Wafer cleaning apparatus and polishing apparatus

Abstract

This utility model discloses a wafer cleaning device and a polishing device. The wafer cleaning device includes: a carrier tray with a wafer carrying area, and a cleaning nozzle on at least one side of the carrier tray corresponding to the wafer carrying area in the vertical direction; and multiple wafer positioning components disposed on the carrier tray, spaced circumferentially around the edge of the wafer carrying area. Each wafer positioning component includes a rotating shaft and a positioning post. The rotating shaft is disposed on the carrier tray and passes through the positioning post. The centerline of the positioning post and the centerline of the rotating shaft are radially spaced apart. The positioning post is rotatable relative to the rotating shaft to drive the wafer to move. Thus, by radially spaced between the centerlines of the positioning post and the centerlines of the rotating shaft, when the positioning post rotates relative to the rotating shaft, the positioning post can drive the wafer to move. This allows adjustment of the wafer's position within the wafer carrying area when the wafer deviates from a preset position, ensuring the wafer is in the preset position.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer cleaning device and polishing equipment. Background Technology

[0002] In the chemical mechanical polishing (CMP) process, the cleaning of the wafer affects the quality of the wafer; therefore, wafer cleaning is of paramount importance.

[0003] In related technologies, after the robotic arm places the wafer on the cleaning platform, due to unavoidable errors, the wafer will shift relative to the preset position. This will result in blind spots in the cleaning nozzle's cleaning of the wafer, poor cleaning effect, and a greater risk of crystallization on the wafer. Utility Model Content

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a wafer cleaning device that can adjust the position of the wafer so that it is cleaned only after being in a preset position, thereby improving the cleaning effect of the wafer cleaning device.

[0005] This utility model further proposes a polishing device.

[0006] The wafer cleaning device according to this utility model includes: a carrier tray with a wafer carrying area, and a cleaning nozzle disposed on at least one side of the carrier tray corresponding to the wafer carrying area in the vertical direction; and a wafer positioning component, which is disposed on the carrier tray and there are multiple wafer positioning components, which are circumferentially spaced at the edge of the wafer carrying area. Each wafer positioning component includes a rotating shaft and a positioning post. The rotating shaft is disposed on the carrier tray and passes through the positioning post. The center line of the positioning post and the center line of the rotating shaft are radially spaced apart. The positioning post is rotatable relative to the rotating shaft to drive the wafer to move.

[0007] Therefore, by spacing the center line of the positioning post and the center line of the rotating shaft radially, the positioning post can drive the wafer to move when it rotates relative to the rotating shaft. When the wafer deviates from the preset position, the position of the wafer in the wafer bearing area can be adjusted so that the wafer is in the preset position.

[0008] In some examples of this invention, the center line of the rotating shaft is located on the side of the center line of the positioning post that is radially closer to the wafer bearing area.

[0009] In some examples of this utility model, the carrier disk is provided with a carrier boss, the carrier boss protrudes upward relative to the surface of the carrier disk, the upper side of the carrier disk is provided with a carrier surface, the carrier surface is suitable for carrying a wafer, and the wafer positioning member is provided on the upper side of the carrier disk.

[0010] In some examples of this utility model, the wafer cleaning device further includes a mounting plate, and the carrier plate is disposed on the upper side of the mounting plate and connected to the mounting plate by a lifting adjustment component. There are multiple lifting adjustment components, which are spaced apart between the mounting plate and the carrier plate. The multiple lifting adjustment components can selectively and independently lift and lower to adjust the angle of the carrier plate.

[0011] In some examples of this utility model, the lifting adjustment assembly includes an adjusting bolt and a connecting column. At least one end of the adjusting bolt in the vertical direction is provided with an external thread, and the connecting column is provided with an internal thread. The connecting column is connected to the adjusting bolt, and the external thread and the internal thread are rotatably threaded together. The connecting column is connected to the mounting plate or the bearing plate.

[0012] In some examples of this utility model, there are two connecting columns, namely an upper connecting column and a lower connecting column. Both ends of the adjusting bolt in the vertical direction are provided with external threads. The upper connecting column is located at the upper end of the adjusting bolt and is rotatably threaded with the external thread of the adjusting bolt. The lower connecting column is located at the lower end of the adjusting bolt and is rotatably threaded with the external thread of the adjusting bolt. The upper connecting column is connected to the bearing plate, and the lower connecting column is connected to the mounting plate.

[0013] In some examples of this utility model, the threaded engagement direction of the upper connecting column and the adjusting bolt is opposite to that of the threaded engagement direction of the lower connecting column and the adjusting bolt.

[0014] In some examples of this utility model, the adjusting bolt includes an adjusting part, and the external threads at the upper end and the lower end of the adjusting bolt are respectively located on the upper and lower sides of the adjusting part, and the adjusting part is polygonal.

[0015] In some examples of this utility model, a horizontal detection sensor is also provided on the carrier disk. There are multiple horizontal detection sensors, and the multiple horizontal detection sensors are arranged circumferentially at intervals on the outer side of the edge of the wafer carrier area.

[0016] The polishing equipment according to this utility model includes: the wafer cleaning device described above.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of a wafer cleaning device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a wafer cleaning device and a wafer according to an embodiment of the present utility model; Figure 3 This is a partial schematic diagram of a wafer cleaning device according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a wafer positioning component according to an embodiment of the present utility model; Figure 5 This is a cross-sectional view of a wafer positioning component according to an embodiment of the present utility model; Figure 6 This is a schematic diagram of a lifting and adjusting assembly according to an embodiment of the present utility model.

[0019] Figure label: 100. Wafer cleaning equipment; 10. Carrier tray; 11. Wafer carrier area; 12. Cleaning nozzle; 121. Lower cleaning nozzle; 122. Upper cleaning nozzle; 13. Carrier boss; 131. Carrier surface; 14. Horizontal detection sensor; 20. Wafer positioning component; 21. Spindle; 211. Centerline of the spindle; 22. Positioning post; 221. Centerline of the positioning post; 30. Mounting plate; 31. Lifting and adjusting assembly; 32. Adjusting bolt; 33. Upper connecting column; 34. Lower connecting column; 35. Adjusting part; 40. Wafer. Detailed Implementation

[0020] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0021] The following is for reference. Figures 1-6 The present invention describes a wafer cleaning apparatus 100 according to an embodiment of the present invention, which can be applied to polishing equipment.

[0022] Combination Figures 1-6As shown, the wafer cleaning device 100 according to this utility model mainly includes: a carrier disk 10 and a wafer positioning component 20. The carrier disk 10 is provided with a wafer carrying area 11. At least one side of the carrier disk 10 corresponding to the wafer carrying area 11 in the vertical direction is provided with a cleaning nozzle 12. Multiple wafer positioning components 20 are provided on the carrier disk 10 and are circumferentially spaced at the edge of the wafer carrying area 11. Each wafer positioning component 20 includes a rotating shaft 21 and a positioning post 22. The rotating shaft 21 is provided on the carrier disk 10 and passes through the positioning post 22. The positioning post 22 is rotatable relative to the rotating shaft 21. The center line 221 of the positioning post and the center line 211 of the rotating shaft are radially spaced from each other. The positioning post 22 is rotatable relative to the rotating shaft 21 to drive the wafer 40 to move.

[0023] Specifically, by setting a wafer carrying area 11 on the carrier tray 10, the polished wafer 40 can be transported from the polishing device to the wafer carrying area 11 by the wafer transport device. By setting a cleaning nozzle 12 on at least one side of the carrier tray 10 corresponding to the wafer carrying area 11 in the vertical direction, the cleaning nozzle 12 can clean at least one side of the wafer 40 in the vertical direction, clean the chemical liquid on the surface of the wafer 40, prevent the surface of the wafer 40 from crystallizing, and affect the quality of the wafer 40.

[0024] Furthermore, by providing multiple wafer positioning elements 20 on the carrier disk 10 and circumferentially spacing the multiple wafer positioning elements 20 at the edge of the wafer carrier region 11, the wafer positioning elements 20 can position the wafer 40, thereby making the wafer 40 stably located in the wafer carrier region 11.

[0025] It should be noted that, in order to ensure the smooth placement of the wafer 40 in the wafer carrying area 11 by the wafer handling device, the wafer positioning component 20 and the wafer 40 cannot be positioned too tightly. Otherwise, it would cause jamming or even damage to the wafer 40 during the placement process in the wafer carrying area 11. Therefore, during the placement of the wafer 40 in the wafer carrying area 11, the wafer positioning component 20 can only play a preliminary positioning role for the wafer 40.

[0026] In this case, the wafer 40 may have a small deviation from the preset position in the wafer carrying area 11, which will result in blind spots in the cleaning of the wafer 40 by the cleaning nozzle 12, thereby affecting the cleaning effect of the wafer cleaning device 100 on the wafer 40.

[0027] Therefore, after placing the wafer 40 in the wafer carrying area 11, the wafer 40 can be moved by the rotation of the positioning post 22 relative to the rotating shaft 21, thereby adjusting the position of the wafer 40 in the wafer carrying area 11 so that the wafer 40 is in the correct preset position, and thus the wafer 40 can be cleaned by the cleaning nozzle 12 in the subsequent cleaning process, which can improve the quality and yield of the wafer 40.

[0028] In some embodiments of this utility model, the position of the wafer 40 can also be defined by rotating the positioning post 22 in advance. After the wafer 40 is positioned and engaged with the wafer positioning member 20, the wafer 40 can be directly placed in the correct preset position.

[0029] It should be noted that there are multiple wafer positioning components 20, which are circumferentially spaced at the edge of the wafer carrying area 11. The positioning posts 22 in the multiple wafer positioning components 20 can rotate independently, so that when the wafer 40 shifts from different angles relative to the preset position, the positioning posts 22 in the corresponding wafer positioning components 20 can be rotated and adjusted accordingly.

[0030] In some embodiments of this utility model, the cleaning nozzle 12 includes an upper cleaning nozzle 122 and a lower cleaning nozzle 121. The lower cleaning nozzle 121 is directly disposed on the carrier plate 10 and located on the lower side of the wafer carrier area 11. The upper cleaning nozzle 122 is disposed on the upper side of the wafer carrier area 11 at intervals through a bracket. In this way, the upper cleaning nozzle 122 and the lower cleaning nozzle 121 can be disposed opposite to the upper and lower sides of the wafer 40, respectively, so that the upper and lower sides of the wafer 40 can be cleaned.

[0031] Therefore, by spacing the center line 221 of the positioning post and the center line 211 of the rotating shaft in the radial direction, when the positioning post 22 rotates relative to the rotating shaft 21, the positioning post 22 can drive the wafer 40 to move. When the wafer 40 deviates from the preset position, the position of the wafer 40 in the wafer carrying area 11 can be adjusted so that the wafer 40 is in the preset position.

[0032] In some embodiments of this invention, the center line 211 of the rotating shaft is located on the side of the center line 221 of the positioning post that is radially closer to the wafer support area 11.

[0033] Combination Figures 1-6 As shown, a support boss 13 is provided on the support disk 10. The support boss 13 protrudes upward relative to the surface of the support disk 10. A support surface 131 is provided on the upper side of the support disk 10. The support surface 131 is suitable for supporting the wafer 40. The wafer positioning member 20 is provided on the upper side of the support disk 10.

[0034] Specifically, by setting the support boss 13 on the support disk 10 and making the support boss 13 protrude upward relative to the surface of the support disk 10, and the support surface 131 is provided on the upper side of the support disk 10, when the wafer 40 is placed in the wafer support area 11, the wafer 40 is placed on the support surface 131, so that the wafer 40 and the upper surface of the support disk 10 are spaced apart.

[0035] It should be noted that the gap between the wafer 40 and the upper surface of the carrier disk 10 can avoid the grippers of the wafer transport device. After the wafer 40 is placed on the carrier surface 131, the grippers of the wafer transport device will not come into contact with or squeeze the carrier disk 10 and can be directly pulled out. This ensures that the grippers of the wafer transport device will not affect the placement of the wafer 40 and will not cause the wafer 40 to shift during the extraction process.

[0036] Furthermore, when the grippers of the wafer transport device grasp the wafer 40 in the wafer carrying area 11, the gap between the wafer 40 and the upper surface of the carrier disk 10 can also avoid the grippers of the wafer transport device, so that the corresponding part of the gripper can directly extend into the gap between the wafer 40 and the upper surface of the carrier disk 10 to grip the wafer 40, which can make the gripping of the wafer 40 smoother.

[0037] In some embodiments of this utility model, by placing the wafer 40 on the support boss 13 and also placing the wafer positioning member 20 on the support boss 13, the consistency of the horizontal positioning of the wafer 40 can be improved.

[0038] Combination Figures 1-6 As shown, the wafer cleaning device 100 also includes a mounting plate 30, a carrier plate 10 is disposed on the upper side of the mounting plate 30 and a lifting adjustment component 31 is connected between the carrier plate 30 and the mounting plate 30. There are multiple lifting adjustment components 31, which are spaced apart between the mounting plate 30 and the carrier plate 10. The multiple lifting adjustment components 31 can be lifted and lowered independently to adjust the angle of the carrier plate 10.

[0039] Specifically, by setting a lifting adjustment component 31 between the mounting plate 30 and the carrier plate 10, when multiple lifting adjustment components 31 lift and lower simultaneously, the carrier plate 10 can be driven to lift and lower synchronously, thereby adjusting the height of the carrier plate 10. When the lifting heights of the multiple lifting adjustment components 31 are different, the tilt angle of the carrier plate 10 can be adjusted. When the carrier plate 10 is in a non-horizontal state, at least some of the multiple lifting adjustment components 31 can be lifted and lowered independently, thereby readjusting the carrier plate 10 to a horizontal state.

[0040] Combination Figures 1-6As shown, the lifting adjustment assembly 31 includes an adjusting bolt 32 and a connecting column. At least one end of the adjusting bolt 32 in the vertical direction is provided with an external thread, and the connecting column is provided with an internal thread. The connecting column is connected to the adjusting bolt 32 and the external thread and internal thread are rotatably threaded together. The connecting column is connected to the mounting plate 30 or the bearing plate 10.

[0041] Specifically, by providing an external thread at at least one end of the adjusting bolt 32 in the vertical direction, a connecting column is positioned at at least one end of the adjusting bolt 32 in the vertical direction, and the internal thread of the connecting column engages with the external thread of the adjusting bolt 32. When the connecting column is positioned at the upper end of the adjusting bolt 32, it is connected to the bearing plate 10. When the connecting column is positioned at the lower end of the adjusting bolt 32, it is connected to the mounting plate 30. When it is necessary to adjust the height of the lifting adjustment assembly 31, the adjusting bolt 32 can be rotated. The rotation of the adjusting bolt 32 can drive the connecting column to rotate. The thread engagement between the connecting column and the adjusting bolt 32 can drive the connecting column to rise or fall relative to the adjusting bolt 32, thereby enabling the bearing plate 10 to rise or fall relative to the mounting plate 30.

[0042] This configuration not only makes the lifting and lowering of the support plate 10 relative to the mounting plate 30 by the lifting and adjusting component 31 smoother, but also makes the structure of the lifting and adjusting component 31 simpler, and makes the lifting and lowering principle of the lifting and adjusting component 31 simple and direct, and easy to operate.

[0043] Combination Figures 1-6 As shown, there are two connecting columns, namely the upper connecting column 33 and the lower connecting column 34. Both ends of the adjusting bolt 32 in the vertical direction are provided with external threads. The upper connecting column 33 is located at the upper end of the adjusting bolt 32 and is rotatably threaded with the external thread of the adjusting bolt 32. The lower connecting column 34 is located at the lower end of the adjusting bolt 32 and is rotatably threaded with the external thread of the adjusting bolt 32. The upper connecting column 33 is connected to the bearing plate 10, and the lower connecting column 34 is connected to the mounting plate 30.

[0044] Specifically, by setting two connecting posts, namely an upper connecting post 33 and a lower connecting post 34, external threads are provided at both ends of the adjusting bolt 32 in the vertical direction. The upper connecting post 33 is set at the upper end of the adjusting bolt 32, and the internal thread on the upper connecting post 33 and the external thread at the upper end of the adjusting bolt 32 are rotatably threaded together. The lower connecting post 34 is set at the lower end of the adjusting bolt 32, and the external thread of the adjusting bolt 32 and the internal thread of the lower connecting post 34 are rotatably threaded together.

[0045] When the adjusting bolt 32 is operated and driven to rotate, the upper connecting column 33 and the lower connecting column 34 can move closer to each other or further away from each other in the vertical direction, thereby realizing the lifting and lowering of the bearing plate 10 relative to the mounting plate 30. This makes the lifting and adjusting assembly 31 more efficient in adjusting the lifting and lowering of the bearing plate 10, and can further reduce the difficulty of lifting and lowering the bearing plate 10.

[0046] Combination Figures 1-6 As shown, the threaded engagement direction of the upper connecting column 33 and the adjusting bolt 32 is opposite to that of the threaded engagement direction of the lower connecting column 34 and the adjusting bolt 32.

[0047] Specifically, the threaded engagement direction of the upper connecting column 33 and the adjusting bolt 32 is opposite to that of the lower connecting column 34 and the adjusting bolt 32. In this way, the upper connecting column 33 and the lower connecting column 34 can be moved closer or further apart by simply rotating the adjusting bolt 32, without any other operation. This ensures the stability of the threaded engagement between the upper connecting column 33 and the lower connecting column 34 and the adjusting bolt 32, while making the movement of the upper connecting column 33 and the lower connecting column 34 relative to the adjusting bolt 32 smoother and more direct, thus optimizing the structural design of the lifting adjustment assembly 31.

[0048] Combination Figures 1-6 As shown, the adjusting bolt 32 includes an adjusting part 35. The external threads at the upper end and the lower end of the adjusting bolt 32 are located on the upper and lower sides of the adjusting part 35, respectively. The adjusting part 35 is polygonal.

[0049] Specifically, by setting the external threads at the upper and lower ends of the adjusting bolt 32 on the upper and lower sides of the adjusting part 35 respectively, and setting the adjusting part 35 as a polygon, after the upper connecting column 33 and the lower connecting column 34 are connected and fixed to the adjusting bolt 32, the upper connecting column 33 and the lower connecting column 34 will be located on the upper and lower sides of the adjusting part 35 respectively. Setting the adjusting part 35 as a polygon can increase the friction when rotating the adjusting part 35 and prevent slippage of the rotating adjusting part 35. This can further reduce the difficulty of the lifting and adjusting assembly 31 in driving the lifting and lowering of the bearing plate 10.

[0050] Combination Figures 1-6 As shown, a horizontal detection sensor 14 is also provided on the carrier disk 10. There are multiple horizontal detection sensors 14, which are arranged circumferentially on the outer side of the edge of the wafer carrier area 11.

[0051] Specifically, by setting multiple level detection sensors 14 on the carrier disk 10 and circumferentially spaced on the outer edge of the wafer carrier area 11, the multiple level detection sensors 14 can detect whether the wafer 40 is in a level state. The controller can drive at least some of the multiple lifting adjustment components 31 to lift or lower according to the detection results of the multiple level detection sensors 14, thereby adjusting the angle of the carrier disk 10.

[0052] The polishing equipment according to this utility model mainly includes: the wafer cleaning device 100 mentioned above. The wafer cleaning device 100 is applied to the polishing equipment. After the wafer 40 is polished, it can achieve a thorough and effective cleaning of the wafer 40. It can prevent the chemical liquid on the surface of the wafer 40 from not being cleaned in time after polishing. This can improve the quality and yield of the wafer 40 after the polishing equipment is completed, thereby improving the structural reliability of the polishing equipment.

[0053] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that it must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0054] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0055] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer cleaning device, characterized in that, include: A carrier disk (10) is provided with a wafer carrier area (11), and a cleaning nozzle (12) is provided on at least one side of the carrier disk (10) in the vertical direction corresponding to the wafer carrier area (11). A wafer positioning element (20) is disposed on the carrier disk (10), and there are multiple wafer positioning elements (20) arranged circumferentially at intervals along the edge of the wafer carrier area (11). The wafer positioning component (20) includes a rotating shaft (21) and a positioning post (22). The rotating shaft (21) is disposed on the carrier disk (10) and passes through the positioning post (22). The center line (221) of the positioning post and the center line (211) of the rotating shaft are radially spaced apart. The positioning post (22) is rotatable relative to the rotating shaft (21) to drive the wafer (40) to move.

2. The wafer cleaning apparatus according to claim 1, characterized in that, The centerline (211) of the rotating shaft is located on the side of the centerline (221) of the positioning post that is radially closer to the wafer carrying area (11).

3. The wafer cleaning apparatus according to claim 1, characterized in that, The carrier disk (10) is provided with a carrier boss (13), which protrudes upward relative to the surface of the carrier disk (10). The upper side of the carrier disk (10) is provided with a carrier surface (131), which is suitable for carrying a wafer (40). The wafer positioning member (20) is provided on the upper side of the carrier disk (10).

4. The wafer cleaning apparatus according to claim 1, characterized in that, It also includes a mounting plate (30), the support plate (10) is disposed on the upper side of the mounting plate (30) and a lifting adjustment component (31) is connected between the mounting plate (30) and the mounting plate (30). There are multiple lifting adjustment components (31), which are spaced apart between the mounting plate (30) and the support plate (10). The multiple lifting adjustment components (31) can be lifted and lowered independently to adjust the angle of the support plate (10).

5. The wafer cleaning apparatus according to claim 4, characterized in that, The lifting adjustment assembly (31) includes an adjusting bolt (32) and a connecting column. At least one end of the adjusting bolt (32) in the vertical direction is provided with an external thread, and the connecting column is provided with an internal thread. The connecting column is connected to the adjusting bolt (32), and the external thread and the internal thread are rotatably threaded together. The connecting column is connected to the mounting plate (30) or the bearing plate (10).

6. The wafer cleaning apparatus according to claim 5, characterized in that, The connecting column consists of two parts, namely an upper connecting column (33) and a lower connecting column (34). Both ends of the adjusting bolt (32) in the vertical direction are provided with external threads. The upper connecting column (33) is located at the upper end of the adjusting bolt (32) and is rotatably threaded with the external thread of the adjusting bolt (32). The lower connecting column (34) is located at the lower end of the adjusting bolt (32) and is rotatably threaded with the external thread of the adjusting bolt (32). The upper connecting column (33) is connected to the bearing plate (10), and the lower connecting column (34) is connected to the mounting plate (30).

7. The wafer cleaning apparatus according to claim 6, characterized in that, The threaded engagement direction of the upper connecting column (33) and the adjusting bolt (32) is opposite to that of the threaded engagement direction of the lower connecting column (34) and the adjusting bolt (32).

8. The wafer cleaning apparatus according to claim 6, characterized in that, The adjusting bolt (32) includes an adjusting part (35). The external threads at the upper end and the lower end of the adjusting bolt (32) are located on the upper and lower sides of the adjusting part (35), respectively. The adjusting part (35) is polygonal.

9. The wafer cleaning apparatus according to claim 1, characterized in that, The carrier disk (10) is also provided with a horizontal detection sensor (14). There are multiple horizontal detection sensors (14), which are circumferentially spaced on the outer side of the edge of the wafer carrier area (11).

10. A polishing device, characterized in that, The wafer cleaning apparatus (100) includes any one of claims 1-9.

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