Wafer processing apparatus

Abstract

This application discloses a wafer processing equipment. The equipment includes a front-end module, a thinning module, a polishing module, a cleaning module, and a transfer module. The thinning module is used to thin the wafer; the polishing module is used to polish the wafer; the cleaning module includes a first cleaning unit and a second cleaning unit, which are stacked vertically. The first cleaning unit cleans the wafer, and the second cleaning unit performs post-cleaning processing. The thinning module, polishing module, and cleaning module are all within the transfer range of a multi-axis robot in the transfer module. The multi-axis robot is used to transfer the wafer between at least two of the thinning module, polishing module, first cleaning unit, and second cleaning unit. The multi-axis robot also transfers polished wafers to the first cleaning unit. This wafer processing equipment effectively improves wafer transfer efficiency, increases processing efficiency, and facilitates increased wafer processing capacity.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a wafer processing equipment. Background Technology

[0002] In the wafer fabrication process, wafer thinning and polishing usually need to work together to control wafer thickness, surface quality, and other parameters.

[0003] In related technologies, wafers can be thinned, polished, and cleaned using different equipment. Each piece of equipment typically has a corresponding structure for loading and unloading wafers. Specifically, when a wafer is processed by a piece of equipment, it is usually first transferred to that equipment via a transport device, then transferred to the loading and unloading structure of that equipment, and then transferred to the processing station of that equipment via the loading and unloading structure for processing. After the equipment completes the processing of the wafer, it must be removed from the processing station of that equipment via the loading and unloading structure and then transferred to the transport device for processing by the next equipment. As a result, the wafer transport efficiency during the processing is low, which is not conducive to improving the wafer processing efficiency. Utility Model Content

[0004] This application discloses a wafer processing equipment that can effectively improve the efficiency of wafer transfer and wafer processing, thereby increasing the production capacity of the wafer processing equipment.

[0005] To achieve the above objectives, embodiments of this application disclose a wafer processing apparatus, comprising:

[0006] A front-end module, which is used to place the wafer to be processed and the wafer that has been processed;

[0007] A thinning module, used to thin the wafer to be processed;

[0008] A polishing module is disposed downstream of the thinning module, and the polishing module is used to polish the thinned wafer;

[0009] A cleaning module is disposed downstream of the polishing module. The cleaning module includes a first cleaning unit and a second cleaning unit, which are stacked vertically. The first cleaning unit is used to clean the polished wafer, and the second cleaning unit is used to perform post-cleaning processing on the wafer cleaned by the first cleaning unit.

[0010] The transfer module includes a multi-axis robot arm. The thinning module, the polishing module, and the cleaning module are all within the transfer range of the multi-axis robot arm. The multi-axis robot arm is used to transfer the wafer between at least two of the thinning module, the polishing module, the first cleaning unit, and the second cleaning unit. The multi-axis robot arm is also used to transfer the polished wafer to the first cleaning unit.

[0011] Optionally, the second cleaning unit has a discharge opening located within the transmission range of the multi-axis robot and a pick-up opening facing the front-end module.

[0012] Optionally, at least one of the first cleaning unit and the second cleaning unit has a cleaning chamber for containing the wafer for cleaning or post-cleaning processing.

[0013] Optionally, the wafer processing equipment further includes a temporary storage module for temporarily storing the wafer to be processed. The temporary storage module, the first cleaning unit, and the second cleaning unit are stacked vertically. The temporary storage module is located within the transmission range of the multi-axis robot. The multi-axis robot is also used to remove the wafer to be processed from the temporary storage module.

[0014] Optionally, the front-end module includes a front-end transfer device and a wafer cassette. The front-end transfer device is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette. The temporary storage module is also located within the transmission range of the front-end transfer device, so that the front-end transfer device can transfer the wafer to be processed from the wafer cassette to the temporary storage module.

[0015] Optionally, the second cleaning unit is located within the transmission range of the front-end transmission device, so that the front-end transmission device can move the wafer processed by the second cleaning unit from the second cleaning unit to the wafer cassette.

[0016] Optionally, along the first horizontal direction, the polishing module, the cleaning module, and the transmission module are all located between the thinning module and the front-end module, and the cleaning module is arranged adjacent to the front-end module.

[0017] Optionally, the cleaning module is located between the polishing module and the front end module along the first horizontal direction, or the cleaning module is located between the thinning module and the front end module along the first horizontal direction, and is arranged side by side with the polishing module along the second horizontal direction.

[0018] Optionally, the multi-axis robot is disposed within the clearance space formed by the front-end module, the thinning module, the polishing module and the cleaning module, and the transmission radius of the multi-axis robot covers the thinning module, the polishing module, the first cleaning unit and the second cleaning unit;

[0019] The multi-axis robot includes a fixed base, which is located near the front end module, or the fixed base is located on the side of the polishing module facing the clearance space.

[0020] Optionally, the transmission module further includes a transmission relay device disposed between the thinning module and the multi-axis robot. The transmission relay device is used to cooperate with the multi-axis robot to transmit the wafer at least between the thinning module and the polishing module.

[0021] Optionally, the wafer processing equipment further includes a gas-liquid module, which is disposed between the polishing module and the thinning module, or the gas-liquid module is disposed on one side of the front end module along the second horizontal direction.

[0022] Compared with the prior art, this application has at least the following beneficial effects:

[0023] In this application, the wafer processing equipment can thin the wafer through a thinning module, perform mechanical and chemical polishing on the thinned wafer through a polishing module, and clean and dry the wafer through a cleaning module. Furthermore, the wafer can be transferred and moved between the front-end module, the thinning module, the polishing module, and the cleaning module through a transfer module. In other words, the wafer processing equipment has a high degree of integration, which not only allows for a more compact layout but also improves wafer processing efficiency, thereby increasing the production capacity of the wafer processing equipment. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of the first type of wafer processing equipment provided in the embodiments of this application;

[0026] Figure 2 This is a schematic diagram of the structure of the second type of wafer processing equipment provided in the embodiments of this application;

[0027] Figure 3This is a schematic diagram of the structure of a cleaning module provided in an embodiment of this application;

[0028] Figure 4 This is a perspective view of a cleaning module provided in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the structure of a front-end module provided in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of a combination of a cleaning module and a temporary storage module provided in an embodiment of this application;

[0031] Figure 7 This is a perspective view of a combination of a cleaning module and a temporary storage module provided in an embodiment of this application;

[0032] Figure 8 This is a schematic diagram of the structure of a gas-liquid module provided in an embodiment of this application;

[0033] Figure 9 This is a schematic diagram of the structure of the first thinning module provided in the embodiments of this application;

[0034] Figure 10 This is a schematic diagram of the structure of the second thinning module provided in the embodiments of this application;

[0035] Figure 11 This is a schematic diagram of the structure of the third thinning module provided in the embodiments of this application;

[0036] Figure 12 This is a schematic diagram of the structure of the first polishing module provided in the embodiments of this application;

[0037] Figure 13 This is a schematic diagram of the structure of a combination of a first polishing head, a second polishing head, a rotating bracket, and a first driving component provided in an embodiment of this application;

[0038] Figure 14 This is a schematic diagram of the structure of the second polishing module provided in the embodiments of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1-Front-end module; 11-Front-end transmission device; 12-Wafer box; 13-Rack; 14-Safety light curtain;

[0041] 2-Cleaning module; 21-First cleaning unit; 22-Second cleaning unit; 221-Discharge opening; 222-Removal opening;

[0042] 3-Thinning module; 3a-Grinding station; 3b-Material handling station; 31-First base; 32-Turntable; 33-Grinding device; 34-Material handling device; 35-Thinning transfer device;

[0043] 4-Polishing module; 41-Second base; 42-First polishing head; 43-Second polishing head; 44-Polishing disc; 45-Polishing fluid supply; 46-Polishing pad conditioner; 47-Cleaning station; 48-Rotating bracket; 49-First drive component;

[0044] 5-Transmission module; 51-Multi-axis robot; 52-Transmission transfer device;

[0045] 6- Temporary storage module;

[0046] 7-Gas-Liquid Module; 71-Gas Supply Unit; 72-Cleaning Fluid Supply Unit; 721-Mixing Tank; 723-Dispensing Tank; 73-Frame; 74-Operation Panel;

[0047] 10-Wafer processing equipment. Detailed Implementation

[0048] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0049] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0050] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0051] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0052] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0053] In the field of wafer fabrication, key processes such as thinning, polishing, and cleaning are typically performed by separate pieces of equipment. For example, wafer thinning is performed using a wafer thinning machine, and chemical mechanical polishing is performed using a wafer polishing machine.

[0054] Among them, wafer thinning machines, also known as wafer grinding machines, are a type of equipment specifically used for fine processing of the surface of semiconductor wafers. Wafer thinning machines reduce the thickness of wafers by grinding them.

[0055] A wafer polishing machine, also known as a chemical mechanical polishing machine, uses the synergistic effect of chemical etching and mechanical abrasion to achieve global planarization of the wafer surface.

[0056] When wafers are thinned, polished, and cleaned using different equipment, each piece of equipment typically has a corresponding wafer loading and unloading structure. Specifically, when a wafer is processed by a piece of equipment, it is usually first transferred to that equipment via a transport device, then transferred to the loading and unloading structure of that equipment, and then transferred to the processing station of that equipment via the loading and unloading structure for processing. After the equipment completes the processing of the wafer, it must be removed from the processing station of that equipment via the loading and unloading structure and then transferred to the transport device for processing by the next equipment. This results in low wafer transport efficiency during the processing, which is not conducive to improving wafer processing efficiency.

[0057] Based on this, the embodiments of this application disclose wafer processing equipment, which can effectively improve the efficiency of wafer transfer, improve the processing efficiency of wafers, and help increase the production capacity of wafer processing equipment.

[0058] The technical solution of this application will be described in detail below with reference to specific embodiments and accompanying drawings.

[0059] This application provides a wafer processing equipment, such as... Figures 1-4 As shown, the wafer processing equipment 10 includes a front-end module 1, a thinning module 3, a polishing module 4, a cleaning module 2, and a transmission module 5. The front-end module 1 is used to place the wafer to be processed and the wafer that has been processed; the thinning module 3 is used to thin the wafer to be processed; the polishing module 4 is located downstream of the thinning module 3 and is used to polish the thinned wafer; the cleaning module 2 is located downstream of the polishing module 4 and includes a first cleaning unit 21 and a second cleaning unit 22, which are stacked vertically. The first cleaning unit 21 is used to clean the polished wafer, and the second cleaning unit 22 is used to perform post-cleaning processing on the wafer cleaned by the first cleaning unit 21; the transmission module 5 includes a multi-axis robot 51, and the thinning module 3, the polishing module 4, and the cleaning module 2 are all within the transmission range of the multi-axis robot 51. The multi-axis robot 51 is used to transfer wafers between at least two of the thinning module 3, the polishing module 4, the first cleaning unit 21, and the second cleaning unit 22. The multi-axis robot 51 is also used to transfer the polished wafer to the first cleaning unit 21.

[0060] It should be clarified that the statement that the polishing module 4 is located downstream of the thinning module 3 means that in the wafer processing flow, the polishing module 4 is located downstream of the thinning module 3. In other words, the wafer is first processed by the thinning module 3 and then transported to the polishing module 4 for further processing. It does not mean that the polishing module 4 is located downstream of the thinning module 3 in terms of orientation or layout. Similarly, the statement that the cleaning module 2 is located downstream of the polishing module 4 means that in the wafer processing flow, the cleaning module 2 is located downstream of the polishing module 4.

[0061] In this embodiment, the wafer processing equipment 10 can thin the wafer to be processed through the thinning module 3, perform mechanical and chemical polishing on the thinned wafer through the polishing module 4, and clean and dry the polished wafer through the cleaning module 2. The wafer can be transferred and moved between the thinning module 3, the polishing module 4, the first cleaning unit 21 and the second cleaning unit 22 through the multi-axis robot 51 in the transfer module 5. That is, the wafer processing equipment 10 has a high degree of integration, which not only makes the wafer processing equipment 10 occupy less space and allows the wafer processing equipment 10 to have a more compact layout, but also helps to improve the wafer processing efficiency, thereby improving the overall performance of the wafer processing equipment 10. At the same time, the wafer can be processed by the wafer processing equipment 10 to obtain a thinner wafer with ultra-high cleanliness.

[0062] Since the thinning module 3, polishing module 4, and cleaning module 2 are all within the transmission range of the multi-axis robot 51, the multi-axis robot 51 is also used to transfer the polished wafer to the first cleaning unit 21. This allows the multi-axis robot 51 to transfer the polished wafer from the polishing module 4 to the first cleaning unit 21, enabling the multi-axis robot 51 to handle both wafer loading and transmission between at least two of the thinning module 3, polishing module 4, first cleaning unit 21, and second cleaning unit 22. This effectively simplifies the structure for transferring wafers between modules and reduces the number of transmission devices. Specifically, firstly, there is no need to set up a separate loading structure for placing wafers in the first cleaning unit 21 for the cleaning module 2, which reduces the structure and number of components of the cleaning module 2, thereby allowing the cleaning module 2 to have a smaller volume and reduce the space occupied by the cleaning module 2, thus enabling the wafer processing equipment 10 to have a more compact layout. Secondly, by reusing the multi-axis robot 51, the thinning module 3, polishing module 4, and cleaning module 2 are all located within the working range of the same multi-axis robot, which makes the transfer of wafers between the thinning module 3 and polishing module 4, and between the polishing module 4 and cleaning module 2 simpler and the transfer path shorter, effectively simplifying the wafer transfer process and improving the efficiency of wafer transfer, thereby improving the wafer processing efficiency and benefiting the increase in the production capacity of the wafer processing equipment 10.

[0063] The multi-axis robot 51 is used to transfer wafers at least between the thinning module 3 and the polishing module 4, and between the polishing module 4 and the cleaning module 2. This allows the transfer module 5 to have multiple degrees of freedom, satisfying various spatial positioning and orientation requirements for the transferred wafers. This makes wafer transfer convenient and efficient, further improving wafer processing efficiency and increasing the capacity of the wafer processing equipment 10. Furthermore, direct transfer between the thinning module 3 and the polishing module 4, and between the polishing module 4 and the cleaning module 2, via the multi-axis robot 51 allows for closer spacing between the thinning module 3 and the transfer module 5, and between the polishing module 4 and the cleaning module 2. This further reduces the space occupied by the wafer processing equipment 10, making its layout more compact.

[0064] The first cleaning unit 21 and the second cleaning unit 22 are stacked vertically, allowing the wafer to undergo a first cleaning in the first cleaning unit 21 and then be moved a shorter vertical distance after being removed from the first cleaning unit 21 before being placed into the second cleaning unit 22 for a second cleaning and drying. This shortens the movement path of the wafer between the first cleaning unit 21 and the second cleaning unit 22, improving the efficiency of wafer transfer and thus increasing the processing efficiency of the wafer processing equipment 10, thereby further increasing the production capacity of the wafer processing equipment 10. At the same time, it can also effectively reduce the space occupied by the first cleaning unit 21 and the second cleaning unit 22 in the horizontal direction, allowing the wafer processing equipment 10 to have a more compact layout.

[0065] The thinning module 3 can thin the wafer to be processed to reduce the thickness of the wafer.

[0066] The polishing module 4 can perform chemical mechanical polishing on the wafer after it has been thinned by the thinning module 3, so as to perform fine removal and planarization on the thinned surface of the wafer.

[0067] like Figure 5 As shown, the front-end module 1 may include a rack 13, a front-end transfer device 11, and a wafer cassette 12. Both the front-end transfer device 11 and the wafer cassette 12 are disposed on the rack 13. The front-end transfer device 11 is used to remove the wafer to be processed from the wafer cassette 12 and to transfer the processed wafer to the wafer cassette 12. That is, the wafer to be processed can be loaded into the wafer cassette 12 first, and the wafer processed by the wafer processing equipment 10 can be temporarily placed in the wafer cassette 12, so as to realize the loading and unloading of wafers on the wafer processing equipment 10, saving time and effort.

[0068] The front-end transmission device 11 can be a robotic arm or a combination of a transfer device and a robotic arm, and there is no limitation on it here.

[0069] In addition, the multi-axis robot 51 can be any of the five-axis robot, six-axis robot, etc., and is not limited here.

[0070] The first cleaning unit 21 described above can perform a first cleaning on the polished wafer to remove the impurities remaining on the surface of the polished wafer. The second cleaning unit 22 performs post-cleaning processing on the wafer after it has been cleaned by the first cleaning unit 21. It can clean the wafer surface again and dry the wafer surface to facilitate subsequent storage and processing of the wafer.

[0071] The cleaning solution used in the first cleaning unit 21 to clean the wafer can be the same as or different from the cleaning solution used in the second cleaning unit 22 to clean the wafer; no limitation is made here.

[0072] Optionally, the second cleaning unit 22 has a discharge opening 221 located within the transmission range of the multi-axis robot 51, and a pick-up opening 222 facing the front end module 1.

[0073] This greatly facilitates the multi-axis robotic arm 51 in placing wafers into the second cleaning unit 22, and in removing wafers from the second cleaning unit 22 and transferring them to the wafer cassette 12 in the front-end module 1, improving wafer transfer efficiency and thus increasing wafer processing efficiency, thereby increasing the production capacity of the wafer processing equipment 10. Simultaneously, it eliminates the need for an additional structure to transfer wafers from the first cleaning unit 21 to the second cleaning unit 22, effectively simplifying the structure of the wafer processing equipment 10 and allowing for a compact layout.

[0074] The material feeding opening 221 can be oriented towards the multi-axis robot arm 51, such as... Figure 2 As shown in the wafer processing equipment 10, or, the feeding opening 221 is positioned toward the thinning module 3, as in... Figure 1 As shown in the wafer processing equipment 10, the multi-axis robot arm 51 can place the wafer into the second cleaning unit 22 by rotating a small angle, which makes the wafer transfer convenient and efficient, improves the wafer processing efficiency, and increases the production capacity of the wafer processing equipment 10.

[0075] In addition, the second cleaning unit 22 may also be located within the transmission range of the front-end transmission device 11, so that the front-end transmission device 11 can move the wafer processed by the second cleaning unit 22 from the second cleaning unit 22 to the wafer cassette 12.

[0076] Therefore, the front-end transfer device 11 of the front-end module 1 can simultaneously handle the unloading of wafers by the second cleaning unit 22 and the transfer between the second cleaning unit 22 and the front-end module 1, effectively simplifying the structure and number of transfer devices for wafer transfer between modules. Specifically, firstly, there is no need to set up a separate unloading structure for removing wafers from the second cleaning unit 22, reducing the structure and number of components of the cleaning module 2, thereby allowing the cleaning module 2 to have a smaller size and less space occupied, and thus allowing the wafer processing equipment 10 to have a more compact layout; secondly, by reusing the front-end transfer device 11, the second cleaning unit 22 is located within the transfer range of the front-end transfer device 11, making the transfer of wafers between the second cleaning unit 22 and the front-end module 1 simpler and the transfer path shorter, effectively simplifying the wafer transfer process, effectively improving the efficiency of wafer transfer, thereby improving the wafer processing efficiency and facilitating the increase in the capacity of the wafer processing equipment 10.

[0077] In this case, the material pick-up opening 222 of the second cleaning unit 22 may be located within the transmission range of the front-end transmission device 11, so that the front-end transmission device 11 can take out the cleaned and dried wafers from the second cleaning unit 22 through the material pick-up opening 222.

[0078] For example, the material picking opening 222 can be set toward the front-end transfer device 11, which facilitates the front-end transfer device 11 to pick up the wafer from the second cleaning unit 22, which helps to improve the efficiency of wafer transfer, thereby improving the wafer processing efficiency and making the wafer processing equipment 10 have a higher capacity.

[0079] In addition, the orientation of the feeding opening 221 is different from that of the picking opening 222, which avoids interference during the process of placing and taking out wafers into the second cleaning unit 22. This effectively improves the efficiency of placing and taking out wafers into the second cleaning unit 22, which is conducive to improving the processing efficiency of the wafer processing equipment 10, and thus further improves the production capacity of the wafer processing equipment 10.

[0080] In some embodiments, at least one of the first cleaning unit 21 and the second cleaning unit 22 has a cleaning chamber for containing a wafer for cleaning or post-cleaning processing of the wafer.

[0081] This allows the cleaning and post-cleaning treatment of the wafers to be carried out in a relatively closed environment, effectively reducing the chance of contamination by other foreign objects during the cleaning and post-cleaning process. As a result, the wafers can have a high degree of cleanliness after being processed by the first cleaning unit 21 and the second cleaning unit 22.

[0082] Both the first cleaning unit 21 and the second cleaning unit 22 may have cleaning boxes, so as to effectively avoid the influence of the external environment on the cleaning effect of the wafer during the first cleaning, the second cleaning and drying process, and ensure that the cleaned wafer has a high degree of cleanliness after being processed by the cleaning module 2.

[0083] In addition, when the second cleaning unit 22 has a cleaning box, the cleaning box may have a receiving space, and the material discharge opening 221 and the material dispensing opening 222 are both provided on the cleaning box and are both connected to the receiving space.

[0084] The first cleaning unit 21 and the second cleaning unit 22 are stacked vertically, and their heights can be set according to actual needs to facilitate wafer handling.

[0085] Optionally, such as Figure 6 and Figure 7As shown, the wafer processing equipment 10 also includes a temporary storage module 6, which is used to temporarily store the wafer to be processed. The temporary storage module 6, the first cleaning unit 21 and the second cleaning unit 22 are stacked in the vertical direction. The temporary storage module 6 is located within the transmission range of the multi-axis robot 51. The multi-axis robot 51 is also used to remove the wafer to be processed from the temporary storage module 6.

[0086] Therefore, after the wafer to be processed is taken out from the front-end module 1, it can be temporarily stored in the temporary storage module 6 to facilitate the transfer of the wafer to the thinning module 3 by the multi-axis robot arm 51. This also facilitates the control of the wafer processing rhythm. Furthermore, since the temporary storage module 6 is located within the transmission range of the multi-axis robot arm 51, the transfer of the wafer to be processed to the thinning module 3 is convenient and efficient, improving the efficiency of wafer transfer and further increasing the production capacity of the wafer processing equipment 10. Additionally, the closer spacing between the temporary storage module 6 and the thinning module 3 allows for a more compact layout of the wafer processing equipment 10.

[0087] In addition, the temporary storage module 6 can also be located within the transmission range of the front-end transmission device 11, so that the front-end transmission device 11 can transfer the wafer to be processed from the wafer cassette 12 to the temporary storage module 6.

[0088] Therefore, there is no need to set up a separate transfer structure and feeding structure for transferring wafers from wafer cassette 12 to temporary storage module 6, which effectively improves the efficiency of wafer transfer, thereby increasing the capacity of wafer processing equipment 10. It also reduces the structure and number of components of temporary storage module 6, allowing temporary storage module 6 to have a smaller size and reduce the space occupied by temporary storage module 6, thus enabling wafer processing equipment 10 to have a more compact layout.

[0089] Optionally, the temporary storage module 6 may include a temporary storage box, which has a storage space and a first opening and a second opening disposed on the temporary storage box. Both the first opening and the second opening are connected to the storage space. The first opening is used by the front-end transmission device 11 to place the wafer to be processed into the storage space, and the second opening is used by the multi-axis robot arm 51 to take out the wafer to be processed from the storage space.

[0090] Therefore, wafers can be placed into and removed from the temporary storage box through two different openings, avoiding interference during the process of placing and removing wafers. This facilitates wafer placement and removal, effectively improves the efficiency of placing and removing wafers from the temporary storage box, and helps to improve the processing efficiency of the wafer processing equipment 10, thereby further improving the production capacity of the wafer processing equipment 10.

[0091] For example, the first opening may be set toward the front-end module 1, and the second opening may be set toward the transmission module 5.

[0092] This makes it easier to place and retrieve wafers into the temporary storage box, further improving the efficiency of placing and retrieving wafers into the temporary storage box, and further improving the processing efficiency of the wafer processing equipment 10.

[0093] Optionally, the first cleaning unit 21 and the second cleaning unit 22 are located on the same side of the temporary storage module 6 in the vertical direction, or the first cleaning unit 21 and the second cleaning unit 22 are located on opposite sides of the temporary storage module 6 in the vertical direction.

[0094] Furthermore, at least two of the first cleaning unit 21, the second cleaning unit 22, and the temporary storage box share some structural components, such as a shared housing, support structure, frame, etc., thereby ensuring a secure connection between the first cleaning unit 21, the second cleaning unit 22, and the temporary storage box. Alternatively, the first cleaning unit 21, the second cleaning unit 22, and the temporary storage box can be set up independently, allowing the height of the first cleaning unit 21, the second cleaning unit 22, and the temporary storage box to be adjusted as needed to facilitate the handling of wafers.

[0095] It is readily understood that the connections between the first cleaning unit 21, the second cleaning unit 22, and the temporary storage module 6 described in the above embodiments can be configured as needed, as long as it ensures that the first cleaning station corresponding to the first cleaning unit 21, the second cleaning station corresponding to the second cleaning unit 22, and the temporary storage station corresponding to the temporary storage box are arranged vertically. Furthermore, the vertical arrangement order of the first cleaning unit 21, the second cleaning unit 22, and the temporary storage box can be adjusted according to actual needs.

[0096] Optionally, such as Figure 1 and Figure 2 As shown, along the first horizontal direction (such as...) Figure 1 (In the direction shown by x), the polishing module 4, the cleaning module 2 and the transmission module 5 are all located between the thinning module 3 and the front-end module 1, and the cleaning module 2 and the front-end module 1 are arranged adjacent to each other.

[0097] This allows for a shorter transmission path between the cleaning module 2 and the front-end module 1, which improves wafer transmission efficiency and thus wafer processing efficiency, thereby increasing the production capacity of the wafer processing equipment 10.

[0098] Wherein, the cleaning module 2 is located between the polishing module 4 and the front end module 1 along the first horizontal direction, or, the cleaning module 2 is located between the thinning module 3 and the front end module 1 along the first horizontal direction, and along the second horizontal direction (e.g. Figure 1 The direction indicated by y in the middle) is set up side by side with polishing module 4.

[0099] This allows the cleaning module 2 and the polishing module 4 to be closer together, resulting in a shorter path for the wafer to travel between the polishing module 4 and the cleaning module 2. This improves the efficiency of wafer transfer, thereby improving the wafer processing efficiency and ultimately increasing the capacity of the wafer processing equipment 10.

[0100] In some embodiments, such as Figure 1 and Figure 2 As shown, the multi-axis robot 51 is disposed within the clearance space formed by the front-end module 1, the thinning module 3, the polishing module 4, and the cleaning module 2. The transmission radius of the multi-axis robot 51 covers the thinning module 3, the polishing module 4, the first cleaning unit 21, and the second cleaning unit 22. The multi-axis robot 51 includes a fixed base, which is disposed close to the front-end module 1, or the fixed base is disposed on the side of the polishing module 4 facing the clearance space.

[0101] This effectively reduces the rotation angle of the multi-axis robot 51 when transferring wafers between the thinning equipment and the polishing equipment, and between the polishing module 4 and the cleaning module 2, thereby improving the efficiency of wafer transfer and further increasing the production capacity of the wafer processing equipment 10.

[0102] The distance between the fixed base and the ground is 1m to 1.5m.

[0103] This allows the multi-axis robot 51 to accommodate the different heights of the thinning module 3, polishing module 4, and cleaning module 2, facilitating the transfer of wafers by the multi-axis robot 51 and thus enabling higher wafer transfer efficiency, which in turn improves the processing efficiency of the wafer processing equipment 10.

[0104] The distance between the fixed base and the ground can be 1m, 1.2m, 1.5m, or any distance between 1m and 1.5m, and is not limited here.

[0105] In some embodiments, such as Figure 2 As shown, the transmission module 5 also includes a transmission transfer device 52, which is disposed between the thinning module 3 and the multi-axis robot 51. The transmission transfer device 52 is used to cooperate with the multi-axis robot 51 to transfer the wafer between at least the thinning module 3 and the polishing module 4.

[0106] This allows the robotic arm of the multi-axis robot 51 to be shorter, resulting in a faster response speed and more flexible picking and transferring of wafers. This improves wafer transfer efficiency and increases the production capacity of the wafer processing equipment 10.

[0107] The transfer device 52 is movably disposed between the thinning module 3 and the multi-axis robot 51, which makes the robotic arm of the multi-axis robot 51 shorter and enables the multi-axis robot 51 to complete the picking and transfer of wafers more flexibly, thereby increasing the production capacity of the wafer processing equipment 10.

[0108] Optionally, the transfer device 52 may include a base, a transfer drive and a transfer platform. The transfer platform is disposed on the base, and the bearing surface is located on the transfer platform. The base is movably disposed between the multi-axis robot 51 and the thinning module 3. The transfer drive is connected to the base and is used to drive the base to reciprocate between the multi-axis robot 51 and the thinning module 3.

[0109] This makes the structure of the transmission relay device 52 relatively simple and easy to implement.

[0110] The transmission drive can be any of the linear motor, electric cylinder, hydraulic cylinder, etc., and is not limited here.

[0111] In addition, the transfer relay device 52 may also include a limiting device, which is disposed on the transfer carrier stage and is used to limit the wafer to a preset position on the carrier surface of the transfer carrier stage.

[0112] Therefore, the transfer device 52 can center the wafer while transferring it, that is, the center of the wafer can be aligned with the geometric center of the bearing surface in the vertical direction, so that the wafer can be transferred to the corresponding position in the thinning module 3 with greater accuracy, which is conducive to improving the wafer processing efficiency and further improving the production capacity of the wafer processing equipment 10.

[0113] For example, the limiting device includes a limiting drive and multiple limiting claws. The multiple limiting claws are arranged around the bearing surface of the transmission carrier stage. The multiple limiting claws are all connected to the limiting drive. The limiting drive is used to drive each limiting claw away from or towards the transmission carrier stage in a direction parallel to the bearing surface, so as to limit the wafer to a preset position on the bearing surface. This makes the structure of the limiting device simple and easy to implement.

[0114] In some embodiments, such as Figure 1 , Figure 2 and Figure 8 As shown, the wafer processing equipment 10 also includes a gas-liquid module 7, which is disposed between the polishing module 4 and the thinning module 3, or the gas-liquid module 7 is disposed on one side of the front end module 1 along the second horizontal direction.

[0115] Therefore, gas and cleaning fluid can be supplied to polishing module 4 and cleaning module 2 through gas-liquid module 7, which effectively simplifies the structure of polishing module 4 and cleaning module 2, reduces the space occupied by polishing module 4 and cleaning module 2, and enables wafer processing equipment 10 to have a more compact layout.

[0116] The cleaning fluid supply unit 72 includes a mixing tank 721, multiple inlet pipes, and multiple dispensing tanks 723. The mixing tank 721 and the multiple dispensing tanks 723 are stacked vertically from bottom to top. The multiple inlet pipes correspond one-to-one with the multiple dispensing tanks 723. Each dispensing tank 723 is equipped with a control pipe. The mixing tank 721 is equipped with a mixing pipe. One end of each control pipe is connected to the corresponding inlet pipe, which is used to introduce cleaning fluid into the corresponding control pipe. The other end of each control pipe is connected to the inlet of the mixing pipe. The outlet of the mixing pipe is connected to at least one of the polishing module 4 and the cleaning module 2. A control valve is provided on the control pipe, which is used to control the flow rate and on / off state of the control pipe.

[0117] Therefore, the mixing tank 721 and the multiple liquid dispensing tanks 723 are stacked vertically from bottom to top. That is, in the vertical direction, the mixing tank 721 is located below the multiple liquid dispensing tanks 723, which simplifies the structure of the cleaning fluid supply unit 72, makes it easier to implement, and also makes the cleaning fluid supply unit 72 occupy less space in the horizontal direction, reducing the space occupied by the gas-liquid module 7 in the horizontal direction, thereby enabling the wafer processing equipment 10 to have a more compact layout.

[0118] The liquid introduced into the inlet pipe can be any of pure water, cleaning fluid, etc., and there is no limitation here.

[0119] In addition, the gas-liquid module 7 may also include a frame 73 and an operation panel 74. The gas supply unit 71, the cleaning fluid supply unit 72 and the operation panel 74 are all mounted on the frame 73. The operation panel 74 is electrically connected to the gas supply unit 71 and the cleaning fluid supply unit 72 respectively, and is used to monitor and control the gas supply of the gas supply unit 71 and the liquid supply of the cleaning fluid supply unit, which facilitates the operation of the staff.

[0120] The mixing tank 721 and multiple liquid preparation tanks 723 are slidably mounted in the frame 73 via slide rails, so as to facilitate the mixing tank 721 and multiple liquid preparation tanks 723 being pulled out or pushed into the frame 73.

[0121] In some embodiments, such as Figures 9-11 As shown, the thinning module 3 may include a first base 31, a turntable 32, and multiple grinding devices 33. The turntable 32 is rotatably mounted on the first base 31, and the turntable 32 is provided with a material loading / unloading station 3b (e.g., Figure 9(as shown in the dashed box) and multiple grinding stations 3a (such as) Figure 9 As shown in the dashed box, a pick-and-place station 3b and multiple grinding stations 3a are spaced around the rotation center axis of the turntable 32. The pick-and-place station 3b is used to place wafers to be thinned or already thinned, so as to facilitate the thinning module 3 to control the thinning rhythm. When the turntable 32 rotates, the wafers located at the pick-and-place station 3b can be rotated sequentially to the multiple grinding stations 3a. After the wafers have undergone thinning processing at the multiple grinding stations 3a, they can return to the pick-and-place station 3b as the turntable 32 rotates. Multiple grinding devices 33 are arranged around the turntable 32 and corresponding to the multiple grinding stations 3a to thin the wafers at the grinding stations 3a.

[0122] Therefore, the same wafer can be thinned multiple times, effectively improving the wafer thinning effect.

[0123] There may be two, three or more grinding stations 3a, and correspondingly, there may be two, three or more grinding devices 33, which are not limited here.

[0124] For example, when there are three grinding stations 3a, the number of grinding devices 33 can also be three, and the three grinding devices 33 can perform three thinning operations on the same wafer. Optionally, the grinding device 33 may include a grinding support, a grinding drive, and a grinding wheel. The grinding support is disposed on the first base 31, the grinding wheel is rotatably connected to the grinding support via a spindle, and the grinding drive is connected to the spindle to drive the spindle to rotate, thereby driving the grinding wheel to rotate, in order to thin the wafer placed on the grinding station 3a. The grinding wheels in different grinding devices 33 have different grit numbers, and can respectively perform rough grinding, fine grinding, and ultra-fine grinding on the wafer to obtain a thinner wafer with a higher surface flatness.

[0125] Additionally, the grinding device 33 may include a dry polishing wheel, replacing the third grinding wheel used for ultra-fine grinding. This allows for sequential rough grinding, fine grinding, and dry polishing of the wafer. The dry polishing wheel rotates to perform dry grinding / polishing on the wafer surface, achieving precise wafer thinning while also ensuring a smooth wafer surface. Therefore, in the above embodiments, the final thinning process performed by the thinning module 3 on the same wafer can be either grinding thinning or dry polishing thinning.

[0126] In some embodiments, such as Figure 9 and Figure 10As shown, the thinning module 3 may also include a pick-and-place device 34 and a thinning transfer device 35. The thinning transfer device 35 is located between the pick-and-place device 34 and the multi-axis robot 51. It is used to temporarily store wafers that have been thinned or wafers to be thinned transferred from the multi-axis robot 51, so as to facilitate the transfer of wafers between the pick-and-place device 34 and the multi-axis robot 51. The pick-and-place device 34 is used to transfer wafers to be thinned from the thinning transfer device 35 to the pick-and-place station 3b, and to transfer wafers that have been thinned to the thinning transfer device 35. This facilitates the pick-and-place of wafers, saves time and effort, and helps to improve the wafer processing efficiency.

[0127] The pick-and-place device 34 may include a robotic arm, which can move wafers between the pick-and-place station 3b and the transfer device 52, and can place wafers at or remove them from the pick-and-place station 3b, which is convenient and fast.

[0128] In other embodiments, such as Figure 2 and Figure 11 As shown, when the transmission module 5 also includes a transmission transfer device 52, the thinning module 3 can be provided with a loading and unloading opening on the side facing the front module 1. The thinning module 3 can also include a pick-and-place device 34, which can extend out of the loading and unloading opening. Alternatively, the transmission transfer device 52 can move into the thinning module 3 through the loading and unloading opening, such as moving into the transmission range of the pick-and-place device 34, to transfer the wafer to be thinned from the transmission transfer device 52 to the pick-and-place station 3b, and to transfer the wafer that has been thinned to the transmission transfer device 52, which facilitates the pick-and-place of the wafer, saving time and effort. Moreover, it is not necessary to set up a thinning transfer device 35 separately in the thinning module 3, which simplifies the structure and number of components of the thinning module 3, reduces the space occupied by the thinning module 3, and allows the wafer processing equipment 10 to have a more compact layout.

[0129] For example, when the thinning module 3 thins the wafer, the multi-axis robot 51 places the wafer to be thinned on the thinning transfer device 35 or the transfer transfer device 52, and the pick-and-place device 34 transfers the wafer to be thinned from the thinning transfer device 35 or the transfer transfer device 52 to the pick-and-place station 3b; then, the turntable 32 can rotate around its rotation center axis to rotate the wafer to the first grinding station 3a, and the corresponding grinding device 33 performs the first thinning on the wafer at the first grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis to rotate the wafer to the second grinding station 3a, and the corresponding grinding... The device 33 performs a second thinning on the wafer located at the second grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis, rotating the wafer to the third grinding station 3a, where the corresponding grinding device 33 performs a third thinning on the wafer located at the third grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis, rotating the wafer to the pick-and-place station 3b, where the pick-and-place device 34 transfers the thinned wafer to the thinning transfer device 35 or the transfer transfer device 52, and finally, the multi-axis robot 51 transfers the thinned wafer located on the thinning transfer device 35 or the transfer transfer device 52 to the polishing module 4.

[0130] As described above, when the first wafer rotates to the second grinding station 3a for the second thinning, the second wafer can be thinned for the first time at the first grinding station 3a. When the first wafer rotates to the third grinding station 3a for the third thinning, the second wafer can rotate to the second grinding station 3a for the second thinning, and the third wafer can be thinned for the first time at the first grinding station 3a. This effectively improves the thinning efficiency of the thinning module 3, thereby further increasing the production capacity of the wafer processing equipment 10.

[0131] In some embodiments, such as Figures 12-14As shown, the polishing module 4 may include a second base 41, a cleaning station 47, a first polishing head 42, a second polishing head 43, and a polishing disk 44. The cleaning station 47 is disposed on the second base 41 and located outside the polishing disk 44. The cleaning station 47 is used to transfer wafers between the transfer module 5 and the polishing heads, and also to clean the polished wafers and polished heads. The first polishing head 42 and the second polishing head 43 are both movably disposed relative to the second base 41. Both the first polishing head 42 and the second polishing head 43 can pick up wafers from the cleaning station 47. The first polishing head 42 and the second polishing head 43 can move between the cleaning station 47 and the polishing disk 44 to... When the second polishing head 43 rotates to the cleaning station 47, it can pick up the wafer to be polished, and then carry the wafer to the polishing disk 44. It can cooperate with the polishing disk 44 to polish the wafer. When one of the first polishing head 42 and the second polishing head 43 picks up the wafer for polishing, the other can be located at the cleaning station 47 to pick up the wafer to be polished, or the polished wafer can be placed in the cleaning station 47. The polishing disk 44 is rotatably disposed on the second base 41. The polishing disk 44 is used to cooperate with the first polishing head 42 or the second polishing head 43 to polish the wafer.

[0132] Therefore, while the first polishing head 42 and the polishing disk 44 are working together to polish the previous wafer, the second polishing head 43 can simultaneously pick up the next wafer. After the previous wafer is polished, the second polishing head 43 can carry the next wafer and work with the polishing disk 44 to polish the next wafer, which effectively improves the polishing efficiency of the polishing module 4 and further increases the production capacity of the wafer processing equipment 10.

[0133] Furthermore, the cleaning station 47 cleans both the polished wafers and the polishing heads, ensuring a cleaner wafer surface and reducing the likelihood of scratches during transport due to impurities on the wafer surface. Simultaneously, it also ensures a cleaner polishing head surface, reducing the likelihood of weak wafer adhesion due to impurities on the polishing head, thus lowering the chance of the wafer falling off due to poor adhesion.

[0134] The polishing module 4 may further include a first driving member 49, a second driving member (not shown in the figure), and a rotating bracket 48. The rotating bracket 48 is rotatably mounted on the second base 41. The first polishing head 42 and the second polishing head 43 are both movably mounted relative to the rotating bracket 48 and are arranged on opposite sides of the rotation center of the rotating bracket 48. The first driving member 49 is connected to the rotating bracket 48 and is used to drive the rotating bracket 48 to rotate relative to the second base 41, so as to drive the first polishing head 42 and the second polishing head 43 to rotate alternately to the polishing disk 44. This simplifies the structure of the polishing module 4, thereby reducing the space occupied by the polishing module 4 and facilitating the compact layout of the wafer processing equipment 10.

[0135] The second driving component is connected to the first polishing head 42 and the second polishing head 43 respectively, and is used to drive the first polishing head 42 and the second polishing head 43 to rotate respectively. When the first polishing head 42 carries the wafer for polishing, the first polishing head 42 can carry the wafer to rotate relative to the polishing disk 44. The polishing disk 44 can rotate around its own rotation center axis, so that the wafer and the polishing disk 44 rotate relative to each other. At this time, the second polishing head 43 can pick up the next wafer and wait. When the second polishing head 43 carries the wafer for polishing, the second driving component can drive the second polishing head 43 to rotate, so as to drive the wafer to rotate.

[0136] The aforementioned cleaning station 47 may include a stage and a cleaning nozzle disposed on the upper side of the stage. The stage is used to place wafers, and the cleaning nozzle is disposed facing the stage. The cleaning nozzle is connected to a cleaning fluid tank through a pipeline to clean the polished wafers located on the stage, or to clean the polished polishing heads located on the upper side of the stage.

[0137] In addition, the cleaning station 47 can be set on the side of the polishing disk 44 facing the transmission module 5 on the second base 41, so that the transmission module 5 can place the wafer to be polished on the cleaning station 47 and remove the polished wafer from the cleaning station 47, which is beneficial to improving the wafer processing efficiency of the wafer processing equipment 10, thereby improving the production capacity of the wafer processing equipment 10.

[0138] like Figure 14 As shown, a polishing pad (not shown) is laid on the polishing disk 44. A polishing slurry supplier 45 can also be provided on one side of the polishing disk 44. The spray nozzle of the polishing slurry supplier 45 is set towards the polishing pad. The polishing disk 44 can rotate together with the polishing pad. When polishing the wafer, the wafer and the polishing pad come into contact and relative motion occurs between the wafer and the polishing pad. At the same time, the polishing slurry supplier 45 sprays polishing slurry onto the polishing pad so that the polishing slurry chemically etches the wafer surface and the particles in the polishing slurry mechanically grind the wafer, thereby achieving fine removal and planarization of the wafer.

[0139] Furthermore, such as Figure 14 As shown, the polishing module 4 also includes a polishing pad conditioner 46, which is disposed on one side of the polishing disk 44 and is used to condition the polishing pad. That is, during wafer polishing, the polishing pad conditioner 46 can smooth the surface morphology of the polishing pad and remove impurity particles remaining on the surface of the polishing pad, such as abrasive particles removed from the polishing fluid and waste materials falling off the wafer surface, so as to ensure the consistency of the surface morphology of the polishing pad during polishing and make the polishing effect of the wafer more stable.

[0140] Optionally, the polishing module 4 may further include a third driving component. The third driving component can be connected to the first polishing head 42 and the second polishing head 43 respectively via a connector. The third driving component is used to drive the first polishing head 42 and the second polishing head 43 to reciprocate radially along the polishing pad 44. That is, when the polishing head cooperates with the polishing pad 44 to polish the wafer, the polishing head can not only rotate, but also reciprocate radially along the polishing pad 44, so that the surface of the wafer in contact with the polishing pad can be gradually polished and planarized.

[0141] The wafer moves radially back and forth along the polishing disk 44, which can be either a linear movement or a curved movement, and there is no limitation on this.

[0142] In summary, when the wafer processing equipment 10 includes a front-end module 1, a thinning module 3, a polishing module 4, a transfer module 5, a temporary storage module 6, and a cleaning module 2, the wafer processing can specifically be as follows: First, the front-end transfer device 11 removes the wafer to be processed from the wafer cassette 12 and transfers it to the temporary storage module 6; Second, the transfer module 5 removes the wafer to be processed from the temporary storage module 6 and transfers it to the thinning module 3 for thinning. For example, the multi-axis robot 51 transfers the wafer to be processed from the temporary storage module 6 to the transfer transfer device 52 or the thinning transfer device 35, and the loading and unloading device 34 in the thinning module 3 transfers the wafer... The wafer is moved from the pick-and-place station 3b to the grinding station 3a by the rotating table 32. The grinding device 33 thins the wafer located at the grinding station 3a, completing the wafer thinning. The rotating table 32 then moves the wafer to the pick-and-place station 3b, where the pick-and-place device 34 removes the wafer from the pick-and-place station 3b. Before transferring the wafer to the thinning transfer device 35 or the transfer transfer device 52, the pick-and-place device 34 picks up the wafer and performs unloading and cleaning at the unloading and cleaning station. Then, the pick-and-place device 34 places the wafer into the thinning transfer device 35 or the transfer transfer device 52. In the third step, the multi-axis robot 51... The thinned wafer is transferred to the polishing module 4, where it is polished. For example, after picking up the wafer from the thinning transfer device 35 or the transfer transfer device 52, the multi-axis robot 51 rotates the wafer 180° and places it with the thinned side down on the cleaning station 47 in the polishing module 4. The polishing head picks up the wafer and rotates to the polishing disk 44, where it cooperates with the polishing disk 44 to polish the wafer. Then, the polishing head places the polished wafer on the cleaning station 47, which cleans the polished wafer. In the fourth step, the multi-axis robot 51 moves the wafer from the cleaning station 47... The polished wafer is removed and transferred to the cleaning module 2. The cleaning module 2 cleans and dries the wafer. For example, after the multi-axis robot 51 picks up the polished wafer, it flips the wafer 180° so that the polished side of the wafer faces upward. Then, the wafer is placed in the first cleaning unit 21 for the first cleaning. Then, the multi-axis robot 51 transfers the wafer from the first cleaning unit 21 to the second cleaning unit 22 for the second cleaning and drying. In the fifth step, the front-end transfer device 11 takes the dried wafer out of the second cleaning unit 22 and places it in the wafer cassette 12 to complete the wafer processing.

[0143] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer processing apparatus characterized by comprising: include: A front-end module, which is used to place the wafer to be processed and the wafer that has been processed; A thinning module, used to thin the wafer to be processed; A polishing module is disposed downstream of the thinning module, and the polishing module is used to polish the thinned wafer; A cleaning module is disposed downstream of the polishing module. The cleaning module includes a first cleaning unit and a second cleaning unit, which are stacked vertically. The first cleaning unit is used to clean the polished wafer, and the second cleaning unit is used to perform post-cleaning processing on the wafer cleaned by the first cleaning unit. The transfer module includes a multi-axis robot arm. The thinning module, the polishing module, and the cleaning module are all within the transfer range of the multi-axis robot arm. The multi-axis robot arm is used to transfer the wafer between at least two of the thinning module, the polishing module, the first cleaning unit, and the second cleaning unit. The multi-axis robot arm is also used to transfer the polished wafer to the first cleaning unit.

2. The wafer processing apparatus according to claim 1, wherein The second cleaning unit has a discharge opening located within the transmission range of the multi-axis robot and a pick-up opening facing the front-end module.

3. The wafer processing equipment according to claim 2, characterized in that, The wafer processing equipment also includes a temporary storage module for temporarily storing the wafer to be processed. The temporary storage module, the first cleaning unit, and the second cleaning unit are stacked vertically. The temporary storage module is located within the transmission range of the multi-axis robot. The multi-axis robot is also used to remove the wafer to be processed from the temporary storage module.

4. The wafer processing apparatus according to claim 3, wherein The front-end module includes a front-end transmission device and a wafer cassette. The front-end transmission device is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette. The temporary storage module is also located within the transmission range of the front-end transmission device, so that the front-end transmission device can transfer the wafer to be processed from the wafer cassette to the temporary storage module.

5. The wafer processing apparatus according to claim 4, wherein The second cleaning unit is located within the transmission range of the front-end transmission device, so that the front-end transmission device can move the wafer processed by the second cleaning unit from the second cleaning unit to the wafer cassette.

6. The wafer processing apparatus according to any one of claims 1 to 5, characterized by Along the first horizontal direction, the polishing module, the cleaning module, and the transmission module are all located between the thinning module and the front-end module, and the cleaning module is arranged adjacent to the front-end module.

7. The wafer processing apparatus according to claim 6, wherein The cleaning module is located between the polishing module and the front end module along the first horizontal direction, or the cleaning module is located between the thinning module and the front end module along the first horizontal direction, and is arranged side by side with the polishing module along the second horizontal direction.

8. The wafer processing equipment according to any one of claims 1-5, characterized in that, The multi-axis robot is positioned within the clearance space formed by the front-end module, the thinning module, the polishing module, and the cleaning module. The transmission radius of the multi-axis robot covers the thinning module, the polishing module, the first cleaning unit, and the second cleaning unit. The multi-axis robot includes a fixed base, which is located near the front end module, or the fixed base is located on the side of the polishing module facing the clearance space.

9. The wafer processing apparatus according to any one of claims 1 to 5, wherein The transmission module further includes a transmission transfer device, which is disposed between the thinning module and the multi-axis robot. The transmission transfer device is used to cooperate with the multi-axis robot to transfer the wafer between at least the thinning module and the polishing module.

10. The wafer processing apparatus according to any one of claims 1 to 5, wherein The wafer processing equipment further includes a gas-liquid module, which is disposed between the polishing module and the thinning module, or the gas-liquid module is disposed on one side of the front end module along the second horizontal direction.

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