A laser chip bonding fixture
By designing a laser chip welding fixture and adopting a pressing component and driving mechanism, the problems of time-consuming operation and uneven pressure during COS welding were solved, achieving a simple and efficient welding effect that can adapt to chip substrates with different inclinations.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- HANS TIANCHENG SEMICON
- Filing Date
- 2025-08-20
- Publication Date
- 2026-07-31
AI Technical Summary
In the existing technology, COS welding to the substrate is time-consuming and it is difficult to apply uniform pressure, resulting in low welding efficiency and difficulty in ensuring the fixation effect.
A laser chip bonding fixture was designed, including a pressing component, a driving mechanism, and a base. The pressing component fixes the pressing probe through multiple through holes. The lower surface of the pressing platform is stepped. Combined with the elastic and stretchable pressing probe and the driving mechanism, uniform pressure is applied.
It achieves uniform pressure application to COS, is easy to operate, provides more stable welding, adapts to chip substrates with different tilt angles, and improves welding efficiency and stability.
Smart Images
Figure CN224574987U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of lasers, and more specifically to a laser chip welding fixture. Background Technology
[0002] COS (Chip on Submount) is a semiconductor packaging technology that refers to the high-precision mounting of optoelectronic chips (such as laser diodes (LDs) and photodiodes (PDs)) or other micro-devices onto a dedicated substrate (submount, also known as a heat sink) for further integration into modules or systems. In the semiconductor laser field, COS is often used to package laser chips. In the semiconductor laser industry, COS needs to be soldered onto the substrate. During soldering, a soldering fixture is used to fix the COS, typically applying pressure above it to ensure it remains in a fixed position with the substrate for a period of time, allowing the solder between the COS and the substrate to cool and firmly bond them together. Chinese utility model patent ZL201910965005.0 uses a pressure block pressed onto the COS, positioned through square holes in the base. However, in practice, this is time-consuming, inefficient, and makes it difficult to ensure uniform pressure on the COS. Therefore, a laser chip soldering fixture that is easy to operate and applies uniform pressure to the COS is needed. Summary of the Invention
[0003] This invention provides a laser chip welding fixture that can apply uniform pressure to COS and is easy to operate.
[0004] The technical solution of this utility model is as follows: A laser chip bonding fixture includes: a pressing member, a driving mechanism, and a base; the pressing member includes a pressing platform with multiple through holes arranged parallel to its longitudinal axis, and multiple pressing probes passing through the through holes and fixed therethrough; the lower surface of the pressing platform is stepped; the pressing member is connected to the driving mechanism, the driving mechanism is fixed to the base, and the pressing member is driven by the driving mechanism to move in the vertical direction.
[0005] Optionally, the drive mechanism includes a support plate, a handle, a connecting rod, and a lifting rod; wherein the support plate is mounted on the base, the end of the handle is pivotally connected to the upper part of the support plate, the middle part of the handle is pivotally connected to one end of the connecting rod, and the other end of the connecting rod is pivotally connected to the upper end of the lifting rod; the lower end of the lifting rod is fixedly connected to the pressing member.
[0006] Optionally, the pressing member is further provided with two through holes on both sides; the support plate also includes a base plate, on which two guide rods are provided, the axis of the guide rods being parallel to the axis of the lifting rod, and the guide rods slidingly passing through the through holes.
[0007] Optionally, the perforations of the pressing platform are configured in two rows.
[0008] Optionally, the pressing probes are configured as a group of four, and each pressing probe passes through the baffle.
[0009] Optionally, the pressing probe is elastically retractable.
[0010] Optionally, a hexagonal bolt passes through the lower surface of the pressing table and spirals into the body of the lifting rod from the lower end of the lifting rod, thereby connecting and fixing the pressing table to the lifting rod.
[0011] Optionally, the height of the pressing platform from the base can be adjusted by adjusting the depth to which the hexagonal bolt spirals into the body of the lifting rod.
[0012] The beneficial effects of this invention are as follows: the laser chip welding fixture can apply uniform pressure to the COS and is easy to operate. The lower surface of its pressing platform is stepped, providing wider adaptability to stepped chip substrates; its pressing probe is elastic and retractable, resulting in more uniform force on the COS; and the COS can be pressed simply by operating the handle of the drive mechanism, thus making the welding more stable. Attached Figure Description
[0013] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0014] Figure 1 This is a schematic diagram of the structure of the laser chip welding fixture of this utility model; Figure 2 yes Figure 1 A magnified view of region A of the laser chip welding fixture; Figure 3A This is a schematic diagram of the stepped chip substrate structure; Figure 3B This is a top view of the stepped chip substrate; Figure 3C It is along Figure 3BA cross-sectional view of the stepped chip substrate taken from plane AA; Figure 4A This is a schematic diagram of the pressing table of the pressing component of this utility model; Figure 4B This is a schematic diagram showing the bottom structure of the pressing table of the pressing component of this utility model; Figure 5 This is a schematic diagram of a set of pressing probes according to this utility model.
[0015] Figure 6A This is a perspective view of the lifting rod and pressing platform of this utility model connected by hexagonal bolts.
[0016] Figure 6B This is a cross-sectional view of the lifting rod and the pressing table connected by hexagonal bolts according to this utility model. Figure 7 This is a perspective view of the connection between the hexagonal bolt and the lifting rod of this utility model.
[0017] Figure label: 1-Base; 2-Stepped chip base plate; 21-Stepped platform; 211-Chip mounting base; 3-Pressing component; 31-Pressing platform; 32-Through hole; 33-Pressing probe; 34-Through hole; 4-Drive mechanism; 41-Support plate; 411-Base plate; 412-Upright plate; 42-Handle; 43-Connecting rod; 44-Lifting rod; 441-Sleeve; 45-Guide rod; 5-COS; 51-Heat sink; 6-Baffle; 7-Hex bolt. Detailed Implementation
[0018] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this invention. Rather, they are merely examples of systems consistent with some aspects of this invention as detailed in the appended claims.
[0019] The description of illustrative embodiments based on the principles of this invention is read in conjunction with the accompanying drawings, which are considered an integral part of the entire written description. Any references to directions or orientations in the description of the embodiments of this invention disclosed herein are merely for ease of description and are not intended to limit the scope of the invention in any way. Relative terms such as “downward,” “upward,” “horizontal,” “vertical,” “above,” “below,” “up,” “top,” “bottom,” and their derivatives (e.g., “horizontally,” “downward,” “upward,” etc.) should be interpreted as referring to the orientation as described or shown in the drawings discussed. These relative terms are for ease of description only and do not require the device to be constructed or operated in a particular orientation unless explicitly stated otherwise.
[0020] Terms such as “attachment,” “addition,” “connection,” “coupling,” and “interconnection” refer to relationships in which structures are directly or indirectly fixed or attached to each other through an intermediate structure, and where both are movable or rigidly attached or related unless otherwise expressly stated. Furthermore, the features and benefits of this invention are illustrated with reference to exemplary embodiments. Therefore, this invention should not be explicitly limited to such exemplary embodiments, which illustrate some possible non-limiting combinations of features that may exist alone or in combination with other features; the scope of this invention is defined by the appended claims.
[0021] like Figure 1 As shown, the laser chip welding fixture of this utility model includes: a pressing member 3, a driving mechanism 4, and a base 1; the pressing member 3 includes a pressing platform 31, on which a plurality of through holes 32 are arranged parallel to its longitudinal axis, and a plurality of pressing probes 33 are fixed through the through holes 32; the lower surface of the pressing platform 31 is set in a stepped shape to adapt to the stepped chip substrate to be welded; the pressing member 3 is connected to the driving mechanism 4, the driving mechanism 4 is fixed to the base 1, and the pressing member 3 is driven by the driving mechanism 4 so that the pressing member 3 can move in the vertical direction.
[0022] like Figure 3A , Figure 3B and Figure 3CAs shown, the stepped chip base plate 2 is a commonly used base plate form for semiconductor laser COS modules. It adopts a stepped design, with one COS mounted on each step, resulting in a height difference between each COS, avoiding mutual interference and enabling high-power laser output. The stepped chip base plate 2 is placed on the base 1 and includes multiple stepped platforms 21. Each stepped platform 21 has chip mounting seats 211 arranged parallel to the longitudinal axis of the stepped chip base plate 2. In actual operation, the pressing member 3 is positioned above the stepped chip base plate 2; the pressing probe 33 corresponds vertically to the chip mounting seats 211. When the pressing member 3 is driven vertically up and down by the driving mechanism 4, the pressing probe 33 can extend downwards to the chip mounting seat 211 and can be lifted upwards from the chip mounting seat 211.
[0023] Figure 1 and Figure 2 This illustration shows a scenario where the laser chip bonding fixture of this invention is used to bond COS5 chips onto a stepped chip substrate. Each chip mounting base 211 of the stepped chip substrate 2 is equipped with a COS5 chip. The COS5 chips are mounted on the chip mounting base 211 of the stepped chip substrate 2 using solder (such as solder) disposed between the COS5 chip and the chip mounting base 211. Since each chip in a high-power laser emits light, if multiple COS5 chips are placed on a horizontal plane, the light emitted by the multiple COS5 chips will interfere with each other. This invention mounts multiple COS5 chips on the stepped chip substrate 2, with each COS5 chip having a height difference, thus preventing the light emitted by each COS5 chip from interfering with each other. During installation, the solder between the base plate 2 and COS5 is melted by high temperature, and COS5 is installed onto the stepped chip base plate 2. After confirming the position of COS5, the stepped chip base plate 2 with COS5 installed is moved to the base 1 of the soldering fixture and placed at the upper limit of the base 1. The pressing probe 33 of the soldering fixture is aligned with the heat sinks on both sides of COS5. The handle 42 of the soldering fixture is pressed down and tightened. The soldering fixture and the stepped chip base plate 2 are moved to the heat sink to cool, so that COS5 and the stepped chip base plate are tightly soldered together.
[0024] In a preferred embodiment, such as Figure 1 , Figure 4A and Figure 4B As shown, the pressing platform 31 has two rows of through holes 32 located at its front end. Two through holes 34 are provided on both sides of the rear end of the pressing platform 31 for the guide rod 45 (described in detail later) to pass through.
[0025] like Figure 5As shown, the pressing probes 33 are arranged in a group of four (two rows, two probes per row), all passing through the baffle 6; the position of a group of pressing probes 33 corresponds to the position of a chip mounting base 211. The baffle 6 has four through holes for the pressing probes 33 to pass through, and the four pressing probes 33 are fixed together to form a group by interference fit. When the pressing probes 33 are installed on the pressing platform 31, the pressing probes 33 pass through the lower surface of the pressing platform 31 (e.g., ...). Figure 4B As shown, the plate 6 is inserted upwards into the perforation 32. After installation, the baffle 6 is located below the pressing table 31.
[0026] When the pressing member 3 presses the stepped chip base plate 2, each set of pressing probes 33 presses onto the heat sink 51 on the corresponding COS5. The pressing probes 33 are elastic and retractable. When the tip of the pressing probe 33 presses onto the heat sink 51, there will be a certain pressure. When the pressure is too great and exceeds the preset elastic force of the spring inside the pressing probe 33, the pressing probe 33 will retract. This can apply more appropriate pressure to avoid excessive pressure and ensure that all the pressing probes 33 fixed on the pressing member 3 can contact and press onto the corresponding heat sink 51 of the COS5, so that the force on the heat sink 51 is more uniform.
[0027] Preferably, such as Figure 4B As shown, the lower surface of the pressing platform 31 is stepped, and the inclination of the steps is consistent with the inclination of the stepped platform of the stepped chip substrate 2. The parts of the lower surface of the pressing platform 31 corresponding to the multiple stepped platforms 21 of the stepped chip substrate 2 are also stepped. The stepped design of the lower surface of the pressing platform 31 allows the pressing member 3 to have wider adaptability to the stepped chip substrate 2. For example, when changing to stepped chip substrates 2 with different inclinations, it is easier to adjust the positional relationship of the pressing probe 33 on the pressing platform 31 to adapt to the stepped gradient of the stepped chip substrate 2.
[0028] like Figure 1 As shown, the drive mechanism 4 includes a support plate 41, a handle 42, a connecting rod 43, and a lifting rod 44. The support plate 41 includes a horizontal base plate 411 and a vertical upright plate 412. The base plate 411 is mounted on the base 1. The end of the handle 42 is pivotally connected to the upper part of the upright plate 412 of the support plate 41, and the middle part of the handle 42 is pivotally connected to one end of the connecting rod 43. The other end of the connecting rod 43 is pivotally connected to the upper end of the lifting rod 44. The lower end of the lifting rod 44 is fixedly connected to the middle of the rear end of the pressing member 3. The lifting rod 44 is limited by a sleeve 441 located outside it, allowing it to move only up and down. The sleeve 441 is fixed to the upright plate 412 of the support plate 41. When the handle 42 is moved up or down, it drives the connecting rod 43 to rotate upwards and outwards or downwards and inwards. The connecting rod 31 then drives the lifting rod 44 to move up and down, thereby controlling the up and down movement of the pressing member 3. Two guide rods 45 (e.g., ...) are provided on the base plate 411 of the support plate 41. Figure 1As shown, the axis of the guide rod 45 is parallel to the axis of the lifting rod 44, and the guide rod 45 slides through the through holes 34 on both sides of the pressing member 3. The guide rod 45 plays a stabilizing and guiding role during the lifting and lowering process of the pressing member 3.
[0029] When using the laser chip bonding fixture of this invention, pressing the handle 42 downwards causes the connecting rod 43 to rotate downwards and inwards. The connecting rod 31 then moves the lifting rod 44 downwards, causing the pressing platform 31 to move downwards and approach the stepped chip substrate 2 until the pressing probe 33 on the pressing platform 31 presses against the heat sink 51 of the corresponding COS5 and applies a certain pressure. After pressing, lifting the handle 42 upwards causes the connecting rod 43 to rotate upwards and outwards, which in turn moves the lifting rod 44 upwards, causing the pressing probe 33 on the pressing platform 31 to lift upwards from the chip mounting base 211 of the stepped chip substrate 2. This laser chip bonding fixture of this invention can apply uniform pressure to the COS and is easy to operate.
[0030] See Figure 6A According to one embodiment of this application, a hexagonal bolt 7 passes through the lower surface of the pressing table 31 and spirals into the body of the lifting rod 44 from the lower end of the lifting rod 44, thereby connecting and fixing the pressing table 31 to the lifting rod 44. The height to which the pressing table 31 can be lowered from the base 1 is adjusted by adjusting the depth to which the hexagonal bolt 7 spirals into the body of the lifting rod 44. That is, when the hexagonal bolt 7 is fully inserted into the body of the lifting rod 44, the height to which the pressing table 31 can be lowered from the base 1 is at its maximum value; as the hexagonal bolt 7 gradually withdraws from the body of the lifting rod 44, the height to which the pressing member 31 can be lowered from the base 1 gradually decreases. It can be understood that in this way, the height to which the pressing probe 33 can descend can be adjusted, thereby adjusting the pressure of the pressing probe 33 on the COS5.
[0031] According to one embodiment of the present invention, the driving mechanism 4 may include a support plate 41 and a cylinder. The cylinder is connected to the support plate 41 and the lifting rod 44, thereby driving the pressing member 3 to rise and fall, achieving uniform pressing of the COS5. Those skilled in the art should also understand that the driving mechanism 4 may also employ a hydraulic cylinder or an electric motor to automatically control the rising and falling of the pressing member 3.
[0032] The above-described embodiments are merely specific implementations of this utility model, used to illustrate the technical solutions of this utility model, and not to limit it. The protection scope of this utility model is not limited thereto. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the technical scope disclosed in this utility model. These modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model, and should all be covered within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.
Claims
1. A laser chip soldering fixture, characterized by, It includes: a pressing component, a driving mechanism, and a base; the pressing component includes a pressing platform, on which multiple through holes are arranged parallel to its longitudinal axis, and multiple pressing probes pass through the through holes and are fixed; the lower surface of the pressing platform is set in a stepped shape; the pressing component is connected to the driving mechanism, the driving mechanism is fixed to the base, and the pressing component is driven by the driving mechanism so that the pressing component can move in the vertical direction.
2. The laser chip solder fixture of claim 1, wherein, The drive mechanism includes a support plate, a handle, a connecting rod, and a lifting rod; wherein the support plate is mounted on the base, the end of the handle is pivotally connected to the upper part of the support plate, the middle part of the handle is pivotally connected to one end of the connecting rod, and the other end of the connecting rod is pivotally connected to the upper end of the lifting rod; the lower end of the lifting rod is fixedly connected to the pressing member.
3. The laser chip solder fixture of claim 1, wherein, The pressing component is provided with two through holes on both sides; the support plate also includes a base plate, on which two guide rods are provided. The axis of the guide rods is parallel to the axis of the lifting rod, and the guide rods slide through the through holes.
4. The laser chip solder fixture of claim 1, wherein, The pressing platform has two rows of perforations.
5. The laser chip soldering fixture of claim 4, wherein, The pressing probes are set to a group of four, and each pressing probe passes through the baffle.
6. The laser chip solder fixture of claim 1, wherein, The pressing probe is elastic and retractable.
7. The laser chip bonding fixture according to claim 2, characterized in that, A hexagonal bolt passes through the lower surface of the pressing table and spirals into the body of the lifting rod from the lower end, thereby connecting and fixing the pressing table to the lifting rod.
8. The laser chip soldering fixture of claim 7, wherein: The height of the pressing platform from the base can be adjusted by adjusting the depth to which the hexagonal bolt spirals into the body of the lifting rod.