Semiconductor lead frame mold polishing positioning device

Abstract

This utility model provides a semiconductor lead frame mold grinding and positioning device, belonging to the field of mold positioning technology. It includes a base; an active positioning stage and a driven positioning stage sliding on the top of the base, the active positioning stage being located on one side of the driven positioning stage; an extension arm fixed to the outer wall of the active positioning stage; a positioning specification adjustment component disposed on the extension arm; and a support arm telescopic component disposed on the driven positioning stage. The positioning specification adjustment component includes a ball screw rotating on the inner surface of the extension arm; and a movable frame fixed to a nut seat on the ball screw by screws. This utility model, through the positioning specification adjustment component and the support arm telescopic component, can adjust the angle and length of the combined support arm one, arm sleeve, and support arm two, thereby adjusting the initial relative position between the active positioning stage and the driven positioning stage, and thus positioning and clamping lead frame molds of different specifications.

Description

Technical Field

[0001] This utility model belongs to the field of mold positioning technology, specifically relating to a semiconductor lead frame mold grinding and positioning device. Background Technology

[0002] In the production process of semiconductor lead frames, molds are required for processing. In order to adapt to different semiconductor lead frames, the molds need to be ground. Grinding equipment can be used to grind the molds.

[0003] However, existing grinding equipment may lack a positioning structure for the lead frame mold, which may cause the mold to shift in position, thus affecting the accuracy of mold grinding. This may result in a waste of resources and consequently affect the production efficiency and quality of semiconductor lead frames.

[0004] Therefore, a semiconductor lead frame mold grinding and positioning device is proposed. Summary of the Invention

[0005] This invention provides a semiconductor lead frame mold grinding and positioning device, the purpose of which is to solve the problems mentioned above.

[0006] This utility model provides a semiconductor lead frame mold grinding and positioning device, including a base; an active positioning stage and a driven positioning stage sliding on the top of the base, the active positioning stage being located on one side of the driven positioning stage; an extension arm fixed to the outer wall of the active positioning stage; a positioning specification adjustment assembly disposed on the extension arm; and a support arm telescopic assembly disposed on the driven positioning stage; wherein, the positioning specification adjustment assembly includes: a ball screw rotating on the inner surface of the extension arm; a movable frame fixed to a nut seat on the ball screw by screws; a first support arm rotating on the inner wall of the movable frame; and an arm sleeve fixed to one side end of the first support arm; wherein, the support arm telescopic assembly includes: a fixed frame fixed at the center position of one side outer wall of the driven positioning stage; a second support arm rotating on the inner wall of the fixed frame; a fastening hole opened on the outer wall of the second support arm; a screw threaded to the outer wall of the arm sleeve; and a fixed positioning stage fixed to the top of the base and positioned opposite to the active positioning stage.

[0007] Furthermore, a support plate is located on the top of the base near the active positioning platform. An electric push rod is fixedly connected to the center of the outer wall of the support plate away from the active positioning platform by bolts. The output end of the electric push rod is fixedly connected to the active positioning platform.

[0008] Furthermore, a rotating disk is fixed at one end of the ball screw near the outer side of the extension arm;

[0009] By adopting the above technical solution, it is easy to rotate the ball screw, thereby adjusting the position of the moving frame on the extension arm.

[0010] Furthermore, a groove is provided on one side of the outer wall of the arm sleeve for inserting and moving the second support arm;

[0011] By adopting the above technical solution, it is convenient for one end of the second outrigger to move inside the arm sleeve, thereby adjusting the length of the second outrigger and adjusting the overall length of the combined outrigger, arm sleeve and outrigger.

[0012] Furthermore, one end of the screw can be inserted into the interior of the fastening hole;

[0013] By adopting the above technical solution, the position of the second outrigger after its extension length can be fixed.

[0014] Furthermore, buffer pads are provided on one outer wall of each of the active positioning stage, the driven positioning stage, and the fixed positioning stage;

[0015] By adopting the above technical solution, the impact force when the active positioning stage, the driven positioning stage, and the fixed positioning stage come into contact with the semiconductor lead frame mold is reduced, thereby reducing the wear on the semiconductor lead frame mold.

[0016] Furthermore, the top of the base is provided with a through groove for the active positioning stage and the driven positioning stage to slide.

[0017] By adopting the above technical solution, the chute can provide guidance for the sliding of the active positioning stage and the driven positioning stage, and the through structure facilitates the discharge of waste generated during grinding, thus avoiding chute blockage.

[0018] The beneficial effects of this utility model are as follows:

[0019] This invention utilizes a positioning specification adjustment component and a support arm telescopic component to adjust the angle and length of the assembled support arm one, arm sleeve, and support arm two. This allows for adjustment of the initial relative position between the active positioning platform and the driven positioning platform, and the adjustment of the driven positioning platform's movement distance after the active positioning platform has moved a certain distance. This enables the positioning and clamping of lead frame molds of different specifications. Through the linkage and coordination between the active and driven positioning platforms and the cooperation of the fixed positioning platform, the semiconductor lead frame mold can be positioned and clamped quickly and efficiently, ensuring stable positioning, avoiding deviations, and guaranteeing the accuracy of subsequent grinding.

[0020] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the drawings. Attached Figure Description

[0021] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0022] Figure 1 This is a structural schematic diagram (isometric view) of an embodiment of the present utility model;

[0023] Figure 2 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0024] Figure 3 This is a schematic diagram of the arm sleeve and the second support arm in an embodiment of the present utility model.

[0025] Figure 4 This is an embodiment of the present utility model. Figure 2 Enlarged diagram of point A in the diagram;

[0026] Reference numerals: 1. Base; 2. Active positioning platform; 3. Extension arm; 4. Positioning specification adjustment assembly; 41. Ball screw; 42. Moving frame; 43. Rotating disc; 44. Support arm one; 45. Arm sleeve; 5. Driven positioning platform; 6. Support arm telescopic assembly; 61. Fixed frame; 62. Support arm two; 63. Fastening hole; 64. Screw; 7. Fixed positioning platform; 8. Support plate; 9. Electric push rod; 10. Buffer pad. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0028] Reference Figure 1-4 This utility model embodiment proposes a semiconductor lead frame mold grinding and positioning device, including an active positioning stage 2 and two driven positioning stages 5 slidably connected to the top of a base 1. The top of the base 1 is provided with a through groove for the active positioning stage 2 and the driven positioning stages 5 to slide. The through groove can provide guidance for the sliding of the active positioning stage 2 and the driven positioning stages 5, and the through structure facilitates the discharge of waste generated during grinding, avoiding blockage of the groove. The two driven positioning stages 5 are located on one side of the active positioning stage 2, and two extension arms 3 are symmetrically arranged on the outer side wall of the active positioning stage 2.

[0029] The extension arm 3 is rotatably connected to the ball screw 41 in the positioning specification adjustment assembly 4. A rotating disk 43 is provided at one end of the ball screw 41 near the outer side of the extension arm 3. The nut seat on the ball screw 41 is fixedly connected to the movable frame 42 by screws. A support arm 44 is rotatably connected to the inner side wall of the movable frame 42. An arm sleeve 45 is provided at one end of the support arm 44.

[0030] A fixed frame 61 of the support arm telescopic assembly 6 is provided at the center of one side outer wall of the two driven positioning platforms 5. The second support arm 62 is rotatably connected to the inner side wall of the fixed frame 61. A groove is provided on one side outer wall of the arm sleeve 45 for the second support arm 62 to be inserted and moved, so that one end of the second support arm 62 can move inside the arm sleeve 45, thereby adjusting the extension length of the second support arm 62 and adjusting the overall length of the combination of the first support arm 44, the arm sleeve 45 and the second support arm 62. A fastening hole 63 is provided on one side outer wall of the second support arm 62. A screw 64 is connected to one side outer wall of the arm sleeve 45 by thread. One end of the screw 64 can be inserted into the fastening hole 63, which can fix the position of the second support arm 62 after it is extended.

[0031] A fixed positioning platform 7 is provided on the top of the base 1 near one side of the two driven positioning platforms 5, and a support plate 8 is provided on the top of the base 1 near the other side of the active positioning platform 2. An electric push rod 9 is fixedly connected to the center of the outer wall of the support plate 8 away from the active positioning platform 2 by bolts. The output end of the electric push rod 9 is fixedly connected to the active positioning platform 2.

[0032] A buffer pad 10 is provided on one outer wall of each of the active positioning platform 2, the driven positioning platform 5, and the fixed positioning platform 7.

[0033] The specific implementation method is as follows:

[0034] During the positioning of the lead frame mold before grinding, the lead frame mold is placed on the top of the base 1, and one side wall of the mold is pressed against the fixed positioning table 7. At this time, the electric push rod 9 is controlled to push the active positioning table 2 to move through its output end. Under the sliding guide, the active positioning table 2 moves toward the other side wall of the mold. The extension arm 3 on the active positioning table 2 moves synchronously. The linkage structure formed by the combination of the positioning specification adjustment component 4 and the support arm telescopic component 6 makes the extension arm 3 and the driven positioning table 5 linked. The two driven positioning tables 5 move toward the other two side walls of the mold respectively. The active positioning table 2, the driven positioning table 5 and the fixed positioning table 7 apply pressure to the outer wall of the mold to achieve the positioning of the mold at the grinding position.

[0035] Since the linkage displacement values ​​of the active positioning table 2 and the driven positioning table 5 are fixed, they can only be used to position one type of lead frame mold. When different types of lead frame molds are timed before grinding, the positioning specification adjustment component 4 and the support arm extension component 6 are used for adjustment. Specifically, the rotating disk 43 is rotated, the ball screw 41 rotates synchronously, the moving frame 42 moves along the extension arm 3, and the angle of one end of the support arm 44 is adjusted. At this time, the initial relative position between the active positioning table 2 and the driven positioning table 5 changes, and the initial adjustment is achieved. Then, the length of the support arm 62 extending out of the arm sleeve 45 is adjusted, and the screw 64 is inserted into the fastening hole 63 for fixing. The initial relative position between the active positioning table 2 and the driven positioning table 5 is further adjusted. The movement distance of the driven positioning table 5 after the active positioning table 2 moves a certain distance is adjusted, thereby positioning and clamping lead frame molds of different specifications.

[0036] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A semiconductor lead frame mold grinding and positioning device, characterized in that: Including the base (1); An active positioning stage (2) and a passive positioning stage (5) slide on the top of the base (1), wherein the active positioning stage (2) is located on one side of the passive positioning stage (5); An extension arm (3) is fixed to the outer wall of the active positioning stage (2); Positioning specification adjustment assembly (4) is provided on the extension arm (3); The outrigger telescopic assembly (6) is mounted on the driven positioning platform (5); The positioning specification adjustment component (4) includes: The ball screw (41) rotates on the inner surface of the extension arm (3); The movable frame (42) is fixed to the nut seat on the ball screw (41) by screws; The support arm (44) rotates on the inner side wall of the movable frame (42); Arm sleeve (45) fixed to one side end of the support arm (44); The outrigger telescopic assembly (6) includes: A fixing bracket (61) is fixed at the center of the outer wall of one side of the driven positioning platform (5); Support arm 2 (62) rotates on the inner side wall of the fixed frame (61); Fastening holes (63) are opened on the outer side wall of the second support arm (62); A screw (64) is threaded onto the outer wall of the arm sleeve (45); Fixed positioning platform (7) is fixed to the top of the base (1) and positioned opposite to the active positioning platform (2).

2. The semiconductor lead frame die grinding positioning device of claim 1, wherein: The base (1) has a support plate (8) located on the top side near the active positioning platform (2). An electric push rod (9) is fixedly connected to the center of the outer wall of the support plate (8) away from the active positioning platform (2) by bolts. The output end of the electric push rod (9) is fixedly connected to the active positioning platform (2).

3. The semiconductor lead frame die polishing positioning device of claim 1, wherein: A rotating disk (43) is fixed at one end of the ball screw (41) near the outer side of the extension arm (3).

4. The semiconductor lead frame die polishing positioning device of claim 1, wherein: A groove is provided on one side of the outer wall of the arm sleeve (45) for inserting and moving the second arm (62).

5. The semiconductor lead frame die polishing positioning device of claim 1, wherein: One end of the screw (64) can be inserted into the fastening hole (63).

6. The semiconductor lead frame mold grinding and positioning device according to claim 1, characterized in that: A buffer pad (10) is provided on one outer wall of each of the active positioning platform (2), the driven positioning platform (5) and the fixed positioning platform (7).

7. The semiconductor lead frame mold grinding and positioning device according to claim 1, characterized in that: The top of the base (1) is provided with a through groove for the active positioning stage (2) and the driven positioning stage (5) to slide.

Images