A silicon controlled rectifier chip angle grinding machine
By combining multiple grinding rollers with a fixed disk and designing an adjustable roller, the problem of low efficiency in existing chip grinding equipment is solved, enabling simultaneous grinding of multiple chips and vibration suppression, thus improving grinding efficiency and stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JINING DONGFANGXIN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-31
AI Technical Summary
Existing thyristor chip grinding equipment has a limited number of chips that can be ground simultaneously, resulting in unsatisfactory grinding efficiency.
The design employs a combination structure of multiple grinding rollers and a fixed disk. The grinding rollers are driven by a motor to rotate and change the contact position between the chip and the grinding belt. Combined with the design of an adjusting roller and an elastic layer, the contact area and contact force between the chip and the grinding belt are reduced, thereby increasing the chip grinding efficiency and suppressing vibration.
It enables simultaneous grinding of multiple chips, improving grinding efficiency, and reduces vibration during chip grinding through elastic deformation and tilt design, thereby enhancing grinding stability and efficiency.
Smart Images

Figure CN224575378U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of chip angle grinding technology, and more specifically, to a silicon controlled rectifier chip angle grinding machine. Background Technology
[0002] As an important semiconductor device, the silicon controlled rectifier (SCR) chip has wide applications in electronics, power, and other fields. In the SCR chip manufacturing process, the grinding process is a crucial step, directly affecting the chip's performance and quality. The main purpose of the grinding process is to remove burrs and sharp angles from the chip's edges, making them smooth and rounded. This improves the chip's mechanical strength and electrical performance, preventing problems such as electric field concentration and breakdown caused by edge defects during subsequent use.
[0003] A search revealed that Chinese patent CN119658552A discloses a chip angle grinding device and grinding method. This device drives a first roller and a second roller to rotate synchronously via the grinding body, enabling the grinding belt to continuously and stably grind the sides of the chip. Through the cooperation of the first and second rollers, the grinding belt can evenly distribute the grinding force over a large contact area, improving grinding efficiency.
[0004] The reduced number of chips that the above-mentioned device can grind at the same time results in unsatisfactory grinding efficiency. In view of this, we propose a silicon controlled rectifier chip angle grinding machine. Utility Model Content
[0005] 1. Technical problems to be solved
[0006] The purpose of this application is to provide a silicon controlled rectifier chip angle grinding machine to solve the problems mentioned in the background art.
[0007] 2. Technical Solution
[0008] This application is achieved through the following technical solution:
[0009] A silicon controlled rectifier chip grinding machine includes a support frame and a grinding belt. Multiple grinding rollers are rotatably connected to the support frame. An adjusting roller is provided between two adjacent grinding rollers. The adjusting roller is rotatably connected to the support frame. The grinding belt is sleeved on the outside of the grinding rollers. The adjusting roller is located on the outside of the grinding belt. The grinding belt is recessed inward at the adjusting roller. A fixing plate is provided on one side of the adjusting roller. The fixing plate is rotatably mounted on the support frame.
[0010] As an optional solution to the technical solution in this application, a first motor is installed on the support frame, and the output end of the first motor is connected to one of the grinding rollers.
[0011] As an optional solution to the technical solution of this application, a support rod is installed on one side of the support frame, and multiple connecting shafts are rotatably connected to the support rod. The connecting shafts are parallel to the axis of the grinding roller. A fixed plate is fixedly installed at one end of the connecting shaft, and a worm wheel is fixedly connected to the other end. A rotating shaft is rotatably connected to the support rod, and multiple worm sections are fixedly provided on the rotating shaft. The worm wheel is meshed with the worm section.
[0012] As an optional solution to the technical solution in this application, a second motor is fixedly installed on the support rod, and the output end of the second motor is connected to the rotating shaft for transmission.
[0013] As an optional solution to the technical solution of this application, the grinding roller is provided with multiple recesses, and the multiple fixed disks are located at different heights, with the positions of the fixed disks corresponding to the recesses.
[0014] As an optional solution to the technical solution of this application, the support frame is provided with a guide rail, and a slider is slidably provided in the guide rail. The slider is connected and fixed to the support rod. The support frame is provided with a third motor, and the output end of the third motor is connected to a threaded rod. The threaded rod passes through the slider and is threadedly connected to it.
[0015] As an optional solution to the technical solution in this application, the adjusting roller rotates in the opposite direction to the fixed disk.
[0016] As an optional solution to the technical solution in this application, the outer side of the adjusting roller is provided with an elastic layer.
[0017] 3. Beneficial effects
[0018] Compared with the prior art, the beneficial effects of this application are:
[0019] 1) By setting up multiple grinding rollers and a fixed disk, and placing the fixed disk on one side of the grinding rollers, this application can grind multiple chips at the same time, thereby increasing the chip grinding efficiency.
[0020] 2) By providing multiple recesses on the grinding roller, the chip can contact the grinding belt at the recesses when the chip is being ground, so that the grinding belt can undergo elastic deformation, reducing the contact force between the chip and the grinding belt, thereby reducing the vibration generated when the chip is being ground.
[0021] 3) This application increases the inclination of the grinding belt at the grinding roller by setting an adjustment roller, thereby reducing the contact area between the grinding belt and the chip and suppressing the vibration generated during chip grinding. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the overall structure of a silicon controlled rectifier (SCR) chip angle grinding machine;
[0023] Figure 2 This is a schematic diagram of the support rod structure of a silicon controlled rectifier chip angle grinding machine;
[0024] Figure 3 This is a schematic diagram of the support frame structure for a silicon controlled rectifier chip angle grinding machine;
[0025] In the diagram: 1. Support frame; 101. Guide rail; 102. Slider; 2. Grinding belt; 3. Grinding roller; 301. Recessed part; 4. Adjusting roller; 5. Fixed plate; 6. First motor; 7. Support rod; 701. Connecting shaft; 702. Worm gear; 703. Rotating shaft; 704. Worm part; 8. Second motor; 9. Third motor; 901. Threaded rod. Detailed Implementation
[0026] The technical solution of this application will now be clearly and completely described in conjunction with the accompanying drawings.
[0027] Please see Figure 1 This application provides a technical solution:
[0028] A silicon controlled rectifier chip grinding machine includes a support frame 1 and a grinding belt 2. Multiple grinding rollers 3 are rotatably connected to the support frame 1. An adjusting roller 4 is provided between two adjacent grinding rollers 3. An elastic layer is provided on the outside of the adjusting roller 4. The adjusting roller 4 is rotatably connected to the support frame 1. The grinding belt 2 is sleeved on the outside of the grinding rollers 3. The adjusting roller 4 is located outside the grinding belt 2. The grinding belt 2 is recessed inward at the adjusting roller 4. A fixing plate 5 is provided on one side of the adjusting roller 4. The fixing plate 5 is rotatably mounted on the support frame 1. A first motor 6 is installed on the support frame 1. The output end of the first motor 6 is connected to one of the grinding rollers 3.
[0029] By setting multiple fixing disks 5, multiple chips can be fixed simultaneously. The first motor 6 drives the polishing roller 3 to rotate, which in turn moves the polishing belt 2. By rotating the fixing disks 5, the contact position between the chip and the polishing belt 2 is changed, enabling polishing of the chip corners and increasing polishing efficiency. Furthermore, the adjusting roller 4 forms a depression on the surface of the polishing belt 2, increasing the inclination of the polishing belt 2 at the polishing roller 3, reducing the contact area between the chip and the polishing belt 2, and thus reducing vibration during chip polishing.
[0030] like Figure 2As shown, a support rod 7 is installed on one side of the support frame 1. Multiple connecting shafts 701 are rotatably connected to the support rod 7. The connecting shafts 701 are parallel to the axis of the grinding roller 3. A fixed disk 5 is fixedly installed at one end of the connecting shaft 701, and a worm gear 702 is fixedly connected to the other end. A rotating shaft 703 is rotatably connected to the support rod 7. Multiple worm gear sections 704 are fixedly provided on the rotating shaft 703. The worm gear 702 is meshed with the worm gear section 704. A second motor 8 is fixedly installed on the support rod 7. The output end of the second motor 8 is connected to the rotating shaft 703 for transmission. The rotation direction of the adjusting roller 4 is opposite to that of the fixed disk 5.
[0031] The second motor 8 can drive the worm gear 704 to rotate, thereby synchronously driving multiple fixed disks 5 to rotate synchronously and simultaneously grind multiple chips. The transmission method of worm wheel 702 and worm gear 704 can increase the stability of fixed disks 5 and suppress chip vibration when the chip contacts the grinding belt 2 for grinding.
[0032] like Figure 3 As shown, the grinding roller 3 is provided with multiple recesses 301, and multiple fixing disks 5 are located at different heights, with the positions of the fixing disks 5 corresponding to the recesses 301.
[0033] When the chip contacts the polishing belt 2 for polishing, the polishing belt 2 at the recess 301 can undergo elastic deformation to avoid excessive contact force between the polishing belt 2 and the chip, which would cause severe vibration during chip polishing.
[0034] Preferably, the support frame 1 is provided with a guide rail 101, and a slider 102 is slidably disposed within the guide rail 101. The slider 102 is connected and fixed to the support rod 7. The support frame 1 is provided with a third motor 9, and the output end of the third motor 9 is connected to a threaded rod 901. The threaded rod 901 passes through the slider 102 and is threadedly connected to it. The third motor 9 can drive the threaded rod 901 to rotate, thereby adjusting the position of the support rod 7 and changing the distance between the fixed disk 5 and the grinding roller 3. The user can select a fixed disk 5 of the corresponding size according to the size of the chip, and by adjusting the distance between the fixed disk 5 and the grinding roller 3, the device can be applied to the grinding operation of chips of different sizes.
Claims
1. A silicon controlled rectifier chip angle grinder, characterized in that: The device includes a support frame (1) and a grinding belt (2). Multiple grinding rollers (3) are rotatably connected to the support frame (1). An adjusting roller (4) is provided between two adjacent grinding rollers (3). The adjusting roller (4) is rotatably connected to the support frame (1). The grinding belt (2) is sleeved on the outside of the grinding rollers (3). The adjusting roller (4) is located on the outside of the grinding belt (2). The grinding belt (2) is recessed inward at the adjusting roller (4). A fixing plate (5) is provided on one side of the adjusting roller (4). The fixing plate (5) is rotatably mounted on the support frame (1).
2. A silicon controlled rectifier chip angle grinder as claimed in claim 1, characterized in that: The support frame (1) is equipped with a first motor (6), and the output end of the first motor (6) is connected to one of the grinding rollers (3) for transmission.
3. The thyristor chip angle grinding machine according to claim 1, characterized in that: A support rod (7) is installed on one side of the support frame (1). Multiple connecting shafts (701) are rotatably connected to the support rod (7). The connecting shafts (701) are parallel to the axis of the grinding roller (3). A fixed plate (5) is fixedly installed at one end of the connecting shaft (701), and a worm gear (702) is fixedly connected to the other end. A rotating shaft (703) is rotatably connected to the support rod (7). Multiple worm sections (704) are fixedly provided on the rotating shaft (703). The worm gear (702) is meshed with the worm section (704).
4. A silicon controlled rectifier chip angle grinder as claimed in claim 3, characterized in that: A second motor (8) is fixedly installed on the support rod (7), and the output end of the second motor (8) is connected to the rotating shaft (703) for transmission.
5. The silicon controlled rectifier chip angle grinder of claim 1, wherein: The grinding roller (3) is provided with a plurality of recesses (301), and the plurality of fixed disks (5) are located at different heights, with the position of the fixed disks (5) corresponding to the recesses (301).
6. A silicon controlled rectifier chip angle grinder as defined in claim 3, characterized in that: The support frame (1) is provided with a guide rail (101), and a slider (102) is slidably provided in the guide rail (101). The slider (102) is connected and fixed to the support rod (7). The support frame (1) is provided with a third motor (9), and the output end of the third motor (9) is connected to a threaded rod (901). The threaded rod (901) passes through the slider (102) and is threadedly connected to it.
7. A silicon controlled rectifier chip angle grinding machine according to claim 1, characterized in that: The adjusting roller (4) rotates in the opposite direction to the fixed disk (5).
8. A silicon controlled rectifier chip angle grinding machine according to claim 1, characterized in that: An elastic layer is provided on the outer side of the adjusting roller (4).