Wafer loading and unloading equipment and polishing equipment

Abstract

This utility model discloses a wafer loading / unloading device and a polishing equipment. The wafer loading / unloading device includes: a mounting plate; a wafer handling assembly; a polishing head docking assembly adapted to correspond to the polishing head; a loading temporary storage assembly; and a unloading temporary storage assembly. The wafer handling assembly is used to transport wafers between the loading temporary storage assembly, the unloading temporary storage assembly, and the polishing head docking assembly. By arranging the loading temporary storage assembly, the unloading temporary storage assembly, and the polishing head docking assembly circumferentially spaced outside the wafer handling assembly along the mounting plate, the wafer handling assembly can conveniently access the loading temporary storage assembly, the unloading temporary storage assembly, and the polishing head docking assembly through rotation and lifting movements. This optimizes the movement path of the wafer handling assembly, shortens wafer handling time, and fully utilizes the space around the wafer handling assembly, making the entire wafer loading / unloading device more compact and orderly. This reduces the debugging difficulty of the wafer loading / unloading device and improves its operational reliability.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a wafer loading and unloading device and a polishing equipment. Background Technology

[0002] In the chemical mechanical polishing process of semiconductors, wafer loading and unloading devices can realize the automated transfer of wafers between different workstations, and are key supporting equipment to ensure the continuous and stable operation of the process production line.

[0003] In related technologies, the layout of the loading, unloading, and processing docking stations of wafer loading and unloading devices is scattered and messy. The wafer handling mechanism needs to perform multi-directional and multi-segment displacement to complete the wafer handling. Its movement path is complex, which increases the overall debugging difficulty of the wafer loading and unloading device and reduces the overall working efficiency of the wafer loading and unloading device. Utility Model Content

[0004] The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a wafer loading and unloading device with a more compact and regular structure and layout, which can optimize the movement path of the wafer handling components, improve wafer handling efficiency, and reduce the debugging difficulty of the wafer loading and unloading device.

[0005] This utility model further proposes a polishing device.

[0006] The wafer loading and unloading device according to this utility model includes: a mounting plate; a wafer handling assembly, which is rotatably disposed on the mounting plate and can move up and down relative to the mounting plate; a polishing head docking assembly, which is disposed on the mounting plate and adapted to correspond to a polishing head to carry a wafer on the polishing head; a loading temporary storage assembly, which is disposed on the mounting plate and adapted to temporarily store wafers; and a unloading temporary storage assembly, which is disposed on the mounting plate and adapted to temporarily store wafers. The loading temporary storage assembly, the unloading temporary storage assembly, and the polishing head docking assembly are spaced apart circumferentially along the mounting plate outside the wafer handling assembly. The wafer handling assembly is used to transport wafers between the loading temporary storage assembly, the unloading temporary storage assembly, and the polishing head docking assembly.

[0007] Therefore, by arranging the loading temporary storage component, unloading temporary storage component, and head docking component circumferentially spaced on the outside of the wafer handling component along the mounting plate, the wafer handling component can conveniently access the loading temporary storage component, unloading temporary storage component, and head docking component through rotation and lifting movements. This optimizes the movement path of the wafer handling component, shortens wafer handling time, and improves wafer handling efficiency. It also makes full use of the space around the wafer handling component, making the structure of the entire wafer loading and unloading device more compact and regular, and effectively avoiding mutual interference between components. This reduces the debugging difficulty of the wafer loading and unloading device and improves its operational reliability.

[0008] In some examples of this utility model, the wafer handling assembly, the loading temporary storage assembly, and the unloading temporary storage assembly are arranged sequentially and spaced apart along the circumference of the mounting plate on the outside of the wafer handling assembly, with the loading temporary storage assembly located between the unloading temporary storage assembly and the wafer handling assembly.

[0009] In some examples of this utility model, the wafer handling assembly includes a clamping arm and a sealing seat. The sealing seat extends vertically along the mounting plate and is connected to the mounting plate at one end. The wafer slinger assembly, the loading temporary storage assembly, and the unloading temporary storage assembly are arranged circumferentially on the outside of the sealing seat along the mounting plate. The clamping arm extends radially along the mounting plate and is connected to the sealing seat at one end, with a gripper at the other end. The gripper is selectively positioned above the wafer slinger assembly, the loading temporary storage assembly, and the unloading temporary storage assembly to accommodate wafer clamping.

[0010] In some examples of this utility model, a waterproof cover is provided around the outer periphery of the sealing seat; and / or a lower sealing ring is provided on the circumferential edge of the lower end of the sealing seat, the lower sealing ring being adapted to be pressed between the sealing seat and the mounting plate of the wafer loading and unloading device; and / or an upper sealing ring is provided on the circumferential edge of the upper end of the sealing seat, the upper sealing ring being pressed between the clamping arm and the sealing seat.

[0011] In some examples of this utility model, the wafer handling assembly includes a drive assembly disposed on the lower side of the mounting plate. The drive assembly includes a rotary drive, a lifting drive, and a transmission shaft. The transmission shaft extends vertically and one end is connected to the rotary drive. The other end of the transmission shaft passes through the mounting plate and the sealing seat at least partially and is connected to the clamping arm. The rotary drive selectively drives the transmission shaft to rotate the clamping arm. The lifting drive selectively drives the rotary drive and the transmission shaft to move up and down to move the clamping arm up and down.

[0012] In some examples of this utility model, the throwing head docking assembly includes a mounting platform and a docking platform. The docking platform is disposed on the upper side of the mounting plate, the throwing head docking assembly penetrates through the mounting plate, the mounting platform is disposed on the lower side of the mounting plate, and a lifting rod is provided between the mounting platform and the docking platform.

[0013] In some examples of this utility model, the throwing head docking assembly further includes a docking drive component, which is disposed on the lower side of the mounting platform and is connected to the lifting rod in a transmission manner.

[0014] In some examples of this utility model, the docking station includes a carrier disk and a wafer cleaning component. A wafer carrying area is formed on the carrier disk, and the wafer carrying area is adapted to carry a wafer. The wafer cleaning component is disposed on the carrier disk and located below the wafer carrying area.

[0015] In some examples of this utility model, the material unloading temporary storage component includes an upper cleaning component, a lower cleaning component, and a material unloading temporary storage platform, wherein the upper cleaning component and the lower cleaning component are located on the upper and lower sides of the material unloading temporary storage platform, respectively.

[0016] The polishing equipment according to an embodiment of the present invention includes: the wafer loading and unloading device described above.

[0017] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0018] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of a wafer loading and unloading device according to an embodiment of the present utility model; Figure 2 This is a schematic diagram of the wafer loading and unloading device according to an embodiment of the present utility model after the mounting plate has been removed; Figure 3 This is a cross-sectional schematic diagram of a wafer handling assembly according to an embodiment of the present utility model.

[0019] Figure label: 100. Wafer loading and unloading device; 10. Mounting plate; 20. Wafer handling assembly; 201. Clamping arm; 2011. Gripper; 202. Sealing seat; 2021. Waterproof cover; 2022. Lower sealing ring; 2023. Upper sealing ring; 203. Drive assembly; 2031. Rotary drive component; 2032. Lifting drive component; 2033. Drive shaft; 30. Spinning head docking assembly; 301. Mounting platform; 302. Dating platform; 3021. Carrier tray; 3022. Wafer carrier area; 303. Lifting rod; 304. Dating drive component; 40. Material loading temporary storage component; 50. Material unloading temporary storage component; 501. Upper cleaning component; 502. Lower cleaning component; 503. Material unloading temporary storage platform. Detailed Implementation

[0020] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0021] The following is for reference. Figures 1-3 The wafer loading and unloading device 100 according to an embodiment of the present invention can be applied to polishing equipment.

[0022] Combination Figures 1-2 As shown, the wafer loading / unloading device 100 according to this utility model mainly includes: a mounting plate 10, a wafer handling assembly 20, a polishing head docking assembly 30, a loading temporary storage assembly 40, and an unloading temporary storage assembly 50. The wafer handling assembly 20 is rotatably mounted on the mounting plate 10 and can move up and down relative to the mounting plate 10; the polishing head docking assembly 30 is mounted on the mounting plate 10 and is adapted to correspond to the polishing head to carry the wafer on the polishing head; the loading temporary storage assembly 40 is mounted on the mounting plate 10 and is adapted to temporarily store the wafer; the unloading temporary storage assembly 50 is mounted on the mounting plate 10 and is adapted to temporarily store the wafer. The loading temporary storage assembly 40, the unloading temporary storage assembly 50, and the polishing head docking assembly 30 are spaced apart circumferentially along the outer side of the wafer handling assembly 20 along the mounting plate 10. The wafer handling assembly 20 is used to transport the wafer between the loading temporary storage assembly 40, the unloading temporary storage assembly 50, and the polishing head docking assembly 30.

[0023] Specifically, the mounting plate 10 serves as the load-bearing foundation and installation reference for the entire device and can be fixedly mounted on the machine base or other supporting structures.

[0024] Furthermore, the wafer handling assembly 20 is movably mounted on the mounting plate 10, and can rotate around its own axis and move vertically up and down.

[0025] Furthermore, the head docking assembly 30 is fixedly mounted on the mounting plate 10 and corresponds to the head. When the head needs to place the wafer onto the wafer loading / unloading device 100, the head docking assembly 30 can receive and carry the wafer from the head. When the head needs to supply the wafer to the head, the wafer can be placed onto the head docking assembly 30 by the wafer transport assembly 20 and then taken away by the head.

[0026] Furthermore, the loading temporary storage component 40 is fixedly mounted on the mounting plate 10 for temporarily storing the wafers to be processed. The wafer handling component 20 can take out the wafers from the loading temporary storage component 40 and transport them to other workstations for subsequent processes.

[0027] Furthermore, the unloading temporary storage component 50 is fixedly mounted on the mounting plate 10 and is used to temporarily store the processed wafers. The wafer handling component 20 can transport the processed wafers to the unloading temporary storage component 50 for storage.

[0028] Furthermore, the loading temporary storage component 40, the unloading temporary storage component 50, and the throwing head docking component 30 are arranged circumferentially on the outside of the wafer handling component 20 along the mounting plate 10. This allows the loading temporary storage component 40, the unloading temporary storage component 50, and the throwing head docking component 30 to be distributed in a fan shape or ring on the outside of the wafer handling component 20. This not only enables the wafer handling component 20 to conveniently access the workstations of each component through rotation and lifting movements, optimizing the movement path of the wafer handling component 20 and avoiding unnecessary horizontal linear movements, thereby shortening the wafer handling time and improving the wafer handling efficiency, but also makes full use of the space around the wafer handling component 20, making the structure of the entire wafer loading and unloading device 100 more compact and regular.

[0029] Moreover, the loading temporary storage component 40, the unloading temporary storage component 50, and the head docking component 30 are spatially independent and in fixed positions. Together with the lifting and rotating actions of the wafer handling component 20, it can be ensured that there is no mechanical interference or collision between the components during the loading, unloading, and docking of the wafers with the head. This not only ensures the safety and reliability of the wafer loading and unloading device 100, but also reduces the structural complexity and debugging difficulty of the wafer loading and unloading device 100.

[0030] Furthermore, the wafer handling assembly 20 is used to transport wafers between the loading temporary storage assembly 40, the unloading temporary storage assembly 50, and the polishing head docking assembly 30. When the wafer loading and unloading device 100 is working, the wafer handling assembly 20 first moves to the loading temporary storage assembly 40 and takes out a wafer to be processed; then it rotates and moves to the polishing head docking assembly 30 and places the wafer on the polishing head docking assembly 30, where it is picked up by the polishing head for processing; after processing, the polishing head puts the wafer back into the polishing head docking assembly 30; the wafer handling assembly 20 then takes the processed wafer from the polishing head docking assembly 30 and transports it to the unloading temporary storage assembly 50 for storage.

[0031] With this setup, the wafer handling component 20 can be rotated and lifted to move the wafer across workstations, thus enabling the automated process of wafer loading, head-mounting and unloading to be completed in an orderly manner. Furthermore, the workstation layout of each component is compact and orderly, and the overall structure of the wafer loading and unloading device 100 is simple with clear action logic, which can effectively improve the automation level and production continuity of wafer loading and unloading.

[0032] Therefore, by arranging the loading temporary storage component 40, the unloading temporary storage component 50, and the throwing head docking component 30 at circumferential intervals along the mounting plate 10 on the outer side of the wafer handling component 20, the wafer handling component 20 can conveniently access the loading temporary storage component 40, the unloading temporary storage component 50, and the throwing head docking component 30 through rotation and lifting movements. This optimizes the movement path of the wafer handling component 20, shortens wafer handling time, and improves wafer handling efficiency. Furthermore, it makes full use of the space around the wafer handling component 20, making the structure of the entire wafer loading and unloading device 100 more compact and regular, and effectively avoiding mutual interference between components. This reduces the debugging difficulty of the wafer loading and unloading device 100 and improves its operational reliability.

[0033] In some embodiments of this utility model, the loading temporary storage component 40 and the unloading temporary storage component 50 may each include one or more wafer storage slots, and each slot can accommodate one or more wafers.

[0034] Combination Figure 1 and Figure 2 As shown, the wafer handling assembly 30, the loading temporary storage assembly 40, and the unloading temporary storage assembly 50 are arranged sequentially and at intervals along the circumference of the mounting plate 10 on the outside of the wafer handling assembly 20, with the loading temporary storage assembly 40 located between the unloading temporary storage assembly 50 and the wafer handling assembly 30.

[0035] Specifically, the loading temporary storage component 40 is positioned close to the throwing head docking component 30. When the wafer transport component 20 picks up the wafer to be processed, it only needs to perform a short distance or a small rotation to transport the wafer from the loading temporary storage component 40 to the throwing head docking component 30, which can shorten the wafer transport stroke between the loading temporary storage component 40 and the throwing head docking component 30. At the same time, positioning the loading temporary storage component 40 between the unloading temporary storage component 50 and the throwing head docking component 30 also facilitates the wafer transport component 20 to quickly connect to the next loading transport action after completing the unloading transport action, thereby further improving the working continuity and efficiency of the loading and unloading device.

[0036] Combination Figure 1 , Figure 2 and Figure 3As shown, the wafer handling assembly 20 includes a clamping arm 201 and a sealing seat 202. The sealing seat 202 extends vertically along the mounting plate 10 and is connected to the mounting plate 10 at one end. The wafer throwing assembly 30, the loading temporary storage assembly 40, and the unloading temporary storage assembly 50 are arranged circumferentially around the outer side of the sealing seat 202 along the mounting plate 10. The clamping arm 201 extends radially along the mounting plate 10 and is connected to the sealing seat 202 at one end. The other end is provided with a gripper 2011. The gripper 2011 is selectively positioned above the wafer throwing assembly 30, the loading temporary storage assembly 40, and the unloading temporary storage assembly 50 to be suitable for clamping the wafer.

[0037] Specifically, the sealing seat 202 is connected to the mounting plate 10, and the clamping arm 201 can rotate and move up and down relative to the sealing seat 202 and the mounting plate 10. By rotating the clamping arm 201, the jaws 2011 at its end can selectively move to directly above the head docking assembly 30, the loading temporary storage assembly 40 or the unloading temporary storage assembly 50. In this way, the lifting and lowering of the clamping arm 201 and the opening or closing of the jaws 2011 can achieve precise gripping, handling and placement of the wafer by the jaws 2011.

[0038] Furthermore, a drive shaft 2033 is provided inside the sealing seat 202, which passes through the mounting plate 10 and the sealing seat 202 in sequence. The drive shaft 2033 is used to drive the clamping arm 201 to rotate and lift, connecting the sealing seat 202 to the mounting plate 10. The sealing seat 202 can seal the through hole of the drive shaft on the mounting plate 10, so that the mounting plate 10 forms a physical isolation interface, completely separating the wafer handling cleaning area above the mounting plate 10 from the area of ​​the drive assembly 203 below. This can not only effectively prevent liquids, particles or contaminants from penetrating or spreading between the upper and lower areas of the mounting plate 10, and prevent the drive assembly 203 and other components from being corroded or jammed, thus extending the service life of the drive assembly 203 and other components, but also optimize the overall spatial layout of the wafer handling assembly 20, simplify the electrical wiring design of the drive assembly 203, and facilitate the installation and maintenance of components in each area.

[0039] Combination Figure 1 , Figure 2 and Figure 3 As shown, a waterproof cover 2021 is provided around the outer periphery of the sealing seat 202; and / or a lower sealing ring 2022 is provided on the circumferential edge of the lower end of the sealing seat 202, the lower sealing ring 2022 being adapted to be pressed between the sealing seat 202 and the mounting plate 10 of the wafer loading and unloading device 100; and / or an upper sealing ring 2023 is provided on the circumferential edge of the upper end of the sealing seat 202, the upper sealing ring 2023 being pressed between the clamping arm 201 and the sealing seat 202.

[0040] In some embodiments of this utility model, the outer side of the sealing seat 202 is completely covered by the waterproof cover 2021. The waterproof cover 2021 fits and wraps the outer periphery of the sealing seat 202 and is connected to the drive shaft 2033. It can rotate and slide relative to the sealing seat 202. In this way, the relative sliding and relative rotation between the waterproof cover 2021 and the sealing seat 202 can adapt to the rotation and lifting movements of the drive shaft 2033. This allows the waterproof cover 2021 to synchronously and adaptively adjust its position according to the movement posture of the drive shaft 2033, thereby ensuring that the outer periphery of the drive shaft 2033 always maintains a sealing barrier to prevent liquids, particles or contaminants from contacting the drive shaft 2033 and causing damage or destruction to the drive shaft 2033 and other components. This improves the movement stability of the drive shaft 2033 and extends the service life of the wafer handling assembly 20.

[0041] In some other embodiments of this utility model, a lower sealing ring 2022 is provided on the circumferential edge of the lower end of the sealing seat 202. The lower sealing ring 2022 is pressed between the mating surfaces of the sealing seat 202 and the mounting plate 10. This can seal the assembly gap between the lower end of the sealing seat 202 and the mounting plate 10, preventing liquids, particles or contaminants from entering the space where the drive shaft 2033 is located or the lower area of ​​the mounting plate 10 through the gap, which would cause damage to the drive shaft 2033 or the drive assembly 203 and other components. This improves the motion stability of the drive shaft 2033 and extends the service life of the wafer handling assembly 20.

[0042] In some embodiments of this utility model, an upper sealing ring 2023 is provided on the circumferential edge of the upper end of the sealing seat 202. The upper sealing ring 2023 is pressed between the mating surfaces of the clamping arm 201 and the sealing seat 202. This can seal the assembly gap between the upper end of the sealing seat 202 and the clamping arm 201, preventing liquids, particles or contaminants from entering the space where the drive shaft 2033 is located or the lower area of ​​the mounting plate 10 through the gap, which would cause damage to the drive shaft 2033 or the drive assembly 203 and other components. This improves the motion stability of the drive shaft 2033 and extends the service life of the wafer handling assembly 20.

[0043] In addition, the structure of the sealing seat 202 can also adopt any combination of the three embodiments described above.

[0044] The above embodiments respectively seal the upper end, lower end and radially outer side of the sealing seat 202, which can prevent liquids, particles or contaminants from entering the interior of the sealing seat 202 from multiple directions. This can effectively improve the sealing performance of the sealing seat 202, realize the isolation of the upper and lower sides of the mounting plate 10, reduce the probability of corrosion, jamming and wear failure of components such as the drive shaft 2033, improve the operational stability of the wafer loading and unloading device 100, and extend the service life of the wafer loading and unloading device 100.

[0045] Combination Figure 1 , Figure 2 and Figure 3 As shown, the wafer handling assembly 20 includes a drive assembly 203, which is disposed on the lower side of the mounting plate 10. The drive assembly 203 includes a rotary drive 2031, a lifting drive 2032, and a drive shaft 2033. The drive shaft 2033 extends vertically and one end is connected to the rotary drive 2031. The other end of the drive shaft 2033 passes through the mounting plate 10 and the sealing seat 202 at least partially and is connected to the clamping arm 201. The rotary drive 2031 selectively drives the drive shaft 2033 to rotate the clamping arm 201. The lifting drive 2032 selectively drives the rotary drive 2031 and the drive shaft 2033 to move up and down to move the clamping arm 201 up and down.

[0046] Specifically, the drive shaft 2033 passes through the mounting plate 10 and the sealing seat 202 in a vertical direction, and extends upward to be fixedly connected to the clamping arm 201. The clamping arm 201 is movably mounted on the sealing seat 202. With this configuration, the drive component in the drive assembly 203 can provide driving force to the drive shaft 2033, and the drive shaft 2033 can drive the clamping arm 201 to move synchronously with it.

[0047] Furthermore, the driving components in the driving assembly 203 include a rotary driving component 2031 and a lifting driving component 2032. The rotary driving component 2031 can drive the transmission shaft 2033 to rotate around its axis, thereby driving the clamping arm 201 to rotate synchronously through the transmission shaft 2033. The lifting driving component 2032 can drive the rotary driving component 2031 and the transmission shaft 2033 to move vertically as a whole, thereby driving the clamping arm 201 to move up and down synchronously through the transmission shaft 2033.

[0048] This configuration allows the gripping arm 201 to rotate and lift synchronously with the drive shaft 2033, enabling precise wafer picking, placement, and orientation adjustment via the grippers 2011 on the gripping arm 201. Furthermore, controlling the rotation and lifting of the gripping arm 201 separately with two drive units simplifies the transmission structure between the drive units and the drive shaft 2033, and also improves the overall response speed, motion accuracy, and control flexibility of the wafer handling assembly 20.

[0049] Combination Figure 1 and Figure 2 As shown, the projectile docking assembly 30 includes a mounting platform 301 and a docking platform 302. The docking platform 302 is located on the upper side of the mounting plate 10. The projectile docking assembly 30 passes through the mounting plate 10. The mounting platform 301 is located on the lower side of the mounting plate 10. A lifting rod 303 is provided between the mounting platform 301 and the docking platform 302.

[0050] Specifically, the lifting rod 303 passes through the mounting plate 10, and its vertical ends are connected to the mounting platform 301 and the docking platform 302 on the upper and lower sides of the mounting plate 10, respectively. By driving the lifting rod 303 to extend or lift vertically, the docking platform 302 can be adjusted relative to the mounting plate 10. This allows the height of the docking platform 302 to be flexibly adjusted according to actual process requirements, thereby ensuring accurate alignment between the docking platform 302 and the polishing head, and improving the docking accuracy and compatibility of the wafer between the polishing head and the docking platform 302.

[0051] Furthermore, the separate structure of the mounting platform 301 and the docking platform 302 is adopted, with the docking platform 302 located on the upper side of the mounting plate 10 and the mounting platform 301 located on the lower side of the mounting plate 10. This facilitates the partitioned arrangement of the power mechanism and the actuator, thereby not only optimizing the spatial layout and reducing the space occupied by the projectile docking assembly 30 on the upper side of the mounting plate 10, but also facilitating the assembly, debugging, and subsequent inspection and maintenance of the components in the projectile docking assembly 30.

[0052] Combination Figure 1 and Figure 2 As shown, the throwing head docking assembly 30 also includes a docking drive component 304, which is disposed on the lower side of the mounting platform 301 and is connected to the lifting rod 303 in a transmission manner.

[0053] Specifically, the docking drive 304 is used to drive the lifting rod 303 to extend or lift, thereby driving the docking platform 302 to complete the lifting and adjustment. By setting the docking drive 304 on the lower side of the mounting platform 301, the docking drive 304 can be kept away from the wafer operation area, which facilitates the isolation and protection of the docking drive 304, reduces the impact of liquids, dust or foreign objects on the docking drive 304, and extends its service life.

[0054] Combination Figure 1 and Figure 2 As shown, the docking station 302 includes a carrier disk 3021 and a wafer cleaning component. A wafer carrying area 3022 is formed on the carrier disk 3021. The wafer carrying area 3022 is suitable for carrying wafers. The wafer cleaning component is disposed on the carrier disk 3021 and located below the wafer carrying area 3022.

[0055] Specifically, the wafer cleaning component is located on the lower side of the wafer carrying area 3022, and can clean the wafers carried on the wafer carrying area 3022. This allows the cleaning task to be completed simultaneously during the wafer resting and docking process, removing dust or impurities from the wafer surface, thereby optimizing the wafer processing flow and improving the wafer processing yield. Moreover, there is no need to add an additional independent cleaning station, which can simplify the overall structure of the wafer loading and unloading device 100 and improve its integration and production efficiency.

[0056] Combination Figure 1 and Figure 2 As shown, the unloading temporary storage assembly 50 includes an upper cleaning component 501, a lower cleaning component 502, and an unloading temporary storage stage 503. The upper cleaning component 501 and the lower cleaning component 502 are located on the upper and lower sides of the unloading temporary storage stage 503, respectively. This allows for simultaneous cleaning of the upper and lower surfaces of the wafer while it is temporarily stored on the unloading temporary storage stage 503, removing dust or impurities from the wafer surface. This ensures that the wafer at the unloading temporary storage stage 503 remains clean, providing reliable quality assurance for subsequent wafer inspection or transfer processes. Moreover, it eliminates the need for a separate cleaning station, simplifying the overall structure of the wafer unloading device 100 and improving its integration and production efficiency.

[0057] Furthermore, the bottom of the unloading temporary storage stage 503 is provided with a mounting base plate, which is fixedly connected to the mounting plate 10 of the wafer loading and unloading device 100 to achieve reliable positioning and overall assembly of the unloading temporary storage stage 503.

[0058] In addition, the upper cleaning component 501, the lower cleaning component 502, and the unloading temporary storage platform 503 are all located on the upper side of the mounting plate 10. This allows the mounting plate 10 to act as a physical isolation barrier, placing the components involved in wafer cleaning on the upper area of ​​the mounting plate 10 and arranging the drive components or electrical components on the lower area of ​​the mounting plate 10. This achieves dry and wet isolation in the overall layout of the wafer loading and unloading device 100, effectively preventing the cleaning fluid from splashing or leaking onto the lower side of the mounting plate 10, and avoiding moisture, corrosion, or electrical short circuits in the drive components or electrical components. This improves the operational stability of the wafer loading and unloading device 100 and extends its service life.

[0059] The polishing equipment according to this utility model may mainly include: the wafer loading and unloading device 100 mentioned above.

[0060] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0061] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0062] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A wafer on-off device, characterized by, include: Mounting plate (10); A wafer handling assembly (20) is rotatably mounted on the mounting plate (10) and can move up and down relative to the mounting plate (10); A head docking assembly (30) is disposed on the mounting plate (10) and is adapted to correspond to the head to carry the wafer on the head. A loading temporary storage component (40) is disposed on the mounting plate (10) and is suitable for temporarily storing wafers; A loading temporary storage component (50) is disposed on the mounting plate (10) and is suitable for temporarily storing wafers. The loading temporary storage component (40), the loading temporary storage component (50) and the wafer head docking component (30) are disposed circumferentially on the outside of the wafer transport component (20) along the mounting plate (10). The wafer transport component (20) is used to transport wafers between the loading temporary storage component (40), the loading temporary storage component (50) and the wafer head docking component (30).

2. The on-wafer material handling device of claim 1, wherein The throwing head docking assembly (30), the loading temporary storage assembly (40), and the unloading temporary storage assembly (50) are arranged sequentially and spaced apart along the circumference of the mounting plate (10) on the outside of the wafer handling assembly (20), with the loading temporary storage assembly (40) located between the unloading temporary storage assembly (50) and the throwing head docking assembly (30).

3. The on-wafer material handling device of claim 1, wherein The wafer handling assembly (20) includes a clamping arm (201) and a sealing seat (202). The sealing seat (202) extends vertically along the mounting plate (10) and is connected to the mounting plate (10) at one end. The head docking assembly (30), the loading temporary storage assembly (40), and the unloading temporary storage assembly (50) are arranged circumferentially on the outside of the sealing seat (202) along the mounting plate (10). The clamping arm (201) extends radially along the mounting plate (10) and is connected to the sealing seat (202) at one end. The other end is provided with a jaw (2011). The jaw (2011) is selectively positioned above the head docking assembly (30), the loading temporary storage assembly (40), and the unloading temporary storage assembly (50) to be suitable for clamping the wafer.

4. The on-wafer material handling device of claim 3, wherein, The sealing seat (202) is fitted with a waterproof cover (2021) around its outer periphery; and / or, A lower sealing ring (2022) is provided on the circumferential edge of the lower end of the sealing seat (202), and the lower sealing ring (2022) is adapted to be pressed between the sealing seat (202) and the mounting plate (10) of the wafer loading and unloading device; and / or, An upper sealing ring (2023) is provided on the circumferential edge of the upper end of the sealing seat (202), and the upper sealing ring (2023) is pressed between the clamping arm (201) and the sealing seat (202).

5. The on-wafer material handling device of claim 3, wherein The wafer handling assembly (20) includes a drive assembly (203), which is disposed on the lower side of the mounting plate (10). The drive assembly (203) includes a rotary drive (2031), a lifting drive (2032), and a drive shaft (2033). The drive shaft (2033) extends vertically and one end is connected to the rotary drive (2031). The other end of the drive shaft (2033) passes through the mounting plate (10) and the sealing seat (202) at least partially and is connected to the clamping arm (201). The rotary drive (2031) selectively drives the drive shaft (2033) to rotate the clamping arm (201). The lifting drive (2032) selectively drives the rotary drive (2031) and the drive shaft (2033) to move up and down to move the clamping arm (201) up and down.

6. The on-wafer material handling device of claim 1, wherein The projectile docking assembly (30) includes a mounting platform (301) and a docking platform (302). The docking platform (302) is located on the upper side of the mounting plate (10). The projectile docking assembly (30) passes through the mounting plate (10). The mounting platform (301) is located on the lower side of the mounting plate (10). A lifting rod (303) is provided between the mounting platform (301) and the docking platform (302).

7. The on-wafer material handling device of claim 6, wherein, The throwing head docking assembly (30) also includes a docking drive (304), which is disposed on the lower side of the mounting platform (301) and is connected to the lifting rod (303) in a transmission manner.

8. The on-wafer material handling device of claim 6, wherein, The docking station (302) includes a carrier plate (3021) and a wafer cleaning component. A wafer carrying area (3022) is formed on the carrier plate (3021). The wafer carrying area (3022) is adapted to carry a wafer. The wafer cleaning component is disposed on the carrier plate (3021) and located on the lower side of the wafer carrying area (3022).

9. The on-wafer material handling device of claim 1, wherein, The material unloading temporary storage assembly (50) includes an upper cleaning component (501), a lower cleaning component (502), and a material unloading temporary storage platform (503). The upper cleaning component (501) and the lower cleaning component (502) are located on the upper and lower sides of the material unloading temporary storage platform (503), respectively.

10. A polishing apparatus characterized by comprising: The wafer loading and unloading device includes any one of claims 1-9.

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