A diamond cutting wire and a diamond cutting wire saw
By setting a concave support surface on the outer circumference of the diamond wire saw core, combined with a nickel-plated or resin-coated layer, the problem of the small core diameter being unable to support coarse diamond particles is solved, thus improving cutting performance and lifespan.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XIAMEN ZL DIAMOND TECH CO LTD
- Filing Date
- 2025-08-11
- Publication Date
- 2026-07-31
AI Technical Summary
Existing diamond wire saws have insufficient cutting performance when cutting narrow slits because the small diameter of the wire core cannot effectively support coarse diamond particles.
A concave support surface is set on the outer periphery of the core to support the diamond particles. Combined with a nickel-plated or resin layer, an abrasive layer is formed to improve the stability and cutting performance of the diamond particles.
The concave support surface enhances the radial and circumferential support of the diamond particles, improving cutting efficiency and lifespan, and strengthening the bonding strength of the abrasive layer.
Smart Images

Figure CN224575913U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of wire cutting, specifically to a diamond cutting wire and a diamond cutting wire saw. Background Technology
[0002] Currently, the diamond wire saw available on the market for cutting hard materials, including hard rocks such as granite, typically uses a diamond wire saw. When used for cutting narrower kerfs, it is often necessary to reduce the diameter of the wire core (e.g., using metal wire with a diameter of 0.05mm-0.1mm). However, a thinner wire core cannot adequately support the coarser diamond particles, thus limiting the potential for further improvement in cutting performance. Utility Model Content
[0003] To address the aforementioned problems, this invention provides a diamond cutting wire and a diamond cutting wire saw.
[0004] To achieve the above objectives, the technical solution provided by this utility model is as follows: A diamond cutting wire includes a wire core and an abrasive layer attached to the outer peripheral surface of the wire core. The outer peripheral surface of the wire core has at least one inwardly recessed support surface, which is provided for the diamond particles of the abrasive layer to abut against.
[0005] Furthermore, the concave support surface is a concave arc-shaped support surface.
[0006] Furthermore, the outer peripheral surface of the wire core is formed with a plurality of the aforementioned concave support surfaces.
[0007] Furthermore, the cross-section of the wire core is triangular or a polygon with more than four sides, and at least one side is the concave support surface.
[0008] Furthermore, the concave support surface extends linearly or spirally along the length of the wire core.
[0009] Furthermore, the wire core is a metal wire core.
[0010] Furthermore, the abrasive layer includes a bonding layer and diamond particles embedded in the bonding layer; the bonding layer covers the outer peripheral surface of the wire core.
[0011] Furthermore, the bonding layer is a nickel plating layer or a resin bonding layer.
[0012] A diamond wire saw is made of multiple strands of diamond cutting wire twisted together, wherein at least one of the multiple strands of diamond cutting wire is the diamond cutting wire described above.
[0013] The technical solution provided by this utility model has the following beneficial effects: 1. An inwardly recessed support surface is provided on the outer peripheral surface of the core, which can stably support the diamond particles in the abrasive layer to improve cutting performance.
[0014] 2. The concave support surface provides a concave cavity structure on the outer periphery of the wire core, and also provides a longer outer periphery, which allows for a firm bond with the abrasive layer.
[0015] 3. The concave support surface not only provides radial support for the diamond particles, but also provides circumferential support, and can also provide stable support when circumferential rotation occurs during the cutting operation.
[0016] 4. The concave support surface allows for the deposition of coarser diamond particles, thereby improving cutting efficiency and cutting life. Attached Figure Description
[0017] Figure 1 The figure shown is a schematic diagram of the cross-section of the wire core in Example 1; Figure 2 The figure shown is a schematic diagram of the cross-section of the diamond cutting wire in Example 1; Figure 3 The diagram shown is a cross-sectional view of the diamond cutting wire in Example 2; Figure 4 The diagram shown is a cross-sectional view of the diamond cutting wire in Example 3. Detailed Implementation
[0018] To further illustrate the various embodiments, the present invention provides accompanying drawings. These drawings are part of the disclosure of the present invention and are mainly used to illustrate the embodiments, and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these drawings, those skilled in the art should be able to understand other possible implementations and the advantages of the present invention. Components in the drawings are not drawn to scale, and similar component symbols are generally used to represent similar components.
[0019] In the description of this utility model, terms such as "upper", "lower", "left", "right", "front", and "rear" are based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0020] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments.
[0021] Example 1 Reference Figure 1 and Figure 2As shown, this embodiment provides a diamond cutting wire, including a wire core 10 and an abrasive layer attached to the outer peripheral surface of the wire core 10. The outer peripheral surface of the wire core 10 has at least one inwardly recessed support surface 11. In this embodiment, the wire core 10 is a metal wire core, specifically a steel wire. The outer peripheral surface of the wire core 10 is provided with four inwardly recessed support surfaces 11, each of which is an inwardly recessed arc-shaped support surface. The abrasive layer includes a bonding layer 21 and diamond particles 22 embedded within the bonding layer 21. The bonding layer 21 encapsulates… The bonding layer 21 is a nickel plating layer covering the outer peripheral surface of the wire core 10. It is applied by electroplating the outer peripheral surface of the wire core 10. Specifically, the wire core 10 is placed in an electroplating tank and deposited by electrochemical deposition using a common buried sand method. During the deposition of nickel, diamond particles 22 are attached to the surface of the wire core 10 to form a diamond wire. The diamond particles 22 then abut against the concave support surface 11, which provides stable support for the diamond particles 22 in the abrasive layer, thereby improving cutting performance.
[0022] Meanwhile, the concave support surface 11 has a longer outer perimeter than a flat surface, and it is more firmly bonded to the abrasive layer.
[0023] The concave support surface 11 provides support to the diamond particle 22 not simply in the radial direction. The direction of support varies depending on its location. For example, when the diamond particle 22 rests against the left side of the concave support surface 11, the surface applies a rightward-tilting support force. This force has both a radial component and a rightward component in the circumferential direction, thus providing support in the circumferential direction. Similarly, when the diamond particle 22 rests against the right side of the surface 11, it applies a leftward component in the circumferential direction. The surface also provides support to the diamond particle 22 during circumferential rotation during the cutting operation.
[0024] Meanwhile, the concave support surface 11 allows for the deposition of coarser diamond particles 22, thereby improving cutting efficiency and cutting life.
[0025] Furthermore, the concave support surface 11 adopts a concave arc-shaped support surface with a large support surface range and a low degree of concavity, which can effectively ensure the strength of the wire core.
[0026] Furthermore, among the four concave support surfaces 11, the concave support surfaces 11 extend linearly along the length of the core 10, which can be prepared by extrusion. Of course, in other embodiments, the concave support surfaces 11 can also extend helically along the length of the core 10.
[0027] This embodiment also provides a diamond cutting wire, which is formed by twisting two strands of diamond cutting wire together. Among the two strands of diamond cutting wire, at least one strand is the diamond cutting wire described above, specifically both strands are the diamond cutting wire described above.
[0028] Example 2 The diamond cutting wire provided in this embodiment has a structure that is largely the same as the diamond cutting wire provided in Embodiment 1 above, except that: (Referring to...) Figure 3 As shown, in this embodiment, the cross-section of the wire core 10 is approximately triangular, with three inwardly concave support surfaces 11, all of which are concave arc-shaped support surfaces; the bonding layer 21 of the abrasive layer is a resin bonding layer, and the three concave support surfaces 11 provide abutment support to the outer diamond particles 22.
[0029] The diamond cutting wire provided in this embodiment is made of two strands of diamond cutting wire twisted together, one of which is the diamond cutting wire in Embodiment 1, and the other is the diamond cutting wire in this embodiment.
[0030] Example 3 The diamond cutting wire provided in this embodiment has a structure that is largely the same as the diamond cutting wire provided in Embodiment 1 above, except that: (Referring to...) Figure 4 As shown, in this embodiment, the outer periphery of the wire core 10 has only one concave support surface 11. The concave support surface 11 is a "V"-shaped recess with an included angle greater than 90°. Specifically, the wire core 10 can be understood as a "V"-shaped recess with an included angle greater than 90° set on the basis of a circle. The concave support surface 11 extends spirally along the length direction of the wire core 10, so that it can also provide relatively stable support for the diamond particles 22 on the outer periphery.
[0031] Meanwhile, diamond abrasive grains 23 with a smaller particle size than diamond particles 22 are embedded on other circumferential surfaces that do not have concave support surfaces 11.
[0032] This embodiment provides a diamond cutting wire, which is made of three diamond cutting wires twisted together. The three diamond cutting wires are the diamond cutting wires provided in Embodiment 1, the diamond cutting wires provided in Embodiment 2, and the diamond cutting wires provided in this embodiment.
[0033] The above embodiments describe different ways of implementing the solution of this application. Of course, in other embodiments, the structure is not limited to the structure disclosed above. For example, the material of the wire core 10 can also be other metal or non-metal materials that meet the requirements of rigidity; the number of concave support surfaces 11 on the outer periphery of the wire core 10 can also be four or more; the shape of the concave support surface 11 can also be other regular or irregular shapes that are concave inward; and in the structures of Embodiment 1 and Embodiment 2, small diamond abrasive grains 23 of Embodiment 3 can also be embedded in the bonding layer 21.
[0034] Although the present invention has been specifically shown and described in conjunction with preferred embodiments, those skilled in the art should understand that various changes in form and detail may be made to the present invention without departing from the spirit and scope of the present invention as defined in the appended claims, and all such changes shall be within the scope of protection of the present invention.
Claims
1. A diamond cutting wire comprising a wire core and an abrasive layer attached to the outer peripheral surface of the wire core, characterized in that: The outer peripheral surface of the wire core has at least one inwardly recessed support surface, which is provided for the diamond particles of the abrasive layer to abut against.
2. The diamond-wire according to claim 1, characterized in that: The concave support surface is a concave arc-shaped support surface.
3. The diamond-wire cutting line of claim 1, wherein: The outer peripheral surface of the wire core has a plurality of concave support surfaces.
4. The diamond-wire cutting line of claim 3, wherein: The cross-section of the wire core is triangular or a polygon with more than four sides, and at least one side is the concave support surface.
5. The diamond wire according to claim 1 or 3, characterized in that: The concave support surface extends linearly or spirally along the length of the wire core.
6. The diamond-wire cutting line of claim 1, wherein: The wire core is a metal wire core.
7. The diamond-wire cutting line of claim 1, wherein: The abrasive layer includes a bonding layer and diamond particles embedded in the bonding layer; the bonding layer covers the outer peripheral surface of the wire core.
8. The diamond-wire cutting line of claim 7, wherein: The bonding layer is a nickel plating layer or a resin bonding layer.
9. A diamond wire saw formed by twisting a plurality of diamond cutting wires together, characterized in that: Of the multiple strands of diamond cutting wire, at least one strand is the diamond cutting wire as described in any one of claims 1 to 8.