A tablet skiving device
By setting up isolation baffles and buffer pads in the wafer rejection device, the contact and impact between silicon wafers are reduced by using isolation plates and flexible materials, thus solving the problem of silicon wafer damage during transportation and achieving a higher level of protection.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (CHENGDU) CO LID
- Filing Date
- 2025-08-01
- Publication Date
- 2026-07-31
AI Technical Summary
In existing wafer rejection devices, silicon wafers are prone to collisions and damage during the transfer to the loading box.
A wafer rejection device was designed, which divides the wafer into multiple loading chambers by setting multiple isolation baffles in the loading box, and is equipped with a transfer isolation component and a buffer pad. The isolation baffles and flexible materials are used to reduce the contact and impact between silicon wafers.
It effectively reduces collisions and damage to silicon wafers during transportation, and improves the protection of silicon wafers.
Smart Images
Figure CN224577665U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of silicon wafer rejection equipment, and more specifically, to a wafer rejection device. Background Technology
[0002] In the wet process of solar cells, the main machine for horizontal development, horizontal film removal and re-etching, and horizontal tinning uses a chain-type horizontal transport system with many tanks, resulting in a long main machine. In the event of an automation malfunction, if there are still many silicon wafers in the main machine, the automated rollers will activate and transfer the wafers from the main machine to the loading box below.
[0003] In existing wafer rejection devices, silicon wafers are directly transferred to the loading box by the action of rejection rollers. During the transfer process, silicon wafers are prone to collisions, which can cause damage to the wafers. Utility Model Content
[0004] The purpose of this invention is to provide a wafer rejection device that can reduce the collision between silicon wafers during the process of transferring the wafers from the rejection structure to the loading box, thereby reducing the occurrence of damage to the silicon wafers.
[0005] The embodiments of this utility model can be implemented as follows:
[0006] In a first aspect, this utility model provides a sheet rejection device, comprising:
[0007] The material box is provided with multiple isolation baffles, which divide the material box into multiple material filling chambers arranged sequentially along the first direction. The material filling chambers are used to accommodate the material sheets.
[0008] The chip removal assembly includes multiple chip removal structures arranged sequentially along a first direction. The chip removal structures are used to transfer the chips on the machine to the loading chamber.
[0009] In an optional embodiment, the sheet rejection device further includes a transfer and isolation component for placing isolation sheets into the loading chamber, the isolation sheets being used to separate adjacent sheets within the loading chamber.
[0010] In an optional embodiment, the transfer isolation component is located on the upper side of the loading box, and the sheet rejection device also includes an isolation box. The isolation box and the loading box are spaced apart along the second direction. The isolation box is used to store isolation sheets, and the transfer isolation component is used to transfer the isolation sheets in the isolation box to the loading box. The first direction and the second direction form an angle.
[0011] In an optional embodiment, the transfer isolation assembly includes a first guide rail, a drive member, and a gripper. The first guide rail extends along a second direction, the drive member is movable along the second direction on the first guide rail, and the drive member is connected to the gripper to drive the gripper to move in the vertical direction. The gripper is used to pick up and put down the isolation sheet.
[0012] In an optional implementation, there are multiple isolation boxes and transfer isolation components, which are arranged in a one-to-one correspondence. The multiple transfer isolation components are spaced apart along the first direction, and the multiple transfer isolation components are arranged in a one-to-one correspondence with multiple loading cavities.
[0013] In an optional embodiment, the driving component is one of a driving cylinder, a driving electric cylinder, or a driving hydraulic cylinder.
[0014] In an optional implementation, the gripping component is a gripping suction cup;
[0015] And / or the isolation sheet is isolation paper.
[0016] In an optional embodiment, a cushioning pad made of flexible material is also provided on the bottom plate of the filling box.
[0017] In an optional embodiment, the filling box includes a bottom plate, a rear plate, and two side plates spaced apart along a first direction. The rear plate is disposed on the rear side of the bottom plate, and the adjacent sides of the side plates are respectively connected to the bottom plate and the rear plate. A plurality of partitions are disposed between the two side plates, and the adjacent sides of the partitions are respectively connected to the bottom plate and the rear plate. At least one of the partitions, the bottom plate, the rear plate, and the side plates is made of a flexible material.
[0018] In an optional embodiment, the sheet rejection device further includes a detection element disposed on the rejection structure, which is used to detect whether a sheet is present on the machine.
[0019] The beneficial effects provided by this embodiment of the utility model include: A wafer rejection device provided by this embodiment of the utility model includes a loading box and a rejection assembly. The loading box is provided with multiple isolation baffles, which divide the loading box into multiple loading cavities arranged sequentially along a first direction. The loading cavities are used to accommodate wafers. The rejection assembly includes multiple rejection structures arranged sequentially along the first direction, which are used to transfer wafers from the machine to the loading cavities. By setting the isolation baffles, the loading box can be divided into multiple mutually isolated loading cavities, thereby reducing the contact between silicon wafers in each loading cavity and reducing the occurrence of silicon wafer damage. Attached Figure Description
[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a schematic diagram of the material loading box in the sheet rejection device provided in this embodiment;
[0022] Figure 2 This is a schematic diagram of the transfer isolation component provided in this embodiment.
[0023] Icons: 100-Filling box; 110-Base plate; 120-Rear plate; 130-Side plate; 140-Isolation baffle; 150-Filling cavity; 300-Transfer isolation assembly; 310-First guide rail; 320-Gripper; 330-Driver; 400-Isolation box; 500-Isolation plate. Detailed Implementation
[0024] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0025] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.
[0026] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0027] In the description of this utility model, it should be noted that if terms such as "upper," "lower," "inner," or "outer" are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the utility model product is usually placed during use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.
[0028] Furthermore, the terms "first" and "second" are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.
[0029] It should be noted that, where there is no conflict, the features in the embodiments of this utility model can be combined with each other.
[0030] In some existing wafer rejection devices, silicon wafers are directly transferred to the loading box 100 by the action of rejection rollers. However, the silicon wafers entering the loading box 100 are prone to collisions, which can cause damage to the silicon wafers.
[0031] The wafer rejection device provided in this application embodiment can reduce the collision between silicon wafers during the process of the wafers being transferred from the rejection structure to the loading box 100, thereby reducing the occurrence of damage to the silicon wafers.
[0032] The following describes in detail, with reference to the accompanying drawings, the specific structure of a sheet chipping device provided by this utility model and its corresponding technical effects.
[0033] Please refer to Figure 1 This utility model provides a sheet rejection device including a loading box 100 and a rejection assembly (not shown). The loading box 100 is provided with multiple isolation baffles 140, which divide the loading box into multiple loading cavities 150 arranged sequentially along a first direction. The loading cavities 150 are used to accommodate sheet metal. The rejection assembly includes multiple rejection structures arranged sequentially along the first direction, which are used to transfer sheet metal from the machine to the loading cavities 150.
[0034] It should be noted that the wafers in this embodiment can be understood as silicon wafers. That is, by setting the isolation baffle 140, the loading box 100 can be divided into multiple mutually isolated loading cavities 150, thereby reducing the contact between silicon wafers in each loading cavity 150 and reducing the occurrence of silicon wafer damage.
[0035] Optionally, in order to further reduce the damage to the silicon wafer when it is transferred to the loading chamber 150 by the wafer rejection structure, in some embodiments, a buffer pad is also provided on the bottom plate 110 of the loading box. The buffer pad is made of a flexible material, such as foam, plastic or rubber pad, so as to absorb the impact force when the silicon wafer falls into the loading box and reduce the risk of microcracks in the silicon wafer.
[0036] In detail, in this embodiment, the loading box includes a bottom plate 110, a rear plate 120, and two side plates 130 spaced apart along a first direction. The two side plates 130 are respectively disposed on both sides of the bottom plate 110 along the first direction. The adjacent sides of the side plates 130 are respectively connected to the bottom plate 110 and the rear plate 120. A plurality of partitions are disposed between the two side plates 130. Similarly, the adjacent sides of the partitions are respectively connected to the bottom plate 110 and the rear plate 120.
[0037] In some embodiments, in order to protect the silicon wafer from easy microcracks in the loading cavity 150, at least one of the partition, bottom plate 110, back plate 120 and side plate 130 is made of a flexible material.
[0038] In some embodiments, in order to facilitate the timely detection of whether there are silicon wafers on the machine by the rejection assembly, so as to ensure that the rejection assembly can promptly transfer the silicon wafers on the machine to the loading box 100 when the machine fails to operate.
[0039] The wafer rejection device also includes a detection element, which is mounted on the rejection structure and is used to detect whether a wafer is present on the machine. Understandably, the detection element can communicate with the rejection assembly. When the detection element detects a wafer on the machine, it can send a signal to the rejection assembly, and the rejection structure of the rejection assembly can promptly transfer the silicon wafer into the loading box 100.
[0040] It should be noted that the detection component can be an image detection component, such as an image detection structure like a camera.
[0041] The wafer rejection structure can be a wafer rejection roller. Since the wafer rejection roller is a conventional device in silicon wafer rejection equipment, the specific structure of the wafer rejection roller will not be described in detail here.
[0042] Please refer to Figure 2 Optionally, the sheet rejection device further includes a transfer isolation component 300, which is used to place isolation sheets 500 into the loading cavity 150, and the isolation sheets 500 are used to separate adjacent sheets in the loading cavity 150.
[0043] Understandably, when there is a silicon wafer in the loading cavity 150, when the next silicon wafer is placed, an isolation plate 500 can be placed above the silicon wafer by the transfer isolation component 300. The isolation plate 500 can reduce the contact between the next silicon wafer and the silicon wafer below the isolation plate 500, thereby reducing the occurrence of microcracks after the silicon wafers come into contact.
[0044] In detail, the transfer isolation assembly 300 is located on the upper side of the loading box 100 to facilitate the placement of the isolation sheet 500 into the loading cavity 150. The sheet rejection device also includes an isolation box 400, which is spaced apart from the loading box 100 along a second direction. The isolation box 400 is used to store the isolation sheet 500, and the transfer isolation assembly 300 is used to transfer the isolation sheet 500 in the isolation box 400 to the loading box 100. The first direction and the second direction form an angle.
[0045] Of course, in some other embodiments, the isolation box 400 and the filling box 100 may also be spaced apart along the first direction.
[0046] The transfer isolation assembly 300 includes a first guide rail 310, a drive member 330, and a gripper 320. The first guide rail 310 extends along a second direction, the drive member 330 can move along the second direction on the first guide rail 310, and the drive member 330 is connected to the gripper 320 to drive the gripper 320 to move in the vertical direction. The gripper 320 is used to pick up and put down the isolation sheet 500.
[0047] The first guide rail 310 and the driving component 330 can be slidably connected to ensure the stability of the driving component 330's movement in the second direction.
[0048] Optionally, in order to reduce the occurrence of silicon wafer damage due to contact between adjacent silicon wafers in each loading cavity 150, the number of isolation boxes 400 and transfer isolation components 300 are multiple and are set in a one-to-one correspondence, so that each transfer isolation component 300 can pick up the isolation paper from one isolation box 400.
[0049] Of course, in some other embodiments, the number of isolation boxes 400 may also be one, and each transfer isolation component 300 can pick up isolation paper from the isolation box 400.
[0050] Multiple transfer isolation components 300 are spaced apart along the first direction, and the multiple transfer isolation components 300 are arranged one-to-one with multiple loading cavities 150.
[0051] In this embodiment, the driving component 330 is one of a driving cylinder, a driving electric cylinder, or a driving hydraulic cylinder. Specifically, in this embodiment, the driving component 330 is a driving cylinder to improve the accuracy of driving the gripper 320.
[0052] In this embodiment, the gripper 320 is a gripping suction cup to improve the stability of gripping the isolation plate 500.
[0053] Optionally, the separator 500 is a separator paper, which can be made of a flexible material. The separator paper has a certain thickness, thereby reducing the damage caused by contact between adjacent silicon wafers within the loading cavity 150.
[0054] In summary, the wafer rejection device provided in this embodiment of the present invention includes a loading box 100 and a rejection assembly. The loading box 100 is provided with multiple isolation baffles 140, which divide the loading box into multiple loading cavities 150 arranged sequentially along a first direction. The loading cavities 150 are used to accommodate wafers. The rejection assembly includes multiple rejection structures arranged sequentially along the first direction, which are used to transfer wafers from the machine to the loading cavities 150. By providing the isolation baffles 140, the loading box 100 can be divided into multiple mutually isolated loading cavities 150, thereby reducing the contact between silicon wafers within each loading cavity 150 and minimizing the possibility of wafer damage.
[0055] The above description is only a specific embodiment of this utility model, but the protection scope of this utility model is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model.
Claims
1. A webbing device, characterized by include: A loading box (100) is provided with a plurality of isolation baffles (140) inside the loading box (100), the plurality of isolation baffles (140) divide the loading box (100) into a plurality of loading cavities (150) arranged sequentially along a first direction, the loading cavities (150) being used to accommodate material sheets; The chip removal assembly includes a plurality of chip removal structures arranged sequentially along a first direction, the chip removal structures being used to transfer the chip on the machine to the loading chamber (150).
2. The sheet rejection device according to claim 1, characterized in that: The sheet rejection device further includes a transfer isolation component (300), which is used to place isolation sheets (500) into the loading cavity (150), and the isolation sheets (500) are used to separate adjacent sheets in the loading cavity (150).
3. The sheet rejection device according to claim 2, characterized in that: The transfer isolation component (300) is located on the upper side of the loading box (100). The sheet rejection device also includes an isolation box (400). The isolation box (400) and the loading box (100) are spaced apart along a second direction. The isolation box (400) is used to store the isolation sheet (500). The transfer isolation component (300) is used to transfer the isolation sheet (500) in the isolation box (400) to the loading box (100). The first direction and the second direction form an angle.
4. The sheet rejection device according to claim 3, characterized in that: The transfer isolation assembly (300) includes a first guide rail (310), a drive member (330), and a gripper (320). The first guide rail (310) extends along the second direction. The drive member (330) is movable along the second direction on the first guide rail (310). The drive member (330) is connected to the gripper (320) to drive the gripper (320) to move in the vertical direction. The gripper (320) is used to pick up and put down the isolation piece (500).
5. The sheet rejection device according to claim 4, characterized in that: The number of the isolation boxes (400) and the transfer isolation components (300) are multiple and are arranged in a one-to-one correspondence. The multiple transfer isolation components (300) are arranged at intervals along the first direction. The multiple transfer isolation components (300) and the multiple loading cavities (150) are arranged in a one-to-one correspondence.
6. The sheet rejection device according to claim 4, characterized in that: The drive component (330) is one of a drive cylinder, a drive electric cylinder, or a drive hydraulic cylinder.
7. The sheet rejection device according to claim 4, characterized in that: The gripping component (320) is a gripping suction cup; And / or the isolation sheet (500) is isolation paper.
8. The sheet rejection device according to claim 1, characterized in that: The bottom plate (110) of the filling box is also provided with a cushioning pad, which is made of flexible material.
9. The sheet rejection device according to claim 1, characterized in that: The loading box (100) includes a bottom plate (110), a rear plate (120), and two side plates (130) spaced apart along the first direction. The rear plate (120) is disposed on the rear side of the bottom plate (110). The adjacent sides of the side plates (130) are respectively connected to the bottom plate (110) and the rear plate (120). A plurality of partitions are disposed between the two side plates (130). The adjacent sides of the partitions are respectively connected to the bottom plate (110) and the rear plate (120). At least one of the partitions, the bottom plate (110), the rear plate (120), and the side plates (130) is made of a flexible material.
10. The sheet rejection device according to claim 1, characterized in that: The sheet rejection device also includes a detection element, which is disposed on the rejection structure and is used to detect whether there are sheets on the machine.