A heat conductive adhesive curing mold for laboratory

Abstract

This utility model discloses a laboratory thermally conductive adhesive curing mold, including legs and a support platform. The legs are located at the bottom of the support platform, and a support plate is arranged between the legs. A cylinder is mounted on the support plate, and a lifting plate is mounted on the telescopic shaft of the cylinder. Four sliding grooves are formed on the support platform, extending outward along the center of the side length of the support platform. A slider is slidably connected in each groove. In this utility model, by activating the cylinder, the lifting plate is driven to move downward. The lifting plate pulls the four sliders through four connecting rods, causing them to slide along their respective sliding grooves towards the center of the support platform. This causes the four trapezoidal baffles to come closer together, with their inclined surfaces tightly fitting together to form a sealed mold cavity. This process is provided by the cylinder with a stable and powerful locking force, effectively preventing mold expansion caused by increased internal pressure during the injection and curing process, ensuring the stability and sealing of the mold cavity, and ensuring the molding quality of the sample.

Description

Technical Field

[0001] This utility model relates to the field of curing mold technology, and in particular to a curing mold for thermally conductive adhesive used in laboratories. Background Technology

[0002] Thermally conductive adhesives are adhesives with excellent thermal conductivity, widely used in heat dissipation and bonding in electronic components, LED lighting, automotive electronics, and other fields. During the laboratory research and development phase, it is necessary to fabricate thermally conductive adhesive samples of specific sizes to test parameters such as thermal conductivity, mechanical strength, and curing characteristics. Therefore, molds used to cure and shape these samples become indispensable tools in the laboratory.

[0003] The utility model disclosed in CN222096712U is a laboratory thermally conductive adhesive curing mold, including a base plate, a baffle slidably disposed on the top surface of the base plate, and a processing component disposed above the base plate. When the laboratory needs to conduct experiments on the thermally conductive adhesive, it is necessary to make a thermally conductive adhesive sample. At this time, the thermally conductive adhesive is added between four baffles. Since the connection of each baffle is made of a sealing material, leakage of the thermally conductive adhesive can be avoided. The thermally conductive adhesive is cured to obtain the thermally conductive adhesive sample. When it is necessary to demold the thermally conductive adhesive sample, the operator holds the handle and pulls the ring column upward, so that the ring column slides inside the inclined frame. Since one end of the inclined frame is inclined, under its constraint, the outer wall of the ring column slides and squeezes against the inner wall of the inclined frame. The inclined frame drives the baffle fixedly installed on its outer wall to slide on the top surface of the base plate. The four baffles are in an open state, so that the side of the baffle that contacts the thermally conductive adhesive sample moves away from the thermally conductive adhesive sample, so as to achieve the effect of rapid demolding.

[0004] The existing technology has certain drawbacks. It relies on manual lifting and spring tension to open and close the four baffles, which is not simple or efficient. The spring tension makes it difficult to ensure that the four baffles remain tightly closed during the injection and curing process. Gaps can easily form due to the expansion pressure of the adhesive, causing adhesive leakage or affecting the dimensional accuracy of the sample. When demolding, the baffles only open outwards, and the cured thermally conductive adhesive sample remains at the bottom of the mold cavity, requiring the operator to manually remove it, which is inconvenient and may damage the sample or the mold. Therefore, a laboratory-grade thermally conductive adhesive curing mold is needed to meet the requirements. Utility Model Content

[0005] The purpose of this invention is to provide a laboratory thermally conductive adhesive curing mold to solve the problems mentioned in the background art.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a laboratory thermally conductive adhesive curing mold, comprising legs and a support platform. The legs are disposed at the bottom of the support platform, and a support plate is disposed between the legs. A cylinder is disposed on the support plate, and a lifting plate is disposed on the telescopic shaft of the cylinder. Four sliding grooves are provided on the support platform, and the four sliding grooves extend outward along the center of the side length of the support platform. A slider is slidably connected in each sliding groove. The bottom end of each slider is rotatably connected to the corresponding side of the lifting plate by a connecting rod. A baffle is disposed on the side of the four sliders that are close to each other. The four baffles are all equilateral trapezoids, and their inclined surfaces are spliced ​​and fitted together. A base plate is disposed on the support platform, and the base plate is arranged between the four baffles. A top rod is disposed on the lifting plate, and a top block is disposed on the top end of the top rod through the support platform. The top block is slidably connected in the base plate.

[0007] Preferably, grooves are provided on both sides of the slide groove, and protrusions are provided on both sides of the slider, with the protrusions slidably connected in the grooves.

[0008] Preferably, the slider is L-shaped, with the vertical section slidably connected in the groove and the horizontal section connected to the baffle.

[0009] Preferably, the two ends of the connecting rod are respectively hinged by a hinge at the bottom of the slider and a slot on the side of the lifting plate.

[0010] Preferably, the inclined surfaces of the four baffles and the four baffles are sealed with sealing strips.

[0011] Preferably, the top rods and top blocks are in four sets, respectively arranged at the four corners of the top of the lifting plate and around the perimeter of the bottom plate.

[0012] Preferably, the top block is conical, with its external dimensions gradually decreasing from top to bottom.

[0013] The beneficial effects of this utility model are:

[0014] In this invention, the cylinder is activated to drive the lifting plate downwards. The lifting plate pulls four sliders via four connecting rods, causing them to slide along their respective grooves toward the center of the support platform. This causes the four trapezoidal baffles to come closer together, with their inclined surfaces tightly fitting together to form a sealed mold cavity. The cylinder provides a stable and powerful locking force during this process, effectively preventing mold expansion caused by increased internal pressure during the injection and curing processes. This ensures the stability and sealing of the mold cavity, thereby guaranteeing the molding quality of the sample.

[0015] In this invention, after curing is completed, the cylinder is restarted to drive the lifting plate to move upward. The lifting plate pushes the four sliders to move around the support platform through the connecting rod, causing the four baffles to separate outward, thus achieving initial demolding. At the same time, as the lifting plate moves upward, the ejector pin fixed on it rises synchronously. The top block at the top of the ejector pin pushes upward from inside the bottom plate, smoothly lifting the cured thermal conductive adhesive sample from the bottom of the mold cavity. This greatly facilitates the operator in removing the part and avoids damage that may be caused by manual prying. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a laboratory thermally conductive adhesive curing mold proposed in this utility model;

[0017] Figure 2 This is a front cross-sectional view of a laboratory thermally conductive adhesive curing mold proposed in this utility model.

[0018] Figure 3 This is a top view cross-sectional diagram of the convex structure of a laboratory thermally conductive adhesive curing mold proposed in this utility model.

[0019] Figure 4 This is a side cross-sectional view of the ejector pin structure of a laboratory thermally conductive adhesive curing mold proposed in this utility model.

[0020] In the diagram: 1. Support leg; 2. Support platform; 3. Support plate; 4. Cylinder; 5. Lifting plate; 6. Slide groove; 7. Slider; 8. Connecting rod; 9. Baffle; 10. Base plate; 11. Top rod; 12. Top block; 13. Groove; 14. Protrusion. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figure 1-4A laboratory thermally conductive adhesive curing mold includes support legs 1 and a support platform 2. The support legs 1 are located at the bottom of the support platform 2, and a support plate 3 is arranged between the support legs 1. A cylinder 4 is arranged on the support plate 3, and a lifting plate 5 is arranged on the telescopic shaft of the cylinder 4. The support platform 2 has four sliding grooves 6, which extend outward along the center of the side length of the support platform 2. A slider 7 is slidably connected in each sliding groove 6. The bottom end of each slider 7 is rotatably connected to the corresponding side of the lifting plate 5 by a connecting rod 8. A baffle 9 is arranged on the side of the four sliders 7 that is close to each other. The four baffles 9 are all equilateral trapezoids, and their inclined surfaces are spliced ​​and fitted together. A base plate 10 is arranged on the support platform 2, and the base plate 10 is arranged between the four baffles 9. A top rod 11 is arranged on the lifting plate 5, and a top block 12 is arranged on the top end of the top rod 11, which is slidably connected in the base plate 10.

[0023] Specifically, in this embodiment, grooves 13 are provided on both sides of the slide groove 6, and protrusions 14 are provided on both sides of the slider 7. The protrusions 14 are slidably connected in the grooves 13, which enhances the guidance and stability of the slider 7 sliding in the slide groove 6 and prevents the slider 7 from twisting or deviating when subjected to force.

[0024] Specifically, in this embodiment, the slider 7 is L-shaped, with the vertical section slidably connected in the groove 6 and the horizontal section connected to the baffle 9, providing a larger connection area, making the installation of the baffle 9 more stable, and effectively preventing the groove 6 from extending to the bottom of the baffle 9 and causing gaps.

[0025] Specifically, in this embodiment, the two ends of the connecting rod 8 are respectively hinged by a hinged member set at the bottom of the slider 7 and a slot opened on the side of the lifting plate 5. The hinged connection ensures smooth and flexible power transmission.

[0026] Specifically, in this embodiment, the inclined surfaces of the four baffles 9 and the four baffles 9 and the perimeter of the base plate 10 are sealed with sealing strips. The double sealing measures further ensure the airtightness of the mold cavity and effectively prevent glue leakage.

[0027] Specifically, in this embodiment, the top rods 11 and the top blocks 12 are in four groups, respectively arranged at the four corners of the top of the lifting plate 5 and around the bottom plate 10, so that the sample blocks are pushed out evenly from multiple points, ensuring that the sample blocks are lifted steadily and preventing damage due to uneven force.

[0028] Specifically, in this embodiment, the top block 12 is conical, and its external dimensions gradually decrease from top to bottom to ensure the sealing effect between the top block 12 and the bottom plate 10.

[0029] The cylinder 4 is activated, driving the lifting plate 5 downwards. The lifting plate 5, via four connecting rods 8, pulls four sliders 7, causing them to slide along their respective grooves 6 towards the center of the support platform 2. This causes the four trapezoidal baffles 9 to come together, their inclined surfaces tightly fitting to form a sealed mold cavity. The cylinder 4 provides a stable and powerful locking force during this process, effectively preventing mold expansion caused by increased internal pressure during injection and curing. This ensures the stability and sealing of the mold cavity, guaranteeing the molding quality of the sample. The mixed liquid thermally conductive adhesive is then introduced through the opening at the top of the mold cavity. Inject the material and allow it to solidify. Once solidified, restart cylinder 4 to drive lifting plate 5 upward. Lifting plate 5, via connecting rod 8, pushes four sliders 7 to move around the support platform 2, causing four baffles 9 to separate outward, achieving initial demolding. Simultaneously, as lifting plate 5 moves upward, ejector rod 11 fixed on it rises synchronously. The ejector block 12 at the top of ejector rod 11 pushes upward from inside the base plate 10, smoothly lifting the solidified thermal conductive adhesive sample from the bottom of the mold cavity. This greatly facilitates the operator's removal of the part and avoids potential damage caused by manual prying.

[0030] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. A laboratory thermally conductive adhesive curing mold, comprising legs (1) and a support platform (2), characterized in that: The support legs (1) are set on the bottom end of the support platform (2). A support plate (3) is set between the support legs (1). A cylinder (4) is set on the support plate (3). A lifting plate (5) is set on the telescopic shaft of the cylinder (4). Four sliding grooves (6) are opened on the support platform (2). The four sliding grooves (6) extend outward along the center of the side length of the support platform (2). A slider (7) is slidably connected in each sliding groove (6). The bottom end of each slider (7) is respectively connected to the side of the lifting plate (5). The four sliders (7) are connected by a connecting rod (8) and a baffle (9) is provided on the side of each slider (7) that is close to each other. The four baffles (9) are all equilateral trapezoids and are spliced ​​together at the inclined surfaces. A base plate (10) is provided on the support platform (2) and the base plate (10) is arranged between the four baffles (9). A top rod (11) is provided on the lifting plate (5). The top rod (11) passes through the top of the support platform (2) and a top block (12) is provided on the top. The top block (12) is slidably connected in the base plate (10).

2. The laboratory thermally conductive adhesive curing mold according to claim 1, characterized in that: The slide groove (6) has grooves (13) on both sides, and the slider (7) has protrusions (14) on both sides, which are slidably connected in the grooves (13).

3. The laboratory thermally conductive adhesive curing mold according to claim 1, characterized in that: The slider (7) is L-shaped, with its vertical section slidably connected in the groove (6) and its horizontal section connected to the baffle (9).

4. A laboratory thermally conductive adhesive curing mold according to claim 1, characterized in that: The two ends of the connecting rod (8) are respectively hinged by a hinge at the bottom of the slider (7) and a slot on the side of the lifting plate (5).

5. A laboratory thermally conductive adhesive curing mold according to claim 1, characterized in that: The inclined surfaces of the four baffles (9) and the four baffles (9) and the perimeter of the base plate (10) are sealed with sealing strips.

6. A laboratory thermally conductive adhesive curing mold according to claim 1, characterized in that: The top rod (11) and top block (12) are in four groups, respectively arranged at the four corners of the top of the lifting plate (5) and around the bottom plate (10).

7. A laboratory thermally conductive adhesive curing mold according to claim 1, characterized in that: The top block (12) is conical, with its external dimensions gradually decreasing from top to bottom.

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