An automatic throughput device for sensing the thickness of a silicon wafer grind quartz wafer

Abstract

This utility model discloses an automatic quartz wafer feeding and dispensing device for sensing the thickness of silicon wafer grinding, including a recycling mechanism, a dispensing mechanism, and a control mechanism. The recycling mechanism includes a waste inlet, a waste box, and a sensor. The sensor is used to detect whether an old quartz wafer has been fed in. The dispensing mechanism includes a storage box, a dispensing port, a drive mechanism, and a pushing mechanism. The storage box is used to store new quartz wafers. The drive mechanism is connected to the storage box. The pushing mechanism can push a new quartz wafer from the bottom of the storage box into the dispensing port. The sensor, drive mechanism, and pushing mechanism are all electrically connected to the control mechanism. The automatic feeding and dispensing device provided by this application can realize intelligent and automated quartz wafer feeding and dispensing operations, precisely controlling that after each used quartz wafer is fed in, only one new quartz wafer can be dispensed for production use, avoiding the risks of overfeeding, underfeeding, or under-dispensing of quartz wafers that may be caused by human intervention in handling quartz wafers.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to an automatic throughput device for sensing the grinding thickness of silicon wafers. Background Technology

[0002] The current basic manufacturing process for silicon wafers in the industry includes: initial processing of single-crystal silicon rods (cutting, rolling), bonding, slicing, chamfering, grinding, etching, back-side treatment, polishing, and cleaning. Grinding, as an indispensable step in the entire silicon wafer manufacturing process, has its unique process technology and technical value. The main technical principle of grinding is: the grinding slurry is evenly distributed on the surface of the silicon wafer, which is driven by a fixture to form a speed rotation. The pressure of the grinding machine is set to generate friction between the grinding powder and the wafer, thereby achieving a mechanical processing effect. This removes saw marks or surface scratches caused during slicing or chamfering, while simultaneously obtaining the target thickness and flatness required for grinding.

[0003] In semiconductor manufacturing, wafer thickness is a crucial parameter. To ensure product quality and reliability, wafer manufacturers need to accurately measure wafer thickness. Measuring wafer thickness using a quartz crystal is a common industry method, based on the stable mechanical and electrical properties of quartz and its unique piezoelectric effect. When a quartz crystal is subjected to external force, an electrical signal is generated on its surface; this phenomenon is called the piezoelectric effect. Furthermore, a quartz crystal has a specific resonant frequency; when the frequency of the electric field equals its resonant frequency, the quartz crystal begins to oscillate. Therefore, during semiconductor grinding, under the influence of an electric field, when the wafer approaches the quartz crystal, the wafer's thickness affects the distribution of the electric field within the quartz crystal, thus altering its oscillation frequency. By measuring the change in the quartz crystal's resonant frequency, the wafer thickness can be calculated.

[0004] This demonstrates the crucial role a tiny quartz crystal plays in wafer thickness sensing. Therefore, during semiconductor silicon wafer grinding, one quartz crystal is required for each batch. Only one quartz crystal can be placed into the processing machine at the start of processing, and it must be removed after processing. Currently, most manufacturers in the industry rely on manual operation by operators to perform this task. This can lead to situations where too many or too few quartz crystals are added at the start of processing, or too few are removed at the end. Minor issues may result in inaccurate wafer thickness sensing, while severe cases may lead to a complete inability to sense wafer thickness. In extreme cases, it can even cause wafer breakage or damage to the machine's mounting surface, resulting in significant losses in process yield and economic impact.

[0005] Therefore, it is crucial to avoid risks such as overfeeding, underfeeding, or under-removal of quartz wafers caused by human intervention in the grinding process of semiconductor silicon wafers. Further optimization and improvement of the existing grinding machine's quartz wafer handling methods and its quartz wafer sensing equipment are necessary to more accurately control the feeding and ejection of quartz wafers. This would ensure that after each used quartz wafer is fed in, only one new quartz wafer is ejected for production use at a time. This has significant technical value for improving the quality of silicon wafer grinding, especially for controlling the thickness of the ground silicon wafer. Utility Model Content

[0006] The purpose of this invention is to provide an automatic throughput device for sensing the thickness of silicon wafer grinding by addressing the shortcomings of existing technologies.

[0007] The objective of this utility model is achieved through the following technical solution:

[0008] An automatic feeding device for sensing the thickness of silicon wafer grinding includes a recycling mechanism, a discharging mechanism, and a control mechanism.

[0009] The recycling mechanism includes a waste inlet, a waste box, and a sensor; the waste inlet is connected to the waste box, the waste inlet is used to put in old quartz pieces, and the waste box is used to collect the old quartz pieces; the sensor is used to sense whether old quartz pieces have been put in.

[0010] The discharge mechanism includes a storage box, a discharge port, a drive mechanism, and a pushing mechanism;

[0011] The storage box is used to store new quartz wafers; the drive mechanism is connected to the storage box and is used to drive the storage box to reciprocate to move closer to or away from the discharge port; the pushing mechanism is perpendicular to the moving direction of the drive mechanism, the pushing mechanism is positioned at the bottom of the storage box near the discharge port, and when the storage box is close to the discharge port, a new quartz wafer can be pushed out from the bottom of the storage box and fall into the discharge port;

[0012] The sensor, the drive mechanism, and the pusher mechanism are all electrically connected to the control mechanism; the control mechanism is used to receive the sensing information from the sensor and control the operation of the drive mechanism and the pusher mechanism.

[0013] Preferably, the discharge mechanism further includes a receiving plate and a pushing plate;

[0014] The bottom of the storage box is located on the receiving plate, and the driving mechanism can drive the storage box to reciprocate along the length of the receiving plate; the inner bottom surface of the storage box is provided with several vertically distributed storage slots, the inner diameter of the storage slots is slightly larger than the new quartz wafers, and is used to store only one row of vertically placed new quartz wafers; the bottom of the storage slot is provided with a first opening; the receiving plate is provided with a second opening, which is not on the movement path of the first opening; the upper end of the discharge port is located directly below the second opening;

[0015] The pushing mechanism is connected to the pushing plate, and the pushing mechanism can drive the pushing plate to reciprocate along the width direction of the receiving plate; the pushing plate is provided with a third opening, and the third opening is on the same straight line as the second opening; the size of the first opening, the second opening and the third opening is slightly larger than the new quartz sheet; the height of the third opening is less than the thickness of the new quartz sheet.

[0016] When the storage box approaches the discharge port, the pushing mechanism drives the pushing plate to move forward and insert between the storage box and the receiving plate until the first opening and the third opening coincide, so that a new quartz piece falls from the storage tank into the third opening. Then, the pushing plate is driven to move backward until the second opening and the third opening coincide, so that the new quartz piece in the third opening falls into the discharge port through the second opening.

[0017] Preferably, the recycling mechanism further includes a counter, which is electrically connected to the sensor and is used to receive the sensing information from the sensor and automatically count the cumulative number of the old quartz pieces put in.

[0018] Preferably, a track is provided between the waste inlet and the waste box, and the sensor is aligned with the track.

[0019] Preferably, both the waste box and the discharge port are sloped.

[0020] Preferably, both the waste box and the discharge port are provided with Teflon protective strips.

[0021] Preferably, the Teflon protective strip is provided on the inner sides of the waste box, the inner sides of the discharge port, and the bottom surface.

[0022] Preferably, the bottom surface of the waste box is provided with an absorbent sponge.

[0023] Preferably, the automatic throughput device provided in this application further includes a housing;

[0024] Except for one end of the waste feeding port and one end of the discharge port, which are located outside the housing, the remaining parts of the recycling mechanism, the discharge mechanism, and the control mechanism are all located inside the housing.

[0025] Preferably, the housing is provided with a safety cover, and the safety cover is connected and fixed to the housing by a gas spring and a flat lock, respectively.

[0026] The automatic quartz wafer feeding device provided in this application can realize intelligent and automated quartz wafer feeding operations. It can precisely control that after each used quartz wafer is put in, only one new quartz wafer can be dispensed for production use, avoiding the risk of multiple feedings, missed feedings, or missed retrievals that may be caused by human intervention in picking up and putting in quartz wafers. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the automatic throughput device provided in this application;

[0028] Figure 2 yes Figure 1 A schematic diagram of the exploded structure;

[0029] Figure 3 This is a schematic diagram of the material discharge mechanism;

[0030] Figure 4 This application includes a comparison chart of product defect rates before and after the use of the automatic throughput device;

[0031] Explanation of reference numerals in the attached figures:

[0032] 1-Counter; 2-Waste feeding port; 3-Sensor; 4-Railway; 5-Waste box; 6-Safety cover; 7-Discharge port; 8-Storage box; 9-Drive mechanism; 10-Control mechanism; 11-Pushing mechanism; 12-Gas spring; 13-Handle; 14-Flat lock; 15-Observation window; 16-Housing; 17-Receiving plate; 18-Pushing plate; 19-Discharge guide port; 20-Proximity switch; 21-Storage trough. Detailed Implementation

[0033] This application provides an automatic throughput device for sensing the grinding thickness of silicon wafers using quartz wafers, such as... Figures 1-3 As shown, it includes a recycling mechanism, a discharge mechanism, and a control mechanism 10.

[0034] The recycling mechanism includes a waste inlet 2, a waste container 5, and a sensor 3. The waste inlet 2 is connected to the waste container 5. Used quartz chips can be put into the waste inlet 2, and the waste container 5 is used to collect the used quartz chips put into the waste inlet 2. The sensor 3 is used to detect whether any used quartz chips have been put into the container.

[0035] The discharging mechanism includes a storage box 8, a discharge port 7, a drive mechanism 9, and a pushing mechanism 11; the storage box 8 is used to store new quartz wafers, and the storage box 8 can store multiple new quartz wafers at a time. In a preferred embodiment, it can store 800 new quartz wafers at a time.

[0036] The drive mechanism 9 is connected to the storage box 8 and is used to drive the storage box 8 to move linearly and reciprocally away from and towards the discharge port 7. The pusher mechanism 11 is perpendicular to the moving direction of the drive mechanism. The pusher mechanism is positioned at the bottom of the storage box 8 near the discharge port 7, and when the storage box 8 approaches the discharge port 7, it can push a new quartz wafer from the bottom of the storage box 8 into the discharge port 7. The drive mechanism 9 and the pusher mechanism 11 can be driven by electric drive, hydraulic drive, or other drive methods.

[0037] Sensor 3, drive mechanism 9, and pusher mechanism 11 are all electrically connected to control mechanism 10. The control mechanism is used to receive the sensing information from the sensor and, upon receiving the sensing information, controls the drive mechanism and pusher mechanism to achieve the automatic feeding and discharging function of new quartz wafers.

[0038] After the silicon wafer grinding thickness is tested, the used quartz wafer needs to be removed, and a new quartz wafer is taken and fed into the processing machine for the next batch of testing. At this time, the operator puts the removed used quartz wafer into the waste box through the waste inlet. During this process, the sensor detects the input of the used quartz wafer and transmits this information to the control mechanism. The control mechanism then controls the drive mechanism and the pusher mechanism to act sequentially. First, the drive mechanism moves the storage box near the discharge port. The pusher mechanism then pushes a new quartz wafer from the bottom of the storage box to the discharge port, completing the automatic discharge of the new quartz wafer. The operator then takes the new quartz wafer from the discharge port and puts it into the processing machine for a new round of operation. Simultaneously, the pusher mechanism and drive mechanism reset, awaiting the next operation.

[0039] Therefore, the automatic feeding and dispensing device provided in this application can realize intelligent and automated quartz wafer feeding and dispensing operations, precisely control that after each used quartz wafer is put in, only one new quartz wafer can be dispensed for production use, avoiding the risk of multiple feedings, missed feedings, or missed dispensings of quartz wafers that may be caused by human intervention in picking up and putting in quartz wafers.

[0040] The discharging mechanism can employ conventional technology, as long as it can dispense one new quartz wafer at a time. This application provides a preferred technical solution, as follows:

[0041] The discharge mechanism also includes a receiving plate 17 and a pushing plate 18.

[0042] The bottom of the storage box 8 is located on the receiving plate 17, and the drive mechanism can drive the storage box to move linearly back and forth along the length of the receiving plate. Several vertically distributed storage slots 21 are provided on the inner bottom surface of the storage box 8. The inner diameter of each storage slot 21 is slightly larger than that of a new quartz wafer, so each storage slot can only store one row of vertically placed new quartz wafers. When there are multiple storage slots 21, they are preferably arranged in an array along the length of the receiving plate 17.

[0043] The bottom of the storage tank 21 is provided with a first opening. The size of the first opening is slightly larger than the new quartz sheet, so the new quartz sheet can be leaked out of the first opening. However, due to the obstruction of the receiving plate, the new quartz sheet is still retained in the first opening.

[0044] The receiving plate 17 is provided with a second opening, the size of which is the same as that of the first opening. The second opening is not on the movement path of the first opening. Therefore, when the drive mechanism drives the storage box to move back and forth, the first opening and the second opening will not overlap, causing the quartz pieces in the storage tank to fall from the first opening into the second opening.

[0045] The upper end of the discharge port 7 is located directly below the second opening. Preferably, the upper end of the discharge port 7 is the discharge guide port 19, that is, the discharge guide port 19 is located directly below the second opening.

[0046] The output end of the pusher mechanism 11 is connected to the pusher plate 18, which can drive the pusher plate to reciprocate along the width direction of the receiving plate. The pusher plate 18 is provided with a third opening, which is on the same straight line as the second opening. The size of the third opening is the same as that of the first and second openings, and is slightly larger than the new quartz wafer; the height of the third opening is less than the thickness of the new quartz wafer.

[0047] When discharge is required, the drive mechanism first moves the storage box closer to the discharge port, so that the storage tank carrying the new quartz wafer is aligned with the third opening and the discharge port. Then, the pusher mechanism drives the pusher plate forward and inserts it between the storage box and the receiving plate until the first opening and the third opening coincide. At this time, the new quartz wafer in the first opening falls into the third opening. Since the height of the third opening is less than the thickness of the new quartz wafer, the third opening can only hold one new quartz wafer. Then, the pusher plate moves the quartz wafer that has fallen into the third opening backward until the second opening and the third opening coincide. The new quartz wafer in the third opening falls from the second opening through the discharge guide into the discharge port.

[0048] As can be seen from the above, the receiving plate should have a certain length and width so that the storage box can move back and forth along the length of the receiving plate and the pusher plate can move back and forth along the width of the receiving plate. In this way, when the first and third openings are not aligned during the discharge process, or when the second and third openings are not aligned, the receiving plate can receive the new quartz pieces in the first and second openings and prevent them from falling out.

[0049] Preferably, the receiving plate is provided with a proximity switch 20, which can detect the remaining amount of quartz sheets in the storage tank. When the quartz sheets in a single storage tank are used up, the proximity switch 20 will send feedback information to the drive mechanism, and then the drive mechanism will control the storage box to move in the length direction of the receiving plate. At the same time, the proximity switch 20 can detect the position of the storage box. When the storage box moves to the target position, it can control the drive mechanism to stop automatically.

[0050] Preferably, the recycling mechanism further includes a counter 1, which is electrically connected to the sensor 3. The counter 1 receives the sensing information from the sensor 3 and automatically counts the cumulative number of used quartz wafers added. The counter 1 can also display the cumulative number of used quartz wafers added to the device in real time. The counter can be used to determine whether the production operator has added, omitted, or failed to retrieve quartz wafers during the operation.

[0051] Preferably, a track 4 is provided between the waste feeding port 2 and the waste box 5, and the sensor 3 is set aligned with the track 4 so that the information of the quartz sheet passing through the track can be detected in a timely and accurate manner.

[0052] More preferably, the sensor is a through-beam sensor, such as a through-beam infrared sensor or a through-beam laser sensor. Under normal circumstances, there is no obstruction between the transmitting and receiving sensors, and the receiving sensor can receive the signal from the transmitting sensor normally. When a quartz disc passes over the track, it will block the signal transmission of the transmitting sensor, thereby allowing the receiving sensor to detect the information that the quartz disc has passed over the track, i.e., the information of the old quartz disc being inserted, and transmit it to the control mechanism and the counter.

[0053] Preferably, both the waste box 5 and the discharge port 7 are sloped to facilitate the falling and sliding of quartz wafers and prevent their accumulation. Both the waste box and the discharge port are equipped with Teflon protective strips to ensure that each quartz wafer falling into the waste box and being discharged from the discharge port is free from collisions, chipped corners, cracks, or other defects. Preferably, the Teflon protective strips are located on the inner sides of the waste box, the inner sides of the discharge port, and the bottom surface.

[0054] Meanwhile, the bottom of the waste bin is protected with absorbent sponge to prevent water stains or grinding slurry dirt from splashing onto the old quartz wafers and affecting the working environment of the equipment. As those skilled in the art will understand, the automatic throughput device provided in this application also includes a housing 16 for supporting and protecting the entire device. Preferably, except for one end of the waste inlet 2 and one end of the outlet 7 which are located outside the housing 16, the remaining parts of the recycling mechanism, the discharge mechanism, and the control mechanism are all located inside the housing.

[0055] Preferably, the housing is provided with an observation window 15 to facilitate observation and supervision of the entire operation process of the device, and to handle any abnormalities in a timely manner.

[0056] Preferably, the housing 16 is provided with a safety cover 6, which is connected and fixed to the housing 16 by a gas spring 12 and a flat lock 14. Furthermore, the safety cover 6 is provided with a handle 13 for easy access.

[0057] Under normal conditions, the safety cover is locked by a flat lock, which protects the equipment and the safety of the user. When the mechanism needs maintenance or cleaning, the flat lock can be opened, the gas spring can be released, and the safety cover can be removed by the handle for convenient maintenance and cleaning.

[0058] The actual use of the automated throughput device provided in this application has greatly improved the yield and quality of silicon wafer grinding. For example... Figure 4 As shown, after using the automatic throughput device of this application, the product defect rate decreased from 0.021% to 0% compared to before use.

[0059] Therefore, the automatic throughput device provided in this application has good practical value and technical improvement significance in silicon wafer processing and manufacturing, especially in silicon wafer grinding processes.

[0060] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if such modifications and modifications fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and modifications.

Claims

1. An automatic throughput device for inducting a quartz wafer lapping thickness of a silicon wafer, characterized by, This includes a recycling mechanism, a discharge mechanism, and a control mechanism; The recycling mechanism includes a waste inlet, a waste box, and a sensor; the waste inlet is connected to the waste box, the waste inlet is used to put in old quartz pieces, and the waste box is used to collect the old quartz pieces; the sensor is used to sense whether old quartz pieces have been put in. The discharge mechanism includes a storage box, a discharge port, a drive mechanism, and a pushing mechanism; The storage box is used to store new quartz wafers; the drive mechanism is connected to the storage box and is used to drive the storage box to reciprocate to move closer to or away from the discharge port; the pushing mechanism is perpendicular to the moving direction of the drive mechanism, the pushing mechanism is positioned at the bottom of the storage box near the discharge port, and when the storage box is close to the discharge port, a new quartz wafer can be pushed out from the bottom of the storage box and fall into the discharge port; The sensor, the drive mechanism, and the pusher mechanism are all electrically connected to the control mechanism; the control mechanism is used to receive the sensing information from the sensor and control the operation of the drive mechanism and the pusher mechanism.

2. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 1, characterized in that, The discharge mechanism also includes a receiving plate and a pushing plate; The bottom of the storage box is located on the receiving plate, and the driving mechanism can drive the storage box to reciprocate along the length of the receiving plate; the inner bottom surface of the storage box is provided with several vertically distributed storage slots, the inner diameter of the storage slots is slightly larger than the new quartz wafers, and is used to store only one row of vertically placed new quartz wafers; the bottom of the storage slot is provided with a first opening; the receiving plate is provided with a second opening, which is not on the movement path of the first opening; the upper end of the discharge port is located directly below the second opening; The pushing mechanism is connected to the pushing plate, and the pushing mechanism can drive the pushing plate to reciprocate along the width direction of the receiving plate; the pushing plate is provided with a third opening, and the third opening is on the same straight line as the second opening; the size of the first opening, the second opening and the third opening is slightly larger than the new quartz sheet; the height of the third opening is less than the thickness of the new quartz sheet. When the storage box approaches the discharge port, the pushing mechanism drives the pushing plate to move forward and insert between the storage box and the receiving plate until the first opening and the third opening coincide, so that a new quartz piece falls from the storage tank into the third opening. Then, the pushing plate is driven to move backward until the second opening and the third opening coincide, so that the new quartz piece in the third opening falls into the discharge port through the second opening.

3. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 1, characterized in that, The recycling mechanism also includes a counter, which is electrically connected to the sensor and is used to receive the sensing information from the sensor and automatically count the cumulative number of the old quartz pieces that have been put in.

4. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 1, characterized in that, A track is provided between the waste inlet and the waste box, and the sensor is aligned with the track.

5. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 1, characterized in that, Both the waste box and the discharge port are designed with ramps.

6. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 5, characterized in that, Both the waste box and the discharge port are equipped with Teflon protective strips.

7. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 6, characterized in that, The Teflon protective strip is provided on the inner sides of the waste box, the inner sides of the discharge port, and the bottom surface.

8. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 7, characterized in that, The bottom surface of the waste box is equipped with an absorbent sponge.

9. The automatic throughput device for inducting a quartz wafer for grinding thickness of a silicon wafer as claimed in claim 1 wherein, It also includes the casing; Except for one end of the waste feeding port and one end of the discharge port, which are located outside the housing, the remaining parts of the recycling mechanism, the discharge mechanism, and the control mechanism are all located inside the housing.

10. The automatic throughput device for sensing the grinding thickness of silicon wafers as described in claim 9, characterized in that, The housing is equipped with a safety cover, which is connected and fixed to the housing by a gas spring and a flat lock, respectively.

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