A diamond surface polishing apparatus

By designing a diamond surface polishing device with multiple mold limiting and polishing modules, the problem of low efficiency of individual polishing in the existing technology is solved, realizing automated polishing and force control of multiple diamonds, and improving equipment efficiency and safety.

CN224575362UActive Publication Date: 2026-07-31XINYANG DELONG SUPERHARD MATERIAL CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
XINYANG DELONG SUPERHARD MATERIAL CO LTD
Filing Date
2025-05-29
Publication Date
2026-07-31

AI Technical Summary

Technical Problem

Existing diamond polishing equipment can only polish one product at a time, and requires manual fixing and spraying of polishing liquid, resulting in low polishing efficiency.

Method used

A diamond surface polishing device was designed, which includes multiple mold limiting modules and a polishing module. Multiple diamonds are quickly clamped using a cylinder and a cylinder piston rod, and polishing liquid is automatically sprayed through a spraying module. The polishing force is controlled by a pressure sensor.

Benefits of technology

It enables simultaneous polishing of multiple diamonds, improving polishing efficiency, and reduces manual intervention through automated operation, preventing damage to the product due to excessive polishing force.

✦ Generated by Eureka AI based on patent content.

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Abstract

This utility model relates to the field of diamond technology, and particularly to a diamond surface polishing device, including a polishing support, a plurality of mold limiting modules on the polishing support, and a polishing module adapted to the mold limiting modules above the mold limiting modules. Each limiting module includes a first limiting plate and a second limiting plate symmetrically arranged with respect to the first limiting plate. A plurality of sliding limiting rods are provided between the first and second limiting plates, and a first limiting groove and a second limiting groove adapted to the first limiting groove are slidably limited on the sliding limiting rods. This utility model's diamond surface polishing device can quickly realize the limiting, clamping, and polishing operations of multiple diamonds.
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Description

Technical Field

[0001] This utility model relates to the field of diamond technology, and in particular to a diamond surface polishing device. Background Technology

[0002] Due to its unique physical and chemical properties, diamond has a wide range of applications in various fields, such as cutting and machining, medical scalpels, and semiconductor materials. After diamonds are manufactured, they need to be polished to improve surface quality and performance. However, existing diamond polishing equipment can only polish one product at a time, and during polishing, the diamond needs to be manually fixed in a fixture and polishing fluid sprayed on, which reduces the polishing efficiency of the equipment. Utility Model Content

[0003] The purpose of this invention is to provide a diamond surface polishing device that can quickly achieve the limiting clamping and polishing operation of multiple diamonds.

[0004] To achieve the above objectives, the technical solution of this utility model is as follows:

[0005] A diamond surface polishing device includes a polishing bracket, a plurality of mold limiting modules are provided on the polishing bracket, and a polishing module adapted to the mold limiting modules is provided above the mold limiting modules.

[0006] The limiting module includes a first limiting plate and a second limiting plate symmetrically arranged with respect to the first limiting plate. A plurality of sliding limiting rods are provided between the first limiting plate and the second limiting plate. A first limiting groove and a second limiting groove adapted to the first limiting groove are slidably limited on the sliding limiting rods.

[0007] A first limiting cylinder is horizontally provided on the first limiting plate, and the piston rod of the first limiting cylinder is fixedly connected to the first limiting groove. A second limiting cylinder is horizontally provided on the second limiting plate, and the piston rod of the second limiting cylinder is fixedly connected to the second limiting groove.

[0008] As an improvement, several heat dissipation holes are provided at the bottom of both the first and second limiting grooves.

[0009] As an improvement, a liquid receiving groove is provided on the polishing bracket, and a liquid outlet pipe is provided at the bottom of the liquid receiving groove.

[0010] As an improvement: a polishing liquid spraying module is provided on the side of the mold limiting module. The polishing liquid spraying module includes a spraying delivery pipe. A rotary joint is connected to the output end of the spraying delivery pipe. The rotary joint is fixed to the bottom of the liquid receiving tank. A spraying pipe is connected to the rotary joint. A spraying head is installed at the output end of the spraying pipe.

[0011] As an improvement: a rotating motor is provided vertically upward at the bottom of the polishing bracket, a drive shaft is connected to the rotor of the rotating motor, a drive gear is fixed on the drive shaft, and a driven gear that meshes with the drive gear is fixed on the spraying pipe.

[0012] As an improvement: the polishing module includes a polishing motor, which is fixed vertically downward on the support plate, and the two ends of the support plate are respectively slidably locked in the first limiting bracket and the second limiting bracket; the first limiting bracket and the second limiting bracket are fixed vertically upward on the polishing bracket;

[0013] A first adjusting cylinder is provided vertically upward at the bottom of the polishing bracket opposite to the first limiting bracket, and a second adjusting cylinder is provided vertically upward at the bottom of the polishing bracket opposite to the second limiting bracket. The piston rod of the first adjusting cylinder is fixedly connected to the left end of the support plate, and the piston rod of the second adjusting cylinder is fixedly connected to the right end of the support plate.

[0014] A polishing rod is fixed on the rotor of the polishing motor. The polishing rod is rotatably limited within a sleeve. A polishing disc is fixed at the bottom end of the polishing rod, and a pressure sensor is provided at the junction of the bottom end of the polishing rod and the polishing disc.

[0015] In summary, this utility model has the following beneficial effects:

[0016] 1. This utility model has multiple mold limiting modules and a polishing module adapted to the mold limiting modules. The mold limiting modules can quickly realize the clamping operation of diamonds. The mold limiting modules and the mold limiting modules work together to realize the polishing operation of multiple diamond products, thereby improving the polishing efficiency of the equipment.

[0017] 2. A pressure sensor is installed at the bottom of the polishing rod where it connects with the polishing disc. The pressure sensor can sense the pressure between the polishing disc and the diamond during polishing, preventing excessive polishing force from damaging the product. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this utility model, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below.

[0019] Figure 1 A schematic diagram of the overall structure of a diamond surface polishing device;

[0020] Figure 2 A front view of a diamond surface polishing device;

[0021] Figure 3This is a schematic cross-sectional view of a diamond surface polishing device.

[0022] The components include: 1. Polishing bracket; 2. First limiting plate; 3. Second limiting plate; 4. Sliding limiting rod; 5. First limiting groove; 6. Second limiting groove; 7. First limiting cylinder; 8. Second limiting cylinder; 9. Heat dissipation hole; 10. Liquid receiving tank; 11. Liquid outlet pipe; 12. Spraying conveying pipe; 13. Rotary joint; 14. Spraying pipe; 15. Spraying head; 16. Rotary motor; 17. Drive shaft; 18. Drive gear; 19. Driven gear; 20. Electric valve; 21. Polishing motor; 22. Supporting cross plate; 23. First limiting bracket; 24. Second limiting bracket; 25. First adjusting cylinder; 26. Second adjusting cylinder; 27. Polishing rod; 28. Sleeve; 29. ​​Polishing disc; 30. Pressure sensor. Detailed Implementation

[0023] The present invention will now be described in further detail with reference to the accompanying drawings.

[0024] Please refer to Figures 1-3 A diamond surface polishing device includes a polishing bracket 1, a plurality of mold limiting modules are provided on the polishing bracket 1, and a polishing module adapted to the mold limiting modules is provided above the mold limiting modules.

[0025] The limiting module includes a first limiting plate 2 and a second limiting plate 3 symmetrically arranged with the first limiting plate 2. A plurality of sliding limiting rods 4 are provided between the first limiting plate 2 and the second limiting plate 3. A first limiting groove 5 and a second limiting groove 6 adapted to the first limiting groove 5 are slidably limited on the sliding limiting rods 4.

[0026] A first limiting cylinder 7 is horizontally provided on the first limiting plate 2, and the piston rod of the first limiting cylinder 7 is fixedly connected to the first limiting groove 5. A second limiting cylinder 8 is horizontally provided on the second limiting plate 3, and the piston rod of the second limiting cylinder 8 is fixedly connected to the second limiting groove 6.

[0027] In this embodiment, the present invention includes multiple mold limiting modules and a polishing module adapted to the mold limiting modules. The mold limiting modules can quickly perform the clamping operation of diamonds. The mold limiting modules and the polishing module work together to perform polishing operations on multiple diamond products, thereby improving the polishing efficiency of the equipment. Furthermore, in this embodiment, pressure sensors are provided at the joints of the piston rod of the first limiting cylinder 7 and the first limiting groove 5, and at the joints of the piston rod of the second limiting cylinder 8 and the second limiting groove 6, to detect the clamping pressure and ensure that the diamonds are clamped tightly.

[0028] Several heat dissipation holes 9 are provided at the bottom of both the first limiting groove 5 and the second limiting groove 6. In this embodiment, the heat dissipation holes 9 can improve the heat dissipation effect.

[0029] A liquid-receiving tank 10 is provided on the polishing support 1, and a liquid outlet pipe 11 is provided at the bottom of the liquid-receiving tank 10. In this embodiment, excess polishing liquid will flow into the liquid-receiving tank 10 for collection.

[0030] A polishing slurry spraying module is provided on the side of the mold limiting module. The polishing slurry spraying module includes a spraying delivery pipe 12. A rotary joint 13 is connected to the output end of the spraying delivery pipe 12. The rotary joint 13 is fixed to the bottom of the liquid receiving tank 10. A spraying pipe 14 is connected to the rotary joint 13. A spraying head 15 is installed at the output end of the spraying pipe 14. A rotary motor 16 is vertically upward at the bottom of the polishing bracket 1. A drive shaft 17 is connected to the rotor of the rotary motor 16. A drive gear 18 is fixed on the drive shaft 17. A driven gear 19 that meshes with the drive gear 18 is fixed on the spraying pipe 14. In this embodiment, the rotary motor 16 can drive the spraying pipe 14 to rotate, so as not to hinder the movement of the polishing disc 29. Before polishing, the spraying head 15 can be moved above the diamond by rotation to facilitate the spraying of polishing slurry. At the same time, an electric valve 20 is provided on the spraying pipe 14, which automatically closes after spraying is completed.

[0031] The polishing module includes a polishing motor 21, which is vertically fixed downward on a supporting horizontal plate 22. The two ends of the supporting horizontal plate 22 are slidably engaged in a first limiting bracket 23 and a second limiting bracket 24, respectively. The first limiting bracket 23 and the second limiting bracket 24 are vertically fixed upward on a polishing bracket 1. A first adjusting cylinder 25 is vertically upward at the bottom of the polishing bracket 1, opposite to the first limiting bracket 23. A second adjusting cylinder 26 is vertically upward at the bottom of the polishing bracket 1, opposite to the second limiting bracket 24. The piston rod of the first adjusting cylinder 25 is fixedly connected to the left end of the supporting plate, and the piston rod of the second adjusting cylinder 26 is fixedly connected to the right end of the supporting plate. A polishing rod 27 is fixed on the rotor of the polishing motor 21. The polishing rod 27 is rotatably limited within a sleeve 28. A polishing disc 29 is fixed at the bottom end of the polishing rod 27, and a pressure sensor 30 is provided at the junction of the bottom end of the polishing rod 27 and the polishing disc 29. In this embodiment, a pressure sensor 30 is provided at the junction of the bottom end of the polishing rod 27 and the polishing disc 29. The pressure sensor 30 can sense the pressure between the polishing disc 29 and the diamond during polishing, preventing excessive polishing force from damaging the product.

[0032] Working principle: Several diamond products are placed into the corresponding first limiting groove 5 and second limiting groove 6 respectively. The first limiting cylinder 7 and the second limiting cylinder 8 are activated to shorten the distance between the first limiting groove 5 and the second limiting groove 6, thereby clamping the diamond products.

[0033] After clamping, open the electric valve 20 to spray a certain amount of polishing liquid onto the diamond surface. After spraying, start the rotating motor 16 to rotate the spraying pipe 14 at a certain angle so as not to hinder the movement of the polishing disc 29.

[0034] Then, the first adjusting cylinder 25 and the second adjusting cylinder 26 are activated to drive the support plate 22 to move downward, so that the polishing disc 29 is applied to the diamond surface. The pressure sensor 30 senses the pressure between the polishing disc 29 and the diamond to prevent excessive pressure. At the same time, the polishing motor 21 is activated to drive the polishing disc 29 to rotate, so as to realize the polishing operation on the diamond surface.

[0035] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.

Claims

1. A diamond surface polishing apparatus, characterized by, It includes a polishing bracket, on which a plurality of mold limiting modules are provided, and above the mold limiting modules is a polishing module adapted to the mold limiting modules; The limiting module includes a first limiting plate and a second limiting plate symmetrically arranged with respect to the first limiting plate. A plurality of sliding limiting rods are provided between the first limiting plate and the second limiting plate. A first limiting groove and a second limiting groove adapted to the first limiting groove are slidably limited on the sliding limiting rods. A first limiting cylinder is horizontally provided on the first limiting plate, and the piston rod of the first limiting cylinder is fixedly connected to the first limiting groove. A second limiting cylinder is horizontally provided on the second limiting plate, and the piston rod of the second limiting cylinder is fixedly connected to the second limiting groove.

2. The diamond surface polishing apparatus of claim 1, wherein, Several heat dissipation holes are provided at the bottom of both the first limiting groove and the second limiting groove.

3. The diamond surface polishing apparatus of claim 1, wherein, A liquid-receiving tank is provided on the polishing bracket, and a liquid outlet pipe is provided at the bottom of the liquid-receiving tank.

4. The diamond surface polishing apparatus of claim 3, wherein, A polishing liquid spraying module is provided on the side of the mold limiting module. The polishing liquid spraying module includes a spraying delivery pipe. A rotary joint is connected to the output end of the spraying delivery pipe. The rotary joint is fixed to the bottom of the liquid receiving tank. A spraying pipe is connected to the rotary joint. A spraying head is installed at the output end of the spraying pipe.

5. The diamond surface polishing apparatus of claim 4, wherein, A rotating motor is vertically mounted at the bottom of the polishing bracket. A drive shaft is connected to the rotor of the rotating motor. A drive gear is fixed on the drive shaft. A driven gear that meshes with the drive gear is fixed on the spraying pipe.

6. The diamond surface polishing apparatus of claim 1, wherein, The polishing module includes a polishing motor, which is fixed vertically downward on a support plate. The two ends of the support plate are slidably engaged in a first limiting bracket and a second limiting bracket, respectively. The first limiting bracket and the second limiting bracket are fixed vertically upward on the polishing bracket. A first adjusting cylinder is provided vertically upward at the bottom of the polishing bracket opposite to the first limiting bracket, and a second adjusting cylinder is provided vertically upward at the bottom of the polishing bracket opposite to the second limiting bracket. The piston rod of the first adjusting cylinder is fixedly connected to the left end of the support plate, and the piston rod of the second adjusting cylinder is fixedly connected to the right end of the support plate. A polishing rod is fixed on the rotor of the polishing motor. The polishing rod is rotatably limited within a sleeve. A polishing disc is fixed at the bottom end of the polishing rod, and a pressure sensor is provided at the junction of the bottom end of the polishing rod and the polishing disc.