed under the drive of the turntable 12, avoiding the external silicon wafer being moved by human intervention, and improving the processing efficiency of the silicon wafer laser film opening assembly 100 on the external silicon wafer.

[0071] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture. If the specific posture changes, the directional indicator will also change accordingly.

[0072] It should also be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or may be connected to an intermediary component. When a component is referred to as being "connected to" another component, it can be directly connected to the other component or indirectly connected to the other component through an intermediary component.

[0073] Furthermore, the use of terms such as "first" and "second" in this utility model is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. Additionally, the technical solutions of the various embodiments can be combined with each other, but only on the basis of being achievable by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, such a combination of technical solutions should be considered non-existent and not within the scope of protection claimed by this utility model.

[0074] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A silicon wafer laser die opening assembly, comprising: include: The turntable assembly includes a first base, a turntable, and a first suction fixture; The turntable is mounted on the first base and can rotate relative to the first base; The first adsorption fixture is disposed on the turntable, and the turntable rotates to move the first adsorption fixture in a circumferential direction; the first adsorption fixture can be used to adsorb or release external silicon wafers. Multiple laser heads are arranged at intervals. The first adsorption fixture moves along the circumferential direction to correspond one by one with the multiple laser heads. The laser heads can laser-open the outer silicon wafer adsorbed by the first adsorption fixture when corresponding to the first adsorption fixture. The camera assembly includes at least one camera. The first adsorption fixture moves in a circumferential direction to pass a position corresponding to the camera. The camera is capable of taking pictures of the external silicon wafer adsorbed by the first adsorption fixture when corresponding to the first adsorption fixture.

2. The laser die singulation assembly of claim 1, wherein, The silicon wafer laser film-opening assembly also includes a feeding assembly located on the outer periphery of the turntable; the feeding assembly is used to transport the external silicon wafer to the first adsorption fixture, and can also remove the external silicon wafer in the first adsorption fixture from the first adsorption fixture.

3. The laser die singulation assembly of claim 2, wherein, The feeding assembly includes a second base, a movable seat, a second suction fixture, and a third suction fixture; The second base is disposed on one side of the first base; The movable seat is movably connected to the second base. The second and third suction fixtures are both mounted on the movable seat and move relative to the second base together with the movable seat. The movement of the movable seat causes the second and third suction fixtures to alternately correspond to the same first suction fixture. The movement rhythm of the movable seat is 1-3 seconds per cycle.

4. The laser die singulation assembly of claim 3, wherein, The silicon wafer laser film-opening assembly also includes a conveyor line disposed on one side of the feeding assembly for receiving external silicon wafers released by the second adsorption fixture.

5. The laser die singulation assembly of claim 4, wherein, The movement of the first suction fixture along the circumferential direction also includes an alternating position, and the movement of the movable seat relative to the second base includes a first preset position and a second preset position; When the first adsorption fixture is located at the alternating position and the movable seat is located at the first preset position, the second adsorption fixture corresponds to the first adsorption fixture at the alternating position, so that the second adsorption fixture obtains the external silicon wafer from the corresponding first adsorption fixture, and the third adsorption fixture corresponds to the external conveying line for outputting the external silicon wafer, so that the third adsorption fixture obtains the external silicon wafer from the external conveying line. When the first adsorption fixture is located at the alternating position and the movable seat is located at the second preset position, the second adsorption fixture corresponds to the conveyor line, thereby causing the second adsorption fixture to release an external silicon wafer to the conveyor line. The third adsorption fixture corresponds to the first adsorption fixture at the alternating position, thereby causing the third adsorption fixture to release the external silicon wafer to the corresponding first adsorption fixture.

6. The laser die singulation assembly of claim 3, wherein, The feeding assembly further includes a linear motion module, which is located between the second base and the movable seat; the linear motion module has a fixed end and a movable end, the fixed end being connected to the second base and the movable end being connected to the movable seat; and / or Both the second and third suction fixtures include a support plate and a plurality of suction cups. The support plate is connected to the movable seat. The plurality of suction cups are connected to the same support plate and are distributed at intervals.

7. The laser die singulation assembly of claim 1, wherein, The camera assembly includes a first bracket, a first lifting base, a camera moving base, and a fill light; The first bracket is disposed on the outside of the first base; The first lifting seat is vertically connected to the first bracket and can move up and down in the vertical direction; The camera moving base is connected to the first lifting base and its position is adjusted as the first lifting base moves up and down; The camera is mounted on the camera moving base and can be adjusted in position along the length of the camera moving base; The fill light is located on the lower side of the camera and is used to illuminate the external silicon wafer.

8. The laser die singulation assembly of claim 1, wherein, The silicon wafer laser film-opening assembly also includes a second support and a laser module. The second bracket is disposed on the outside of the first base; the laser module is mounted on the second bracket and connected to the laser head; when the laser head corresponds to the first adsorption fixture, the laser head is positioned above the external silicon wafer adsorbed by the corresponding first adsorption fixture and performs laser film opening on the external silicon wafer.

9. The laser die singulation assembly of claim 1, wherein, The turntable is provided with at least one first fixture station. The first adsorption fixture is disposed on the first fixture station. One side surface of the first adsorption fixture is arranged opposite to the first fixture station. Multiple adsorption holes are distributed at intervals on the side surface of the first adsorption fixture facing away from the first fixture station. The adsorption holes are used for the first adsorption fixture to draw air. An air nozzle is provided on the side wall of the first adsorption fixture. An internal flow channel communicating with the adsorption holes is provided inside the first adsorption fixture. The air nozzle is connected to the internal flow channel. Alternatively, a rotating component is provided between the turntable and the first base, the rotating component connecting the turntable and the first base; the rotating component is connected to a power motor and rotates under the drive of the power motor, so that the turntable rotates relative to the first base; The turntable rotates at a rate of 4 to 8 seconds per revolution.

10. A laser film opening apparatus, characterized by, Includes the silicon wafer laser opening assembly as described in any one of claims 1 to 9.

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