Hot runner system and injection molding apparatus
By setting receiving grooves on the hot runner plate and filling the gaps with a heat-conducting layer with a high thermal conductivity, the problems of low heat transfer efficiency and poor uniformity between the heater and the hot runner plate are solved, realizing rapid and uniform heat transfer and improving the stability and production efficiency of the hot runner system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU HOTST MOULD CO LTD
- Filing Date
- 2025-07-09
- Publication Date
- 2026-07-31
AI Technical Summary
In existing hot runner systems, there are problems of low heat transfer efficiency and poor heat transfer uniformity between the heater and the hot runner plate.
A receiving groove is made in the hot runner plate to accommodate the heating element, and a heat-conducting layer is set between the heating element and the hot runner plate. The heat-conducting layer is made of a material with high thermal conductivity, such as graphene, and fills the tiny gaps to reduce air thermal resistance and ensure uniform heat transfer.
It improves the heat transfer efficiency between the heater and the hot runner plate, reduces heat transfer energy consumption, ensures uniform heat diffusion, avoids excessive local temperature, and enhances the stability and production efficiency of the hot runner system.
Smart Images

Figure CN224576078U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of injection molding equipment manufacturing technology, and in particular to a hot runner system and injection molding device. Background Technology
[0002] Hot runner systems are key technologies in injection molding, primarily composed of hot runner plates, hot nozzles, heaters, and temperature controllers. By precisely controlling the temperature through heaters and temperature controllers, the molten plastic remains molten within the runner system, allowing it to be directly injected into the mold cavity. This avoids the gate waste generated in traditional injection molding, improving production efficiency, reducing material waste, enabling multi-point injection, and improving product molding quality. The hot runner plate is the core component of the system, typically made of a metal with good thermal conductivity. It houses the hot runner nozzles and forms the distribution channels for the molten plastic. Heaters are installed on the hot runner plate to continuously heat it, ensuring the molten plastic within the hot runner plate and its internal channels remains at a suitable melting temperature. This prevents the plastic from solidifying and clogging the runner due to temperature drops, while also ensuring stable flowability and uniform temperature distribution during the molten plastic's flow. This results in efficient and stable operation of the injection molding process, improving product quality and production efficiency.
[0003] Currently, some hot runner systems embed heaters directly within the hot runner plate. However, in actual operation, there may be tiny air gaps or insufficient contact between the heating element and the hot runner plate. Since air is a poor conductor of heat, these tiny air gaps will create thermal resistance, hindering the efficient transfer of heat from the heater to the hot runner plate. Due to the presence of thermal resistance, the temperature in local areas near the heater may also be too high, causing uneven temperature distribution within the hot runner system.
[0004] Therefore, there is an urgent need for a hot runner system that can solve the problems of low heat transfer efficiency and poor heat transfer uniformity between the heater and the hot runner plate. Utility Model Content
[0005] The purpose of this invention is to provide a hot runner system that can solve the problems of low heat transfer efficiency and poor heat transfer uniformity between the heater and the hot runner plate.
[0006] Based on the above concept, the technical solution adopted by this utility model is as follows:
[0007] A hot runner system, comprising:
[0008] Heating element;
[0009] Hot runner plate, with a receiving groove on the hot runner plate, into which the heating element can be received;
[0010] A heat-conducting layer is disposed between the heating element and the hot runner plate. The heat-conducting layer is used to transfer the heat emitted by the heating element to the hot runner plate.
[0011] As an optional solution for this hot runner system, the heat-conducting layer is in close contact with the hot runner plate, and the heat-conducting layer is in close contact with the heating surface of the heating element.
[0012] As an alternative to this hot runner system, the thermal conductivity of the heat-conducting layer is greater than 50 W / (m·K).
[0013] As an alternative to this hot runner system, the thermally conductive layer is made of graphene material.
[0014] As an optional solution for the hot runner system, the hot runner system also includes a limiting element, which is disposed at the opening of the receiving groove and cooperates with the inner wall of the receiving groove to limit the installation position of the hot runner plate.
[0015] As an optional feature of this hot runner system, the receiving tank includes:
[0016] The groove portion has a rectangular longitudinal section and is used to mate with the limiting component.
[0017] The groove cavity has a bottom end connected to the top end of the groove opening. The longitudinal cross-sectional profile of the groove cavity is the same as that of the heating element. There is a stepped transition between the groove opening and the groove cavity.
[0018] As an optional solution for the hot runner system, the hot runner plate system also includes an anti-slip pad, with an anti-slip pad provided between the limiting member and the inner wall of the receiving groove.
[0019] As an optional solution for this hot runner system, the limiting component is a trapezoidal pressure plate. The longitudinal cross-sectional area of the trapezoidal pressure plate gradually increases from bottom to top, and the width of the bottom surface of the limiting component is adapted to the width of the inner wall of the receiving groove opening.
[0020] As an alternative to this hot runner system, the receiving groove extends in a serpentine trajectory in the horizontal direction.
[0021] An injection molding apparatus includes an apparatus body and a hot runner system, the hot runner system being mounted on the apparatus body.
[0022] The beneficial effects of this utility model are as follows:
[0023] This invention proposes a hot runner system. A receiving groove is formed on the hot runner plate, into which a heating element can be received. A heat-conducting layer is disposed between the heating element and the hot runner plate, and is used to transfer the heat emitted by the heating element to the hot runner plate. There may be small gaps or insufficient contact between the heating element and the hot runner plate; the heat-conducting layer can fill these gaps, reducing air thermal resistance. As a heat-conducting medium, the heat-conducting layer can conduct heat more efficiently, improving the heat transfer efficiency between the heater and the hot runner plate, thereby reducing heat transfer energy consumption. The heat-conducting layer can also quickly and evenly diffuse heat to a larger area of the hot runner plate, avoiding localized overheating. Attached Figure Description
[0024] Figure 1 This is a first structural schematic diagram of the hot runner system provided in this embodiment of the present invention;
[0025] Figure 2 This is a second structural schematic diagram of the hot runner system provided in this embodiment of the utility model.
[0026] In the picture:
[0027] 1. Heating element;
[0028] 2. Hot runner plate; 21. Receiving groove; 211. Groove opening; 212. Groove cavity;
[0029] 3. Thermal conductive layer; 4. Limiting component. Detailed Implementation
[0030] To make the technical problem solved by this utility model, the technical solution adopted, and the technical effect achieved clearer, the technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely for explaining this utility model and not for limiting it. Furthermore, it should be noted that, for ease of description, only the parts related to this utility model are shown in the accompanying drawings, not all of them.
[0031] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0032] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0033] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0034] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0035] This embodiment provides a hot runner system, such as Figure 1 As shown, in this embodiment, the hot runner system includes a heating element 1, a hot runner plate 2, and a heat-conducting layer 3. The hot runner plate 2 has a receiving groove 21, into which the heating element 1 can be received. The heat-conducting layer 3 is disposed between the heating element 1 and the hot runner plate 2, and is used to transfer the heat emitted by the heating element 1 to the hot runner plate 2. There may be small gaps or insufficient contact between the heating element 1 and the hot runner plate 2. The heat-conducting layer 3 can fill these gaps, reducing air thermal resistance. As a heat-conducting medium, the heat-conducting layer 3 can conduct heat more efficiently, improving the heat transfer efficiency between the heater and the hot runner plate 2, thereby reducing heat transfer energy consumption. The heat-conducting layer 3 can also quickly and evenly diffuse heat to a larger area of the hot runner plate 2, avoiding localized overheating.
[0036] Preferably, in this embodiment, the heat-conducting layer 3 is tightly bonded to the contact surface of the hot runner plate 2, and the heat-conducting layer 3 is tightly bonded to the heating surface of the heating element 1. This completely eliminates the problem of small gaps and insufficient contact between the three, and completely eliminates the interference of air thermal resistance on heat transfer. The heat-conducting layer 3 can serve as a highly efficient heat-conducting medium to achieve rapid heat conduction, quickly and evenly diffusing the heat generated by the heating element 1 to a larger area of the hot runner plate 2, effectively avoiding excessively high local temperatures. The tight fit between the hot runner plate 2, the heat-conducting layer 3, and the heating element 1 also greatly improves the heat conduction efficiency, significantly reduces heat conduction energy consumption, ensures uniform and stable temperature distribution of the hot runner system, provides more reliable temperature conditions for processes such as injection molding, and improves product quality and production efficiency.
[0037] Preferably, in this embodiment, the thermal conductivity of the heat-conducting layer 3 is greater than 50 W / (m·K), which gives the heat-conducting layer 3 a strong thermal conductivity. This allows it to fill the tiny gaps between the heating element 1 and the hot runner plate 2 more efficiently and compensate for insufficient contact, greatly reducing air thermal resistance. This enables heat to be conducted from the heating element 1 to the hot runner plate 2 at a faster speed and with higher efficiency, significantly improving heat conduction efficiency. The higher thermal conductivity also allows heat to be quickly and evenly diffused to a larger area of the hot runner plate 2, effectively avoiding excessively high local temperatures. This not only significantly reduces heat conduction energy consumption but also ensures uniform temperature distribution in the hot runner system, improving the quality of processed products and production efficiency, and ensuring the stable and reliable operation of the hot runner system.
[0038] Optionally, in this embodiment, the heat-conducting layer 3 is made of graphene material. Ideally, the thermal conductivity of a single layer of graphene at room temperature can reach about 5300 W / (m·K). Therefore, graphene material can significantly enhance the speed and efficiency of heat conduction from the heating element 1 to the hot runner plate 2 due to its ultra-high thermal conductivity, greatly reducing heat conduction energy consumption. Graphene material also has good flexibility and filling properties, which can fully fill the tiny gaps between the heating element 1 and the hot runner plate 2, effectively reducing air thermal resistance. Graphene material can also diffuse heat more quickly and evenly to a larger area of the hot runner plate 2, avoiding local overheating, ensuring uniform and stable temperature of the hot runner plate 2, and improving the overall performance and operational reliability of the hot runner system.
[0039] Specifically, such as Figures 1-2As shown, in this embodiment, the hot runner system also includes a limiting member 4. The limiting member 4 is disposed at the opening of the receiving groove 21 and cooperates with the inner wall of the receiving groove 21. The limiting member 4 is used to limit the installation position of the hot runner plate 2. The setting of the limiting member 4 can ensure that the heating element 1 and the hot runner plate 2 are always in the optimal relative position, ensuring that the heat-conducting layer 3 effectively fills the gap and plays an efficient heat conduction role. The limiting member 4 can also avoid local poor contact caused by the installation offset of the hot runner plate 2, reduce the problems of uneven heat conduction and increased energy consumption caused by position deviation, make the hot runner system more stable and reliable in operation, improve the overall heat conduction efficiency and working performance, and reduce the failure risk and maintenance cost caused by improper installation.
[0040] Preferably, such as Figures 1-2 As shown, in this embodiment, the receiving groove 21 includes a groove opening 211 and a groove cavity 212. The longitudinal section of the groove opening 211 is rectangular. The groove opening 211 is used to cooperate with the limiting member 4. The bottom end of the groove opening 211 is connected to the top of the groove cavity 212. The longitudinal section profile of the groove cavity 212 is the same as that of the heating element 1. The longitudinal section profile of the groove cavity 212 is consistent with that of the heating element 1, which allows the heating element 1 to be tightly embedded therein, ensuring full contact between the two. Combined with the heat-conducting layer 3, the gap thermal resistance is reduced, and the heat conduction efficiency is improved. The groove opening 211 and the groove cavity 212 have a stepped transition, which allows the rectangular longitudinal section of the groove opening 211 to accurately cooperate with the limiting member 4, realizing the stable limitation of the installation position of the heating element 1 and preventing it from shifting during operation. The stepped transition structure not only facilitates the installation and disassembly of the heating element 1, but also facilitates the installation and fixation of the limiting member 4, optimizes the assembly process of the hot runner system, enhances the overall stability and reliability of the system, and reduces the risk of heat conduction loss and operational failure caused by component installation and matching problems.
[0041] Preferably, in this embodiment, the hot runner plate 2 system further includes an anti-slip pad. An anti-slip pad is provided between the limiting member 4 and the inner wall of the receiving groove 21. The anti-slip pad can generate a large frictional force between the contact surface of the limiting member 4 and the receiving groove 21, effectively preventing the limiting member 4 from shifting during installation or use, ensuring that the limiting member 4 accurately restricts the installation position of the heating element 1, thereby ensuring that the heat-conducting layer 3 continuously and stably fills the gap between the heating element 1 and the hot runner plate 2, maintaining a highly efficient heat conduction state. The anti-slip pad can also reduce component loosening caused by factors such as vibration, avoid problems such as uneven heat conduction and increased energy consumption caused by changes in the position of the limiting member 4, improve the stability and reliability of the hot runner system, reduce the risk of failure and maintenance costs caused by component loosening, and also reduce hard contact wear between components through buffering effect, extending the service life of the hot runner system.
[0042] Preferably, such as Figures 1-2As shown, in this embodiment, the limiting member 4 is a trapezoidal pressure plate. The longitudinal cross-sectional area of the trapezoidal pressure plate gradually increases from bottom to top. The width of the bottom surface of the limiting member 4 is adapted to the width of the inner wall of the opening of the receiving groove 21 to form an interference fit. Through the wedge action of the trapezoidal structure, it is tightly embedded into the opening of the receiving groove 21. The extrusion force of the interference fit stabilizes the limiting heating member 1, ensuring that it maintains the optimal relative position with the hot runner plate 2, effectively avoiding poor contact caused by installation misalignment. At the same time, with the extrusion filling effect of the trapezoidal side, the heat-conducting layer 3 further promotes the full filling of the gap between the heating member 1 and the hot runner plate 2, reducing air thermal resistance, enhancing the uniformity and efficiency of heat conduction, improving the stability of the hot runner system operation, reducing the risk of increased energy consumption and uneven heat conduction caused by position deviation, ensuring that the heat-conducting layer 3 continues to play an efficient heat conduction role, thereby reducing the risk of failure and maintenance costs.
[0043] Optionally, in this embodiment, the angle between the hypotenuse of the trapezoidal pressure plate and the vertical direction is 5-15 degrees. This allows the trapezoidal pressure plate, after being inserted into the receiving groove 21, to restrict the heater's installation position through the stop engagement between its lower base and the edge of the opening of the receiving groove 21, and the wedge-shaped engagement between its hypotenuse and the inner wall of the receiving groove 21. This ensures that the heat-conducting layer 3 fully fills the gap between the heating element 1 and the hot runner plate 2, reducing air thermal resistance and enhancing the uniformity and efficiency of heat conduction. In this embodiment, the angle between the hypotenuse of the trapezoidal pressure plate and the vertical direction is 5 degrees. In other embodiments, the angle between the hypotenuse of the trapezoidal pressure plate and the vertical direction can be 3 degrees, 6 degrees, 9 degrees, 12 degrees, or 15 degrees, etc.
[0044] Preferably, in this embodiment, the receiving groove 21 extends in a serpentine trajectory in the horizontal direction, which allows the heating element 1 to be distributed along the serpentine path. This increases the contact length and coverage area between the heating element 1 and the hot runner plate 2. Combined with the efficient heat transfer and gap-filling function of the heat-conducting layer 3, heat can be diffused more widely and evenly on the hot runner plate 2, further reducing local temperature differences, improving overall heat conduction efficiency, and reducing energy consumption. At the same time, it can flexibly adapt to the complex structure of the hot runner plate 2, ensuring the comprehensiveness and accuracy of heating, and optimizing the working performance of the hot runner system.
[0045] This embodiment also discloses an injection molding apparatus. In this embodiment, the injection molding apparatus includes an apparatus body and a hot runner system. The hot runner system is installed on the apparatus body. The injection molding apparatus can achieve efficient and stable heating conduction by means of the synergistic effect of the heating element 1, the hot runner plate 2 with receiving groove 21 and the heat-conducting layer 3 in the hot runner system. The heat-conducting layer 3 fills the gaps to reduce air thermal resistance, improves heat conduction efficiency to reduce energy consumption, and at the same time quickly and uniformly diffuses heat to avoid excessive local temperature differences, ensuring the stability and uniformity of temperature during the injection molding process, thereby improving the quality and production efficiency of the injection molded products.
[0046] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A hot runner system characterized by, include: Heating element (1); A hot runner plate (2) is provided with a receiving groove (21) on the hot runner plate (2), and the heating element (1) can be received into the receiving groove (21); A heat-conducting layer (3) is disposed between the heating element (1) and the hot runner plate (2), and the heat-conducting layer (3) is used to transfer the heat emitted by the heating element (1) to the hot runner plate (2).
2. The hot- runner system of claim 1, wherein The heat-conducting layer (3) is in close contact with the surface of the heat flow plate (2), and the heat-conducting layer (3) is in close contact with the heating surface of the heating element (1).
3. The hot- runner system of claim 1, wherein The thermal conductivity of the thermally conductive layer (3) is greater than 50 W / (m·K).
4. The hot- runner system of claim 1, wherein The thermally conductive layer (3) is made of graphene material.
5. The hot runner system of any of claims 1-4, wherein, The hot runner system also includes a limiting member (4), which is disposed at the opening of the receiving groove (21) and cooperates with the inner wall of the receiving groove (21) to limit the installation position of the hot runner plate (2).
6. The hot- runner system of claim 5, wherein The receiving groove (21) includes: The slot (211) has a rectangular longitudinal section and is used to cooperate with the limiting member (4). The groove (212) has a bottom end of the groove opening (211) connected to the top of the groove (212). The longitudinal section profile of the groove (212) is the same as that of the heating element (1). The groove opening (211) and the groove (212) have a stepped transition.
7. The hot-duct system of claim 5, wherein The hot runner plate (2) system also includes an anti-slip pad, which is provided between the limiting member (4) and the inner wall of the receiving groove (21).
8. The hot-duct system of claim 5, wherein, The limiting member (4) is a trapezoidal pressure plate. The longitudinal cross-sectional area of the trapezoidal pressure plate gradually increases from bottom to top. The width of the bottom surface of the limiting member (4) is adapted to the width of the inner wall of the opening of the receiving groove (21).
9. The hot runner system of any of claims 1-4, wherein, The receiving groove (21) extends in a serpentine trajectory in the horizontal direction.
10. An injection molding apparatus characterized by comprising: It includes a device body and a hot runner system as described in any one of claims 1-9, the hot runner system being mounted on the device body.