A ceramic target for the preparation of ceramic plates

Abstract

This utility model relates to the field of ceramic target technology, and discloses a ceramic target for preparing ceramic plates, comprising a copper plate. A thermally conductive silicone pad and multiple fan-shaped ceramic plates are sequentially arranged on the top of the copper plate. The multiple fan-shaped ceramic plates are arranged side-by-side to cover the copper plate. The thermally conductive silicone pad is disposed between the multiple fan-shaped ceramic plates and the copper plate. Multiple heat dissipation holes are formed on the surface of the thermally conductive silicone pad. Multiple fixing screws are disposed between the multiple fan-shaped ceramic plates and the copper plate. The fixing screws are used to fasten the fan-shaped ceramic plates to the copper plate via the thermally conductive silicone pad. In this utility model, by segmenting the target material and introducing an elastic thermally conductive layer, efficient heat management is achieved: the copper plate, thermally conductive silicone pad, and heat dissipation layer can quickly dissipate heat, which ultimately enhances the structural stability and operational reliability of the product under high-temperature conditions, effectively preventing damage.

Description

Technical Field

[0001] This utility model relates to the field of ceramic target materials, and in particular to a ceramic target material for the preparation of ceramic plates. Background Technology

[0002] In the field of modern materials preparation, ceramic targets used in ceramic plate fabrication are core components of coating processes such as physical vapor deposition and chemical vapor deposition, and are widely used in high-end fields such as flat panel displays, optical coating, and semiconductor manufacturing. The performance of ceramic targets directly affects the quality and production efficiency of ceramic plates. During the coating process, they must withstand bombardment by high-energy particles, causing a sharp rise in the surface temperature of the target. Therefore, efficient heat dissipation and structural stability have become key factors restricting the improvement of ceramic target performance.

[0003] Traditional ceramic targets typically employ a monolithic design, constructed from a single ceramic material and mechanically mounted within the coating equipment. During the coating process, heat is primarily transferred to the equipment's cooling system through the target's own thermal conductivity, while external air or water cooling devices remove heat, thus maintaining the target's operating temperature. This design concept and technological principle can, to a certain extent, meet the basic requirements of coating and ensure the fundamental operation of the coating process.

[0004] However, with the increasing demands on the performance of ceramic targets in coating processes, traditional monolithic ceramic targets have revealed significant defects in practical applications. Due to prolonged bombardment by high-energy particles, monolithic targets are prone to heat accumulation, and the uneven thermal expansion coefficient of ceramic materials leads to uneven thermal expansion within the target. This stress concentration problem can cause cracks or even fractures in the target, severely affecting its service life and the quality stability of the coated products, significantly increasing maintenance costs and product defect rates during production. Therefore, a ceramic target for ceramic plate preparation is proposed to address these issues. Utility Model Content

[0005] To overcome the above shortcomings, this utility model provides a ceramic target material for the preparation of ceramic plates, which aims to improve the problems of stress concentration and easy cracking caused by heat accumulation and uneven thermal expansion of traditional integral targets.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A ceramic target material for preparing ceramic plates includes a copper plate. A thermally conductive silicone pad and a plurality of fan-shaped ceramic plates are sequentially disposed on the top of the copper plate. The plurality of fan-shaped ceramic plates are arranged side by side to cover the copper plate. The thermally conductive silicone pad is disposed between the plurality of fan-shaped ceramic plates and the copper plate. The surface of the thermally conductive silicone pad has a plurality of heat dissipation holes. A plurality of fixing screws are disposed between the plurality of fan-shaped ceramic plates and the copper plate. The fixing screws are used to fasten the fan-shaped ceramic plates to the copper plate via the thermally conductive silicone pad.

[0008] As a further description of the above technical solution:

[0009] The working surface, which is composed of multiple fan-shaped ceramic plates spliced ​​together, has an inwardly concave arc-shaped surface on its top surface.

[0010] As a further description of the above technical solution:

[0011] Each of the fan-shaped ceramic plates has multiple threaded holes at its bottom, and the fixing screws cooperate with the threaded holes to achieve a threaded connection.

[0012] As a further description of the above technical solution:

[0013] The copper plate has multiple limiting holes on its surface. Before the fixing screw is connected to the threaded hole, it passes through the limiting hole and the heat dissipation hole in sequence.

[0014] As a further description of the above technical solution:

[0015] A gap for releasing thermal stress is formed between any two adjacent sector-shaped ceramic plates.

[0016] As a further description of the above technical solution:

[0017] The thermally conductive silicone pad is an elastic material used to buffer the stress caused by the thermal expansion mismatch between the fan-shaped ceramic plate and the copper plate.

[0018] This utility model has the following beneficial effects:

[0019] 1. This invention solves the technical problem of stress concentration and cracking caused by heat accumulation and uneven thermal expansion in traditional integral targets by segmenting the target material and introducing an elastic thermally conductive layer. This design achieves efficient heat management: a three-dimensional heat dissipation network is constructed using copper plates, thermally conductive silicone pads, and heat dissipation holes, which can quickly dissipate heat. Simultaneously, the gaps between the fan-shaped ceramic plates and the elasticity of the thermally conductive silicone pads release and absorb thermal stress, ultimately enhancing the structural stability and operational reliability of the product under high-temperature conditions and effectively preventing damage.

[0020] 2. This utility model solves the problem of traditional targets requiring complete scrapping due to partial damage, resulting in material waste and high maintenance costs, through modular design. This design utilizes the precise fit of fixing screws, limiting holes, and threaded holes to achieve rapid and accurate disassembly and replacement of any individual sector-shaped ceramic plate, enhancing the maintainability and economic efficiency of the equipment. It not only reduces material loss but also improves overall production and work efficiency by shortening downtime. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of a ceramic target material for preparing ceramic plates according to the present invention.

[0022] Figure 2 This is a schematic diagram of a copper plate structure for a ceramic target material used in the preparation of ceramic plates, as proposed in this utility model.

[0023] Figure 3 This is a schematic diagram of a fixing screw structure for a ceramic target material used in the preparation of ceramic plates, as proposed in this utility model.

[0024] Legend:

[0025] 1. Fan-shaped ceramic plate; 2. Thermally conductive silicone pad; 3. Copper plate; 4. Fixing screws; 5. Heat dissipation holes; 6. Limiting holes; 7. Threaded holes. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Reference Figures 1-3This utility model provides an embodiment of a ceramic target material for ceramic plate preparation, comprising a copper plate 3. A thermally conductive silicone pad 2 and multiple fan-shaped ceramic plates 1 are sequentially arranged on the top of the copper plate 3. The multiple fan-shaped ceramic plates 1 are arranged side-by-side to cover the copper plate 3. The thermally conductive silicone pad 2 is positioned between the multiple fan-shaped ceramic plates 1 and the copper plate 3 to tightly fill the microscopic gaps between them, achieving the effect of forming a low thermal resistance and high-efficiency heat conduction channel. Multiple heat dissipation holes 5 are formed on the surface of the thermally conductive silicone pad 2. These holes 5 provide a direct channel for the collected heat to be released to the external environment, achieving the purpose of efficiently dissipating heat by enhancing air convection and thermal radiation. Multiple fixing screws 4 are arranged between the multiple fan-shaped ceramic plates 1 and the copper plate 3. The fixing screws 4 are used to independently fasten the fan-shaped ceramic plates 1 to the copper plate 3 via the thermally conductive silicone pad 2, achieving the effect of convenient individual replacement of specific damaged modules and reducing maintenance costs. The working surface formed by the splicing of multiple fan-shaped ceramic plates 1 has an inwardly concave arc-shaped top surface. This arc-shaped surface structure is used for... Optimization of energy or material convergence and distribution improves process uniformity. Multiple threaded holes 7 are provided at the bottom of each sector ceramic plate 1. Fixing screws 4 engage with these threaded holes 7 to achieve threaded connection. These threaded holes 7 provide a stable anchor point for the fixing screws 4 to ensure reliable fastening. Multiple limiting holes 6 are provided on the surface of the copper plate 3. These limiting holes 6 guide and limit the position of the sector ceramic plate 1 during installation or replacement, ensuring installation accuracy. Before connecting to the threaded holes 7, the fixing screws 4 pass through the limiting holes 6 and the heat dissipation holes 5 in sequence. A gap is formed between any two adjacent sector ceramic plates 1 to release thermal stress. This gap acts as a buffer zone for thermal expansion, fundamentally preventing target material cracking due to internal stress concentration. The thermally conductive silicone pad 2 is an elastic material used to buffer the stress generated between the sector ceramic plate 1 and the copper plate 3 due to thermal expansion mismatch, absorbing and mitigating destructive shear stress to protect the upper brittle ceramic layer and improve the overall structural stability of the product.

[0028] Working principle: The product is structurally a composite disc. Its core working surface is composed of multiple independent fan-shaped ceramic plates 1 tightly spliced ​​together to form a complete disc shape. The top surface of the disc is an inwardly concave arc surface. This shape helps to optimize the convergence and distribution of energy or matter during the manufacturing process. During operation, the arc-shaped working surface directly bears the bombardment of high-energy particles, thereby generating huge heat. This heat then passes through the fan-shaped ceramic plate 1 and is transferred to the surface of the copper plate 3 below via the tightly fitted, highly thermally conductive and elastic thermally conductive silicone pad 2. The copper plate 3 not only conducts the heat downwards but also rapidly diffuses it laterally to the entire outer wall. At this time, the heat dissipation holes 5 set on the surface of the thermally conductive silicone pad 2 provide a direct channel for the heat collected on the side wall to be released to the external environment. By enhancing air convection and thermal radiation, the heat is efficiently discharged, thus forming a three-dimensional heat dissipation network together with the downward heat conduction. In this process, the thermally conductive silicone pad 2 is not only a bridge for heat conduction, but its own elastic deformation ability can also effectively absorb the destructive thermal stress caused by the difference in thermal expansion coefficients between the fan-shaped ceramic plate 1 and the fixing screw 4, protecting the brittle upper fan-shaped ceramic plate 1. The overall target surface is divided into multiple independent fan-shaped units, and the gaps naturally formed between the plates reserve buffer space for thermal expansion, avoiding cracking caused by internal stress concentration in traditional integral target materials. This ensures that even if a crack appears in a fan-shaped ceramic plate 1, it will not spread to other parts, greatly improving the reliability of product operation. When it is necessary to replace worn parts, maintenance personnel can easily disassemble and replace specific sector ceramic plates 1 independently by using the fixing screws 4 and threaded holes 7, without discarding the entire target material product. This not only significantly reduces material consumption and maintenance costs, but also greatly shortens equipment downtime, achieving a dual optimization of economic benefits and work efficiency.

[0029] Finally, it should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A ceramic target for the production of ceramic slabs comprising a copper plate (3), characterized in that: The top of the copper plate (3) is provided with a thermally conductive silicone pad (2) and a plurality of fan-shaped ceramic plates (1) in sequence. The plurality of fan-shaped ceramic plates (1) are arranged side by side to cover the copper plate (3). The thermally conductive silicone pad (2) is disposed between the plurality of fan-shaped ceramic plates (1) and the copper plate (3). The surface of the thermally conductive silicone pad (2) is provided with a plurality of heat dissipation holes (5). A plurality of fixing screws (4) are provided between the plurality of fan-shaped ceramic plates (1) and the copper plate (3). The fixing screws (4) are used to fasten the fan-shaped ceramic plates (1) to the copper plate (3) via the thermally conductive silicone pad (2).

2. A ceramic target material for the production of ceramic plates according to claim 1, characterized in that: The working surface is composed of multiple fan-shaped ceramic plates (1) spliced ​​together, and its top surface is an inwardly concave arc surface.

3. The ceramic target for the preparation of ceramic plates according to claim 1, characterized in that: Each of the fan-shaped ceramic plates (1) has multiple threaded holes (7) at its bottom, and the fixing screw (4) cooperates with the threaded holes (7) to achieve a threaded connection.

4. A ceramic target material for the production of ceramic plates according to claim 3, characterized in that: The copper plate (3) has multiple limiting holes (6) on its surface. Before the fixing screw (4) is connected to the threaded hole (7), it passes through the limiting hole (6) and the heat dissipation hole (5) in sequence.

5. The ceramic target material for the preparation of ceramic plates according to claim 1, characterized in that: A gap for releasing thermal stress is formed between any two adjacent sector-shaped ceramic plates (1).

6. The ceramic target for the preparation of ceramic plates according to claim 1, characterized in that: The thermally conductive silicone pad (2) is an elastic material used to buffer the stress caused by the thermal expansion mismatch between the fan-shaped ceramic plate (1) and the copper plate (3).

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