A wafer processing equipment

Abstract

This application discloses a wafer processing equipment. The equipment includes a front-end module, an edge trimming module, a thinning module, a polishing module, and a transfer module. The front-end module's front-end transfer device is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette. The edge trimming module is used to trim the edge of the wafer to be processed and is located within the transfer range of the front-end transfer device, enabling the front-end transfer device to transfer the wafer to be processed from the wafer cassette to the edge trimming module. The thinning module is used to thin the trimmed wafer. The polishing module is used to polish the thinned wafer. The multi-axis robot in the transfer module cooperates with a transfer transfer device to transfer the wafer at least between the thinning module and the polishing module. This wafer processing equipment achieves ultra-high cleanliness wafer trimming, thinning, and polishing processing, occupies little space, facilitates compact equipment layout, and has high throughput.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and in particular to a wafer processing equipment. Background Technology

[0002] In the wafer processing, processes such as wafer thinning and polishing are usually performed by separate equipment. That is, the wafer is transferred between these separate devices through a transport structure to complete the processing.

[0003] However, when wafers are transferred between independent devices, each device needs to be equipped with a corresponding loading and unloading structure to achieve loading and unloading on each device. This usually results in the wafer transfer structure needing to coordinate with multiple loading and unloading structures, increasing the complexity and difficulty of wafer transfer, making wafer processing more difficult and hindering the improvement of wafer processing efficiency. Utility Model Content

[0004] This application discloses a wafer processing equipment that can effectively simplify the wafer transfer process, greatly improve wafer processing efficiency, and help increase the production capacity of wafer processing equipment.

[0005] To achieve the above objectives, embodiments of this application disclose a wafer processing apparatus, comprising:

[0006] The front-end module includes a front-end transfer device and a wafer cassette. The front-end transfer device is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette.

[0007] The trimming module is used to trim the edge of the wafer to be processed. The trimming module is located within the transmission range of the front-end transmission device so that the front-end transmission device can transfer the wafer to be processed from the wafer cassette to the trimming module.

[0008] A thinning module is disposed downstream of the trimming module, and the thinning module is used to thin the trimmed wafer;

[0009] A polishing module is disposed downstream of the thinning module, and the polishing module is used to perform mechanical and chemical polishing on the thinned wafer;

[0010] The transmission module includes a multi-axis robot and a transmission transfer device. The multi-axis robot cooperates with the transmission transfer device to transfer the wafer between at least the thinning module and the polishing module.

[0011] Optionally, along the first horizontal direction, the polishing module, the multi-axis robot, and the transfer device are all located between the thinning module and the front-end module. The multi-axis robot is positioned close to the front-end module, and the transfer device is positioned between the thinning module and the multi-axis robot. The transfer device has a bearing surface for bearing the wafer.

[0012] Optionally, the front-end module has two opposite sides along a second horizontal direction, and the multi-axis manipulator is disposed close to one of the two sides, wherein the side closest to the fixed position of the multi-axis manipulator along the second horizontal direction is the first side;

[0013] The trimming module is disposed on the first side along the first horizontal direction, and the trimming module protrudes relative to the front end module. The second horizontal direction is perpendicular to the first horizontal direction.

[0014] Optionally, the transfer device is movably disposed between the thinning module and the multi-axis robot.

[0015] Optionally, the transfer device includes a base, a transfer drive, and a transfer platform. The transfer platform is disposed on the base, and the bearing surface is located on the transfer platform. The base is movably disposed between the multi-axis robot and the thinning module. The transfer drive is connected to the base and is used to drive the base to reciprocate between the multi-axis robot and the thinning module.

[0016] Optionally, the trimming module includes a trimming and blanking opening facing the thinning module, the trimming and blanking opening being located within the transmission range of the multi-axis robot.

[0017] Optionally, the wafer processing equipment further includes a cleaning module, which is disposed between the polishing module and the front-end module. The cleaning module is used to clean the polished wafer and perform post-cleaning processing.

[0018] The cleaning module is located within the transmission range of the multi-axis robot, which is also used to transfer the polished wafer to the cleaning module.

[0019] The cleaning module is also located within the transmission range of the front-end transmission device, which is also used to transfer the wafer that has completed cleaning and post-processing from the cleaning module to the wafer cassette.

[0020] Optionally, the cleaning module includes a first cleaning unit and a second cleaning unit. The first cleaning unit is used to perform a first cleaning on the polished wafer, and the second cleaning unit is used to perform a second cleaning and drying on the wafer after the first cleaning.

[0021] Optionally, the second cleaning unit includes a discharge opening located within the transmission range of the multi-axis robot and a pick-up opening located within the transmission range of the front-end transmission device.

[0022] Optionally, the multi-axis manipulator includes either a five-axis manipulator or a six-axis manipulator.

[0023] Compared with the prior art, this application has at least the following beneficial effects:

[0024] In this application, the wafer processing equipment can trim the wafer using an edge trimming module, thin the trimmed wafer using a thinning module, and perform mechanical and chemical polishing on the thinned wafer using a polishing module. Furthermore, the reuse of the transfer module effectively simplifies the structure and number of transfer devices for transferring wafers between modules. In other words, the wafer processing equipment has a high degree of integration, which not only allows for a more compact layout but also simplifies the wafer transfer process, thereby improving wafer processing efficiency and ultimately increasing the production capacity of the wafer processing equipment. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the structure of a wafer processing equipment provided in an embodiment of this application;

[0027] Figure 2 This is a schematic diagram of a combination of a front-end module and a trimming module provided in an embodiment of this application;

[0028] Figure 3 This is a perspective view of a trimming module provided in an embodiment of this application;

[0029] Figure 4 This is a schematic diagram of a trimming module performing trimming on a wafer according to an embodiment of this application;

[0030] Figure 5 This is a schematic diagram of the structure of a cleaning module provided in an embodiment of this application;

[0031] Figure 6 This is a perspective view of a cleaning module provided in an embodiment of this application;

[0032] Figure 7 This is a schematic diagram of the structure of the first thinning module provided in the embodiments of this application;

[0033] Figure 8 This is a schematic diagram of the structure of the second thinning module provided in the embodiments of this application;

[0034] Figure 9 This is a schematic diagram of the structure of the first polishing module provided in the embodiments of this application;

[0035] Figure 10 This is a schematic diagram of the structure of a combination of a first polishing head, a second polishing head, a rotating bracket, and a first driving component provided in an embodiment of this application;

[0036] Figure 11 This is a schematic diagram of the structure of the second polishing module provided in the embodiments of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1-Front-end module; 11-Front-end transmission device; 12-Wafer box; 13-Rack; 14-Safety light curtain; 15-First side;

[0039] 2- Trimming module; 21- Trimming support platform; 221- Supporting surface; 22- Trimming device; 23- Rotation drive component; 24- First guide rail; 25- First slider; 26- Second guide rail; 27- Camera;

[0040] 3-Thinning module; 3a-Grinding station; 3b-Material handling station; 31-First base; 32-Turntable; 33-Grinding device; 34-Material handling device;

[0041] 4-Polishing module; 41-Second base; 42-First polishing head; 43-Second polishing head; 44-Polishing disc; 45-Polishing fluid supply; 46-Polishing pad conditioner; 47-Cleaning station; 48-Rotating bracket; 49-First drive component;

[0042] 5-Transmission module; 51-Multi-axis robot; 52-Transmission transfer device;

[0043] 7-Cleaning module; 71-First cleaning unit; 72-Second cleaning unit; 721-Discharge opening; 722-Removal opening;

[0044] 10 - Wafer processing equipment; 20 - Wafer. Detailed Implementation

[0045] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0046] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0047] Furthermore, in addition to indicating direction or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0048] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0049] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0050] In the field of wafer fabrication, key processes such as thinning, polishing, and cleaning are typically performed by separate pieces of equipment. For example, wafer thinning is performed using a wafer thinning machine, and chemical mechanical polishing is performed using a wafer polishing machine.

[0051] Among them, wafer thinning machines, also known as wafer grinding machines, are a type of equipment specifically used for fine processing of the surface of semiconductor wafers. Wafer thinning machines reduce the thickness of wafers by grinding them.

[0052] A wafer polishing machine, also known as a chemical mechanical polishing machine, uses the synergistic effect of chemical etching and mechanical abrasion to achieve global planarization of the wafer surface.

[0053] However, when wafers are transferred between independent devices, each device needs to be equipped with its own loading and unloading structure to achieve loading and unloading on each device. As a result, the transfer structure usually needs to coordinate with the loading and unloading structure of each device to perform corresponding processing during the transfer process. This increases the complexity and difficulty of wafer transfer, making wafer processing more difficult and hindering the improvement of wafer processing efficiency.

[0054] Based on this, this application discloses a wafer processing equipment that can effectively simplify the wafer transfer process, greatly improve wafer processing efficiency, and help increase the production capacity of wafer processing equipment.

[0055] The technical solution of this application will be described in detail below with reference to specific embodiments and accompanying drawings.

[0056] This application provides a wafer processing equipment, such as... Figure 1 As shown, the module includes a front-end module 1, an edge trimming module 2, a thinning module 3, a polishing module 4, and a transfer module 5. The front-end module 1 includes a front-end transfer device 11 and a wafer cassette 12. The front-end transfer device 11 is used to remove the wafer to be processed from the wafer cassette 12 and to transfer the processed wafer to the wafer cassette 12. The edge trimming module 2 is used to trim the edge of the wafer to be processed. The edge trimming module 2 is located within the transfer range of the front-end transfer device 11, enabling the front-end transfer device 11 to transfer the wafer to be processed from the wafer cassette 12 to the edge trimming module 2. The thinning module 3 is located downstream of the edge trimming module 2 and is used to thin the trimmed wafer. The polishing module 4 is located downstream of the thinning module 3 and is used to perform mechanical and chemical polishing on the thinned wafer. The transfer module 5 includes a multi-axis robot 51 and a transfer transfer device 52. The multi-axis robot 51 cooperates with the transfer transfer device 52 to transfer the wafer at least between the thinning module 3 and the polishing module 4.

[0057] It should be clarified that the aforementioned placement of the thinning module 3 downstream of the trimming module 2 means that in the wafer processing flow, the thinning module 3 is located downstream of the trimming module 2. In other words, the wafer is first processed by the trimming module 2 and then transported to the thinning module 3 for further processing. It does not mean that the thinning module 3 is located downstream of the trimming module 2 in terms of orientation or layout. Similarly, the placement of the polishing module 4 downstream of the thinning module 3 means that in the wafer processing flow, the polishing module 4 is located downstream of the thinning module 3.

[0058] In this embodiment, the wafer processing equipment 10 can trim the wafer using the trimming module 2, thin the trimmed wafer using the thinning module 3, and perform mechanical and chemical polishing on the thinned wafer using the polishing module 4. Furthermore, the wafer can be transferred and moved between the front-end module 1, trimming module 2, thinning module 3, and polishing module 4 via the transmission module 5 and the front-end transmission device 11 in the front-end module 1. This means the wafer processing equipment 10 has a high degree of integration, which not only reduces the space occupied by the wafer processing equipment 10 and allows for a more compact layout, but also improves wafer processing efficiency, thereby enhancing the overall performance of the wafer processing equipment 10.

[0059] The front-end module 1 includes a front-end transfer device 11 and a wafer cassette 12. The front-end transfer device 11 is used to remove the wafer to be processed from the wafer cassette 12 and to transfer the processed wafer to the wafer cassette 12. That is, the wafer processed by the wafer processing equipment 10 can be temporarily placed in the wafer cassette 12 to realize the loading and unloading of wafers on the wafer processing equipment 10, saving time and effort.

[0060] The edge trimming module 2 can trim the edges of the wafer to be processed, reducing the probability of edge chipping when the wafer is thinned by the thinning module 3, thereby improving the processing quality of the wafer by the wafer processing equipment 10.

[0061] By placing the trimming module 2 within the transmission range of the front-end transfer device 11, the front-end transfer device 11 can transfer the wafers to be processed from the wafer cassette 12 to the trimming module 2. This allows the front-end transfer device 11 of the front-end module 1 to handle both wafer loading and transfer between the front-end module 1 and the trimming module 2, effectively simplifying the wafer transfer structure and the number of transfer devices between modules. Specifically, firstly, there is no need to set up a separate loading structure for the trimming module 2, reducing the structure and number of components of the trimming module 2, thus allowing the trimming module 2 to have a smaller size and less space occupation, thereby enabling a more compact layout of the wafer processing equipment 10. Secondly, by reusing the front-end transport device, the trimming module 2 and the front-end module 1 are both located within the working range of the same front-end transfer device 11, making the transfer of wafers between the wafer cassette 12 and the trimming module 2 simpler and the transfer path shorter, effectively simplifying the wafer transfer process, improving wafer processing efficiency, and facilitating the increase in the capacity of the wafer processing equipment 10.

[0062] The multi-axis robot 51, in conjunction with the transfer and relay device 52, is used to transfer wafers between at least the thinning module 3 and the polishing module 4. This allows the transfer module 5 to have multiple degrees of freedom, satisfying various spatial positioning and orientation requirements for the transferred wafers. This makes wafer transfer convenient and efficient, further improving wafer processing efficiency and increasing the throughput of the wafer processing equipment 10. Furthermore, directly transferring wafers between the thinning module 3 and the transfer module 5 using the multi-axis robot 51 and the transfer and relay device 52 allows for closer spacing between the two modules, further reducing the space occupied by the wafer processing equipment 10 and making its layout more compact.

[0063] The thinning module 3 can thin the wafer that has been trimmed by the trimming module 2 to reduce the thickness of the wafer.

[0064] The polishing module 4 can perform chemical mechanical polishing on the wafer after it has been thinned by the thinning module 3, so as to perform fine removal and planarization on the thinned surface of the wafer.

[0065] The front-end transmission device 11 can be a robotic arm or a combination of a transfer device and a robotic arm, and there is no limitation on it here.

[0066] For example, when the front-end transmission device 11 includes a robotic arm, the robotic arm can be movable relative to the trimming module 2, and can move at least between the wafer cassette 12 and the trimming module 2, so that the front-end transmission device 11 can simultaneously pick up and place wafers onto the wafer cassette 12 and place wafers onto the trimming module 2. Of course, in other embodiments, both the trimming module 2 and the wafer cassette 12 may be within the transmission radius of the front robotic arm, and the rotation range of the free end of the robotic arm may cover both the trimming module 2 and the wafer cassette 12.

[0067] The aforementioned multi-axis robot 51 may include either a five-axis robot or a six-axis robot, enabling the multi-axis robot 51 to have more degrees of freedom to meet more spatial positioning and posture requirements for transporting wafers, making wafer transport more convenient and efficient, further improving wafer processing efficiency, and further facilitating the increase in the production capacity of the wafer processing equipment 10.

[0068] Optionally, such as Figure 1 As shown, along the first horizontal direction (such as...) Figure 1 (In the direction shown by x), the polishing module 4, the multi-axis robot 51 and the transfer device 52 are all located between the thinning module 3 and the front-end module 1. The multi-axis robot 51 is set close to the front-end module 1, and the transfer device 52 is set between the thinning module 3 and the multi-axis robot 51. The transfer device 52 has a bearing surface 221, which is used to bear the wafer.

[0069] Therefore, the multi-axis robot 51 can place the wafer to be thinned on the transfer device 52. The wafer can be transferred to the thinning module 3 through the transfer device 52. After the wafer is thinned by the thinning module 3, it can be transferred from the thinning module 3 to the transfer device 52. Then, the multi-axis robot 51 can transfer the thinned wafer from the transfer device 52 to the polishing module 4. This allows the multi-axis robot 51 to transfer the wafer between the transfer device and the polishing module 4 with a small rotation angle, making the transfer between the thinning module 3 and the polishing module 4 more convenient and efficient, and more conducive to improving the production capacity of the wafer processing equipment 10. Moreover, when the transfer device 52 can also temporarily store wafers, it can also facilitate the adjustment of the wafer processing rhythm.

[0070] In addition, when the distance between the thinning module 3 and the front-end module 1 is constant, the multi-axis robot 51 is positioned close to the front-end module 1, and the transfer device 52 is positioned between the thinning module 3 and the multi-axis robot 51. This allows the robotic arm of the multi-axis robot 51 to be shorter, resulting in a faster response speed and more flexible wafer picking and transfer operations. This improves the efficiency of wafer transfer and thus increases the production capacity of the wafer processing equipment 10.

[0071] like Figure 1 and Figure 2 As shown, the front-end module 1 has a second horizontal direction (such as...) Figure 1 On the two sides opposite to each other (in the direction shown in the middle y), the side closest to the fixed position of the multi-axis robot 51 along the second horizontal direction is the first side 15. The trimming module 2 is set on the first side 15. Along the first horizontal direction, the trimming module 2 protrudes from the front end module 1. The second horizontal direction is perpendicular to the first horizontal direction.

[0072] This allows the trimming module 2 to be located within the transmission range of the multi-axis robot 51, enabling the multi-axis robot 51 to remove the wafer from the trimming module 2. This eliminates the need for a separate unloading structure for the trimming module 2, further reducing its structure and the number of components, resulting in a smaller trimming module 2 and less space requirements. Consequently, the wafer processing equipment 10 can have a more compact layout. Furthermore, by reusing the multi-axis robot 51, both the trimming module 2 and the transfer device 52 are located within the same working range. This simplifies the wafer transfer process and shortens the transmission path between the trimming module 2 and the transfer device 52, effectively simplifying the wafer transfer process and further improving wafer processing efficiency, thus increasing the production capacity of the wafer processing equipment 10. In addition, the robotic arm of the multi-axis robot 51 can be made shorter, enabling the multi-axis robot 51 to complete the picking and transfer of wafers more flexibly, thereby increasing the production capacity of the wafer processing equipment 10.

[0073] The trimming module 2 protrudes from the front-end module 1. Specifically, the trimming module 2 protrudes from the side of the front-end module 1 away from the thinning module 3. This allows the trimming module 2 and the front-end module 1 to occupy less space along the second horizontal direction, which is beneficial for the compact layout of the wafer processing equipment 10.

[0074] For example, such as Figure 2 As shown, the aforementioned front-end module 1 may include a frame 13, which extends along a second horizontal direction, and the trimming module 2 is arranged side by side with the frame 13 along the second horizontal direction.

[0075] Therefore, the dimensions of the wafer processing equipment 10 along the first horizontal direction can also be smaller, so that the space occupied by the wafer processing equipment 10 along the first horizontal direction will not be too large, thus allowing the wafer processing equipment 10 to have a more compact layout.

[0076] Optionally, as shown in the figure, the rack 13 has a first clearance space extending along a second horizontal direction, and the front-end transmission device 11 is disposed within the first clearance space.

[0077] The front-end transmission device 11 can be movably disposed within the first clearance space, so that the front-end transmission device 11 can have a relatively wide transmission range. For example, the front-end module 1 may also include a transmission driver connected to the front-end transmission device 11, for driving the front-end transmission device 11 to move within the first clearance space.

[0078] Optionally, such as Figure 1 and Figure 2As shown, the trimming module 2 protrudes from the frame 13 on the side away from the thinning module 3. The part of the trimming module 2 protruding from the frame 13 together with the frame 13 defines the receiving area. The part of the trimming module 2 protruding from the frame 13 facing the frame 13 and the side of the frame 13 away from the thinning module 3 form part of the boundary of the receiving area.

[0079] This allows the trimming module 2 and the front-end module 1 to occupy less space along the second horizontal direction, which is beneficial for the compact layout of the wafer processing equipment 10.

[0080] In addition, the side of the frame 13 facing the thinning module 3 and the side of the trimming module 2 facing the thinning module 3 can be aligned along the second horizontal direction to facilitate the layout of the polishing module 4 and the thinning module 3.

[0081] like Figure 2 As shown, the wafer cassette 12 is disposed on the side of the rack 13 away from the thinning module 3 and is located in the accommodating area.

[0082] This allows for a more compact layout of the front-end module 1 and the trimming module 2, resulting in a smaller space occupied by the front-end module 1 and the trimming module 2, and thus enabling the wafer processing equipment 10 to have a more compact layout.

[0083] The number of wafer boxes 12 can be multiple, and multiple wafer boxes 12 can be arranged along the second horizontal direction, which reduces the space occupied by the front-end equipment along the first horizontal direction. At the same time, multiple wafer boxes 12 can be located on one side of the transmission path of the front-end transmission device 11 to the trimming module 2, shortening the wafer transmission path and improving the wafer processing efficiency of the wafer processing equipment 10, thereby improving the production capacity of the wafer processing equipment 10.

[0084] In addition, two safety light curtains 14 are provided on the side of the rack 13 away from the thinning module 3, which are opposite each other in the second horizontal direction. The wafer box 12 is also located between the two safety light curtains 14. The safety light curtains 14 are used to perform safety detection during crane interaction to prevent the wafer box 12 from being hit, thus avoiding the impact on the wafer inside the wafer box 12 due to being hit.

[0085] Optionally, the transfer device 52 is movably disposed between the thinning module 3 and the multi-axis robot 51.

[0086] Therefore, while enabling the transmission module 5 to have a wider transmission range, it also allows the robotic arm of the multi-axis robot 51 to be shorter, enabling the multi-axis robot 51 to more flexibly complete the picking and transmission of wafers, thereby increasing the production capacity of the wafer processing equipment 10.

[0087] The transfer device 52 includes a base, a transfer drive and a transfer platform. The transfer platform is mounted on the base, and the bearing surface 221 is located on the transfer platform. The base is movably mounted between the multi-axis robot 51 and the thinning module 3. The transfer drive is connected to the base and is used to drive the base to reciprocate between the multi-axis robot 51 and the thinning module 3.

[0088] This makes the structure of the transmission relay device 52 relatively simple and easy to implement.

[0089] The transmission drive can be any of the linear motor, electric cylinder, hydraulic cylinder, etc., and is not limited here.

[0090] In addition, the transfer relay device 52 may also include a limiting device, which is disposed on the transfer carrier stage and is used to limit the wafer to a preset position on the carrier surface 221 of the transfer carrier stage.

[0091] Therefore, the transfer device 52 can center the wafer while transferring the wafer, that is, the center of the wafer can be aligned with the geometric center of the bearing surface 221 in the vertical direction, so that the wafer can be transferred to the corresponding position in the thinning module 3 with greater accuracy, which is conducive to improving the wafer processing efficiency and further improving the production capacity of the wafer processing equipment 10.

[0092] For example, the limiting device includes a limiting drive and multiple limiting claws. The multiple limiting claws are arranged around the bearing surface 221 of the transmission carrier stage. The multiple limiting claws are all connected to the limiting drive. The limiting drive is used to drive each limiting claw away from or towards the transmission carrier stage in a direction parallel to the bearing surface 221, so as to limit the wafer to a preset position on the bearing surface 221. This makes the structure of the limiting device simple and easy to implement.

[0093] Optionally, the trimming module 2 includes a trimming and blanking opening (not shown in the figure) facing the thinning module 3, and the trimming and blanking opening is located within the transmission range of the multi-axis robot 51.

[0094] This greatly facilitates the multi-axis robot 51 in picking up the trimmed wafers from the trimming module 2, which is beneficial to improving wafer processing efficiency and thus further improving the production capacity of the wafer processing equipment 10.

[0095] The trimming and feeding opening can be set on the side of the trimming module 2 facing the thinning module 3, so that the multi-axis robot 51 can rotate at a smaller angle and pick up the wafer from the trimming module 2. This is convenient, efficient, and conducive to improving the wafer processing efficiency, thereby improving the production capacity of the wafer processing equipment 10.

[0096] like Figure 3 and Figure 4As shown, the trimming module 2 may further include a trimming base (not shown in the figure), a trimming support platform 21, a trimming device 22, and a rotation drive 23. The trimming feeding opening can be set on the trimming base. The trimming support platform 21 is movably set relative to the trimming base. The trimming support platform 21 is located within the transmission range of the transmission module 5. The trimming support platform 21 has a support surface 221, which is used to place the wafer 20 to be trimmed. The trimming device 22 is set on one side of the trimming support platform 21 and is used to trim the wafer 20 placed on the trimming support platform 21. The rotation drive 23 is connected to the trimming support platform 21 and is used to drive the trimming support platform 21 to rotate so that the trimming device 22 can trim the wafer 20.

[0097] Therefore, when trimming the wafer 20, the front-end transmission device 11 can place the wafer 20 on the bearing surface 221, and then the trimming bearing stage 21 rotates relative to the trimming base. The trimming device 22 processes the edge of the wafer 20 located on the bearing surface 221. After the trimming bearing stage 21 carries the wafer 20 and rotates one revolution, the trimming of the edge of the wafer 20 can be completed. The operation is simple and quick.

[0098] The trimming support platform 21 may be provided with a vacuum adsorption hole on its support surface 221. The vacuum adsorption hole can be connected to a vacuum pump through a pipeline to vacuum adsorb and fix the wafer 20 placed on the support surface 221. This effectively prevents the wafer 20 from shifting during the trimming process, which would cause a large dimensional deviation and improve the trimming quality.

[0099] The rotating drive component 23 can be any of the following: motor, electric motor, rotary cylinder, etc., and is not limited to any one of them.

[0100] In addition, the trimming module 2 may also include a camera 27, which can take a picture of the position of the wafer 20 on the support surface 221 when the wafer 20 is placed on the support surface 221, so as to obtain the center information of the wafer 20, so as to ensure that the center of the wafer 20 coincides with the center of the support surface 221 before the trimming process.

[0101] Optionally, the trimming module 2 may further include a first moving drive, a second moving drive, a first guide rail 24, a second guide rail 26, a first slider 25, and a second slider. The second guide rail 26 is disposed on the trimming base and extends along a second horizontal direction. The second slider is connected to the first guide rail 24 and slidably connected to the second guide rail 26. The first slider 25 is connected to the trimming support platform 21 and slidably connected to the first guide rail 24. The first moving drive is connected to the trimming support platform 21 and is used to drive the trimming support platform 21 to move along a first horizontal direction so that the first slider 25 slides relative to the first guide rail 24 along the first horizontal direction. The second moving drive is connected to the first guide rail 24 and is used to drive the first guide rail 24 to move relative to the second guide rail 26 along a second horizontal direction so that the trimming support platform 21 moves along the second horizontal direction via the first slider 25.

[0102] Therefore, by adjusting the position of the trimming support stage 21 in the first horizontal direction and the second horizontal direction through the first moving drive component and the second moving drive component, the position of the wafer 20 located on the support surface 221 in the first horizontal direction and the second horizontal direction can be adjusted, so that the relative position of the wafer 20 and the trimming device 22 can be adjusted, and the trimming range of the wafer 20 can be flexibly adjusted according to the requirements.

[0103] The trimming support platform 21 is guided to move along the first horizontal direction by the cooperation of the first slider 25 and the first guide rail 24, so as to prevent the trimming support platform 21 from deviating along the first horizontal direction; the first guide rail 24 can be guided to move along the second horizontal direction by the cooperation of the second slider and the second guide rail 26, and then the trimming support platform 21 can be guided to move along the second horizontal direction by the first slider 25, so as to prevent the trimming support platform 21 from deviating along the second horizontal direction.

[0104] The first horizontal direction and the second horizontal direction are perpendicular to each other.

[0105] The aforementioned trimming device 22 may include a focusing unit to trim the wafer 20 with a laser, or it may include a trimming wheel to trim the wafer 20 with a trimming wheel; there is no limitation on this.

[0106] Optionally, when the trimming device 22 includes a focusing unit, the focusing unit is positioned facing the bearing surface 221. The focusing unit focuses the laser beam inside the wafer 20, allowing for laser-based refining of the edge region of the wafer 20. The trimming bearing stage 21 rotates the wafer 20, thereby forming annular refining regions within the edge region of the wafer 20. Furthermore, the focusing position of the laser beam radially within the wafer 20 and / or along the thickness direction can be changed as needed, thereby forming multiple annular refining regions within the edge region of the wafer 20. This allows the edge region of the wafer 20 to fracture along cracks in these refining regions when subjected to pressure, effectively preventing edge chipping and scrapping of the wafer 20 due to uncontrollable crack / fracture paths in the edge region during pressure-induced thinning processes.

[0107] Optionally, after the modified region is formed inside the edge of the wafer 20 by the focusing unit, the wafer 20 can be directly transferred to the thinning module 3 for thinning, so as to remove the edge portion of the wafer 20 during the thinning process; or, an edge removal structure can be set in the edge trimming module 2, such as ultrasonically removing the edge portion of the wafer 20 by an ultrasonic structure, or removing the edge portion of the wafer 20 by a trimming mechanical claw by prying or pressing, and then the wafer 20 with the edge portion removed can be transferred to the thinning module 3 for thinning.

[0108] Therefore, the wafer processing equipment 10 first trims the edges of the wafer 20 and then thins the wafer 20, avoiding edge chipping, scrap, curling and other situations that may occur when obtaining a thinner wafer 20, thus improving the yield.

[0109] In some embodiments, such as Figure 1 and Figure 5 As shown, the wafer processing equipment 10 also includes a cleaning module 7, which is located between the polishing module 4 and the front-end module 1. The cleaning module 7 is used to clean and perform post-cleaning processing on the polished wafer 20. The cleaning module 7 is located within the transmission range of the multi-axis robot 51, which is also used to transfer the polished wafer 20 to the cleaning module 7. The cleaning module 7 is also located within the transmission range of the front-end transfer device 11, which is also used to transfer the post-cleaned wafer 20 from the cleaning module 7 to the wafer cassette 12.

[0110] Therefore, the polished wafer 20 can be cleaned and post-cleaned using the cleaning module 7 to remove impurities from its surface, improving the cleanliness of the wafer 20 and thus enhancing its processing quality. In the above embodiment, the wafer 20 is processed by the wafer processing equipment 10 to obtain a thinner wafer 20 with ultra-high cleanliness.

[0111] Furthermore, the cleaning module 7 can be located within the transmission range of the multi-axis robot 51. The multi-axis robot 51 is also used to transfer the polished wafer 20 to the cleaning module 7, so that the distance between the cleaning module 7 and the polishing module 4 can be closer, which is beneficial to the compact layout of the wafer processing equipment 10. The cleaning module 7 is also located within the transmission range of the front-end transfer device 11. The front-end transfer device 11 is also used to transfer the post-cleaning processed wafer 20 from the cleaning module 7 to the wafer cassette 12, so that the distance between the cleaning module 7 and the front-end module 1 can also be closer, which is more beneficial to the compact layout of the wafer processing equipment 10.

[0112] Optionally, such as Figure 5 and Figure 6 As shown, the cleaning module 7 includes a first cleaning unit 71 and a second cleaning unit 72. The first cleaning unit 71 is used to perform a first cleaning on the polished wafer 20, and the second cleaning unit 72 is used to perform a second cleaning and drying on the wafer 20 after the first cleaning.

[0113] Therefore, the impurities remaining on the surface of the polished wafer 20 can be cleaned by the first cleaning unit 71, and the surface of the wafer 20 can be cleaned again by the second cleaning unit 72. The surface of the wafer 20 can also be dried to facilitate the subsequent storage and processing of the wafer 20.

[0114] The first cleaning unit 71 and the second cleaning unit 72 can be stacked vertically. This allows the wafer 20 to undergo a first cleaning in the first cleaning unit 71 and then be removed from the first cleaning unit 71. After moving a short distance vertically, it can be placed in the second cleaning unit 72 for a second cleaning and drying. This shortens the movement path of the wafer 20 between the first and second cleaning units 71 and 72, improving the processing efficiency of the wafer processing equipment 10 and thus increasing its production capacity. It also effectively reduces the horizontal space occupied by the cleaning module 7, allowing for a more compact layout of the wafer processing equipment 10. Alternatively, the first cleaning unit 71 and the second cleaning unit 72 can be arranged side-by-side horizontally. When transferring the wafer 20 between the first and second cleaning units 71 using the multi-axis robotic arm 51, the movement can be done horizontally. This efficient and convenient transfer of the wafer 20 further improves the processing efficiency of the wafer processing equipment 10 and increases its production capacity.

[0115] The cleaning solution used in the first cleaning unit 71 to clean the wafer 20 can be the same as or different from the cleaning solution used in the second cleaning unit 72 to clean the wafer 20. No limitation is made here.

[0116] The second cleaning unit 72 includes a material discharge opening 721 located within the transmission range of the multi-axis robot 51, and a material pick-up opening 722 located within the transmission range of the front-end transmission device 11.

[0117] Therefore, the wafer 20 that has completed the first cleaning can be placed into the second cleaning unit 72 by the multi-axis robot arm 51, and the dried wafer 20 can be transferred from the second cleaning unit 72 to the wafer cassette 12 by the front-end transfer device 11. There is no need to set up a separate structure for picking up and placing the wafer 20 into the second cleaning unit 72, which reduces the structure and number of components of the cleaning module 7, thereby allowing the cleaning module 7 to have a smaller volume and reduce the space occupied by the cleaning module 7, and thus allowing the wafer processing equipment 10 to have a more compact layout.

[0118] For example, the second cleaning unit 72 may include a second cleaning box, which has a receiving space and a feeding opening 721 and a picking opening 722 disposed on the second cleaning box. Both the feeding opening 721 and the picking opening 722 are connected to the receiving space. The feeding opening 721 is disposed towards the multi-axis robot arm 51, and the picking opening 722 is disposed towards the front-end module 1. The wafer 20 can be placed into the second cleaning box and the wafer 20 can be taken out through the two openings with different orientations, which avoids interference in the process of placing and taking out the wafer 20 into the second cleaning box, effectively improves the efficiency of placing and taking out the wafer 20 into the second cleaning box, and is conducive to improving the processing efficiency of the wafer processing equipment 10, thereby further improving the production capacity of the wafer processing equipment 10.

[0119] Furthermore, the first cleaning unit 71 and the second cleaning unit 72 can share some structural components, such as a shared housing, support structure, frame, etc., thereby ensuring a secure connection between them. Alternatively, the first cleaning unit 71 and the second cleaning unit 72 can be independently configured, allowing for height adjustments to the first cleaning unit 71 and the second cleaning unit 72 as needed, facilitating the handling of the wafer 20.

[0120] In some embodiments, such as Figure 7 and Figure 8 As shown, the thinning module 3 may include a first base 31, a turntable 32, and multiple grinding devices 33. The turntable 32 is rotatably mounted on the first base 31, and the turntable 32 is provided with a material loading / unloading station 3b (e.g., Figure 7 (as shown in the dashed box) and multiple grinding stations 3a (such as) Figure 7As shown in the dashed box, a pick-and-place station 3b and multiple grinding stations 3a are spaced around the rotation center axis of the turntable 32. The pick-and-place station 3b is used to place the wafer 20 to be thinned or already thinned, so as to facilitate the thinning module 3 to control the thinning rhythm. When the turntable 32 rotates, the wafer 20 located at the pick-and-place station 3b can be rotated sequentially to the multiple grinding stations 3a. After the wafer 20 has undergone thinning processing on the multiple grinding stations 3a, it can return to the pick-and-place station 3b as the turntable 32 rotates. Multiple grinding devices 33 are arranged around the turntable 32 and corresponding to the multiple grinding stations 3a to thin the wafer 20 on the grinding stations 3a.

[0121] Therefore, the same wafer 20 can be thinned multiple times, effectively improving the thinning effect of wafer 20.

[0122] There may be two, three or more grinding stations 3a, and correspondingly, there may be two, three or more grinding devices 33, which are not limited here.

[0123] For example, when there are three grinding stations 3a, the number of grinding devices 33 can also be three, and the three grinding devices 33 can perform three thinning operations on the same wafer 20. Optionally, the grinding device 33 may include a grinding support, a grinding drive, and a grinding wheel. The grinding support is disposed on the first base 31, the grinding wheel is rotatably connected to the grinding support via a spindle, and the grinding drive is connected to the spindle to drive the spindle to rotate, thereby driving the grinding wheel to rotate, so as to thin the wafer 20 placed on the grinding station 3a. Among them, the grinding wheels in different grinding devices 33 have different grit numbers, and can respectively perform rough grinding, fine grinding, and ultra-fine grinding on the wafer 20 to obtain a thinner wafer 20, and the surface of the wafer 20 has a high flatness.

[0124] Additionally, the grinding device 33 may include a dry polishing wheel, replacing the third grinding wheel used for ultra-fine grinding. This allows for sequential rough grinding, fine grinding, and dry polishing of the wafer 20. The dry polishing wheel rotates to perform dry grinding / polishing on the surface of the wafer 20, achieving precise thinning of the wafer 20 while also ensuring a smooth surface. Therefore, in the above embodiments, the final thinning process performed by the thinning module 3 on the same wafer 20 can be either grinding thinning or dry polishing thinning.

[0125] Optionally, the thinning module 3 may be provided with a loading and unloading opening on the side facing the front module 1. The thinning module 3 may also include a pick-and-place device 34, which can extend out of the loading and unloading opening. Alternatively, the transfer device 52 can move into the thinning module 3 through the loading and unloading opening, such as into the transfer range of the pick-and-place device 34, to transfer the wafer 20 to be thinned from the transfer device 52 to the pick-and-place station 3b, and to transfer the thinned wafer 20 to the transfer device 52, which facilitates the pick-and-place of the wafer 20, saving time and effort. Moreover, it eliminates the need to set up a separate thinning transfer device in the thinning module 3, which simplifies the structure and number of components of the thinning module 3, reduces the space occupied by the thinning module 3, and allows the wafer processing equipment 10 to have a more compact layout.

[0126] The picking and unloading device 34 may include a robotic arm, which can move the wafer 20 between the picking and unloading station 3b and the transfer device 52, and can place the wafer 20 at the picking and unloading station 3b or remove it from the picking and unloading station 3b, which is convenient and fast.

[0127] For example, when the thinning module 3 thins the wafer 20, the multi-axis robot 51 places the wafer 20 to be thinned on the transfer device 52, and the pick-and-place device 34 transfers the wafer 20 to be thinned from the transfer device 52 to the pick-and-place station 3b; then, the turntable 32 can rotate around its rotation center axis to rotate the wafer 20 to the first grinding station 3a, and the corresponding grinding device 33 performs the first thinning on the wafer 20 at the first grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis to rotate the wafer 20 to the second grinding station 3a, and the corresponding grinding device 33 performs the first thinning on the wafer 20 at the first grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis to rotate the wafer 20 to the second grinding station 3a, and the corresponding grinding device 33 performs the first thinning on the wafer 20 at the second grinding station 3a. The grinding device 33 performs a second thinning on the wafer 20 located at the second grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis, rotating the wafer 20 to the third grinding station 3a, where the corresponding grinding device 33 performs a third thinning on the wafer 20 located at the third grinding station 3a; then, the turntable 32 continues to rotate around its rotation center axis, rotating the wafer 20 to the pick-and-place station 3b, where the pick-and-place device 34 transfers the thinned wafer 20 to the transfer transfer device 52, and finally, the transfer module 5 transfers the thinned wafer 20 located on the transfer transfer device 52 to the polishing module 4.

[0128] As described above, when the first wafer 20 rotates to the second grinding station 3a for the second thinning, the second wafer 20 can be thinned for the first time at the first grinding station 3a. When the first wafer 20 rotates to the third grinding station 3a for the third thinning, the second wafer 20 can rotate to the second grinding station 3a for the second thinning, and the third wafer 20 can be thinned for the first time at the first grinding station 3a. This effectively improves the thinning efficiency of the thinning module 3, thereby further increasing the production capacity of the wafer processing equipment 10.

[0129] In some embodiments, such as Figures 9-11 As shown, the polishing module 4 may include a second base 41, a cleaning station 47, a first polishing head 42, a second polishing head 43, and a polishing disk 44. The cleaning station 47 is disposed on the second base 41 and located outside the polishing disk 44. The cleaning station 47 is used to transfer the wafer 20 between the transfer module 5 and the polishing head, and also to clean the polished wafer 20 and the polished polishing head. The first polishing head 42 and the second polishing head 43 are both movably disposed relative to the second base 41. Both the first polishing head 42 and the second polishing head 43 can pick up the wafer 20 from the cleaning station 47. The first polishing head 42 and the second polishing head 43 can move between the cleaning station 47 and the polishing disk 44 to perform polishing on either the first polishing head 42 or the second polishing head 43. When head 43 rotates to cleaning station 47, it can pick up the wafer 20 to be polished, and then carry the wafer 20 to polishing disk 44. It can cooperate with polishing disk 44 to polish the wafer 20. When one of the first polishing head 42 and the second polishing head 43 picks up the wafer 20 for polishing, the other can be located at cleaning station 47 to pick up the wafer 20 to be polished, or the polished wafer 20 can be placed in cleaning station 47. Polishing disk 44 is rotatably set on second base 41. Polishing disk 44 is used to cooperate with the first polishing head 42 or the second polishing head 43 to polish the wafer 20.

[0130] Therefore, while the first polishing head 42 and the polishing disk 44 are working together to polish the previous wafer 20, the second polishing head 43 can simultaneously pick up the next wafer 20. After the previous wafer 20 is polished, the second polishing head 43 can carry the next wafer 20 and work with the polishing disk 44 to polish the next wafer 20, which effectively improves the polishing efficiency of the polishing module 4 and further increases the production capacity of the wafer processing equipment 10.

[0131] Furthermore, the cleaning station 47 cleans the polished wafer 20 and the polishing head, ensuring that the surface of the polished wafer 20 is relatively clean and reducing the chance of scratches during transport due to impurities on the surface of the wafer 20. At the same time, it also ensures that the surface of the polishing head is relatively clean, reducing the chance of the polishing head not adhering firmly to the wafer 20 due to impurities on its surface, and reducing the chance of the wafer 20 falling off due to weak adhesion.

[0132] The polishing module 4 may further include a first driving member 49, a second driving member (not shown in the figure), and a rotating bracket 48. The rotating bracket 48 is rotatably mounted on the second base 41. The first polishing head 42 and the second polishing head 43 are both movably mounted relative to the rotating bracket 48 and are arranged on opposite sides of the rotation center of the rotating bracket 48. The first driving member 49 is connected to the rotating bracket 48 and is used to drive the rotating bracket 48 to rotate relative to the second base 41, so as to drive the first polishing head 42 and the second polishing head 43 to rotate alternately to the polishing disk 44. This simplifies the structure of the polishing module 4, thereby reducing the space occupied by the polishing module 4 and facilitating the compact layout of the wafer processing equipment 10.

[0133] The second driving component is connected to the first polishing head 42 and the second polishing head 43 respectively, and is used to drive the first polishing head 42 and the second polishing head 43 to rotate respectively. When the first polishing head 42 carries the wafer 20 for polishing, the first polishing head 42 can carry the wafer 20 to rotate relative to the polishing disk 44. The polishing disk 44 can rotate around its own rotation center axis, so that the wafer 20 and the polishing disk 44 rotate relative to each other. At this time, the second polishing head 43 can pick up the next wafer 20 and wait. When the second polishing head 43 carries the wafer 20 for polishing, the second driving component can drive the second polishing head 43 to rotate, so as to drive the wafer 20 to rotate.

[0134] The cleaning station 47 described above may include a stage and a cleaning nozzle disposed on the upper side of the stage. The stage is used to place the wafer 20, and the cleaning nozzle is disposed facing the stage. The cleaning nozzle is connected to the cleaning fluid tank through a pipeline to clean the polished wafer 20 located on the stage, or to clean the polished polishing head located on the upper side of the stage.

[0135] In addition, the cleaning station 47 can be set on the side of the polishing disk 44 facing the transmission module 5 on the second base 41, so that the transmission module 5 can place the wafer 20 to be polished on the cleaning station 47 and remove the polished wafer 20 from the cleaning station 47, which is conducive to improving the processing efficiency of the wafer processing equipment 10 on the wafer 20, thereby improving the production capacity of the wafer processing equipment 10.

[0136] like Figure 11As shown, a polishing pad (not shown in the figure) is laid on the polishing disk 44. A polishing slurry supplier 45 can also be provided on one side of the polishing disk 44. The spray nozzle of the polishing slurry supplier 45 is set towards the polishing pad. The polishing disk 44 can rotate together with the polishing pad. When polishing the wafer 20, the wafer 20 comes into contact with the polishing pad, and relative movement occurs between the wafer 20 and the polishing pad. At the same time, the polishing slurry supplier 45 sprays polishing slurry onto the polishing pad so that the polishing slurry chemically etches the surface of the wafer 20, and the particles in the polishing slurry mechanically grind the wafer 20, thereby achieving fine removal and planarization of the wafer 20.

[0137] Furthermore, such as Figure 11 As shown, the polishing module 4 also includes a polishing pad conditioner 46, which is disposed on one side of the polishing disk 44 and is used to condition the polishing pad. That is, during the polishing of the wafer 20, the polishing pad conditioner 46 can smooth the surface morphology of the polishing pad and remove impurity particles remaining on the surface of the polishing pad, such as abrasive particles removed from the polishing fluid and waste materials falling off the surface of the wafer 20, so as to ensure the consistency of the surface morphology of the polishing pad during the polishing process, so that the polishing effect of the wafer 20 can be relatively stable.

[0138] Optionally, the polishing module 4 may further include a third driving component. The third driving component can be connected to the first polishing head 42 and the second polishing head 43 respectively via a connector. The third driving component is used to drive the first polishing head 42 and the second polishing head 43 to reciprocate radially along the polishing pad 44. That is, when the polishing head cooperates with the polishing pad 44 to polish the wafer 20, the polishing head can not only rotate, but also reciprocate radially along the polishing pad 44, so that the surface of the wafer 20 in contact with the polishing pad can be gradually polished and planarized.

[0139] The wafer 20 moves radially back and forth along the polishing disk 44, which can be a linear movement or a curved movement, and is not limited here.

[0140] In summary, when the wafer processing equipment 10 includes a front-end module 1, an edge trimming module 2, a thinning module 3, a polishing module 4, a transfer module 5, and a cleaning module 7, the specific steps for processing the wafer 20 are as follows: First, the front-end transfer device 11 removes the wafer 20 to be processed from the wafer cassette 12 and transfers it to the edge trimming module 2. The edge trimming module 2 performs edge trimming processing on the wafer 20, such as laser-modifying the peripheral edge area of ​​the wafer 20. The multi-axis robot arm 51 places the trimmed wafer 20 into the transfer transfer device 52. Second, the pick-and-place device 34 in the thinning module 3 transfers the wafer 20 from the transfer transfer device 52 to the pick-and-place device. At station 3b, the turntable 32 rotates to move the wafer 20 to the grinding station 3a. The grinding device 33 thins the wafer 20 located at the grinding station 3a, completing the thinning of the wafer 20. The turntable 32 then rotates to move the wafer 20 to the pick-and-place station 3b. The pick-and-place device 34 then removes the wafer 20 from the pick-and-place station 3b and transfers it to the transfer device 52. The pick-and-place device 34 then picks up the wafer 20 and performs unloading and cleaning on it at the unloading and cleaning station. Finally, the pick-and-place device 34 places the wafer 20 into the transfer device 52. In the third step, the multi-axis robot 51 transfers the thinned wafer 20 to the transfer device 52. Polishing module 4 polishes the wafer 20. For example, after picking up the wafer 20 from the transfer device 52, the multi-axis robot 51 rotates the wafer 20 180° and places it on the cleaning station 47 in the polishing module 4 with the thinned side facing down. The polishing head picks up the wafer 20 and rotates to the polishing disk 44, cooperating with the polishing disk 44 to complete the polishing of the wafer 20. Then, the polishing head places the polished wafer 20 on the cleaning station 47, which cleans the polished wafer 20. In the fourth step, the multi-axis robot 51 removes the polished wafer 20 from the cleaning station 47. The wafer 20 is then transferred to the cleaning module 7, where it is cleaned and dried. For example, after the multi-axis robot 51 picks up the polished wafer 20, it flips the wafer 20 180° so that the polished side of the wafer 20 faces upward. Then, the wafer 20 is placed in the first cleaning unit 71 for the first cleaning. Then, the multi-axis robot 51 transfers the wafer 20 from the first cleaning unit 71 to the second cleaning unit 72 for the second cleaning and drying. In the fifth step, the front-end transfer device 11 takes the dried wafer 20 out of the second cleaning unit 72 and places it into the wafer cassette 12 to complete the processing of the wafer 20.

[0141] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer processing apparatus characterized by comprising: include: The front-end module includes a front-end transfer device and a wafer cassette. The front-end transfer device is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette. The trimming module is used to trim the edge of the wafer to be processed. The trimming module is located within the transmission range of the front-end transmission device so that the front-end transmission device can transfer the wafer to be processed from the wafer cassette to the trimming module. A thinning module is disposed downstream of the trimming module, and the thinning module is used to thin the trimmed wafer; A polishing module is disposed downstream of the thinning module, and the polishing module is used to perform mechanical and chemical polishing on the thinned wafer; The transmission module includes a multi-axis robot and a transmission transfer device. The multi-axis robot cooperates with the transmission transfer device to transfer the wafer between at least the thinning module and the polishing module.

2. The wafer processing equipment according to claim 1, characterized in that, Along the first horizontal direction, the polishing module, the multi-axis robot, and the transfer device are all located between the thinning module and the front-end module. The multi-axis robot is positioned close to the front-end module, and the transfer device is positioned between the thinning module and the multi-axis robot. The transfer device has a bearing surface for bearing the wafer.

3. The wafer processing apparatus according to claim 2, wherein The front-end module has two opposite sides along a second horizontal direction, and the multi-axis manipulator is positioned close to one of the two sides. The side closest to the fixed position of the multi-axis manipulator along the second horizontal direction is the first side. The trimming module is disposed on the first side along the first horizontal direction, and the trimming module protrudes relative to the front end module. The second horizontal direction is perpendicular to the first horizontal direction.

4. The wafer processing apparatus according to claim 2, wherein The transfer device is movably disposed between the thinning module and the multi-axis robot.

5. The wafer processing apparatus according to claim 4, wherein The transfer device includes a base, a transfer drive, and a transfer platform. The transfer platform is disposed on the base, and the bearing surface is located on the transfer platform. The base is movably disposed between the multi-axis robot and the thinning module. The transfer drive is connected to the base and is used to drive the base to reciprocate between the multi-axis robot and the thinning module.

6. The wafer processing apparatus according to claim 2, wherein The trimming module includes a trimming and blanking opening facing the thinning module, and the trimming and blanking opening is located within the transmission range of the multi-axis robot.

7. The wafer processing apparatus according to any one of claims 1 to 6, characterized by The wafer processing equipment also includes a cleaning module, which is disposed between the polishing module and the front-end module. The cleaning module is used to clean the polished wafer and perform post-cleaning processing. The cleaning module is located within the transmission range of the multi-axis robot, which is also used to transfer the polished wafer to the cleaning module. The cleaning module is also located within the transmission range of the front-end transmission device, which is also used to transfer the wafer that has completed cleaning and post-processing from the cleaning module to the wafer cassette.

8. The wafer processing apparatus according to claim 7, wherein The cleaning module includes a first cleaning unit and a second cleaning unit. The first cleaning unit is used to perform a first cleaning on the polished wafer, and the second cleaning unit is used to perform a second cleaning and drying on the wafer after the first cleaning.

9. The wafer processing apparatus according to claim 8, wherein The second cleaning unit includes a feeding opening located within the transmission range of the multi-axis robot and a picking opening located within the transmission range of the front-end transmission device.

10. The wafer processing apparatus according to any one of claims 1 to 6, wherein The multi-axis manipulator includes either a five-axis manipulator or a six-axis manipulator.

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