Deposition equipment and electronic devices

Abstract

A deposition apparatus and an electronic device are disclosed. The deposition apparatus includes: an electrostatic chuck configured to support a substrate; a mask assembly disposed on the surface of the substrate; a deposition module configured to be movable in a horizontal direction intersecting the thickness direction of the mask assembly, wherein the deposition module is configured to discharge deposition material onto the mask assembly; and a camera configured to capture images of the electrostatic chuck or the mask assembly, wherein when the deposition module discharges deposition material, the deposition module is in a deposition position overlapping with the mask assembly in the thickness direction, and when the deposition module does not discharge deposition material, the deposition module is in a standby position not overlapping with the mask assembly in the thickness direction, and the camera captures images of the electrostatic chuck or the mask assembly when the deposition module is in the standby position.

Description

[0001] This application claims priority to Korean Patent Application No. 10-2024-0086524, filed on July 2, 2024, and all benefits derived therefrom, the entire contents of which are incorporated herein by reference. Technical Field

[0002] Embodiments of this disclosure relate to deposition equipment and electronic devices. Background Technology

[0003] Organic light-emitting display devices utilize the phenomenon that electrons injected from the cathode and holes injected from the anode recombine in an organic thin film to form excitons, and generate light of a specific wavelength as energy is released when the excitons relax from the excited state to the ground state.

[0004] In the manufacturing process of organic light-emitting display devices, vacuum deposition using a deposition equipment can be used as a method for depositing organic materials or metals that serve as electrodes. Vacuum deposition is carried out by placing a substrate on which an organic thin film to be deposited on an electrostatic chuck located inside a vacuum chamber, bringing a mask assembly having the same pattern as the pattern of the thin film to be formed into contact with the substrate, and then using a deposition module to evaporate or sublimate a deposition material such as an organic material to deposit the organic material on the substrate. Utility Model Content

[0005] In the manufacturing process of organic light-emitting display devices, defects may occur in the organic light-emitting display device if there are particles on the surface of the electrostatic chuck or the mask assembly is not in the correct position during the process of depositing the deposition material onto the substrate.

[0006] Embodiments of this disclosure provide a deposition apparatus and a method for inspecting the functionality of an internal electrostatic chuck and mask assembly.

[0007] However, the embodiments of this disclosure are not limited to those described herein. The above and other embodiments of this disclosure will become more apparent to those skilled in the art from the following detailed description of this disclosure.

[0008] According to an embodiment of this disclosure, a deposition apparatus includes: an electrostatic chuck configured to support a substrate; a mask assembly disposed on a surface of the substrate; a deposition module configured to be movable in a horizontal direction intersecting the thickness direction of the mask assembly, wherein the deposition module is configured to discharge deposition material onto the mask assembly; and a camera configured to capture images of the electrostatic chuck or the mask assembly, wherein when the deposition module discharges deposition material, the deposition module is in a deposition position overlapping with the mask assembly in the thickness direction of the mask assembly, and when the deposition module does not discharge deposition material, the deposition module is in a standby position not overlapping with the mask assembly in the thickness direction of the mask assembly, and wherein when the deposition module is in the standby position, the camera captures images of the electrostatic chuck or the mask assembly.

[0009] In an embodiment, when the deposition module is in the deposition position, the camera can overlap with the deposition module in the thickness direction of the mask assembly, and when the deposition module is in the standby position, the camera can not overlap with the deposition module in the thickness direction of the mask assembly.

[0010] In one embodiment, the camera below the deposition module can be positioned below the mask assembly to overlap with the mask assembly in the thickness direction.

[0011] In an embodiment, the deposition apparatus may further include: a chamber housing an electrostatic chuck, a mask assembly, a deposition module, and a camera; and a connection module disposed inside the chamber, wherein the connection module connects the outside of the chamber to the inside of the deposition module.

[0012] In one embodiment, the camera may be located inside the connection module.

[0013] In an embodiment, the connection module may include: a first fixing member disposed on the lower surface of a chamber located below the mask assembly, wherein the first fixing member provides a passage to the outside of the chamber; a first rotating member having one end rotatably connected to the first fixing member, wherein a first communicating space is defined in the first rotating member to communicate with the outside of the chamber; a second fixing member disposed on the deposition module, wherein the second fixing member provides a passage to the interior of the deposition module; and a second rotating member having one end rotatably connected to the opposite end of the first rotating member and an opposite end rotatably connected to the second fixing member, wherein a second communicating space is defined in the second rotating member to communicate with the first communicating space and the interior of the deposition module.

[0014] In an embodiment, the connection module may further include a rotatable connection member that rotatably connects the opposite end of the first rotatable member to one end of the second rotatable member.

[0015] In one embodiment, the camera may be positioned inside one end of the first rotating member.

[0016] In one embodiment, the camera may be positioned such that its lens faces the mask assembly, and the viewing window may be formed on the upper part of one end of the first rotating member.

[0017] In one embodiment, the deposition module may include: a track extending in a horizontal direction; a body configured to move along the track; and a deposition nozzle disposed on the body to discharge deposition material onto a mask assembly.

[0018] In an embodiment, the deposition apparatus may further include an analysis unit configured to analyze images captured by a camera to determine whether the electrostatic chuck or mask assembly is functioning correctly.

[0019] According to an embodiment of this disclosure, an electronic device includes a display device manufactured according to the deposition equipment described above.

[0020] According to embodiments of this disclosure, an inspection method using a deposition apparatus includes moving a deposition module to a standby position, capturing an image of an electrostatic chuck for the first time using a camera, placing a mask assembly under the electrostatic chuck, and capturing an image of the mask assembly for the first time using a camera.

[0021] In an embodiment, when the deposition module is in a standby position, the deposition module may not overlap with the electrostatic chuck or mask assembly in the thickness direction.

[0022] In one embodiment, the camera may be positioned below the electrostatic chuck or mask assembly to overlap with it.

[0023] In an embodiment, the inspection method may further include placing the substrate on an electrostatic chuck after the image of the mask assembly is first captured by the camera.

[0024] In an embodiment, the inspection method may further include: after placing the substrate on an electrostatic chuck, moving the deposition module to the deposition position and discharging the deposition material onto the mask assembly.

[0025] In an embodiment, when the deposition module is in the deposition position, the deposition module may overlap with the electrostatic chuck or mask assembly in the thickness direction.

[0026] In an embodiment, the inspection method may further include moving the deposition module to a standby location after the deposited material is discharged onto the mask assembly.

[0027] In an embodiment, the inspection method may further include: after moving the deposition module to a standby position, unloading the substrate from the electrostatic chuck, and then capturing an image of the mask assembly a second time using a camera.

[0028] In an embodiment, the inspection method may further include: after capturing an image of the mask assembly a second time via the camera, unloading the mask assembly, and capturing an image of the electrostatic chuck a second time via the camera.

[0029] According to embodiments of this disclosure, the electrostatic chuck and mask assembly inside the deposition equipment can be checked for proper functioning, thereby effectively preventing malfunctions in the process of depositing material onto a substrate.

[0030] The effects of embodiments according to this disclosure are not limited to those mentioned above, and many more effects are included in the following description of this disclosure. Attached Figure Description

[0031] The above and other features of this disclosure will become more apparent from the detailed description of embodiments thereof with reference to the accompanying drawings, in which:

[0032] Figure 1 This is a view illustrating a deposition apparatus according to an embodiment of the present disclosure;

[0033] Figure 2 It is along Figure 1 A cross-sectional view taken from line A-A';

[0034] Figure 3 It is shown Figure 1 A view of the deposition module and the connection module;

[0035] Figure 4 It is shown Figure 1 A view of the connection module;

[0036] Figure 5 This is a flowchart illustrating an inspection method using a deposition apparatus according to an embodiment of the present disclosure;

[0037] Figure 6 It is shown Figure 5 The first deposition preparation process and the first inspection of the electrostatic chuck;

[0038] Figure 7 It is shown Figure 5 The placement of the mask component and the initial view of the mask component;

[0039] Figure 8 It is shown Figure 5 A view showing the placement of the substrate;

[0040] Figure 9 It is shown Figure 5 A view of the deposition process;

[0041] Figure 10 It is shown Figure 5 A view of the second deposition standby process;

[0042] Figure 11 It is shown Figure 5 A view of the unloading substrate and the secondary inspection mask assembly;

[0043] Figure 12 It is shown Figure 5 View of the unloading mask assembly and secondary inspection electrostatic chuck;

[0044] Figure 13 This is a block diagram of an electronic device according to an embodiment of the present disclosure; and

[0045] Figure 14 This is a schematic diagram of an electronic device according to various embodiments of the present disclosure. Detailed Implementation

[0046] The present invention will now be described more fully below with reference to the accompanying drawings, in which various embodiments are illustrated. However, the present invention may be embodied in many different forms and should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the present invention to those skilled in the art. The same reference numerals throughout refer to the same elements.

[0047] It will be understood that when an element is referred to as being "on" another element, it can be directly on the other element, or an intermediary element can exist between them. In contrast, when an element is referred to as being "directly on" another element, no intermediary element exists.

[0048] It will be understood that although the terms “first,” “second,” and “third,” etc., may be used in this document to describe various elements, components, regions, layers, and / or sections, these elements, components, regions, layers, and / or sections should not be limited by these terms. These terms are used only to distinguish one element, component, region, layer, or section from another. Therefore, the first element, component, region, layer, or section discussed below may be referred to as the second element, component, region, layer, or section without departing from the teachings of this document.

[0049] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, “a,” “the,” and “at least one” do not indicate a limitation of quantity and are intended to include both the singular and the plural unless the context clearly indicates otherwise. Thus, reference to an element as “a” followed by reference to an element as “the” in a claim includes one element and multiple elements. For example, “a element” has the same meaning as “at least one element” unless the context clearly indicates otherwise. “At least one” should not be construed as limiting “a.” “Or” means “and / or.” As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. It will be further understood that the term “comprising,” when used in this specification, indicates the presence of the stated features, areas, integers, steps, operations, elements, and / or components, but does not exclude the presence or addition of one or more other features, areas, integers, steps, operations, elements, components, and / or groups thereof.

[0050] Furthermore, relative terms such as “down” or “bottom” and “up” or “top” may be used throughout this document to describe the relationship between one element and another illustrated in the figures. It will be understood that, in addition to the orientation depicted in the figures, the relative terms are intended to cover different orientations of the device. For example, if a device in one of the figures is flipped, an element described as being “down” to the other elements will be oriented “up” to the other elements. Thus, depending on the specific orientation of the figure, the term “down” can cover both “down” and “up” orientations. Similarly, if a device in one of the figures is flipped, an element described as being “below” or “under” the other elements will be oriented “above” the other elements. Thus, the term “below” or “under” can cover both “up” and “down” orientations.

[0051] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having the same meaning as they have in the context of the relevant art and this disclosure, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0052] The embodiments described herein are illustrative examples with reference to idealized embodiments. Thus, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are to be expected. Therefore, the embodiments described herein should not be construed as limited to the specific shapes of the regions illustrated herein, but should include shape deviations caused, for example, by manufacturing processes. For example, regions illustrated or described as flat may generally have rough and / or non-linear characteristics. Furthermore, illustrated sharp corners may be rounded. Therefore, the regions illustrated in the figures are schematic in nature, and their shapes are not intended to illustrate precise shapes of the regions, nor are they intended to limit the scope of the claims.

[0053] In the following, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0054] Figure 1 This is a view showing a deposition apparatus 10 according to an embodiment of the present disclosure. Figure 2 It is along Figure 1 A cross-sectional view taken from line A-A'.

[0055] refer to Figure 1 and Figure 2 The deposition apparatus 10 according to embodiments of the present disclosure can deposit organic materials or metals used as electrodes on a substrate S. In embodiments, the deposition apparatus 10 may include a chamber 100, an electrostatic chuck 200, a substrate holder 210, a mask assembly 300, a deposition module 400, a connection module 500, a camera 600, and an analysis unit 700.

[0056] Chamber 100 may provide or define a space for performing a deposition process. During the deposition process, the interior (or interior space) of chamber 100 may be maintained under a vacuum. Maintaining the interior of chamber 100 under a vacuum may mean maintaining the pressure inside chamber 100 at a low pressure, which is a pressure below a predetermined pressure. Chamber 100 may include an inlet / outlet (not shown) for loading / unloading substrate S. Furthermore, chamber 100 may include a vacuum pump (not shown) for controlling the pressure inside chamber 100 and discharging deposition material not deposited on substrate S, and an outlet (not shown) connected to the vacuum pump. Chamber 100 may accommodate at least one selected from electrostatic chuck 200, substrate holder 210, mask assembly 300, deposition module 400, connection module 500, camera 600, and analysis unit 700.

[0057] The substrate S on which organic materials or metals used as electrodes are deposited can be provided as an insulating substrate, a semiconductor substrate, a display device substrate, etc., but this disclosure is not limited thereto. According to an embodiment, the substrate S can be, for example, a substrate used in an organic light-emitting display device. A predetermined structure can be formed on the substrate S via a deposition process. Depending on the manufacturing process of the organic light-emitting display device, the structure formed on the substrate S via the deposition process can be formed in various ways. For example, in the process of forming a hole injection layer, a pixel defining film and an anode electrode can be formed on the substrate S. Furthermore, in the process of forming an organic light-emitting layer, not only a pixel defining film and an anode electrode can be formed on the substrate S, but also a hole injection layer and a hole transport layer can be formed.

[0058] An electrostatic chuck 200 can support a substrate S. The electrostatic chuck 200 can be disposed inside a chamber 100. According to embodiments of this disclosure, the electrostatic chuck 200 can be disposed on the upper side (or upper part of the internal space) of the chamber 100, and the substrate S can be located below and supported by the electrostatic chuck 200. The electrostatic chuck 200 can clamp or release the substrate S by electrostatic force. The electrostatic chuck 200 can be bipolar or unipolar. A bipolar electrostatic chuck 200 can include two electrode plates and can clamp the substrate S when a voltage is applied between the two electrode plates. A unipolar electrostatic chuck 200 can include only one electrode plate and can clamp the substrate S when a voltage is applied between the electrode plate and the substrate S. The electrostatic chuck 200 can release the substrate S after a deposition process has been performed. In embodiments, the electrostatic chuck 200 can include a fixing member. The fixing member helps to fix the substrate S and the mask assembly 300 and can maintain a constant distance between the substrate S and the mask assembly 300. The fixed components can have a detachable frame structure.

[0059] The substrate holder 210 can be disposed between the electrostatic chuck 200 and the mask assembly 300. There can be multiple substrate holders 210, that is, multiple substrate holders 210 can be provided in a plurality of forms, and the multiple substrate holders 210 can hold the substrate S.

[0060] A mask assembly 300 may define an area on a substrate S where deposition material discharged from a deposition module 400 will be deposited. The mask assembly 300 may be disposed beneath the substrate S. The mask assembly 300 may include a mask portion 310, a transmission portion 320, and mask sidewalls (not shown). The mask portion 310 may cover certain areas of the substrate S to prevent deposition material discharged from the deposition module 400 from depositing in these areas. The transmission portion 320 may be an open area formed between the mask portions 310, exposing certain areas of the substrate S. Deposition material may be sprayed onto the exposed areas of the substrate S exposed by the transmission portion 320, allowing deposition material to be deposited on the exposed areas of the substrate S. Deposition material sprayed from the deposition module 400 may be patterned through the mask assembly 300 and deposited on the substrate S. The mask sidewalls may be located at the edges of the mask assembly 300 to effectively prevent deposition material from spreading beyond areas of the substrate S. The mask assembly 300 may be a master mask such as a fine metal mask (FMM) or may include multiple segmented masks, but this disclosure is not limited thereto. The mask assembly 300 may be tightly fixed to the substrate S, and the gap between the mask assembly 300 and the substrate S may be adjusted by the electrostatic chuck 200 and the fixing member.

[0061] Figure 3 It is shown Figure 1 A view of the deposition module 400 and the connection module 500. Figure 4 It is shown Figure 1 The view of the connection module 500.

[0062] refer to Figure 3 and Figure 4 Embodiments of the deposition module 400 can discharge deposition material to be deposited on the substrate S. The deposition module 400 can be disposed inside the chamber 100 with the deposition module 400 facing the substrate S. According to embodiments of the present disclosure, an electrostatic chuck 200 on which the substrate S is disposed is positioned on an upper side in the chamber 100, and the deposition module 400 can be positioned on a lower side in the chamber 100. The deposition module 400 can be positioned in a manner that allows the deposition module 400 to move horizontally within the chamber 100. The deposition module 400 may include a track 410, a body 420, and a deposition nozzle 430.

[0063] The track 410 can support at least one selected from the body 420 and the deposition nozzle 430 in a manner that allows the body 420 or the deposition nozzle 430 to move horizontally. The track 410 can extend horizontally within the chamber 100. Multiple tracks 410 can be present, spaced apart from each other and extending in a first direction. The first direction can be... Figure 3 The track 410 can be positioned on the lower side of the chamber 100 in the front-back direction.

[0064] The main body 420 can be mounted on the track 410 and can move along the track 410 in a first direction. In other words, the main body 420 can move along the track 410 in... Figure 3 The body 420 can support the deposition nozzle 430. An actuator (not shown) for moving the body 420 along the track 410 can be provided on the body 420, so that the body 420 can be moved along the track 410 by the operation of the actuator.

[0065] The deposition nozzle 430 can discharge and supply deposition material to the substrate S. The deposition nozzle 430 can be disposed on and supported by the upper surface of the body 420. The deposition nozzle 430 can extend from the upper surface of the body 420 in a second direction. The second direction can refer to a direction orthogonal to the first direction, and can be... Figure 3 The deposition nozzle 430 can be connected to a deposition material reservoir (not shown) and can receive and discharge the deposition material stored in the deposition material reservoir. The deposition nozzle 430 can discharge the deposition material upwards to supply the deposition material to the substrate S.

[0066] When the deposition module 400 discharges deposition material to the mask assembly 300, the deposition module 400 can move to a deposition position, and when the deposition module 400 does not discharge deposition material to the mask assembly 300, the deposition module 400 can move to a standby position. The deposition position can be a location where the deposition module 400 overlaps with the mask assembly 300 in the thickness direction intersecting the first direction, and the standby position can be a location where the deposition module 400 does not overlap with the mask assembly 300 in the thickness direction. In an embodiment, for example, the deposition position can be a location where the body 420 moves along the track 410 and... Figure 2 The position shown is located directly below the mask assembly 300, and the alternative position can be a position where the body 420 moves forward or backward along the track 410 in the first direction and is not located directly below the mask assembly 300.

[0067] In one embodiment, the connection module 500 can be disposed inside the chamber 100 and can connect the outside of the chamber 100 to the inside of the main body 420. In another embodiment, such as... Figure 4 As shown, the connection module 500 may include a first fixing member 510, a first rotating member 520, a rotating connecting member 530, a second rotating member 540, and a second fixing member 550.

[0068] The first fixing member 510 can provide a channel connecting the outside of chamber 100 to the inside of chamber 100. That is, the first fixing member 510 can provide access to the outside of chamber 100. The first fixing member 510 can have a hollow cylindrical structure and can be fixed to the lower surface of chamber 100. The first fixing member 510 can be disposed on the lower surface of chamber 100 directly below mask assembly 300. A through-hole is defined or formed on the lower surface of chamber 100, and the first fixing member 510 can be disposed on the lower surface of chamber 100 such that the hollow portion of the first fixing member 520 connects to the through-hole of chamber 100, thereby connecting the outside of chamber 100 to the inside of chamber 100.

[0069] The first rotating member 520 may be rotatably connected to the upper portion of the first fixed member 510. The first rotating member 520 may be provided as a rectangular block extending in a certain direction, and a first communicating space may be formed therein. The first rotating member 520 may have one end rotatably connected to the first fixed member 510, such that the first communicating space therein can connect to the hollow portion of the first fixed member 510. Since the first communicating space of the first rotating member 520 is connected to the hollow portion of the first fixed member 510, the first communicating space can connect to the outside of the chamber 100. An observation window 521 may be formed on the upper portion of one end of the first rotating member 520. When the camera 600 captures an image of the electrostatic chuck 200 or the mask assembly 300, the observation window 521 can provide the field of view of the camera 600.

[0070] The rotary connecting member 530 can be rotatably connected to the first rotary member 520. The rotary connecting member 530 can have a hollow cylindrical structure, and its lower portion can be rotatably connected to the other end or the opposite end of the first rotary member 520. Since the lower portion of the rotary connecting member 530 can be rotatably connected to the other side of the first rotary member 520, the hollow portion of the rotary connecting member 530 can communicate with the first communicating space in the first rotary member 520.

[0071] The second rotating member 540 can be rotatably connected to the upper portion of the rotating connecting member 530. The second rotating member 540 can be provided as a rectangular block extending in a certain direction, and a second communicating space can be formed therein. The second rotating member 540 may have one end rotatably connected to the upper portion of the rotating connecting member 530, such that the second communicating space therein can be connected to the hollow portion of the rotating connecting member 530. Since the second communicating space of the second rotating member 540 is connected to the hollow portion of the rotating connecting member 530, the second communicating space can be connected to the first communicating space. The other end or opposite end of the second rotating member 540 can be rotatably connected to the second fixing member 550.

[0072] The second fixing member 550 can provide a passage to the interior of the body 420. The second fixing member 550 may have a hollow cylindrical structure and can be fixed to the lower surface of the body 420. A through hole is defined or formed in the lower surface of the body 420, and the upper portion of the second fixing member 550 is disposed on the lower surface of the body 420 such that the hollow portion of the second fixing member 550 connects to the through hole of the body 420, thereby connecting the interior of the body 420 to the second fixing member 550. Since the lower portion of the second fixing member 550 is rotatably connected to the other side of the second rotating member 540, the hollow portion of the second fixing member 550 can connect to a second communicating space. In other words, the second communicating space of the second rotating member 540 can communicate with the interior of the body 420 through the second fixing member 550.

[0073] Camera 600 can capture images of electrostatic chuck 200 or mask assembly 300. Camera 600 can be configured to be located directly below mask assembly 300, below deposition module 400. Camera 600 can be disposed within connection module 500. For example, camera 600 can be disposed inside one end of first rotating member 520. Since this end of first rotating member 520 is located directly below mask assembly 300, camera 600 can be disposed directly below mask assembly 300. Camera 600 can be disposed inside one end of first rotating member 520 such that its lens faces mask assembly 300. In other words, the lens of camera 600 can be configured to face viewing window 521 of first rotating member 520. When body 420 is moved to standby position, camera 600 can capture images of electrostatic chuck 200 or mask assembly 300. When body 420 is moved to deposition position, body 420 is above camera 600, therefore camera 600 may not be able to effectively capture images of electrostatic chuck 200 or mask assembly 300. Therefore, the camera 600 can only capture images of the electrostatic chuck 200 or the mask assembly 300 when the main body 420 is moved to the standby position.

[0074] The analysis unit 700 receives and analyzes images captured by the camera 600, and can determine whether the electrostatic chuck 200 or the mask assembly 300 is functioning correctly based on the analysis results. In an embodiment, for example, when the electrostatic chuck 200 and the mask assembly 300 are functioning correctly, the analysis unit 700 can store the image, and the analysis unit 700 can receive images captured by the camera 600 and compare the images with previously stored images to determine whether the electrostatic chuck 200 and the mask assembly 300 are functioning correctly. In an embodiment, the analysis unit 700 may include circuitry configured to perform the operations described above.

[0075] Figure 5This is a flowchart illustrating an inspection method using a deposition apparatus 10 according to an embodiment of the present disclosure.

[0076] refer to Figure 5 The inspection method using the deposition apparatus 10 according to an embodiment of the present disclosure may include: performing a first deposition preparation process S1, first inspecting the electrostatic chuck S2, placing the mask assembly S3, first inspecting the mask assembly S4, placing the substrate S5, performing a deposition process S6, performing a second deposition preparation process S7, unloading the substrate S8, second inspecting the mask assembly S9, unloading the mask assembly S10, and second inspecting the electrostatic chuck S11.

[0077] Figure 6 It is shown Figure 5 The first deposition preparation process S1 and the first inspection of the electrostatic chuck S2 are shown in the view.

[0078] refer to Figure 6 In the first deposition standby process S1, the deposition module 400 can be moved to a standby position. In the first deposition standby process S1, the body 420 of the deposition module 400 can move along... Figure 6 The track 410 moves to the rear, allowing the main body 420 to be in a standby position. When the main body 420 moves to... Figure 6 When the first rotating member 520 and the second rotating member 540 are in the rear side, the first rotating member 520 and the second rotating member 540 are such that... Figure 6 The connecting module 500 shown can be rotated in a manner that extends to the rear.

[0079] During the initial inspection of the electrostatic chuck S2, the camera 600 can capture an image of the electrostatic chuck 200. This is because the body 420 moves during the first deposition standby process S1. Figure 6 The main body 420 is positioned behind the camera 600, thus not above it, allowing the camera 600 to effectively capture images of the electrostatic chuck 200 without being obstructed by the main body 420. The captured images of the electrostatic chuck 200 by the camera 600 can be transmitted to the analysis unit 700. The analysis unit 700 can compare the transmitted captured images of the electrostatic chuck 200 with previously stored images of a normal electrostatic chuck 200 and analyze the transmitted captured images to determine whether the electrostatic chuck 200 is functioning correctly.

[0080] Figure 7 It is shown Figure 5 The view of placing mask component S3 and first inspecting mask component S4.

[0081] refer to Figure 7When placing the mask assembly S3, the mask assembly 300 can be placed below the electrostatic chuck 200. The mask assembly 300 can be placed at a certain distance from the electrostatic chuck 200 below it. The mask assembly 300 can be fixed to a predetermined position or location below the electrostatic chuck 200 by the fixing members of the electrostatic chuck 200.

[0082] During the initial inspection of the mask assembly S4, the camera 600 can capture an image of the mask assembly 300. This is because the body 420 moves during the first deposition standby process S1. Figure 7 The mask assembly 300 is positioned behind the camera 600, thus allowing the camera 600 to capture images of the mask assembly 300. The captured images of the mask assembly 300 by the camera 600 can be transmitted to the analysis unit 700. The analysis unit 700 can compare the transmitted captured images of the mask assembly 300 with previously stored images of a normal mask assembly 300 and analyze the transmitted captured images to determine whether the mask assembly 300 is functioning correctly.

[0083] Figure 8 It is shown Figure 5 A view of the substrate S5.

[0084] refer to Figure 8 When placing substrate S5, substrate S can be positioned on electrostatic chuck 200. When placing substrate S5, substrate S can be positioned below electrostatic chuck 200 and on mask assembly 300. In other words, when placing substrate S5, substrate S can be positioned between electrostatic chuck 200 and mask assembly 300.

[0085] After the substrate S is placed on the electrostatic chuck 200, the camera 600 can further capture images of the substrate S and the mask assembly 300. The captured images of the substrate S and mask assembly 300 by the camera 600 can be transmitted to the analysis unit 700, and the analysis unit 700 can analyze the transmitted images to determine whether the substrate S is correctly placed on the electrostatic chuck 200. Furthermore, the analysis unit 700 can analyze the transmitted images to determine whether the substrate S and the mask assembly 300 are correctly aligned.

[0086] Figure 9 It is shown Figure 5 A view of the deposition process S6.

[0087] refer to Figure 9 During the deposition process S6, the deposition module 400 can move to the deposition position and discharge the deposited material. In deposition process S6, the body 420 of the deposition module 400 can move along... Figure 9The track 410 moves to the front, allowing the main body 420 to be positioned directly below the mask assembly 300. When the main body 420 moves... Figure 9 When the first rotating member 520 and the second rotating member 540 are in the front position, they can rotate in a manner that allows them to overlap each other. In other words, when the first rotating member 520 and the second rotating member 540 overlap each other, the total length of the connecting module 500 can be reduced. Once the body 420 is moved to the deposition position, the deposition material can be discharged through the deposition nozzle 430 toward the mask assembly 300. The deposition material discharged into the mask assembly 300 can pass through the transmission portion 320 to be deposited on the substrate S.

[0088] Figure 10 It is shown Figure 5 A view of the second deposition standby process S7.

[0089] refer to Figure 10 In the second deposition standby process S7, the deposition module 400 can be moved back to the standby position. In the second deposition standby process S7, the body 420 of the deposition module 400 can move along... Figure 10 The track 410 moves to the rear, allowing the main body 420 to be in a standby position. When the main body 420 moves to... Figure 10 When the first rotating member 520 and the second rotating member 540 are in the rear side, the first rotating member 520 and the second rotating member 540 are such that... Figure 10 The connecting module 500 shown can be rotated in a manner that extends to the rear.

[0090] Figure 11 It is shown Figure 5 A view of the unloading substrate S8 and the secondary inspection mask assembly S9.

[0091] refer to Figure 11 When unloading substrate S8, substrate S can be unloaded from electrostatic chuck 200. When unloading substrate S8, substrate S, which is disposed between electrostatic chuck 200 and mask assembly 300, can be removed to the outside of chamber 100.

[0092] During the secondary inspection of the mask assembly S9, the camera 600 can again capture an image of the mask assembly 300. This is because the body 420 moves to the second deposition standby process S7. Figure 11The mask assembly 300 is positioned behind the camera 600, thus allowing the camera 600 to capture images of the mask assembly 300. The captured image of the mask assembly 300, recaptured by the camera 600, can be transmitted to the analysis unit 700. The analysis unit 700 can compare the transmitted captured image of the mask assembly 300 with previously stored images of a normal mask assembly 300 and analyze the transmitted captured image to re-determine whether the mask assembly 300 is functioning correctly. Furthermore, the analysis unit 700 can analyze the transmitted image to determine whether the substrate S was correctly unloaded from the electrostatic chuck 200.

[0093] Figure 12 It is shown Figure 5 View of the unloading mask assembly S10 and the secondary inspection electrostatic chuck S11.

[0094] refer to Figure 12 When unloading the mask assembly S10, the mask assembly 300 can be unloaded. When unloading the mask assembly S10, the mask assembly 300 placed under the electrostatic chuck 200 can be removed to the outside of the chamber 100.

[0095] During the secondary inspection of the electrostatic chuck S11, the camera 600 can again capture an image of the electrostatic chuck 200. This is because the body 420 moves to the second deposition standby process S7. Figure 12 The body 420 is positioned behind the camera 600, thus allowing the camera 600 to capture images of the electrostatic chuck 200. The captured images of the electrostatic chuck 200, recaptured by the camera 600, can be transmitted to the analysis unit 700. The analysis unit 700 can compare the transmitted captured images of the electrostatic chuck 200 with previously stored images of a normal electrostatic chuck 200 and analyze the transmitted captured images of the static chuck 200 to re-determine whether the electrostatic chuck 200 is functioning correctly.

[0096] The display device according to one embodiment of the present disclosure can be applied to various electronic devices. The electronic device according to one embodiment of the present disclosure includes the display device described above, and may further include modules or devices with additional functions in addition to the display device.

[0097] Figure 13 This is a block diagram of an electronic device 10000 according to an embodiment of the present disclosure.

[0098] refer to Figure 13 An electronic device 10000 according to an embodiment of the present disclosure may include a display module 10001, a processor 10002, a memory 10003, and a power module 10004.

[0099] The processor 10002 may include at least one of a central processing unit (CPU), an application processor (AP), a graphics processing unit (GPU), a communication processor (CP), an image signal processor (ISP), and a controller.

[0100] The memory 10003 can store the data information required for the operation of the processor 10002 or the display module 10001. When the processor 10002 executes the application program stored in the memory 10003, image data signals and / or input control signals are transmitted to the display module 10001, and the display module 10001 can process the received signals and output image information through the display screen.

[0101] The power module 10004 may include a power module such as a power adapter or battery, and a power conversion module that converts the power supplied by the power module to generate the power required for the operation of the electronic device 10000.

[0102] At least one of the components of an electronic device 10000 according to an embodiment of the present disclosure may be included in a display device according to an embodiment of the present disclosure. Furthermore, some modules that are functionally included in a single module may be included in the display device, and other modules may be provided separately from the display device. For example, the display device may include a display module 10001, and a processor 10002, a memory 10003, and a power module 10004 may be provided as other devices within the electronic device 10000 besides the display device.

[0103] Figure 14 This is a schematic diagram of an electronic device according to various embodiments of the present disclosure.

[0104] refer to Figure 14 The various electronic devices that apply the display device according to the embodiments of the present disclosure may include not only image display electronic devices such as, for example, smartphones 10000_1a, tablet PCs (personal computers) 10000_1b, laptop computers 10000_1c, TVs 10000_1d, and desktop monitors 10000_1e, but also wearable electronic devices including display modules such as smart glasses 10000_2a, head-mounted displays 10000_2b, and smartwatches 10000_2c, as well as automotive electronic devices 10000_3 including display modules, such as central information displays (CIDs) arranged on the central dashboard and dashboard of a car, and rearview mirror displays.

[0105] According to embodiments of this disclosure, as described herein, the electrostatic chuck and mask assembly inside the deposition apparatus can be checked for proper functioning, thereby effectively preventing malfunctions in the process of depositing material onto a substrate.

[0106] This invention should not be construed as limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of this invention to those skilled in the art.

[0107] Although the present invention has been specifically shown and described with reference to embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made therein without departing from the spirit or scope of the present invention as defined by the claims.

Claims

1. A deposition apparatus, characterized by, include: An electrostatic chuck, the electrostatic chuck being configured to support a substrate; A mask assembly is disposed on the surface of the substrate; A deposition module is configured to move in a horizontal direction intersecting the thickness direction of the mask assembly, wherein the deposition module is configured to discharge deposition material onto the mask assembly; and A camera, configured to capture images of the electrostatic chuck or the mask assembly, Specifically, when the deposition module discharges the deposition material, it is positioned at a deposition location overlapping with the mask assembly in the thickness direction; and when the deposition module does not discharge the deposition material, it is positioned at a standby location not overlapping with the mask assembly in the thickness direction. When the deposition module is in the standby position, the camera captures the image of the electrostatic chuck or the mask assembly.

2. The deposition apparatus of claim 1, wherein When the deposition module is in the deposition position, the camera overlaps with the deposition module in the thickness direction of the mask assembly, and when the deposition module is in the standby position, the camera does not overlap with the deposition module in the thickness direction of the mask assembly.

3. The deposition apparatus of claim 2, wherein The camera, located below the deposition module, is positioned below the mask assembly to overlap with the mask assembly in the thickness direction.

4. The deposition apparatus of claim 2, wherein The deposition apparatus further includes: A chamber, the chamber housing the electrostatic chuck, the mask assembly, the deposition module, and the camera; and A connection module is disposed inside the chamber, wherein the connection module connects the outside of the chamber to the inside of the deposition module. The camera is located inside the connection module.

5. The deposition apparatus according to claim 4, characterized in that, The connection module includes: A first fixing member is disposed on the lower surface of the chamber located below the mask assembly, wherein the first fixing member provides a passage to the outside of the chamber; A first rotating member has one end rotatably connected to the first fixed member, wherein a first communicating space is defined in the first rotating member to communicate with the outside of the chamber; A second fixing member is disposed on the deposition module, wherein the second fixing member provides a passage to the interior of the deposition module; and The second rotating member has one end rotatably connected to the opposite end of the first rotating member and an opposite end rotatably connected to the second fixed member, wherein a second communicating space is defined in the second rotating member to communicate with the first communicating space and the interior of the deposition module. The camera is located inside one end of the first rotating member.

6. The deposition apparatus according to claim 5, characterized in that, The connection module further includes a rotatable connection member that rotatably connects the opposite end of the first rotatable member to one end of the second rotatable member.

7. The deposition apparatus according to claim 5, characterized in that, The camera is positioned with its lens facing the mask assembly, and an observation window is formed on the upper portion of one end of the first rotating member.

8. The deposition apparatus according to claim 1, characterized in that, The deposition module includes: a track extending in the horizontal direction; a body configured to move along the track; and a deposition nozzle disposed on the body to discharge the deposition material into the mask assembly.

9. The deposition apparatus according to claim 1, characterized in that, The deposition apparatus further includes: An analysis unit is configured to analyze the images captured by the camera to determine whether the electrostatic chuck or the mask assembly is functioning correctly.

10. An electronic device, characterized in that... include: A display device manufactured using a deposition apparatus according to any one of claims 1 to 9.

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