Wafer processing apparatus

Abstract

This utility model discloses a wafer processing equipment. The equipment includes a front-end module; an edge trimming module for trimming the wafer to be processed; a thinning module, located downstream of the front-end module, for thinning the wafer; and a polishing module, also located downstream of the front-end module, for chemically and mechanically polishing the wafer. Each of the front-end module, edge trimming module, thinning module, and polishing module is an independent modular unit, and the front-end module, along with at least one of these modules, is configured to jointly form a functional component. This functional component performs at least one of the edge trimming, thinning, and polishing operations on the wafer. This wafer processing equipment can adjust the number and layout of each module in a timely manner according to actual production conditions and process requirements, which is beneficial for increasing equipment capacity. It also effectively simplifies the structure of the wafer processing equipment, reduces the space occupied, and lowers the manufacturing difficulty.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer processing equipment. Background Technology

[0002] In the wafer fabrication process, wafer thinning and polishing usually need to work together to control wafer thickness, surface quality, and other parameters.

[0003] In related technologies, wafer trimming, thinning, polishing, and cleaning processes are performed in different process modules. However, these process modules are usually fixedly connected together, resulting in a fixed number and layout of functional modules in the equipment. In addition, to facilitate the loading and unloading of wafers in each module, each module is usually equipped with a transmission channel and wafer transfer structure, which can easily lead to a large equipment size, requiring a large space and wasting space. It can also lead to structural redundancy in the equipment and high manufacturing difficulty. Utility Model Content

[0004] This application discloses a wafer processing equipment that can adjust the quantity and layout of each module in a timely manner according to actual production conditions and process requirements, which is conducive to improving equipment capacity and can effectively simplify the structure of the wafer processing equipment, reduce the space occupied by the equipment, and reduce the manufacturing difficulty of the equipment.

[0005] To achieve the above objectives, this application discloses a wafer processing apparatus, comprising:

[0006] Front-end module;

[0007] The trimming module is used to trim the edges of the wafer to be processed;

[0008] A thinning module is disposed downstream of the front-end module, and the thinning module is used to thin the wafer;

[0009] A polishing module is disposed downstream of the front-end module, and the polishing module is used to perform chemical mechanical polishing on the wafer;

[0010] The front-end module, the trimming module, the thinning module, and the polishing module are all independent modular units, and the front-end module and at least one of the trimming module, the thinning module, and the polishing module are configured to jointly form a functional component, which is used to perform at least one of trimming, thinning, and polishing of the wafer.

[0011] In one possible implementation, the front-end module, the trimming module, the thinning module, and the polishing module all include a frame, and the frames of each module can be combined and spliced ​​together.

[0012] In one possible implementation, the rack corresponding to the front-end module and the rack corresponding to the trimming module are combined and spliced ​​together to form a trimming functional component.

[0013] In one possible implementation, the rack corresponding to the front-end module and the rack corresponding to the thinning module are combined and spliced ​​together to form a thinning functional component.

[0014] In one possible implementation, the rack corresponding to the front-end module and the rack corresponding to the polishing module are combined and spliced ​​to form a polishing functional component.

[0015] In one possible implementation, the rack corresponding to the front-end module is combined and spliced ​​with the rack corresponding to the trimming module and the rack corresponding to the thinning module to form a trimming and thinning functional component.

[0016] In one possible implementation, the rack corresponding to the front-end module is combined and spliced ​​with the rack corresponding to the trimming module, the rack corresponding to the thinning module, and the rack corresponding to the polishing module to form a trimming, thinning, and polishing functional component.

[0017] In one possible implementation, the wafer processing equipment further includes a cleaning module for cleaning the wafer and performing post-cleaning processing.

[0018] The cleaning module is configured to constitute the functional component together with at least one of the thinning module and the polishing module and the front-end module, or the cleaning module is configured to constitute the functional component together with the trimming module, the thinning module and the front-end module.

[0019] In one possible implementation, the wafer processing equipment further includes a transfer module, wherein the thinning module and the polishing module are both located within the transfer range of the transfer module, the transfer module is used to transfer the wafer at least between the thinning module and the polishing module, and the transfer module is configured to constitute the functional components together with at least one of the trimming module, the thinning module, the polishing module and the front-end module.

[0020] In one possible implementation, when the front-end module and at least one of the trimming module, the thinning module and the polishing module together constitute a functional component, the modules constituting the functional component are arranged closely together or connected to each other through a detachable connection structure.

[0021] Compared with the prior art, this application has at least the following beneficial effects:

[0022] The wafer processing equipment provided in this application includes a front-end module, an edge trimming module, a thinning module, and a polishing module located downstream of the front-end module. The edge trimming module trims the edges of the wafer to be processed, removing excess material from the wafer edges. The thinning module reduces the thickness of the wafer to be processed. The polishing module performs chemical mechanical polishing on the thinned wafer to optimize surface quality. The front-end module, edge trimming module, thinning module, and polishing module are all independent modular units. Furthermore, the front-end module and at least one of the edge trimming module, thinning module, and polishing module can be combined to form a functional component. This functional component can realize at least one of the wafer trimming, thinning, and polishing processes, retaining module independence while possessing the flexibility of functional integration.

[0023] Therefore, firstly, the independent configuration of each module breaks free from the constraints of a fixed connection structure, allowing for timely adjustments to the number and layout of modules based on actual production conditions and process requirements. This freedom from fixed architecture limitations facilitates increased equipment capacity. The modular design, which allows for the combination of modules into functional components, enables flexible functional combinations based on process needs. While ensuring the implementation of core processes, this enhances the equipment's functional scalability and reusability, thereby improving production efficiency. Secondly, the ability to combine modules into corresponding functional components reduces the need for long transmission channels and wafer transfer structures within each process module, avoiding structural redundancy, effectively reducing the overall equipment size, minimizing space occupation, reducing space waste, simplifying the overall equipment structure, and reducing manufacturing difficulties caused by structural redundancy. This contributes to reduced manufacturing and subsequent maintenance costs. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is one of the structural schematic diagrams of a wafer processing equipment provided in the embodiments of this application;

[0026] Figure 2 This is one of the structural schematic diagrams of functional components of a wafer processing equipment provided in an embodiment of this application;

[0027] Figure 3 This is a schematic diagram of the structure of a thinning functional component of a wafer processing equipment provided in an embodiment of this application;

[0028] Figure 4 This is a schematic diagram of the structure of a trimming and thinning functional component of a wafer processing equipment provided in an embodiment of this application;

[0029] Figure 5 This is a schematic diagram of the structure of a cleaning and polishing functional component of a wafer processing equipment provided in an embodiment of this application;

[0030] Figure 6 This is a schematic diagram of the structure of a front-end module of a wafer processing equipment provided in an embodiment of this application;

[0031] Figure 7 This is a schematic diagram of the structure of a thinning module of a wafer processing equipment provided in an embodiment of this application;

[0032] Figure 8 This is one of the structural schematic diagrams of a polishing module of a wafer processing equipment provided in the embodiments of this application;

[0033] Figure 9 This is a second schematic diagram of the structure of a cleaning module of a wafer processing equipment provided in this application embodiment;

[0034] Figure 10 This is a schematic diagram of the structure of a trimming function component of a wafer processing equipment provided in an embodiment of this application;

[0035] Figure 11 This is a second schematic diagram of the structure of a wafer processing equipment provided in an embodiment of this application;

[0036] Figure 12 This is a schematic diagram of the structure of a trimming module of a wafer processing equipment provided in an embodiment of this application.

[0037] Explanation of reference numerals in the attached figures:

[0038] 1-Front-end module; 11-Front-end transmission device; 12-First rack; 13-Loading device; 14-Safety light curtain;

[0039] 2-Thinning module; 21-Second frame; 22-Turntable; 23-Grinding device; 24-Centering mechanism; 25-Loading and unloading mechanism;

[0040] 3-Polishing module; 31-Third rack; 32-Polishing disc; 33-Polishing head; 34-Polishing pad dresser; 35-Polishing fluid supply; 36-Cleaning station;

[0041] 4-Cleaning module; 41-Fourth rack; 42-First cleaning station; 43-Temporary storage station; 44-Second cleaning station;

[0042] 5-Transmission module;

[0043] 6- Trimming module; 61- Trimming support platform; 621- Supporting surface; 62- Trimming device; 63- Rotation drive component; 64- First guide rail; 65- First slider; 66- Second guide rail; 67- Camera. Detailed Implementation

[0044] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0045] In this invention, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this invention and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0046] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this utility model according to the specific circumstances.

[0047] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this utility model based on the specific circumstances.

[0048] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, components, or parts (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, components, or parts. Unless otherwise stated, "a plurality of" means two or more.

[0049] In the wafer fabrication process, wafer thinning and polishing usually need to work together to control wafer thickness, surface quality, and other parameters.

[0050] In related technologies, wafer trimming, thinning, polishing, and cleaning processes are performed in different process modules. However, these process modules are usually fixedly connected together, resulting in a fixed number and layout of functional modules in the equipment. In addition, to facilitate the loading and unloading of wafers in each module, each module is usually equipped with a transmission channel and transmission structure, which can easily lead to a large equipment size, requiring a large space and wasting space. It can also lead to structural redundancy in the equipment and high manufacturing difficulty.

[0051] Based on this, this application discloses a wafer processing equipment that can adjust the number and layout of each module in a timely manner according to the actual production situation and process requirements, which is conducive to improving the equipment's capacity and can effectively simplify the structure of the wafer processing equipment, reduce the space occupied by the equipment, and reduce the manufacturing difficulty of the equipment.

[0052] The technical solution of this application will be described in detail below with reference to specific embodiments and accompanying drawings.

[0053] The present application will be described in detail below through specific embodiments:

[0054] This application provides a wafer processing equipment, such as... Figures 1 to 12 As shown, a wafer processing equipment includes:

[0055] Front-end module 1;

[0056] Trimming module 6 is used to trim the edges of the wafer to be processed;

[0057] Thinning module 2 is located downstream of front-end module 1 and is used to thin the wafer.

[0058] Polishing module 3 is located downstream of front-end module 1 and is used to perform chemical mechanical polishing on the wafer.

[0059] Among them, the front-end module 1, the trimming module 6, the thinning module 2, and the polishing module 3 are all independent modular units, and the front-end module 1 and at least one of the trimming module 6, the thinning module 2, and the polishing module 3 are constructed to jointly form a functional component, which is used to realize at least one of the wafer trimming, thinning, and polishing.

[0060] The wafer processing equipment provided in this application includes a front-end module 1, an edge trimming module 6, a thinning module 2, and a polishing module 3 disposed downstream of the front-end module 1. The edge trimming module 6 trims the edges of the wafer to be processed, removing excess portions. The thinning module 2 reduces the thickness of the wafer to be processed. The polishing module 3 performs chemical mechanical polishing on the thinned wafer to optimize surface quality. The front-end module 1, edge trimming module 6, thinning module 2, and polishing module 3 are all independent modular units. Furthermore, the front-end module 1 and at least one of the edge trimming module 6, thinning module 2, and polishing module 3 can be combined to form a functional component. This functional component can realize at least one of the wafer trimming, thinning, and polishing processes, retaining module independence while possessing the flexibility of functional integration.

[0061] Therefore, firstly, the independent configuration of each module breaks free from the constraints of a fixed connection structure, allowing for timely adjustments to the number and layout of modules based on actual production conditions and process requirements. This freedom from fixed architecture limitations facilitates increased equipment capacity. The modular design, which allows for the combination of modules into functional components, enables flexible functional combinations based on process needs. While ensuring the implementation of core processes, this enhances the equipment's functional scalability and reusability, thereby improving production efficiency. Secondly, the ability to combine modules into corresponding functional components reduces the need for long transmission channels and wafer transfer structures within each process module, avoiding structural redundancy, effectively reducing the overall equipment size, minimizing space occupation, reducing space waste, simplifying the overall equipment structure, and reducing manufacturing difficulties caused by structural redundancy. This contributes to reduced manufacturing and subsequent maintenance costs.

[0062] It is understood that the aforementioned wafer transfer structure may include at least one of the following: a transport structure, a wafer loading structure, and a wafer unloading structure, and is not limited thereto.

[0063] It should be clarified that the aforementioned thinning module 2 and polishing module 3, which are located downstream of the front-end module 1, means that in the wafer processing flow, the wafer will first be processed by the front-end module 1 and then transported to the thinning module 2 and polishing module 3 for further processing. It does not mean that the thinning module 2 and polishing module 3 are located downstream of the front-end module 1 in terms of orientation and layout.

[0064] In the diagram, the X direction is the first horizontal direction, and the Y direction is the second horizontal direction.

[0065] In addition, the thinning module 2 can thin the wafer to reduce its thickness. The polishing module 3 can perform chemical mechanical polishing on the wafer to finely remove and planarize the thinned surface.

[0066] The wafers processed by this wafer processing equipment can be bonding wafers, meaning that the equipment can perform at least one of the following processing steps on bonding wafers: thinning, chemical mechanical polishing, etc. Of course, this equipment can also process other types of wafers, and this is not a limitation.

[0067] In some embodiments, the front-end module 1, trimming module 6, thinning module 2, and polishing module 3 each include a frame, and the frames of each module can be combined and spliced ​​together.

[0068] In this way, each module is an independent unit with a rack, which facilitates the installation of components of each module and makes it easy to integrate each module individually. At the same time, since each module is integrated on its own rack, it is convenient to quickly adjust the layout or add or remove modules according to production needs, without having to move the internal equipment structure of each module. This allows for quick replacement of each module and improves equipment uptime.

[0069] Modular racks clearly define the structural boundaries of each module, allowing maintenance personnel to familiarize themselves with the internal layout and maintenance procedures of individual modules. Furthermore, each module independently supports its internal components through the rack, reducing the transmission of vibration and noise between different modules during operation and improving the processing accuracy of each process and the stability of equipment operation.

[0070] The frame can be a frame structure formed by crossbeams and longitudinal beams, or a closed box structure or a base structure with a bottom plate, etc., and this application does not limit it.

[0071] In addition, each rack can be equipped with casters at the bottom to facilitate the movement and arrangement of each module as needed.

[0072] In some embodiments, such as Figure 6 As shown, the front-end module 1 includes a front-end transfer device 11 and a wafer cassette. The front-end transfer device 11 is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette.

[0073] The front-end transfer device 11 can directly participate in wafer transfer within the functional components, reducing the independent loading and unloading links between the front-end module 1 and other process modules. As the unloading and recycling node of wafer transfer, the integration of the front-end module 1 with other process modules can shorten the wafer path in the loading and unloading process, improve the connection efficiency between loading and unloading and process operations, and reduce potential risks in the wafer transfer process.

[0074] After the front-end module 1 is combined with other process modules to form a functional component, it can be laid out in a compact manner according to the functional requirements of the component. The front-end transmission device 11 of the front-end module 1 in the functional component can replace the original independent loading and unloading structure of some process modules, reducing the repetitive setting of loading and unloading structure. Under the premise of ensuring the realization of functions, the overall layout of the equipment is more compact, further improving the space utilization rate, which is especially suitable for production environments with high requirements for site space.

[0075] like Figure 6 As shown, the front-end module 1 may include a first rack 12, a wafer cassette, a loading device 13, a safety light curtain 14, and a front-end transfer device 11. The front-end transfer device 11 is used to remove the wafer to be processed from the wafer cassette and to transfer the processed wafer to the wafer cassette. That is, the wafer to be processed can be loaded into the wafer cassette first, and the wafer processed by the wafer processing equipment can be temporarily placed in the wafer cassette, so as to realize the loading and unloading of wafers on the wafer processing equipment, saving time and effort.

[0076] The front-end transmission device 11 can be a robotic arm or a combination of a transfer device and a robotic arm, and there is no limitation on it here.

[0077] The first rack 12 serves as a base for mounting all other components of the front-end module 1, including the loading device 13, safety light curtain 14, and front-end transfer device 11, to integrate the front-end module 1 together. The loading device 13 is used to mount the wafer cassette, and the safety light curtain 14 is used for safety detection during the crane interaction process to prevent the wafer cassette from being bumped, thus avoiding damage to the wafers inside. The front-end transfer device 11 is used to transfer wafers. The rack can have openings in various directions as needed, allowing the front-end transfer device 11 to extend from these openings for wafer loading and unloading operations.

[0078] The loading device 13 may include 2, 3, etc., and is not limited here; the front-end transfer device 11 may be equipped with two clamping members, one for handling clean and dry wafers, and the other for handling damp or dirty wafers.

[0079] The aforementioned functional components can be implemented in various ways. In a first possible implementation, such as... Figure 10 As shown, the front-end module 1 and the trimming module 6 are combined and spliced ​​to form a trimming functional component, that is, the rack corresponding to the front-end module 1 and the rack corresponding to the trimming module 6 are combined and spliced.

[0080] The trimming module 6 is used to trim the edges of the wafer to be processed. The trimming module 6 can remove excess parts of the wafer edges, providing a regular wafer substrate for subsequent thinning, polishing and other processes. The trimming module 6 is located within the transmission range of the front-end transfer device 11. The front-end transfer device 11 can directly complete the bidirectional transfer of the wafer between the wafer cassette and the trimming module 6. After the wafer to be processed is removed from the wafer cassette, it is transferred to the trimming module 6. After trimming is completed, the wafer is removed from the trimming module 6 and transferred to the next process module. This transmission design integrates the trimming process into the feeding system of the front-end module 1, without the need for an additional independent loading and unloading structure.

[0081] In this embodiment, as Figure 12 As shown, the trimming module 6 may further include a trimming frame, a trimming support platform 61, a trimming device 62, and a rotation drive 63. The trimming feeding opening can be set on the trimming base. The trimming support platform 61 is movably set relative to the trimming base. The trimming support platform 61 is located within the transmission range of the transmission module 5. The trimming support platform 61 has a bearing surface 621, which is used to place the wafer to be trimmed. The trimming device 62 is set on one side of the trimming support platform 61 and is used to trim the wafer placed on the trimming support platform 61. The rotation drive 63 is connected to the trimming support platform 61 and is used to drive the trimming support platform 61 to rotate so that the trimming device 62 can trim the wafer.

[0082] Therefore, when trimming the wafer, the transmission module 5 can place the wafer on the bearing surface 621, and then the trimming bearing stage 61 rotates relative to the trimming base. The trimming device 62 processes the edge of the wafer located on the bearing surface 621, so that after the trimming bearing stage 61 carries the wafer and rotates one revolution, the trimming of the edge of the wafer can be completed. The operation is simple and quick.

[0083] The trimming support platform 61 may be provided with a vacuum adsorption hole on its support surface 621. The vacuum adsorption hole can be connected to a vacuum pump through a pipeline to vacuum adsorb and fix the wafer placed on the support surface 621. This effectively prevents the wafer from shifting during the trimming process, which would cause a large dimensional deviation and improve the trimming quality.

[0084] The rotating drive component 63 can be any of the following: motor, electric motor, rotary cylinder, etc., and is not limited to any one of them.

[0085] In addition, the trimming module 6 may also include a camera 67, which can take a picture of the position of the wafer on the support surface 621 when the wafer is placed on the support surface 621, so as to obtain the center information of the wafer, so as to ensure that the center of the wafer coincides with the center of the support surface 621 before the trimming process.

[0086] Optionally, the trimming module 6 may further include a first moving drive, a second moving drive, a first guide rail 64, a second guide rail 66, a first slider 65, and a second slider. The second guide rail 66 is disposed on the trimming base and extends along a second horizontal direction. The second slider is connected to the first guide rail 64 and slidably connected to the second guide rail 66. The first slider 65 is connected to the trimming support platform 61 and slidably connected to the first guide rail 64. The first moving drive is connected to the trimming support platform 61 and is used to drive the trimming support platform 61 to move along a first horizontal direction, so that the first slider 65 slides relative to the first guide rail 64 along the first horizontal direction. The second moving drive is connected to the first guide rail 64 and is used to drive the first guide rail 64 to move relative to the second guide rail 66 along a second horizontal direction, so that the trimming support platform 61 moves along the second horizontal direction via the first slider 65.

[0087] Therefore, by adjusting the position of the trimming support stage 61 in the first horizontal direction and the second horizontal direction through the first moving drive component and the second moving drive component, the position of the wafer located on the support surface 621 in the first horizontal direction and the second horizontal direction can be adjusted, so that the relative position of the wafer and the trimming device 62 can be adjusted, and the trimming range of the wafer can be flexibly adjusted according to the requirements.

[0088] The trimming support platform 61 is guided to move along the first horizontal direction by the cooperation of the first slider 65 and the first guide rail 64, so as to prevent the trimming support platform 61 from deviating along the first horizontal direction; the first guide rail 64 can be guided to move along the second horizontal direction by the cooperation of the second slider and the second guide rail 66, and then the trimming support platform 61 can be guided to move along the second horizontal direction by the first slider 65, so as to prevent the trimming support platform 61 from deviating along the second horizontal direction.

[0089] The aforementioned trimming device 62 may include a focusing unit for trimming the wafer with a laser, or it may include a trimming wheel for trimming the wafer with a trimming wheel; there is no limitation on this.

[0090] Optionally, when the trimming device 62 includes a focusing unit, the focusing unit is positioned facing the bearing surface 621. The focusing unit focuses the laser beam inside the wafer, allowing for the modification of the wafer's edge region using the laser. The trimming bearing stage 61 rotates the wafer, thereby forming annular modified regions within the wafer's edge region. Furthermore, the radial focusing position of the laser beam inside the wafer can be changed according to actual needs, thereby forming multiple annular modified regions within the wafer's edge region. When the wafer is subjected to pressure, the edge region can fracture along the cracks in these modified regions, effectively preventing wafer chipping and scrap due to uncontrollable crack / fracture paths in the edge region when the wafer is subjected to pressure, such as during thinning.

[0091] Optionally, after the modified region is formed inside the wafer edge by the focusing unit, the wafer can be directly transferred to the thinning module 2 for thinning, so as to remove the edge part of the wafer during the thinning process; or, an edge removal structure can be set in the edge trimming module 6, such as ultrasonic removal of the edge part of the wafer by an ultrasonic structure, or edge removal by a trimming mechanical claw to break off or press off the edge part of the wafer, and then the wafer with the edge part removed can be transferred to the thinning module 2 for thinning.

[0092] In the second possible implementation, such as Figure 3 As shown, the front-end module 1 and the thinning module 2 are combined and spliced ​​to form a thinning functional component, that is, the rack corresponding to the front-end module 1 and the rack corresponding to the thinning module 2 are combined and spliced.

[0093] Thus, the front-end module 1 and the thinning module 2 can achieve the thinning function. The front-end module 1 completes the removal of the wafer to be processed from the wafer cassette through its front-end transfer device 11, and then transfers the wafer to the thinning module 2, which is located in a preset position, according to a preset transfer path. After receiving the wafer, the thinning module 2 performs the thinning process. After the thinning is completed, the front-end transfer device 11 or other transfer structure transfers the thinned wafer from the thinning module 2 to the subsequent process or temporary storage position.

[0094] When the front-end module 1 and the thinning module 2 are combined, the front-end transmission device 11 can undertake the loading and unloading tasks within the component, eliminating the need for a separate configuration of the thinning module 2. This reduces the redundancy of the equipment structure, simplifies the manufacturing process, and further reduces the manufacturing and maintenance costs of the equipment.

[0095] In some embodiments, such as Figure 3 As shown, the preset positions may be: the front-end module 1 and the thinning module 2 are arranged along the first horizontal direction.

[0096] The front-end module 1 and the thinning module 2 form a compact structure that connects in the first horizontal direction and converges in the second horizontal direction. The front-end transmission device 11 of the front-end module 1 can extend the transmission path directly to the thinning module 2 along the first horizontal direction. After the wafer to be processed is taken out of the wafer cassette, it can be quickly sent into the processing station of the thinning module 2 by translating in the first horizontal direction. After processing, the wafer can be returned to the front-end module 1 for temporary storage along the original path or a parallel path, or transferred to the next process through the transmission module 5. This straight transmission path does not require a complex turning mechanism, reducing the direction conversion links in the transmission process.

[0097] This allows the front-end transmission device 11 to adopt a simpler drive structure, such as linear guide rails or synchronous belt drives, to achieve stable transmission, reduce the probability of mechanical failure, improve the reliability of the transmission system, and ensure the integrity of the wafer during the transmission process.

[0098] The width of the thinning module 2 in the second horizontal direction can be equal to or less than the width of the front-end module 1, and is not limited here.

[0099] In this embodiment, as Figure 7 As shown, the thinning module 2 includes a second frame 21, a turntable 22, multiple grinding devices 23, a centering mechanism 24, and a loading / unloading mechanism 25. The second frame 21 serves as a base for mounting all other components of the thinning module 2, including the turntable 22, multiple grinding devices 23, the centering mechanism 24, and the loading / unloading mechanism 25, to integrate the thinning module 2 together. The turntable 22 is equipped with multiple wafer chucks, which are arranged one-to-one with the multiple grinding devices 23. The turntable 22 can rotate clockwise or counterclockwise. Each of the multiple grinding devices 23 is equipped with an air-bearing spindle and a grinding wheel. The turntable 22 can rotate a certain angle each time, such as 90° or 120°. The centering mechanism 24 is used for centering the wafers, and the loading / unloading mechanism 25 is used to transport the wafers between the centering mechanism 24 and the turntable 22.

[0100] The number of grinding devices 23 can be two, three, four, etc., and this application does not limit the number.

[0101] In a third possible implementation, the front-end module 1 and the polishing module 3 are combined and spliced ​​to form a polishing functional component, that is, the frame corresponding to the front-end module 1 and the frame corresponding to the polishing module 3 are combined and spliced.

[0102] Front-end module 1 typically handles pre-processing functions such as wafer loading, positioning, and inspection, while polishing module 3 is responsible for the core surface polishing process. After the two racks are directly connected, the wafer transport path from front-end module 1 to polishing module 3 is significantly shortened, which can reduce positioning errors, vibration interference, or contamination risks during transport and improve processing accuracy. At the same time, the shortened turnaround time can speed up the process rhythm and increase the wafer throughput per unit time.

[0103] In this embodiment, as Figure 8 As shown, the polishing module 3 includes a third frame 31, a polishing disc 32, a polishing head 33, a polishing pad dresser 34, a polishing fluid supply 35, and a cleaning station 36.

[0104] The third frame 31 serves as a base for mounting all other components of the polishing module 3, including the polishing disc 32, polishing head 33, polishing pad dresser 34, polishing slurry supplier 35, and cleaning station 36, to integrate the polishing module 3 together. The polishing disc 32 is used to mount the polishing pad, the polishing head 33 is used to hold or transport the wafer, the polishing pad dresser 34 is used to dress the polishing pad, the polishing slurry supplier 35 is used to supply polishing slurry to the polishing pad, and the cleaning station 36 is used to clean the polishing head 33 and the wafer.

[0105] After the polishing head 33 clamps the wafer to be processed in the cleaning station 36, it is moved above the polishing pad 32 and then pressed onto the polishing pad for processing. During the processing, the polishing head 33 and the polishing pad 32 rotate synchronously and independently, while the polishing head 33 moves back and forth in a straight line. This combined motion ensures uniform polishing of the wafer surface. After polishing, the polishing head 33 sends the processed wafer back to the cleaning station 36 for rinsing. After the rinsed wafer is taken away by the transfer module 5, the cleaning station 36 can immediately switch to the cleaning mode for the polishing head 33 for rinsing and maintenance.

[0106] The polishing head 33 includes two polishing heads that operate in an alternating mode. When one polishing head 33 performs wafer clamping, polishing, or return for cleaning, the other polishing head 33 simultaneously completes the corresponding stage of the process, such as cleaning and maintenance, waiting for wafer pickup, or preparing for polishing. Through the seamless design of process connection, the efficiency and continuity of the overall polishing process are significantly improved.

[0107] In a fourth possible implementation, such as Figure 4 As shown, the front-end module 1 is combined with the trimming module 6 and the thinning module 2 to form a trimming and thinning functional component, that is, the frame corresponding to the front-end module 1 is combined with the frame corresponding to the trimming module 6 and the frame corresponding to the thinning module 2.

[0108] Front-end module 1 typically handles pre-processing functions such as wafer loading, positioning, and inspection. Trimming module 6 removes excess material from the wafer edges, while thinning module 2 reduces wafer thickness through grinding or polishing. With the three modules directly connected in the rack, the wafer transfer path from front-end pre-processing to trimming and then to thinning is significantly shortened. This eliminates the need for external long-distance transport mechanisms, reducing vibration interference, positioning errors, and contamination risks during handling. It also significantly improves process efficiency, enabling seamless integration of pre-processing, trimming, and thinning processes.

[0109] In the fifth possible implementation, the front-end module 1 is combined and spliced ​​with the trimming module 6, the thinning module 2, and the polishing module 3 to form a trimming, thinning, and polishing functional component. That is, the frame corresponding to the front-end module 1 is combined and spliced ​​with the frame corresponding to the trimming module 6, the frame corresponding to the thinning module 2, and the frame corresponding to the polishing module 3.

[0110] The core pre-processing chain for wafer fabrication consists of front-end module 1 (pre-processing, loading, and inspection), trimming module 6 (edge ​​treatment), thinning module 2 (thickness control), and polishing module 3 (surface precision improvement). With each rack directly connected, the wafer's flow between processes is interconnected, reducing vibration interference, positioning errors, and contamination risks during handling. For example, thinned wafers can directly enter polishing module 3, avoiding surface scratches caused by secondary handling and significantly improving process integration efficiency.

[0111] In some embodiments, the wafer processing equipment further includes a cleaning module 4, which is used to clean the wafer and perform post-cleaning processing.

[0112] The cleaning module 4 is configured to form a functional component together with at least one of the thinning module 2, the polishing module 3, and the front-end module 1.

[0113] For example, such as Figure 5 As shown, the functional components include a front-end module 1, a polishing module 3, and a cleaning module 4. The front-end module 1, polishing module 3, and cleaning module 4 are located in preset positions for polishing the wafer.

[0114] Thus, the front-end module 1, polishing module 3, and cleaning module 4 can achieve the cleaning function after thinning. After the front-end module 1 takes the wafer to be polished out of the wafer cassette through the front-end transfer device 11, it is quickly transferred to the processing station of the polishing module 3 along the preset first horizontal path. After the polishing module 3 completes chemical mechanical polishing, the wafer is transferred to the downstream cleaning module 4 through the transfer module 5 or the connection structure between the modules for cleaning and post-processing after polishing. The processed wafer can be sent back to the wafer cassette of the front-end module 1 by the front-end transfer device 11. The preset positions of each module make the wafer transfer path flow in a straight line continuously, reducing direction conversion and path offset.

[0115] Alternatively, the cleaning module 4 may be configured to form a functional component together with the trimming module 6, the thinning module 2, and the front-end module 1.

[0116] In some embodiments, such as Figure 5 As shown, the polishing module 3 and the cleaning module 4 are both arranged along the first horizontal direction with the front-end module 1, and the polishing module 3 and the cleaning module 4 are arranged along the second horizontal direction.

[0117] The sum of the widths of the polishing module 3 and the cleaning module 4 in the second horizontal direction is less than or equal to the width of the front-end module 1 in the second horizontal direction.

[0118] The wafer to be polished is transferred from the front-end transfer device 11 of the front-end module 1 to the polishing module 3 along the first horizontal direction. After chemical mechanical polishing, it is transferred to the adjacent cleaning module 4 along the second horizontal direction via the front-end transfer device 11 or the transfer module 5 for further processing. The front-end transfer device 11 or the transfer module 5 can be a rotary manipulator. After cleaning, it can be returned along the original path or sent back to the front-end module 1 via the first horizontal direction transfer path. This transfer path combines the characteristics of the main channel in the first horizontal direction and the branch in the second horizontal direction, which not only ensures the continuity of the process, but also utilizes the space in the first horizontal direction to achieve a compact arrangement of modules.

[0119] Therefore, the main transmission path in the first horizontal direction ensures rapid connection between the front-end module 1 and the polishing module 3. The parallel layout in the second horizontal direction allows the polished wafers to be transferred into the cleaning module 4 over a short distance, reducing the transmission time caused by the cleaning module 4 being far from the polishing module 3 in the traditional sequential arrangement. At the same time, the two modules arranged in parallel along the second horizontal direction can perform parallel preprocessing or alternating operations according to production needs. For example, when the polishing module 3 is processing a wafer, the cleaning module 4 can simultaneously complete the final processing of the previous wafer, improving the equipment's wafer processing efficiency.

[0120] In this embodiment, as Figure 9 As shown, the cleaning module 4 includes a fourth rack 41, a first cleaning station 42, a temporary storage station 43, and a second cleaning station 44. The fourth rack 41 serves as a base for mounting all other components of the cleaning module 4, including the first cleaning station 42, the temporary storage station 43, and the second cleaning station 44, to integrate the cleaning module 4 together. The first cleaning station 42 and the second cleaning station 44 are used for cleaning and drying the wafers, while the temporary storage station 43 is used for temporary storage of the wafers.

[0121] In some embodiments, such as Figure 1 and Figure 2 As shown, the wafer processing equipment also includes a transfer module 5, and the thinning module 2 and the polishing module 3 are all located within the transfer range of the transfer module 5. The transfer module 5 is used to transfer wafers between at least the thinning module 2 and the polishing module 3. The transfer module 5 is configured to form a functional component together with at least one of the trimming module 6, the thinning module 2, the polishing module 3 and the front-end module 1.

[0122] In some embodiments, the cleaning module 4 can be fixed on the rack corresponding to the thinning module 2 or the rack corresponding to the polishing module 3, saving space and cost.

[0123] In some embodiments, when the thinning module 2 and the polishing module 3 are bonded together, the transmission module 5 can be fixed above the bonding area between the frame corresponding to the thinning module 2 and the frame corresponding to the polishing module 3; or the transmission module 5 can be fixed on the frame corresponding to the thinning module 2 or the frame corresponding to the polishing module 3.

[0124] like Figure 3 and Figure 4 As shown, in the functional components, at least two of the front-end module 1, thinning module 2, polishing module 3 and cleaning module 4 are arranged along the first horizontal direction, and at least one of the front-end module 1, thinning module 2, polishing module 3 and cleaning module 4 is arranged along the second horizontal direction, and the first horizontal direction and the second horizontal direction are perpendicular to each other.

[0125] This vertical arrangement allows for full utilization of planar space, rational allocation of module positions, and spatial integration within functional components. It also makes the distances between modules more reasonable, enabling transmission module 5 to plan shorter transmission paths. When it is necessary to increase the number of modules or integrate new functions, expansion can be carried out in the available areas of the first or second horizontal direction. This two-dimensional module layout makes the operating area of ​​the equipment more dispersed and orderly, allowing operators to perform maintenance, monitoring, and other operations on the corresponding modules from different directions, reducing mutual interference between different module operations.

[0126] Among them, the front-end module 1, as one of the core functional components, can be positioned at a key node in the first or second horizontal direction according to layout requirements, forming a close spatial connection with other process modules. The transmission path of the transmission module 5 can be adaptively planned according to the layout in two dimensions, covering modules arranged in different directions, ensuring efficient flow of wafers between modules distributed in the two directions.

[0127] For example, the front-end module 1 and the thinning module 2 are arranged in the first horizontal direction, and the polishing module 3 is arranged next to the front-end module 1 in the second horizontal direction; or the thinning module 2 and the polishing module 3 are distributed in sequence in the first horizontal direction, and the front-end module 1 is arranged in the second horizontal direction corresponding to the position of the thinning module 2, etc. This application does not limit the combination.

[0128] In some embodiments, such as Figure 3 and Figure 4 As shown, the functional component includes a front-end module 1, and the width occupied by the functional component in the second horizontal direction is less than or equal to the width of the front-end module 1 in the second horizontal direction.

[0129] By constraining the width of the second horizontal direction to not exceed the width of the front-end module 1, the spatial expansion of the module in the second horizontal direction is forcibly limited, enabling the functional components to form a compact layout in the second horizontal dimension. When the front-end transmission device 11 of the front-end module 1 moves the wafer to the next module along the width direction of the front-end module 1, it can cover the transport path to the maximum extent, facilitating the transmission of the front-end transmission device 11, effectively improving the transmission speed, and reducing problems such as vibration and offset during the transmission process, thereby enhancing the stability and accuracy of wafer transmission.

[0130] In some embodiments, when the front-end module 1 and at least one of the thinning module 2, polishing module 3 and trimming module 6 jointly constitute a functional component, the modules constituting the functional component are arranged closely together or connected to each other through a detachable connection structure.

[0131] The modules that make up the functional components are arranged in close proximity through optimized spatial layout, with minimal gaps reserved between modules to meet the safety distance and maintenance space required for equipment operation.

[0132] For example, the front-end module 1 and the thinning module 2 arranged along the first horizontal direction can adopt a fitted layout, with the spacing between adjacent sides controlled within the minimum operating range. The polishing module 3 and the cleaning module 4 arranged side by side along the second horizontal direction are arranged in a compact manner, so that the edges are aligned or partially overlapped, forming an integrated form without redundant space. The module collaboration is achieved through spatial positioning.

[0133] Alternatively, the modules can be fixed together using a detachable connection structure. This detachable connection structure has a positioning function to ensure the relative positional accuracy of the modules during docking, while also supporting quick assembly and disassembly. For example, the front-end module 1 and the polishing module 3 can be initially fixed by inserting positioning pins on both sides into the positioning holes of each other, and then locked in place by manual or automatic locking. The thinning module 2 and the cleaning module 4 can be connected by bolts, with the help of guide rails to facilitate the easy loading and unloading of the modules, and the strength of the connection structure meets the vibration and load requirements during equipment operation.

[0134] Whether the modules are closely spaced or detachable, the relative positional accuracy between them remains stable, while also allowing for dynamic adjustment. The arrangement can be changed according to production needs, and modules can be quickly replaced or added / removed for reconfiguration. The detachable connection structure can be secured using quick-locking mechanisms, locating pins and holes, bolt connections, etc., which are not limited to this application.

[0135] In some embodiments, when at least two of the front-end module 1, thinning module 2, polishing module 3 and cleaning module 4 constitute a functional component, a detachable connection structure is provided on the adjacent side of each module constituting the functional component.

[0136] The detachable connection structures are concentrated on the adjacent sides between modules. For example, when the front-end module 1 and the thinning module 2 are adjacent along the first horizontal direction, the opposite sides of the two are respectively provided with matching detachable connection structures. When the polishing module 3 and the cleaning module 4 are adjacent along the second horizontal direction, the opposite sides of the two are also arranged with corresponding detachable connection structures.

[0137] The detachable connection on the adjacent side creates a rigid physical connection between the modules while retaining the possibility of separation. When the modules are assembled, they can be quickly aligned, facilitating wafer transfer interface docking and ensuring that the front-end transfer device 11 of the front-end module 1 can smoothly transfer the wafer to the thinning module 2, or that the connection structure between the polishing module 3 and the cleaning module 4 is without deviation. When disassembling, the connection structure can be loosened to disconnect the module, which can be moved or replaced independently without affecting the basic functions of other modules.

[0138] In some embodiments, the front-end module 1, the thinning module 2, and the polishing module 3 each have at least one maintenance surface facing the outside of the wafer processing equipment. A detachable connection structure is provided in the front-end module 1, the thinning module 2, the polishing module 3, and the cleaning module 4 on the side of the module constituting the functional component that does not have a maintenance surface. The maintenance surface is a side wall surface with a maintenance panel or a maintenance window.

[0139] The front-end module 1, the thinning module 2, and the polishing module 3 are each provided with at least one maintenance surface. This maintenance surface is a side wall surface equipped with a maintenance panel or maintenance window, and all face the outside of the wafer processing equipment. Operators can conveniently inspect the key components inside the module from outside the equipment through the maintenance surface, and can complete maintenance, parameter adjustment and other operations without going deep into the equipment.

[0140] The detachable connection structure is located on the side of each module that constitutes the functional components, where there is no maintenance surface. Since the maintenance surface faces the outside of the equipment, the sidewall of the non-maintenance surface is usually not easily affected by external collisions or interference. Placing the detachable connection structure here reduces the risk of loosening due to accidental human contact. Moreover, the connection structure is hidden inside the module or on the adjacent side, making the equipment appearance more regular, avoiding externally protruding connection parts that occupy extra space or cause safety hazards, and improving the compactness and aesthetics of the equipment layout.

[0141] In some embodiments, such as Figure 10 As shown, the trimming module 6 can be arranged with the front-end module 1 along the first horizontal direction, with a detachable connection structure on the non-maintenance side of the two adjacent to each other, forming a functional component for front-end feeding plus trimming pre-processing. Alternatively, the trimming module 6, the front-end module 1, and the thinning module 2 can jointly form a component, with the front-end module 1, trimming module 6, and thinning module 2 distributed sequentially along the first horizontal direction, and the width of the trimming module 6 in the second horizontal direction not exceeding the width of the front-end module 1. The connection structures are all deployed on the non-maintenance side, and the maintenance surface uniformly faces the outside of the equipment. Alternatively, for wafers with many edge defects, the front-end module 1, trimming module 6, polishing module 3, and cleaning module 4 can be combined for direct cleaning after trimming and polishing, improving the cleanliness of the wafer. The flexible combination capability of the trimming module 6 can adapt to the process requirements of different scenarios, enhancing the market competitiveness and application breadth of the equipment.

[0142] In some embodiments, such as Figure 10 As shown, the trimming module 6 is located on one side of the front-end module 1 along the second horizontal direction.

[0143] Since the trimming module 6 is located within the transmission range of the front-end transmission device 11, the front-end transmission device 11 can switch between the first horizontal direction and the second horizontal direction through a rotation or telescopic mechanism. By setting the trimming module 6 on one side of the front-end module 1 along the second horizontal direction, after the wafer is taken out from the wafer cassette of the front-end module 1, it is transferred to the trimming module 6 through the second horizontal direction transmission path. After trimming, it returns to the front-end module 1 through the original path, or is directly transferred to other process modules such as the thinning module 2. The transmission path does not need to detour significantly, ensuring the high efficiency of wafer transfer.

[0144] Furthermore, it makes full use of the unused space in the second horizontal direction next to the front-end module 1, avoiding the problem of excessive equipment length in the first horizontal direction caused by adding modules in the first horizontal direction. This layout allows the equipment to maintain a compact main process flow in the first horizontal direction, while the second horizontal direction achieves functional expansion through the integration of the trimming module 6, resulting in a more balanced overall footprint and improved functional density per unit space.

[0145] In some embodiments, such as Figure 11 As shown, the trimming module 6 is located on one side of the front-end module 1 along the first horizontal direction, and the transmission module 5 and the thinning module 2 are both located adjacent to the trimming module 6.

[0146] The front-end transfer device 11 can transfer the wafer from the front-end module 1 to the trimming module 6 along the first horizontal direction. After trimming, the transfer module 5 takes over the wafer transfer task and transfers it to the adjacent thinning module 2. The transfer path of the transfer module 5 covers the trimming module 6 and the thinning module 2. It achieves efficient wafer transfer through straight-line transfer or short-distance turning, without the need for complex path planning, ensuring the continuity of wafer flow between each process.

[0147] The trimming module 6 is positioned along the first horizontal direction of the front-end module 1, adjacent to the transfer module 5 and the thinning module 2, forming a continuous process flow from front-end material feeding to trimming pre-processing and then to thinning processing. After the wafer is taken out from the front-end module 1, it is directly transferred to the trimming module 6 along the first horizontal direction. After trimming, it quickly enters the thinning module 2 through the transfer module 5, reducing jumps between process steps and improving the overall process continuity and flow efficiency.

[0148] The trimming module 6 is laterally adjacent to the front-end module 1, and the transmission module 5 and the thinning module 2 are closely adjacent to the trimming module 6, which significantly shortens the transmission distance of the wafer between the modules. The paths of the front-end transmission device 11 and the transmission module 5 are mainly straight lines, reducing turning and detours, reducing transmission time loss and wafer vibration risk, and improving the efficiency and stability of wafer transfer.

[0149] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.

Claims

1. A wafer processing apparatus characterized by comprising: include: Front-end module; The trimming module is used to trim the edges of the wafer to be processed; A thinning module is disposed downstream of the front-end module, and the thinning module is used to thin the wafer; A polishing module is disposed downstream of the front-end module, and the polishing module is used to perform chemical mechanical polishing on the wafer; The front-end module, the trimming module, the thinning module, and the polishing module are all independent modular units, and the front-end module and at least one of the trimming module, the thinning module, and the polishing module are configured to jointly form a functional component, which is used to perform at least one of trimming, thinning, and polishing of the wafer.

2. The wafer processing apparatus according to claim 1, wherein The front-end module, the trimming module, the thinning module, and the polishing module all include a frame, and the frames of each module can be combined and spliced ​​together.

3. The wafer processing apparatus according to claim 2, wherein The rack corresponding to the front-end module and the rack corresponding to the trimming module are combined and spliced ​​to form a trimming functional component.

4. The wafer processing apparatus according to claim 2, wherein The rack corresponding to the front-end module and the rack corresponding to the thinning module are combined and spliced ​​to form a thinning functional component.

5. The wafer processing apparatus according to claim 2, wherein The rack corresponding to the front-end module and the rack corresponding to the polishing module are combined and spliced ​​to form a polishing functional component.

6. The wafer processing apparatus according to claim 2, wherein The frame corresponding to the front-end module is combined and spliced ​​with the frame corresponding to the trimming module and the frame corresponding to the thinning module to form a trimming and thinning functional component.

7. The wafer processing equipment according to claim 2, characterized in that, The frame corresponding to the front-end module is combined and spliced ​​with the frame corresponding to the trimming module, the frame corresponding to the thinning module, and the frame corresponding to the polishing module to construct a trimming, thinning, and polishing functional component.

8. The wafer processing apparatus according to any one of claims 1 to 7, characterized by The wafer processing equipment also includes a cleaning module, which is used to clean the wafer and perform post-cleaning processing. The cleaning module is configured to constitute the functional component together with at least one of the thinning module and the polishing module and the front-end module, or the cleaning module is configured to constitute the functional component together with the trimming module, the thinning module and the front-end module.

9. The wafer processing apparatus according to any one of claims 1 to 7, characterized by The wafer processing equipment further includes a transfer module, wherein the thinning module and the polishing module are both located within the transfer range of the transfer module. The transfer module is used to transfer the wafer between at least the thinning module and the polishing module. The transfer module is configured to constitute the functional components together with at least one of the trimming module, the thinning module, the polishing module, and the front-end module.

10. The wafer processing apparatus according to any one of claims 1 to 7, characterized by When the front-end module and at least one of the trimming module, the thinning module and the polishing module together constitute a functional component, the modules constituting the functional component are arranged closely together or connected to each other through a detachable connection structure.

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