An external protection device for silicon controlled rectifier chip production cutting equipment
By installing protective covers, collection tanks, storage tanks, and baffles on silicon ingot cutting equipment, the problem of silicon chips and cutting fluid splashing during silicon ingot cutting is solved, achieving safety protection and effective management of cutting fluid.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JINING DONGFANGXIN ELECTRONIC TECH CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-07-31
AI Technical Summary
Existing silicon ingot cutting equipment lacks protective structures, resulting in silicon chips and cutting fluid splashing, endangering operators and equipment.
An external protective device comprising a protective cover, a collection tank, a storage tank, a baffle, and a water pump is designed to collect and transport silicon chips and cutting fluid generated during cutting, and to empty and cool the cutting fluid by moving the baffle and the support seat.
It effectively prevents silicon chips and cutting fluid from splashing, protects operators and equipment, avoids clogging, and enables the recycling and cooling of cutting fluid.
Smart Images

Figure CN224575926U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of silicon ingot cutting technology, and more specifically, to an external protective device for a silicon controlled rectifier chip production and cutting equipment. Background Technology
[0002] Chip manufacturing is a complex process, and silicon dicing is one of the key steps. Silicon is the primary material for semiconductor chips, possessing excellent semiconductor properties. In chip manufacturing, silicon crystals are first grown into silicon ingots. These ingots are typically cylindrical, with diameters reaching several hundred millimeters. The ingots are then diced into thin wafers, which are the silicon wafers. Subsequent chip manufacturing processes, such as photolithography and etching, are performed on these wafers.
[0003] A search revealed that Chinese patent CN105216128B discloses a multi-wire cutting device for squaring silicon ingots. The device has a winding drum, a cutting roller, and diamond wire wound on the winding drum and the cutting roller. It is used to squared cut silicon ingots, and can realize automated cutting to complete the squaring operation of silicon ingots, saving labor costs and improving production efficiency.
[0004] The aforementioned devices lack protective structures, leading to the splashing of silicon chips and cutting fluid during silicon ingot cutting, posing a potential hazard to operators and equipment. Therefore, we propose an external protective device for thyristor chip manufacturing cutting equipment. Utility Model Content
[0005] 1. Technical problems to be solved
[0006] The purpose of this application is to provide an external protective device for thyristor chip manufacturing and cutting equipment to solve the problems mentioned in the background art.
[0007] 2. Technical Solution
[0008] This application is achieved through the following technical solution:
[0009] An external protective device for a silicon controlled rectifier (SCR) chip manufacturing and cutting equipment includes a worktable. Two cutting rollers are rotatably mounted inside the worktable, with cutting wire wound around their outer sides. A protective cover is movably mounted on the upper part of the worktable. A support seat is slidably mounted inside the worktable, with multiple clearance grooves on the support seat. A U-shaped barrier is mounted on the upper part of the support seat, with its opening facing the cutting wire. The clearance grooves are located inside the support seat. A liquid outlet pipe is fixedly mounted on the U-shaped barrier. A baffle is slidably mounted on the bottom of the support seat. A collection tank and a storage tank are located at the lower part of the worktable. The cutting rollers and the support seat are both positioned above the collection tank. A water pump is installed in the storage tank, and the output end of the water pump is connected to the liquid outlet pipe.
[0010] As an optional solution to the technical solution of this application, the baffle is provided with multiple drainage grooves, which are staggered with the clearance grooves. The baffle is slidably connected to the worktable, and the moving direction of the baffle is orthogonal to the moving direction of the support.
[0011] As an optional solution to the technical solution of this application, a first motor is installed on the workbench, and a crank rocker arm is fixedly connected to the output end of the first motor. The crank rocker arm is rotatably connected to the workbench, and a vertical groove is provided on the baffle, with the end of the crank rocker arm extending into the vertical groove.
[0012] As an optional solution to the technical solution of this application, a guide rail is fixedly installed on the workbench, the bearing seat is slidably mounted on the guide rail, a second motor is fixedly installed on the workbench, the output end of the second motor is connected to a lead screw, the lead screw is rotatably mounted on the workbench, and the lead screw is threadedly connected to the bearing seat.
[0013] As an optional solution to the technical solution in this application, the protective cover is slidably connected to the workbench.
[0014] As an optional solution to the technical solution of this application, the bottom surface of the collection tank is higher than the bottom surface of the storage tank, and a filter screen is fixedly installed inside the workbench, with the filter screen located between the collection tank and the storage tank.
[0015] 3. Beneficial effects
[0016] Compared with the prior art, the beneficial effects of this application are:
[0017] 1) This application protects the upper part of the worktable by setting a protective cover and setting a collection tank to collect silicon chips and cutting fluid generated during cutting, so as to avoid silicon chips and cutting fluid splashing and causing potential hazards to operators and equipment.
[0018] 2) This application achieves the delivery of cutting fluid by setting a baffle, and achieves the emptying of cutting fluid in the clearance tank by the relative movement of the baffle and the support seat, thereby discharging the high-temperature cutting fluid carrying silicon chips, avoiding blockage of the clearance tank, and maintaining the cooling effect of the cutting fluid. Attached Figure Description
[0019] Figure 1 This is a schematic diagram of the overall structure of an external protective device for a silicon controlled rectifier chip manufacturing and cutting equipment;
[0020] Figure 2 This is a schematic diagram of the internal structure of an external protective device for a silicon controlled rectifier (SCR) chip manufacturing and cutting equipment.
[0021] Figure 3This is a schematic diagram of the support structure for an external protective device used in the production and cutting of silicon controlled rectifier chips.
[0022] Figure 4 This is a schematic diagram of a baffle structure for an external protective device used in the production and cutting of silicon controlled rectifier chips.
[0023] In the diagram: 1. Workbench; 101. Collection tank; 102. Storage tank; 2. Cutting roller; 3. Cutting line; 4. Protective cover; 5. Support seat; 501. Clearance groove; 502. U-shaped enclosure; 503. Liquid outlet pipe; 6. Water pump; 7. Baffle; 701. Drainage trough; 702. Vertical slide rail; 8. First motor; 801. Crank rocker arm; 9. Guide rail; 10. Second motor; 11. Lead screw. Detailed Implementation
[0024] The technical solution of this application will now be clearly and completely described in conjunction with the accompanying drawings.
[0025] Please see Figure 1 and Figure 2 This application provides a technical solution:
[0026] An external protective device for a silicon controlled rectifier (SCR) chip manufacturing and cutting equipment includes a worktable 1. Two cutting rollers 2 are rotatably mounted inside the worktable 1, and cutting wires 3 are wound around the outside of the two cutting rollers 2. A protective cover 4 is movably mounted on the upper part of the worktable 1. A support seat 5 is slidably mounted inside the worktable 1. Multiple clearance grooves 501 are opened on the support seat 5. A U-shaped enclosure 502 is provided on the upper part of the support seat 5, with the opening of the U-shaped enclosure 502 facing the cutting wires 3. The clearance grooves 501 are located inside the support seat 5. A liquid outlet pipe 503 is fixedly mounted on the U-shaped enclosure 502. A baffle 7 is slidably mounted on the bottom of the support seat 5. A collection tank 101 and a storage tank 102 are provided at the lower part of the worktable 1. The cutting rollers 2 and the support seat 5 are both located above the collection tank 101. A water pump 6 is provided in the storage tank 102, and the output end of the water pump 6 is connected to the liquid outlet pipe 503.
[0027] In use, the device involves placing a silicon ingot on a support 5 and covering the upper part of the worktable 1 with a protective cover 4; using a cutting roller 2 to drive the cutting wire 3 to move back and forth, and controlling the support 5 to move towards the cutting wire 3; the cutting wire 3 enters the clearance groove 501 and contacts the silicon ingot, thus cutting the silicon ingot; by pumping water 6 into the U-shaped enclosure 502 through the outlet pipe 503, the cutting fluid can enter the clearance groove 501 and move towards the cutting wire 3 along the baffle 7, cooling the cutting wire 3; the silicon chips and splashed cutting fluid generated by the cutting wire 3 can be blocked by the protective cover 4 and finally fall into the collection tank 101, avoiding potential hazards to external operators and equipment.
[0028] like Figure 3 and Figure 4 As shown, the baffle 7 has multiple drainage grooves 701, which are staggered with the clearance grooves 501. The baffle 7 is slidably connected to the workbench 1, and the moving direction of the baffle 7 is orthogonal to the moving direction of the support seat 5. A first motor 8 is installed on the workbench 1, and a crank rocker arm 801 is fixedly connected to the output end of the first motor 8. The crank rocker arm 801 is rotatably connected to the workbench 1. A vertical sliding groove 702 is provided on the baffle 7, and the end of the crank rocker arm 801 extends into the vertical sliding groove 702.
[0029] When cutting the silicon ingot, the first motor 8 drives the crank rocker 801 to rotate. The end of the crank rocker 801 slides in the vertical slide groove 702 and pushes the baffle 7 to move back and forth. When the drain trough 701 and the clearance groove 501 do not overlap, the cutting fluid can be delivered to the silicon ingot cutting position. When the drain trough 701 and the clearance groove 501 overlap, the cutting fluid will be discharged through the drain trough 701. By repeating the above actions, the cutting fluid in the clearance groove 501 can be replaced.
[0030] Preferably, a guide rail 9 is fixedly installed on the worktable 1, and the bearing seat 5 is slidably mounted on the guide rail 9. A second motor 10 is fixedly installed on the worktable 1, and a lead screw 11 is connected to the output end of the second motor 10. The lead screw 11 is rotatably mounted on the worktable 1 and is threadedly connected to the bearing seat 5. The second motor 10 can drive the lead screw 11 to rotate, thereby achieving displacement control of the bearing seat 5.
[0031] Preferably, the protective cover 4 is slidably connected to the workbench 1; the bottom surface of the collection tank 101 is higher than the bottom surface of the storage tank 102, and a filter screen is fixedly installed inside the workbench 1, with the filter screen located between the collection tank 101 and the storage tank 102. The cutting fluid entering the collection tank 101 can flow back into the collection tank 101 through the filter screen, realizing the recycling of the cutting fluid.
Claims
1. An external protection device for a silicon controlled rectifier chip production cutting apparatus, characterized by: The system includes a workbench (1) with two cutting rollers (2) rotatably mounted inside. Cutting wire (3) is wound around the outer sides of the two cutting rollers (2). A protective cover (4) is movably mounted on the upper part of the workbench (1). A support seat (5) is slidably mounted inside the workbench (1). Multiple clearance grooves (501) are provided on the support seat (5). A U-shaped barrier (502) is provided on the upper part of the support seat (5), with the opening of the U-shaped barrier (502) facing the cutting wire (3). The clearance groove (501) is located inside the support seat (5). The U-shaped enclosure (502) is fixedly installed with a liquid outlet pipe (503). The support seat (5) is slidably provided with a baffle (7) at the bottom. The workbench (1) is provided with a collection tank (101) and a storage tank (102) at the bottom. The cutting roller (2) and the support seat (5) are both located above the collection tank (101). The storage tank (102) is provided with a water pump (6). The output end of the water pump (6) is connected to the liquid outlet pipe (503).
2. The external protection device for a silicon controlled rectifier chip production cutting apparatus according to claim 1, characterized in that: The baffle (7) is provided with multiple drainage grooves (701), which are staggered with the clearance grooves (501). The baffle (7) is slidably connected to the workbench (1), and the moving direction of the baffle (7) is orthogonal to the moving direction of the support seat (5).
3. The external protection device for a silicon controlled rectifier chip production cutting apparatus according to claim 2, characterized in that: A first motor (8) is installed on the workbench (1). A crank rocker arm (801) is fixedly connected to the output end of the first motor (8). The crank rocker arm (801) is rotatably connected to the workbench (1). A vertical groove (702) is provided on the baffle (7). The end of the crank rocker arm (801) extends into the vertical groove (702).
4. The external protection device for a silicon controlled rectifier chip production cutting apparatus according to claim 1, characterized in that: A guide rail (9) is fixedly installed on the workbench (1), and the bearing seat (5) is slidably arranged on the guide rail (9). A second motor (10) is fixedly installed on the workbench (1), and a lead screw (11) is connected to the output end of the second motor (10). The lead screw (11) is rotatably installed on the workbench (1), and the lead screw (11) is threadedly connected to the bearing seat (5).
5. The external protection device for a silicon controlled rectifier chip production cutting apparatus according to claim 1, characterized in that: The protective cover (4) is slidably connected to the workbench (1).
6. The external protection device for a silicon controlled rectifier chip production cutting apparatus according to claim 1, characterized in that: The bottom surface of the collection tank (101) is higher than the bottom surface of the storage tank (102). A filter screen is fixedly installed inside the workbench (1), and the filter screen is located between the collection tank (101) and the storage tank (102).