Lapping and polishing apparatus and diamond thin film processing equipment
By combining the lifting and positioning mechanisms, and using ball bearings and polishing pads to limit the diamond film, the problem of diamond film displacement during processing is solved, achieving high-quality processing results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- GOLDEN LEOPARD TECH (SUZHOU) CO LTD
- Filing Date
- 2025-08-22
- Publication Date
- 2026-07-31
AI Technical Summary
Diamond films are prone to displacement during processing, resulting in poor processing quality. Existing devices are difficult to effectively position and limit them.
A device comprising a lifting mechanism, a positioning mechanism, and a grinding and polishing mechanism is designed. The positioning mechanism and the grinding and polishing mechanism are lowered by the lifting plate. The diamond film is limited by the ball bearings and the polishing pad, and the positioning is maintained by the rebound force of the spring. The anti-slip pad is used to increase the friction and prevent deviation.
This effectively prevents the diamond film from shifting during processing, ensuring processing quality and precision.
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Figure CN224575384U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of diamond thin film processing technology, specifically to a grinding and polishing device and a diamond thin film processing equipment. Background Technology
[0002] Diamond films have shown great application potential in many fields due to their excellent hardness, good thermal conductivity, optical transparency from ultraviolet to infrared, and high chemical stability. However, diamond films prepared by vapor deposition often have problems such as large surface roughness and poor flatness after formation, which seriously limits their application in some high-precision fields. Therefore, grinding and polishing equipment is needed to grind and polish their surfaces.
[0003] Because diamond films are thin, they are not easy to position using clamping. Furthermore, due to their rough surface, the effect of vacuum adsorption is not ideal. Traditional diamond film grinding and polishing devices are also not easy to position, which can easily lead to displacement during the grinding and polishing process and affect the processing quality. Therefore, we need to propose a grinding and polishing device and a diamond film processing equipment. Utility Model Content
[0004] The purpose of this invention is to provide a grinding and polishing device and a diamond film processing equipment to limit the diamond film, prevent it from shifting during processing, and ensure processing quality, thereby solving the problems mentioned in the background art.
[0005] To achieve the above objectives, this utility model provides the following technical solution: A grinding and polishing apparatus, comprising: The housing has a partition fixedly installed inside it. The housing is divided into a first chamber and a second chamber by the partition. A lifting plate is installed inside the first chamber. The grinding and polishing mechanism, which is set on the lifting plate, grinds and polishes the diamond film; The positioning mechanism consists of two sets, which are symmetrically arranged at the bottom of the lifting plate to position the diamond film. The lifting mechanism is located inside the first chamber and is used to drive the lifting plate to move up and down, so that the grinding and polishing mechanism and the positioning mechanism set on the lifting plate can move up and down. The liquid supply mechanism, which is located on the lifting plate, is used to provide the polishing fluid required for diamond film processing.
[0006] Preferably, the grinding and polishing mechanism includes a first drive motor, a connecting rod, a grinding disc, and a polishing pad. The connecting rod is rotatably mounted on the bottom of the lifting plate, and the top end of the connecting rod passes through the lifting plate and is fixedly connected to the first drive motor. The bottom end of the connecting rod is fixedly connected to the grinding disc, and the polishing pad is disposed at the bottom of the grinding disc.
[0007] Preferably, the positioning mechanism includes a damping rod, a spring, a connecting block, and a ball bearing. The damping rod is fixedly installed at the bottom of the lifting plate, and the bottom end of the damping rod is fixedly connected to the connecting block. The spring is sleeved on the outer wall of the damping rod, and the ball bearing is rolled on the bottom of the connecting block.
[0008] Preferably, the lifting mechanism includes a threaded rod, a second drive motor, a limiting rod, and two sets of auxiliary blocks. The threaded rod is rotatably installed inside the first chamber, and the top end of the threaded rod is fixedly connected to the second drive motor. One side of the lifting plate is threadedly connected to the outer wall of the threaded rod. The limiting rod is fixedly installed inside the first chamber, and the other side of the lifting plate is slidably installed on the outer wall of the limiting rod.
[0009] Preferably, the housing is provided with sliding grooves on both sides of the first chamber that are adapted to the auxiliary blocks. The two sets of auxiliary blocks are slidably installed inside the two sets of sliding grooves, and the two sets of auxiliary blocks are fixedly connected to both sides of the lifting plate.
[0010] Preferably, the liquid supply mechanism includes a liquid storage tank, a liquid outlet pipe, and a liquid outlet head. The liquid storage tank is fixedly installed on the top of the lifting plate. One end of the liquid outlet pipe is fixedly connected to the liquid storage tank, and the other end of the liquid outlet pipe passes through the lifting plate and is connected to the liquid outlet head.
[0011] A diamond thin film processing device includes a grinding and polishing apparatus, and further includes: a material tray, a rotating rod, a turntable bearing, and a rotating mechanism for rotating the rotating rod and the material tray.
[0012] Preferably, the top of the material tray is provided with a material trough, and the inside of the material trough is provided with an anti-slip mat.
[0013] Preferably, the rotating rod is rotatably installed inside the second chamber, the top end of the rotating rod passes through the partition and is fixedly connected to the material tray, the turntable bearing is disposed on the top of the partition, and the top end of the turntable bearing is fixedly connected to the material tray.
[0014] Preferably, the rotating mechanism includes a third drive motor, a connecting shaft, a driving bevel gear, and a driven bevel gear. The third drive motor is fixedly installed inside the second chamber, and its output end is fixedly connected to the connecting shaft. The driving bevel gear is fixedly sleeved on the outer wall of the connecting shaft, and the driven bevel gear is fixedly sleeved on the outer wall of the rotating rod, and the driven bevel gear meshes with the driving bevel gear.
[0015] Compared with the prior art, the beneficial effects of this utility model are: This invention uses a lifting mechanism to lower a lifting plate, which in turn lowers a positioning mechanism and a grinding and polishing mechanism. This allows two sets of ball bearings to come into contact with a diamond film placed inside a material tank. As the lifting plate continues to descend, the polishing pad can process the diamond film. At this point, the damping rod and spring retract, using the spring's rebound force to keep the ball bearings on the surface of the diamond film. The anti-slip pad further limits the diamond film's position, preventing it from shifting during processing and ensuring processing quality. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 This is a schematic diagram of the grinding and polishing mechanism of this utility model; Figure 3 This is a schematic diagram of the positioning mechanism of this utility model; Figure 4 This is a schematic diagram of the rotating mechanism of this utility model.
[0017] In the diagram: 1. Housing; 101. First chamber; 102. Second chamber; 2. Partition; 3. Lifting plate; 4. Grinding and polishing mechanism; 41. First drive motor; 42. Connecting rod; 43. Grinding disc; 44. Polishing pad; 5. Positioning mechanism; 51. Damping rod; 52. Spring; 53. Connecting block; 54. Ball bearing; 6. Lifting mechanism; 61. Threaded rod; 62. Second drive motor; 63. Limiting rod; 64. Auxiliary block; 7. Liquid supply mechanism; 71. Liquid storage tank; 72. Liquid outlet pipe; 73. Liquid outlet head; 8. Material tray; 9. Rotating rod; 10. Turntable bearing; 11. Rotating mechanism; 111. Third drive motor; 112. Connecting shaft; 113. Driving bevel gear; 114. Driven bevel gear; 12. Material trough; 13. Anti-slip pad. Detailed Implementation
[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0019] Please see Figure 1-4 This utility model provides a technical solution: A grinding and polishing apparatus includes: a housing 1, inside which a partition 2 is fixedly installed; the housing 1 is divided by the partition 2 to form a first chamber 101 and a second chamber 102; a lifting plate 3 is movably installed inside the first chamber 101; a grinding and polishing mechanism 4, which is disposed on the lifting plate 3, for grinding and polishing a diamond film; a positioning mechanism 5, which is provided in two sets, symmetrically arranged at the bottom of the lifting plate 3, for positioning the diamond film; a lifting mechanism 6, which is disposed inside the first chamber 101, for driving the lifting plate 3 to move up and down, thereby causing the grinding and polishing mechanism 4 and the positioning mechanism 5 disposed on the lifting plate 3 to move up and down; and a liquid supply mechanism 7, which is disposed on the lifting plate 3, for providing polishing liquid required for diamond film processing. In this embodiment, the lifting mechanism 6 drives the lifting plate 3 to descend, and the lifting plate 3 drives the positioning mechanism 5 and the grinding and polishing mechanism 4 to descend. The positioning mechanism 5 limits the diamond film, and the lifting plate 3 continues to descend until the grinding and polishing mechanism 4 can process the diamond film. It can position the diamond film while processing it, so as to avoid it from shifting during processing and ensure the processing quality. The grinding and polishing mechanism 4 includes a first drive motor 41, a connecting rod 42, a grinding disc 43, and a polishing pad 44. The connecting rod 42 is rotatably mounted on the bottom of the lifting plate 3, and the top end of the connecting rod 42 passes through the lifting plate 3 and is fixedly connected to the first drive motor 41. The bottom end of the connecting rod 42 is fixedly connected to the grinding disc 43, and the polishing pad 44 is set at the bottom of the grinding disc 43. In this embodiment, the output end of the first drive motor 41 drives the connecting rod 42 to rotate, the connecting rod 42 drives the grinding disc 43 to rotate, and then the polishing pad 44 is used to process the surface of the diamond film. The positioning mechanism 5 includes a damping rod 51, a spring 52, a connecting block 53, and a ball bearing 54. The damping rod 51 is fixedly installed at the bottom of the lifting plate 3, and the bottom end of the damping rod 51 is fixedly connected to the connecting block 53. The spring 52 is sleeved on the outer wall of the damping rod 51, and the ball bearing 54 is rolled on the bottom of the connecting block 53. In this embodiment, when the lifting plate 3 drives the positioning mechanism 5 to descend, the two sets of balls 54 will come into contact with the diamond film. As the lifting plate 3 continues to descend, until the polishing pad 44 can process the diamond film, the damping rod 51 and the spring 52 will retract. The rebound force of the spring 52 will be used to position the balls 54 on the surface of the diamond film and position them. The lifting mechanism 6 includes a threaded rod 61, a second drive motor 62, a limiting rod 63, and two sets of auxiliary blocks 64. The threaded rod 61 is rotatably installed inside the first chamber 101, and the top end of the threaded rod 61 is fixedly connected to the second drive motor 62. One side of the lifting plate 3 is threadedly connected to the outer wall of the threaded rod 61. The limiting rod 63 is fixedly installed inside the first chamber 101, and the other side of the lifting plate 3 is slidably installed on the outer wall of the limiting rod 63. In this embodiment, the output end of the second drive motor 62 drives the threaded rod 61 connected to it to rotate, and the lifting plate 3 is limited by the limiting rod 63, so that the lifting plate 3 can be raised and lowered, thereby driving the grinding and polishing mechanism 4, the positioning mechanism 5 and the liquid supply mechanism 7 to be raised and lowered. The housing 1 has sliding grooves on both sides of the first chamber 101 that are adapted to the auxiliary blocks 64. The two sets of auxiliary blocks 64 are slidably installed inside the two sets of sliding grooves, and the two sets of auxiliary blocks 64 are fixedly connected to both sides of the lifting plate 3. In this embodiment, when the lifting plate 3 is raised or lowered, it will drive the two sets of auxiliary blocks 64 connected to it to slide inside the two sets of sliding grooves respectively. Since the auxiliary blocks 64 can only move in a straight line, the lifting plate 3 can always maintain a straight line movement, avoid tilting, and ensure processing accuracy. The liquid supply mechanism 7 includes a liquid storage tank 71, a liquid outlet pipe 72, and a liquid outlet head 73. The liquid storage tank 71 is fixedly installed on the top of the lifting plate 3. One end of the liquid outlet pipe 72 is fixedly connected to the liquid storage tank 71, and the other end of the liquid outlet pipe 72 passes through the lifting plate 3 and is connected to the liquid outlet head 73. In this embodiment, the storage tank 71 is used to store the polishing liquid and deliver it to the outlet head 73 through the outlet pipe 72. The liquid is dripped out through the outlet head 73 to cool the diamond film and prevent it from being damaged by the temperature generated during processing. The outlet pipe 72 and the outlet head 73 can be the movable joint pipe and nozzle commonly used in cutting machines, which will not be described in detail here. A diamond thin film processing device includes a grinding and polishing apparatus, and further includes: a material tray 8, a rotating rod 9, a turntable bearing 10, and a rotating mechanism 11 for rotating the rotating rod 9 and the material tray 8. The top of the material tray 8 is provided with a material trough 12, and the inside of the material trough 12 is provided with an anti-slip pad 13; In this embodiment, the material tank 12 should be compatible with the diamond film. If it is not compatible, the material tray 8 should be replaced. The diamond film to be processed is located inside the material tank 12 and is in contact with the anti-slip pad 13. The anti-slip pad 13 can increase the friction between the material tray 8 and the diamond film. With the cooperation of the positioning mechanism 5, the diamond film can be positioned well. It is worth noting that the two sets of positioning mechanisms 5 are located on both sides of the center of the top of the diamond film, while the grinding and polishing mechanism 4 is not located directly above the center of the diamond film, but should be set in a position that can satisfy the processing of its entire surface. The rotating rod 9 is rotatably installed inside the second chamber 102. The top end of the rotating rod 9 passes through the partition 2 and is fixedly connected to the material tray 8. The turntable bearing 10 is set on the top of the partition 2, and the top end of the turntable bearing 10 is fixedly connected to the material tray 8. In this embodiment, the rotation of the rotating rod 9 can drive the material tray 8 to rotate, thereby causing the diamond film placed inside the material tank 12 to rotate. In conjunction with the grinding and polishing mechanism 4, its surface is processed. The rotating disc bearing 10 can support the material tray 8 to ensure the stability of the material tray 8 when it rotates. The rotating mechanism 11 includes a third drive motor 111, a connecting shaft 112, a driving bevel gear 113, and a driven bevel gear 114. The third drive motor 111 is fixedly installed inside the second chamber 102. The output end of the third drive motor 111 is fixedly connected to the connecting shaft 112. The driving bevel gear 113 is fixedly sleeved on the outer wall of the connecting shaft 112. The driven bevel gear 114 is fixedly sleeved on the outer wall of the rotating rod 9, and the driven bevel gear 114 meshes with the driving bevel gear 113. In this embodiment, the output end of the third drive motor 111 drives the connecting shaft 112 to rotate, the connecting shaft 112 drives the active bevel gear 113 to rotate, the active bevel gear 113 drives the driven bevel gear 114 meshing with it to rotate, thereby causing the rotating rod 9 to rotate, and the rotating rod 9 drives the material disk 8 to rotate.
[0020] In this application, the first drive motor 41 can be a Y80M2-4 three-phase asynchronous frequency converter motor, the second drive motor 62 can be a 110AEA12025-SH3 servo motor, and the third drive motor 111 can be a 6GU-550W-10K geared motor. All of them are finished products in the prior art, and will not be described in detail here.
[0021] Working principle: When using this utility model, firstly, the diamond film to be processed is placed inside the material tank 12. Then, the rotating mechanism 11 drives the material disk 8 to rotate, causing the diamond film to rotate. Then, the lifting mechanism 6 drives the lifting plate 3 to descend. The lifting plate 3 drives the positioning mechanism 5 and the grinding and polishing mechanism 4 to descend, so that the two sets of balls 54 come into contact with the diamond film. As the lifting plate 3 continues to descend, the polishing pad 44 can process the diamond film. At this time, the damping rod 51 and the spring 52 will retract. The rebound force of the spring 52 keeps the balls 54 on the surface of the diamond film. With the cooperation of the anti-slip pad 13, the diamond film can be limited to prevent it from shifting during processing, thus ensuring the processing quality.
[0022] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A lapping polishing apparatus characterized by comprising: include: The housing has a partition fixedly installed inside it. The housing is divided into a first chamber and a second chamber by the partition. A lifting plate is installed inside the first chamber. The grinding and polishing mechanism, which is set on the lifting plate, grinds and polishes the diamond film; The positioning mechanism consists of two sets, which are symmetrically arranged at the bottom of the lifting plate to position the diamond film. The lifting mechanism is located inside the first chamber and is used to drive the lifting plate to move up and down, so that the grinding and polishing mechanism and the positioning mechanism set on the lifting plate can move up and down. The liquid supply mechanism, which is located on the lifting plate, is used to provide the polishing fluid required for diamond film processing.
2. The lapping polishing apparatus of claim 1, wherein: The grinding and polishing mechanism includes a first drive motor, a connecting rod, a grinding disc, and a polishing pad. The connecting rod is rotatably mounted on the bottom of the lifting plate, and the top end of the connecting rod passes through the lifting plate and is fixedly connected to the first drive motor. The bottom end of the connecting rod is fixedly connected to the grinding disc, and the polishing pad is disposed at the bottom of the grinding disc.
3. The lapping polishing apparatus of claim 1, wherein: The positioning mechanism includes a damping rod, a spring, a connecting block, and a ball bearing. The damping rod is fixedly installed at the bottom of the lifting plate, and the bottom end of the damping rod is fixedly connected to the connecting block. The spring is sleeved on the outer wall of the damping rod, and the ball bearing is rolled on the bottom of the connecting block.
4. The lapping-polishing apparatus of claim 1, wherein: The lifting mechanism includes a threaded rod, a second drive motor, a limit rod, and two sets of auxiliary blocks. The threaded rod is rotatably installed inside the first chamber, and the top end of the threaded rod is fixedly connected to the second drive motor. One side of the lifting plate is threadedly connected to the outer wall of the threaded rod. The limit rod is fixedly installed inside the first chamber, and the other side of the lifting plate is slidably installed on the outer wall of the limit rod.
5. The lapping polishing apparatus of claim 4, wherein: The housing is provided with sliding grooves on both sides of the first chamber, which are adapted to the auxiliary blocks. The two sets of auxiliary blocks are slidably installed inside the two sets of sliding grooves, and the two sets of auxiliary blocks are fixedly connected to the two sides of the lifting plate.
6. The lapping-polishing apparatus of claim 1, wherein: The liquid supply mechanism includes a liquid storage tank, a liquid outlet pipe, and a liquid outlet head. The liquid storage tank is fixedly installed on the top of the lifting plate. One end of the liquid outlet pipe is fixedly connected to the liquid storage tank, and the other end of the liquid outlet pipe passes through the lifting plate and is connected to the liquid outlet head.
7. A diamond thin film processing apparatus, comprising the grinding and polishing device according to any one of claims 1-6, characterized in that, Also includes: Material tray, rotating rod, turntable bearing, and rotating mechanism for rotating the rotating rod and material tray.
8. The diamond thin-film processing apparatus according to claim 7, characterized by: The top of the material tray has a material trough, and the inside of the material trough is provided with an anti-slip mat.
9. The diamond thin-film processing apparatus according to claim 7, characterized by: The rotating rod is rotatably installed inside the second chamber. The top end of the rotating rod passes through the partition and is fixedly connected to the material tray. The turntable bearing is located on the top of the partition, and the top end of the turntable bearing is fixedly connected to the material tray.
10. The diamond thin-film processing apparatus of claim 7, wherein: The rotating mechanism includes a third drive motor, a connecting shaft, a driving bevel gear, and a driven bevel gear. The third drive motor is fixedly installed inside the second chamber, and its output end is fixedly connected to the connecting shaft. The driving bevel gear is fixedly sleeved on the outer wall of the connecting shaft, and the driven bevel gear is fixedly sleeved on the outer wall of the rotating rod, and the driven bevel gear meshes with the driving bevel gear.