An injection molding die for the bottom shell of an electronic product

Abstract

This utility model belongs to the field of injection molding technology, specifically an injection molding mold for the bottom shell of electronic products. It includes a worktable, with an injection molding mechanism and a heat dissipation mechanism respectively arranged above the worktable. The heat dissipation mechanism is located on one side of the injection molding mechanism. The injection molding mechanism cools the injection-molded bottom shell product, enabling rapid cooling and molding; the heat dissipation mechanism rapidly cools the mold coolant, providing better cooling performance. This injection molding mold for the bottom shell of electronic products solves the technical problem of insufficient cooling of the injection mold during continuous injection molding of electronic product bottom shells, which affects the production efficiency of subsequent products. The injection molding mechanism cools the injection-molded bottom shell product for rapid cooling and molding, while the heat dissipation mechanism rapidly cools the mold coolant, providing better cooling performance.

Description

Technical Field

[0001] This utility model relates to the field of injection molding technology, and in particular to an injection molding mold for the bottom shell of electronic products. Background Technology

[0002] Injection molding, also known as injection molding, is a molding method that combines injection and molding. The advantages of injection molding include high production speed and efficiency, automated operation, a wide variety of colors and shapes (from simple to complex), and sizes ranging from large to small. It also produces precise dimensions, facilitates product updates and replacements, and can create complex shapes. Injection molding is suitable for mass production and molding processes involving complex shapes.

[0003] In actual use, the bottom shell of electronic products needs to be injection molded during the production and processing process. However, when using continuous injection molding, the injection mold cannot be cooled in time, which affects the production efficiency of subsequent products and makes it inconvenient to use. Utility Model Content

[0004] To address the technical problem that the injection mold cannot be cooled in time during the continuous injection molding of the bottom shell of existing electronic products, which affects the production efficiency of subsequent products, this utility model proposes an injection molding mold for the bottom shell of electronic products.

[0005] The present invention provides an injection molding mold for the bottom shell of an electronic product, including a worktable, and an injection molding mechanism and a heat dissipation mechanism are respectively arranged above the worktable.

[0006] The heat dissipation mechanism is located on one side of the injection molding mechanism;

[0007] The injection molding mechanism cools the injection-molded bottom shell product, allowing it to cool and solidify rapidly.

[0008] The heat dissipation mechanism enables rapid cooling of the mold coolant, resulting in better cooling performance.

[0009] Preferably, the injection molding mechanism includes a mounting plate, two mounting plates are arranged in a linear array along the length of the worktable, a fixed base plate and a servo electric cylinder are fixedly connected to the surface of the two mounting plates respectively, a guide rod is provided between the two mounting plates, the two ends of the guide rod are fixedly connected to the surface of the two mounting plates respectively, and a plurality of guide rods are symmetrically distributed with the axis of the length direction of the mounting plate as the center.

[0010] Preferably, the output end of the servo electric cylinder is fixedly connected to a movable base plate, the surface of the movable base plate is slidably connected to the surfaces of the plurality of guide rods, a cooling box is fixedly connected to the surface of the fixed base plate and the surface of the movable base plate, a support block is fixedly connected inside the cooling box, the plurality of support blocks are symmetrically distributed about the length axis of the cooling box, a water inlet is fixedly connected to the upper end of the cooling box, and a water outlet is fixedly connected to the lower end of the cooling box.

[0011] Preferably, a shock-absorbing spring is provided on the outer side of the guide rod, and the two ends of the shock-absorbing spring are elastically connected to the surface of the fixed base plate and the surface of the movable base plate, respectively. A fixed mold and a movable mold are fixedly connected to the surfaces of the two cooling boxes, and the surfaces of the fixed mold and the movable mold are slidably connected.

[0012] Preferably, the heat dissipation mechanism includes a heat dissipation water tank, with a water inlet fixedly connected to the upper end of the heat dissipation water tank, and a drain pipe and an outlet pipe fixedly connected to the lower end of the heat dissipation water tank, respectively. A drain valve and a temperature sensor are fixedly connected to the surface of the drain pipe and the surface of the outlet pipe, respectively. A circulating water pump is fixedly connected to the surface of the workbench, with the inlet of the circulating water pump fixedly connected to one end of the outlet pipe via a water pipe, and the outlet of the circulating water pump fixedly connected to the surfaces of the two inlets via a water pipe. The surfaces of the two outlets are fixedly connected to the surface of the heat dissipation water tank via a water pipe.

[0013] Preferably, the surface of the heat dissipation tank is provided with a ventilation opening, and a dust filter plate and a cooling fan are fixedly connected to the surface of the ventilation opening respectively. The dust filter plate and the cooling fan are located on both sides of the heat dissipation tank. A stirring motor is fixedly connected to the surface of the heat dissipation tank, and a stirring rod is fixedly connected to the output end of the stirring motor through a coupling. Both ends of the stirring rod are rotatably connected to the inner wall of the heat dissipation tank.

[0014] The beneficial effects of this utility model are as follows:

[0015] By setting up an injection molding mechanism and a heat dissipation mechanism, the injection molding mechanism cools the injection-molded bottom shell product, allowing it to cool and solidify quickly, while the heat dissipation mechanism rapidly cools the mold coolant, resulting in better cooling effect. This solves the technical problem that when the bottom shell of existing electronic products is continuously produced through injection molding, the injection mold cannot be cooled in time, affecting the production efficiency of subsequent products. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an injection molding die for the bottom shell of an electronic product according to the present invention.

[0017] Figure 2This is a side view of the guide rod structure of an injection molding die for the bottom shell of an electronic product, as proposed in this utility model.

[0018] Figure 3 A three-dimensional view of the support block structure of an injection molding die for the bottom shell of an electronic product proposed in this utility model;

[0019] Figure 4 This is a three-dimensional view of the stirring rod structure of an injection molding die for the bottom shell of an electronic product, as proposed in this utility model.

[0020] In the diagram: 1. Workbench; 2. Mounting plate; 201. Fixed base plate; 202. Servo electric cylinder; 203. Guide rod; 204. Moving base plate; 205. Cooling tank; 206. Support block; 207. Water inlet; 208. Water outlet; 209. Shock-absorbing spring; 210. Fixed mold; 211. Moving mold; 3. Cooling water tank; 301. Water inlet; 302. Drain pipe; 303. Water outlet pipe; 304. Drain valve; 305. Temperature sensor; 306. Circulating water pump; 307. Ventilation vent; 308. Dust filter plate; 309. Cooling fan; 310. Stirring motor; 311. Stirring rod. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0022] Reference Figures 1-4 An injection molding mold for the bottom shell of an electronic product includes a worktable 1, with an injection molding mechanism and a heat dissipation mechanism respectively arranged above the worktable 1.

[0023] The heat dissipation mechanism is located on one side of the injection molding mechanism.

[0024] To prevent the mold temperature from rising during continuous injection molding of the bottom shell of electronic products, thus affecting production efficiency, an injection molding mechanism is installed, such as... Figures 1-3 The injection molding mechanism cools the injection-molded base shell product, allowing it to cool and solidify rapidly.

[0025] The injection molding mechanism includes a mounting plate 2. Two mounting plates 2 are arranged in a linear array along the length of the worktable 1. A fixed base plate 201 and a servo electric cylinder 202 are fixedly connected to the surfaces of the two mounting plates 2 respectively. A guide rod 203 is provided between the two mounting plates 2. The two ends of the guide rod 203 are fixedly connected to the surfaces of the two mounting plates 2 respectively. Multiple guide rods 203 are symmetrically distributed with the axis of the length of the mounting plate 2 as the center.

[0026] Furthermore, the injection mechanism completes the injection action between the two mounting plates 2, and multiple guide rods 203 realize the sliding guidance for continuous injection production.

[0027] The output end of the servo electric cylinder 202 is fixedly connected to a movable base plate 204. The surface of the movable base plate 204 is slidably connected to the surfaces of multiple guide rods 203. Cooling boxes 205 are fixedly connected to the surfaces of the fixed base plate 201 and the movable base plate 204, respectively. Support blocks 206 are fixedly connected inside the cooling box 205. Multiple support blocks 206 are symmetrically distributed around the axis of the length direction of the cooling box 205. The upper end of the cooling box 205 is fixedly connected to a water inlet 207, and the lower end of the cooling box 205 is fixedly connected to a water outlet 208.

[0028] Furthermore, the servo electric cylinder 202 drives the moving base plate 204 to slide along the surface of multiple guide rods 203, and the cooling box 205 is reinforced with support blocks 206 inside.

[0029] A shock-absorbing spring 209 is provided on the outside of the guide rod 203. The two ends of the shock-absorbing spring 209 are elastically connected to the surface of the fixed base plate 201 and the surface of the movable base plate 204, respectively. The surfaces of the two cooling boxes 205 are respectively fixedly connected to the fixed mold 210 and the movable mold 211, and the surfaces of the fixed mold 210 and the movable mold 211 are slidably connected.

[0030] Furthermore, the fixed mold 210 and the movable mold 211 work together to shape the injection molded product, and the shock-absorbing spring 209 prevents collisions during injection molding.

[0031] To improve the cooling effect of the injection molding mechanism, the circulating coolant is cooled by a heat dissipation mechanism, such as... Figures 1-2 and Figure 4 The heat dissipation mechanism enables rapid cooling of the mold coolant, resulting in better cooling performance.

[0032] The heat dissipation mechanism includes a heat dissipation tank 3. The upper end of the heat dissipation tank 3 is fixedly connected to a water inlet 301. The lower end of the heat dissipation tank 3 is fixedly connected to a drain pipe 302 and a water outlet pipe 303. A drain valve 304 and a temperature sensor 305 are fixedly connected to the surface of the drain pipe 302 and the surface of the water outlet pipe 303, respectively. A circulating water pump 306 is fixedly connected to the surface of the workbench 1. The water inlet of the circulating water pump 306 is fixedly connected to one end of the water outlet pipe 303 through a water pipe. The water outlet of the circulating water pump 306 is fixedly connected to the surface of two water inlets 207 through a water pipe. The surface of two water outlets 208 is fixedly connected to the surface of the heat dissipation tank 3 through a water pipe.

[0033] Furthermore, the coolant inside the heat dissipation tank 3 is circulated into the two cooling tanks 205 by the circulating water pump 306 to cool the injection-molded product.

[0034] The surface of the heat dissipation tank 3 is provided with a ventilation opening 307. A dust filter plate 308 and a cooling fan 309 are fixedly connected to the surface of the ventilation opening 307. The dust filter plate 308 and the cooling fan 309 are located on both sides of the heat dissipation tank 3. A stirring motor 310 is fixedly connected to the surface of the heat dissipation tank 3. The output end of the stirring motor 310 is fixedly connected to a stirring rod 311 through a coupling. Both ends of the stirring rod 311 are rotatably connected to the inner wall of the heat dissipation tank 3.

[0035] Furthermore, the coolant inside the radiator tank 3 is stirred by the stirring rod 311, and the heat inside the radiator tank 3 is discharged by the cooling fan 309 above the stirring rod 311.

[0036] By setting up an injection molding mechanism and a heat dissipation mechanism, the injection molding mechanism cools the injection-molded bottom shell product, allowing it to cool and solidify quickly, while the heat dissipation mechanism rapidly cools the mold coolant, resulting in better cooling effect. This solves the technical problem that when the bottom shell of existing electronic products is continuously produced through injection molding, the injection mold cannot be cooled in time, affecting the production efficiency of subsequent products.

[0037] Working principle:

[0038] Before use, two mounting plates 2 are installed above the workbench 1. The two mounting plates 2 are fixedly connected by multiple guide rods 203. A servo cylinder 202 installed on the surface of one mounting plate 2 drives a movable base plate 204 to slide along the surface of the multiple guide rods 203 towards the mounting plate 2 on the other side. A fixed base plate 201 is installed on the surface of the other mounting plate 2. The surface of the fixed base plate 201 and the surface of the movable base plate 204 are connected by multiple shock-absorbing springs 209 to prevent rapid collision when the servo cylinder 202 drives the movable base plate 204 to approach. Cooling boxes 205 are installed on the surfaces of both the fixed base plate 201 and the movable base plate 204. Multiple support blocks 206 are installed inside the cooling boxes 205. Fixed molds 210 and movable molds 211 are installed on the surfaces of the two cooling boxes 205 respectively. The bottom of the fixed mold 210 and the bottom of the movable mold 211 are connected to the fixed base plate 201 and the movable base plate 204 respectively by multiple support blocks 206. 4. Connect the components and perform injection molding between the fixed mold 210 and the moving mold 211 through the injection pipe provided on one side of the fixed base plate 201. Coolant inside the cooling tank 205 cools the fixed mold 210 and the moving mold 211. The outlet 208 at the lower end of the cooling tank 205 circulates the cooling water to the top of the heat dissipation tank 3 through a water pipe. The circulating water pump 306 above the workbench 1 pumps the coolant inside the heat dissipation tank 3 out through the outlet pipe 303. The outlet pipe 303 is connected to two inlets 207 through water pipes to realize the circulation of coolant. A temperature sensor 305 is provided on the surface of the outlet pipe 303 to monitor the temperature of the coolant, so as to cool the coolant inside the heat dissipation tank 3 in a timely manner. Coolant is added into the heat dissipation tank 3 through the water inlet 301 at the upper end of the heat dissipation tank 3. The coolant inside the heat dissipation tank 3 is discharged from the drain pipe 302 through the drain valve 304.

[0039] The above are merely preferred embodiments of this utility model, but the scope of protection of this utility model is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in this utility model, based on the technical solution and inventive concept of this utility model, should be included within the scope of protection of this utility model.

Claims

1. An injection molding die for an electronic product bottom shell, comprising a worktable (1), characterized in that: An injection molding mechanism and a heat dissipation mechanism are respectively provided above the workbench (1); The heat dissipation mechanism is located on one side of the injection molding mechanism; The injection molding mechanism cools the injection-molded bottom shell product, allowing it to cool and solidify rapidly. The heat dissipation mechanism enables rapid cooling of the mold coolant, resulting in better cooling performance.

2. The injection molding tool for an electronic product bottom shell of claim 1, wherein: The injection molding mechanism includes a mounting plate (2), two mounting plates (2) are arranged in a linear array along the length of the worktable (1), a fixed base plate (201) and a servo electric cylinder (202) are fixedly connected to the surfaces of the two mounting plates (2) respectively, a guide rod (203) is provided between the two mounting plates (2), the two ends of the guide rod (203) are fixedly connected to the surfaces of the two mounting plates (2) respectively, and a plurality of guide rods (203) are symmetrically distributed with the axis of the length direction of the mounting plate (2) as the center.

3. The electronic product bottom shell injection molding mold of claim 2, wherein: The output end of the servo electric cylinder (202) is fixedly connected to a movable base plate (204). The surface of the movable base plate (204) is slidably connected to the surfaces of the multiple guide rods (203). Cooling boxes (205) are fixedly connected to the surfaces of the fixed base plate (201) and the movable base plate (204). Support blocks (206) are fixedly connected inside the cooling box (205). The multiple support blocks (206) are symmetrically distributed around the length axis of the cooling box (205). The upper end of the cooling box (205) is fixedly connected to a water inlet (207), and the lower end of the cooling box (205) is fixedly connected to a water outlet (208).

4. The electronic product bottom shell injection molding mold of claim 3, wherein: A shock-absorbing spring (209) is provided on the outside of the guide rod (203). The two ends of the shock-absorbing spring (209) are elastically connected to the surface of the fixed base plate (201) and the surface of the movable base plate (204), respectively. A fixed mold (210) and a movable mold (211) are fixedly connected to the surfaces of the two cooling boxes (205), respectively. The surfaces of the fixed mold (210) and the movable mold (211) are slidably connected.

5. The electronic product bottom shell injection molding mold of claim 4, wherein: The heat dissipation mechanism includes a heat dissipation tank (3), with a water inlet (301) fixedly connected to the upper end of the heat dissipation tank (3), and a drain pipe (302) and an outlet pipe (303) fixedly connected to the lower end of the heat dissipation tank (3). A drain valve (304) and a temperature sensor (305) are fixedly connected to the surface of the drain pipe (302) and the surface of the outlet pipe (303), respectively. A circulating water pump (306) is fixedly connected to the surface of the workbench (1). The water inlet of the circulating water pump (306) is fixedly connected to one end of the outlet pipe (303) through a water pipe. The water outlet of the circulating water pump (306) is fixedly connected to the surface of the two water inlets (207) through a water pipe. The surface of the two water outlets (208) is fixedly connected to the surface of the heat dissipation tank (3) through a water pipe.

6. The electronic product bottom shell injection molding mold of claim 5, wherein: The surface of the heat dissipation tank (3) is provided with a ventilation opening (307). A dust filter plate (308) and a cooling fan (309) are fixedly connected to the surface of the ventilation opening (307). The dust filter plate (308) and the cooling fan (309) are located on both sides of the heat dissipation tank (3). A stirring motor (310) is fixedly connected to the surface of the heat dissipation tank (3). The output end of the stirring motor (310) is fixedly connected to a stirring rod (311) through a coupling. Both ends of the stirring rod (311) are rotatably connected to the inner wall of the heat dissipation tank (3).

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