Lower electrode and chemical vapor deposition equipment

Abstract

This utility model discloses a lower electrode for a chemical vapor deposition (CVD) apparatus and the CVD apparatus itself. The lower electrode includes an insulating support stage and an electrode plate. The insulating support stage has a support surface for supporting a substrate. A gas supply channel is provided inside the insulating support stage. The electrode plate is disposed inside the insulating support stage and is parallel to the support surface. The gas supply hole has a first end and a second end. The first end penetrates the support surface, and the second end connects to the gas supply channel. The gas supply hole penetrates the electrode plate to form electrode pores on the electrode plate. The electrode plate is located between the first end and the second end. There are multiple gas supply holes, which are spaced apart. This lower electrode makes it easier for the substrate to separate from the support surface, and the substrate is not easily damaged during the separation process.

Description

Technical Field

[0001] This utility model relates to the field of display panel manufacturing technology, and in particular to a lower electrode of a chemical vapor deposition (CVD) apparatus and a CVD apparatus. Background Technology

[0002] In the manufacturing process of display panels, chemical vapor deposition equipment is required to perform chemical vapor deposition on the substrate, such as... Figure 1 As shown, specifically, a chemical vapor deposition apparatus typically includes a lower electrode 100', which includes an insulating support stage 1' and an electrode plate 2' disposed within the insulating support stage 1'.

[0003] During chemical vapor deposition, the substrate is usually placed on the bearing surface 10' of the insulating bearing stage 1'. The flatness of the bearing surface 10' is usually high to ensure a good fit between the substrate and the bearing surface 10', thereby effectively preventing the chemical vapor deposition material from seeping into the contact surface between the substrate and the bearing surface 10'.

[0004] However, this results in an excessively tight bond between the substrate and the bearing surface 10', creating a near-vacuum environment at the bonding point, which makes it difficult to remove the substrate from the bearing surface 10'.

[0005] In related technologies, a retractable support rod 6' is usually provided on the insulating support stage 1' so that during the chemical vapor deposition process, the support end 62' of the support rod 6' retracts into the insulating support stage 1'. When it is necessary to remove the substrate, the support end 62' of the support rod 6' extends out of the insulating support stage 1' and protrudes from the support surface 10', thereby lifting the substrate and reducing the difficulty of separating the substrate from the support surface 10'.

[0006] However, the connection area between the support end 62' of the support rod 6' and the substrate is small, and the external force required to remove the substrate is large. Therefore, in the actual process of using the support end 62' of the support rod 6' to lift the substrate, the local pressure at the connection between the support end 62' and the substrate is prone to be too large, which may cause the substrate to break. Utility Model Content

[0007] The first objective of this invention is to provide a lower electrode for a chemical vapor deposition apparatus that makes it easier for the substrate to separate from the support surface, and the substrate is less likely to break during the separation process.

[0008] The second objective of this invention is to provide a chemical vapor deposition apparatus that, by using the aforementioned lower electrode, reduces the likelihood of substrate breakage when placed or removed from the support surface, thereby effectively improving the manufacturing yield of display panels.

[0009] To achieve this objective, the present invention adopts the following technical solution:

[0010] In a first aspect, a lower electrode of a chemical vapor deposition apparatus is provided, comprising:

[0011] An insulating support platform has a support surface for supporting a substrate, and an air supply channel is provided inside the insulating support platform.

[0012] An electrode plate is disposed within the insulating support platform and is parallel to the support surface;

[0013] An air supply hole has a first end and a second end. The first end penetrates the bearing surface, and the second end is connected to the air supply channel. The air supply hole penetrates the electrode plate to form an electrode air hole on the electrode plate. The electrode plate is located between the first end and the second end. There are multiple air supply holes, which are spaced apart.

[0014] As a preferred embodiment of the lower electrode in a chemical vapor deposition apparatus, the gas supply port has a first expanding section, the inner diameter of which gradually increases from a position away from the bearing surface to a position closer to the bearing surface, and the first expanding section penetrates the bearing surface; and / or,

[0015] The air supply hole has a second gradually expanding section, the inner diameter of which gradually increases from a position close to the bearing surface to a position away from the bearing surface, and the second gradually expanding section is connected to the air supply channel.

[0016] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, the gas supply port has a first gradually expanding section, a straight section, and a second gradually expanding section connected in sequence. The inner diameter of the first gradually expanding section gradually increases from a position away from the bearing surface to a position closer to the bearing surface, and the first gradually expanding section penetrates the bearing surface. The inner diameter of the second gradually expanding section gradually increases from a position closer to the bearing surface to a position away from the bearing surface, and the second gradually expanding section is connected to the gas supply channel.

[0017] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, the lower electrode further includes a conductive cover and a first driving member. The conductive cover is disposed within at least a portion of the gas supply hole. The first driving member is disposed on the insulating support platform and is tractively connected to the conductive cover. The first driving member can drive the conductive cover to switch between a first posture and a second posture. When the conductive cover is in the first posture, the conductive cover blocks the electrode gas hole and is electrically connected to the electrode plate. When the conductive cover is in the second posture, the conductive cover is at least partially away from the electrode plate and the interior of the gas supply hole is not blocked.

[0018] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, the gas supply hole includes a gradually expanding section, the inner diameter of which gradually increases along the direction from one end of the gas supply hole to the other end, and the gradually expanding section includes the electrode vent.

[0019] The first driving member can drive the conductive cover to move along the extension direction of the air supply hole. When the conductive cover is in the second posture, the conductive cover is located in the gradually expanding section at a position where the inner diameter is larger than the inner diameter of the electrode air hole.

[0020] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, the first driving member can drive the conductive cover to rotate relative to the insulating support platform. When the conductive cover is in the first posture, the conductive cover is parallel to the support surface. When the conductive cover is in the second posture, the conductive cover is tilted relative to the support surface.

[0021] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, the gas supply port includes a straight section, and the straight section includes the electrode gas port, and the first driving member is capable of driving the conductive cover to rotate around a first axis.

[0022] Wherein, the first axis is perpendicular to the second axis and intersects the second axis, and the second axis is the central axis of the straight hole section.

[0023] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, the gas supply hole includes a gradually expanding section, the inner diameter of which gradually increases along the direction from one end of the gas supply hole to the other end, and the gradually expanding section includes the electrode vent.

[0024] The first driving member can drive the conductive cover to rotate about a pivot near one edge of the conductive cover. When the conductive cover is in the second posture, the conductive cover is at least partially located in the expanding section at a position where the inner diameter is larger than the inner diameter of the electrode vent.

[0025] As a preferred embodiment of the lower electrode of a chemical vapor deposition apparatus, it further includes a receiving hole extending in a direction perpendicular to the bearing surface, the receiving hole being spaced apart from the gas supply hole, the receiving hole having a third end and a fourth end opposite to each other, the third end penetrating the bearing surface, the fourth end being located inside the lower electrode, the receiving hole penetrating the electrode plate to form an electrode through hole on the electrode plate, and the electrode plate being located between the third end and the fourth end;

[0026] The lower electrode also includes a support rod and a second driving member. The support rod is movably inserted through the receiving hole. The second driving member is located at the fourth end and connected between the insulating support platform and the support rod. The second driving rod is used to drive the support end of the support rod to switch between a first position and a second position. When the support end is in the first position, the support end extends from the third end to protrude from the bearing surface. When the support end is in the second position, the support end is located inside the receiving hole.

[0027] In a second aspect, a chemical vapor deposition apparatus is provided, including an apparatus housing and a lower electrode as described in the first aspect above, wherein the apparatus housing has a reaction chamber and the lower electrode is disposed within the reaction chamber and located at the bottom of the reaction chamber.

[0028] The advantages of this utility model compared to the prior art are:

[0029] The lower electrode of the chemical vapor deposition apparatus of this invention features gas supply holes and channels on an insulating support platform and electrode vents on the electrode plate. The first end of each gas supply hole penetrates the support surface, and the second end connects to the gas supply channel. When the substrate needs to be removed from the support surface, gas can be supplied to each gas supply hole through the gas supply channel, increasing the gas pressure at the openings of the gas supply holes penetrating the support surface. This applies pressure to the substrate at the openings of the gas supply holes and forces some gas between the substrate and the support surface, disrupting the near-vacuum environment formed by their tight adhesion. Simultaneously, gas release prevents excessive local stress on the substrate at the openings of the gas supply holes, thus reducing the tightness of the substrate's adhesion to the support surface. This makes the substrate easier to separate from the support surface and less prone to breakage due to excessive local stress during separation. Attached Figure Description

[0030] Figure 1 A schematic diagram of the lower electrode structure of a chemical vapor deposition apparatus provided by the prior art.

[0031] Figure 2 This is a schematic diagram of the structure of the lower electrode in an embodiment of the present invention.

[0032] Figure 3 for Figure 2 Enlarged schematic diagram of point M in the middle.

[0033] Figure 4 This is a partial structural schematic diagram of the lower electrode of this utility model (the air supply hole includes a first gradually expanding section, a straight hole section and a second gradually expanding section, the conductive cover is in a first posture, and the support rod and the second driving member are not shown).

[0034] Figure 5 for Figure 4 The diagram shows a partial structural schematic of the lower electrode (with the conductive cover in the second posture and the support rod and the second drive element shown).

[0035] Figure 6 This is a partial structural diagram of a lower electrode (with the conductive cover in the first position) according to this utility model.

[0036] Figure 7 for Figure 6 The diagram shows a partial structural schematic of the lower electrode (with the conductive cover in the second position).

[0037] Figure 8 This is a partial structural diagram of another lower electrode (conductive cover in the first posture) of this utility model.

[0038] Figure 9 for Figure 8 The diagram shows a partial structural schematic of the lower electrode (with the conductive cover in the second position).

[0039] Figure 10 This is a schematic diagram of the structure of a chemical vapor deposition apparatus according to an embodiment of the present invention.

[0040] Figure 1 middle:

[0041] 100', lower electrode;

[0042] 1' Insulating support platform; 10' Bearing surface;

[0043] 2', Electrode plate;

[0044] 6', support rod; 62', support end.

[0045] Figures 2 to 10 middle:

[0046] 100. Lower electrode;

[0047] 1. Insulated support platform; 10. Support surface; 11. Air supply channel;

[0048] 2. Electrode plate; 21. Electrode vent; 22. Electrode through hole;

[0049] 3. Air supply port; 3a. First end; 3b. Second end; 31. First gradually expanding section; 32. Second gradually expanding section; 33. Straight hole section; 34. Second axis;

[0050] 4. Conductive cover; 41. First axis; 42. First driving component; 43. Transmission mechanism;

[0051] 5. Receiving hole; 5a. Third end; 5b. Fourth end;

[0052] 6. Support rod; 61. Second driving component; 62. Support end;

[0053] 200, Equipment housing; 200a, Reaction chamber. Detailed Implementation

[0054] The advantages and features of this invention, as well as methods of implementing them, will become apparent from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, this invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided merely to complete the disclosure of this invention and to enable those skilled in the art to fully understand its scope, which is defined only by the scope of the claims. The same reference numerals denote the same constituent elements throughout the specification.

[0055] The present invention will now be described in detail with reference to the accompanying drawings.

[0056] like Figure 2 and Figure 3 As shown, a lower electrode 100 of a chemical vapor deposition apparatus is provided, including an insulating support stage 1 and an electrode plate 2. The insulating support stage 1 has a support surface 10 for supporting a substrate. A gas supply channel 11 is provided inside the insulating support stage 1. The electrode plate 2 is disposed inside the insulating support stage 1 and is parallel to the support surface 10. The lower electrode 100 is also provided with a gas supply hole 3. The gas supply hole 3 has a first end 3a and a second end 3b. The first end 3a penetrates the support surface 10, and the second end 3b is connected to the gas supply channel 11. The gas supply hole 3 penetrates the electrode plate 2 so that electrode vents 21 are formed on the electrode plate 2. The electrode plate 2 is located between the first end 3a and the second end 3b. There are multiple gas supply holes 3, which are spaced apart.

[0057] By providing air supply holes 3 and air supply channels 11 on the insulating support platform 1, and providing electrode air holes 21 on the electrode plate 2, the first end 3a of the air supply hole 3 penetrates the support surface 10, and the second end 3b of the air supply hole 3 connects to the air supply channel 11. Thus, when the substrate needs to be removed from the support surface 10, air can be supplied to each air supply hole 3 through the air supply channel 11, increasing the air pressure at the opening of the air supply hole 3 through the support surface 10. This allows a certain pressure to be applied to the position of the substrate facing the opening of the air supply hole 3. On the other hand, pressure can squeeze some gas between the substrate and the bearing surface 10 to break the near-vacuum environment formed by the tight adhesion between the substrate and the bearing surface 10. At the same time, it can release gas between the substrate and the bearing surface 10 to avoid excessive local stress on the substrate at the opening of the air supply hole 3. This can reduce the tightness of the adhesion between the substrate and the bearing surface 10, making it easier for the substrate to separate from the bearing surface 10. Furthermore, the substrate is less likely to break due to excessive local stress during the separation process from the bearing surface 10.

[0058] Among them, the electrode plate 2 can be electrically connected to an external power supply circuit through a conductive wire (not shown in the figure), and the multiple air supply holes 3 can be arranged at intervals along one direction, or can be arranged in an array at intervals.

[0059] Specifically, air can be supplied to the air supply channel 11 by a blower (not shown in the figure). The blower can be part of the chemical vapor deposition equipment, or it can be an external blower to the chemical vapor deposition equipment. In addition, the blower can be directly connected to the air supply channel 11, and the blower can be entirely located outside the air supply channel 11 or partially located inside the air supply channel 11. Alternatively, the blower can be connected to the air supply channel 11 through an air supply pipe.

[0060] In addition, an exhaust device can be used to extract air from the air supply channel 11 to create a near-vacuum environment at the air supply hole 3, which helps to make the substrate and the bearing surface 10 fit more tightly.

[0061] Please combine Figure 4 As shown, optionally, the air supply hole 3 may have a first gradually expanding section 31. The inner diameter of the first gradually expanding section 31 gradually increases from a position away from the bearing surface 10 to a position closer to the bearing surface 10, and the first gradually expanding section 31 penetrates the bearing surface 10. This allows the gas in the air supply hole 3 to gradually decelerate as it flows toward the bearing surface 10 by gradually increasing the flow path provided by the air supply hole 3. This can prevent the gas from rapidly impacting the part of the substrate directly opposite the air supply hole 3 when the gas supply is first started, thereby preventing excessive local stress on the substrate.

[0062] Optionally, the air supply hole 3 has a second gradually expanding section 32. The inner diameter of the second gradually expanding section 32 gradually increases from the position near the bearing surface 10 to the position away from the bearing surface 10. The second gradually expanding section 32 is connected to the air supply channel 11, which enables the air supply hole 3 to obtain more air supply from the air supply channel 11. This alleviates the problem of insufficient air supply to the air supply hole 3 caused by the rapid flow of gas in the air supply channel 11 making it difficult to turn and flow into the air supply hole 3.

[0063] Optionally, the air supply hole 3 may simultaneously have the aforementioned first gradually expanding section 31 and second gradually expanding section 32, thereby better avoiding excessive local stress on the substrate and enabling the air supply hole 3 to obtain more sufficient air supply.

[0064] Optionally, the air supply port 3 has a first gradually expanding section 31, a straight section 33, and a second gradually expanding section 32 connected in sequence. The inner diameter of the first gradually expanding section 31 gradually increases from a position away from the bearing surface 10 to a position closer to the bearing surface 10, and the first gradually expanding section 31 penetrates the bearing surface 10. The inner diameter of the second gradually expanding section 32 gradually increases from a position closer to the bearing surface 10 to a position away from the bearing surface 10, and the second gradually expanding section 32 is connected to the air supply channel 11. Thus, the straight section 33 of the air supply port 3 has the minimum aperture of the air supply port 3. Therefore, by controlling the aperture of the air supply port 3, the minimum aperture of the air supply port 3 can be controlled, and the controllability of the minimum aperture of the air supply port 3 is good, so as to facilitate the control of the minimum air supply flow diameter of each air supply port 3. Specifically, the straight section 33 has a structure in which the aperture remains unchanged at each position along its own extension direction.

[0065] In other embodiments, the air supply hole 3 may also be a straight hole; in other words, the entire air supply hole 3 may be the aforementioned straight hole section 33.

[0066] It is understandable that the air supply hole 3 passes through the electrode plate 2 to form an electrode air hole 21. However, this setting will cause the electrode plate 2 to be unable to conduct electricity at the electrode air hole 21, thereby affecting the uniformity of the electric field formed by the electrode plate 2 in the chemical vapor deposition apparatus, resulting in a decrease in the uniformity of the film layer formed on the substrate surface by chemical vapor deposition.

[0067] Please combine Figure 4 and Figure 5 As shown, based on this, the lower electrode 100 may optionally include a conductive cover 4 and a first driving member 42. At least a portion of the air supply holes 3 are provided with conductive cover 4. The first driving member 42 is disposed on the insulating support platform 1 and is tractively connected to the conductive cover 4. The first driving member 42 can drive the conductive cover 4 to switch between a first posture and a second posture.

[0068] When the conductive cover 4 is in the first position, the conductive cover 4 blocks the electrode vent 21 and is electrically connected to the electrode plate 2. Thus, when the lower electrode 100 is in the energized working state, that is, when the electrode plate 2 is energized, the conductive cover 4 can also be energized along with the electrode plate 2, so that the conductive cover 4 and the electrode plate 2 together act as electrodes to form a more uniform electric field in the chemical vapor deposition equipment, so that the film layer formed on the substrate surface by chemical vapor deposition is more uniform.

[0069] When the conductive cover 4 is in the second position, the conductive cover 4 is at least partially away from the electrode plate 2 and the interior of the gas supply hole 3 is not blocked. So when the substrate needs to be removed from the support surface 10 after the chemical vapor deposition is completed, the conductive cover 4 will not block the gas supply hole 3, so that the gas supplied by the gas supply channel 11 can flow through the gas supply hole 3 to the space between the support surface 10 and the substrate.

[0070] Understandably, when the conductive cover 4 is in the second position, the conductive cover 4 is still located entirely in the air supply hole 3 to avoid interference between the conductive cover 4 and the substrate.

[0071] To ensure good electrical conductivity and a large effective connection area between the conductive cover 4 and the electrode plate 2 when the conductive cover 4 is in the first posture, the outer peripheral surface shape of the conductive cover 4 can be adapted to the shape of the hole wall of the electrode vent 21. This allows the outer peripheral surface of the conductive cover 4 to tightly abut against the hole wall of the electrode vent 21 when the conductive cover 4 is in the first posture, resulting in a large effective connection area between the outer peripheral surface of the conductive cover 4 and the hole wall of the electrode vent 21. For example, when the electrode vent 21 is a circular straight hole, the outer peripheral surface of the conductive cover 4 is also a cylindrical surface of the same diameter. When the electrode vent 21 is a circular gradually expanding hole, the outer peripheral surface of the conductive cover 4 is also a gradually expanding surface with a circular cross-section and the same diameter variation. When the electrode vent 21 is a polygonal straight hole, the outer peripheral surface of the conductive cover 4 is also a cylindrical surface of the same shape. When the electrode vent 21 is a polygonal gradually expanding hole, the outer peripheral surface of the conductive cover 4 is also a gradually expanding surface with a polygonal cross-section and the same size variation.

[0072] The conductive cover 4 and the first driving member 42 can be configured in various ways. As long as the conductive cover 4 is in the first position, it blocks the electrode air hole 21 and is electrically connected to the electrode plate 2, and the conductive cover 4 is at least partially away from the electrode plate 2 and the interior of the air supply hole 3 is not blocked when it is in the second position, several specific configurations of the conductive cover 4 and the first driving member 42 will be described in detail with reference to the accompanying drawings.

[0073] In one optional embodiment, the air supply port 3 includes a gradually expanding section. The inner diameter of the expanding section gradually increases along the direction from one end of the air supply port 3 to the other end, and the expanding section includes an electrode air hole 21. The first driving member 42 can drive the conductive cover 4 to move along the extending direction of the air supply port 3. When the conductive cover 4 is in a second posture, it is located within the expanding section, with an inner diameter larger than the inner diameter of the electrode air hole 21. This creates a gap between the outer periphery of the conductive cover 4 and the inner wall of the expanding section, allowing gas to flow through this gap. The first driving member 42 may include, but is not limited to, a linear motor, a lead screw motor, or a linear cylinder, such as... Figure 4 and Figure 5 As shown, Figure 4 The diagram shows a partial structure of the lower electrode 100 when the first driving member 42 drives the conductive cover 4 to move along the extension direction of the air supply hole 3 to a first posture. Figure 5 The diagram shows a partial structure of the lower electrode 100 when the first driving member 42 drives the conductive cover 4 to move along the extension direction of the air supply hole 3 to the second posture.

[0074] Understandably, when the air supply port 3 only includes the aforementioned first gradually expanding section 31, the gradually expanding section is the first gradually expanding section 31; when the air supply port 3 only includes the aforementioned second gradually expanding section 32, the gradually expanding section is the second gradually expanding section 32; when the air supply port 3 includes both the aforementioned first gradually expanding section 31 and the second gradually expanding section 32, the gradually expanding section is either the first gradually expanding section 31 or the second gradually expanding section 32. In this case, the electrode air port 21 can be located within either the first gradually expanding section 31 or the second gradually expanding section 32.

[0075] In other embodiments, the electrode vent 21 may also be located within the straight hole section 33 included in the air supply hole 3.

[0076] When the expanding section is the first expanding section 31, the inner diameter of the air supply hole 3 between the first end 3a and the electrode air hole 21 is larger than the inner diameter of the electrode air hole 21. Thus, in the second posture, the conductive cover 4 is located between the first end 3a and the electrode air hole 21, and a gap is formed between the outer periphery of the conductive cover 4 and the inner wall of the air supply hole 3. The driving member is used to drive the conductive cover 4 to move between the first end 3a and the electrode air hole 21 along the extension direction of the air supply hole 3.

[0077] When the expanding section is the second expanding section 32 (not shown), the inner diameter of the portion of the air supply hole 3 between the second end 3b and the electrode air hole 21 is larger than the inner diameter of the electrode air hole 21. Thus, in the second posture, the conductive cover 4 is located between the second end 3b and the electrode air hole 21, and a gap is formed between the outer periphery of the conductive cover 4 and the inner wall of the air supply hole 3. The driving member is used to drive the conductive cover 4 to move between the second end 3b and the electrode air hole 21 along the extension direction of the air supply hole 3.

[0078] Please see also Figures 6 to 9 In another optional embodiment, the first driving member 42 can drive the conductive cover 4 to rotate relative to the insulating support platform 1. When the conductive cover 4 is in a first posture, the conductive cover 4 is parallel to the support surface 10, so that the outer periphery of the conductive cover 4 can abut against the hole wall of the electrode vent 21 to block the electrode vent 21. When the conductive cover 4 is in a second posture, the conductive cover 4 is tilted relative to the support surface 10, so that at least a part of the outer periphery of the conductive cover 4 is detached from the hole wall of the electrode vent 21, and a gap is formed between it and the inner wall of the air supply hole 3 outside the electrode vent 21 to allow gas to flow. The first driving member 42 may include, but is not limited to, a rotary motor, a swing motor, or a rotary cylinder.

[0079] When, as described in the aforementioned technical solution, the air supply hole 3 includes a straight hole section 33, that is, the entire air supply hole 3 is a straight hole section 33, or a portion of the air supply hole 3 is formed as a straight hole section 33, in an optional example, the straight hole section 33 includes an electrode air hole 21. The first driving member 42 can drive the conductive cover 4 to rotate around the first axis 41, so as to realize the conversion of the conductive cover 4 between the first posture and the second posture, and at the same time, it can avoid interference between the conductive cover 4 and the inner wall of the air supply hole 3 during the conversion between the first posture and the second posture. The first axis 41 is perpendicular to the second axis 34 and intersects with the second axis 34. The second axis 34 is the central axis of the straight hole section 33. Figure 6 and 7 As shown, Figure 6 The diagram shows a partial structure of the lower electrode 100 when the first driving member 42 drives the conductive cover 4 to rotate around the first axis 41 to a first posture. Figure 7 The diagram shows a partial structure of the lower electrode 100 when the first driving member 42 drives the conductive cover 4 to rotate around the first axis 41 to a second posture.

[0080] Optionally, the first driving member 42 can be directly connected to the conductive cover 4, or the first driving member 42 can be connected by a transmission mechanism 43 including but not limited to pulleys, gears, etc., so that the setting position of the first driving member 42 is more flexible. For example, the first driving member 42 can be set off from the electrode plate 2.

[0081] In another alternative example, the air supply port 3 includes a gradually expanding section. The inner diameter of the expanding section gradually increases from one end of the air supply port 3 to the other. The expanding section includes an electrode air hole 21. The first driving member 42 can drive the conductive cover 4 to rotate about a pivot near one edge of the conductive cover 4. When the conductive cover 4 is in the second posture, it is at least partially located within the expanding section, at a position where its inner diameter is larger than the inner diameter of the electrode air hole 21. This allows the conductive cover 4 to switch between the first and second postures, while preventing interference between the conductive cover 4 and the inner wall of the air supply port 3 during the switching process. Figure 8 and Figure 9 As shown, Figure 8 The diagram shows a partial structure of the lower electrode 100 when the first driving member 42 drives the conductive cover 4 to rotate about a pivot near one edge of the conductive cover 4 to a first posture. Figure 9 The diagram shows a partial structure of the lower electrode 100 when the first driving member 42 drives the conductive cover 4 to rotate about a pivot near one edge of the conductive cover 4 to a second posture.

[0082] When placing the substrate onto the support surface 10, the structure of some chemical vapor deposition apparatuses makes operation in a space at a certain height relative to the support surface 10 simpler. In other words, compared to placing the substrate directly onto the support surface 10, placing the substrate at a certain height relative to the support surface 10 is less difficult. Therefore, please refer to [further details needed]. Figures 3 to 5 Optionally, the lower electrode 100 further includes a receiving hole 5 extending in a direction perpendicular to the bearing surface 10. The receiving hole 5 is spaced apart from the air supply hole 3. The receiving hole 5 has a third end 5a and a fourth end 5b opposite to each other. The third end 5a penetrates the bearing surface 10, and the fourth end 5b is located inside the lower electrode 100. The receiving hole 5 penetrates the electrode plate 2, so that an electrode through hole 22 is formed on the electrode plate 2, and the electrode plate 2 is located between the third end 5a and the fourth end 5b. The lower electrode 100 also includes a support rod 6 and a second driving member 61. The support rod 6 is movably inserted through the receiving hole. 5. A second driving member 61 is located at the fourth end 5b and connected between the insulating support platform 1 and the support rod 6. The second driving member 61 is used to drive the support end 62 of the support rod 6 to switch between a first position and a second position. When the support end 62 is in the first position, the support end 62 extends from the third end 5a and protrudes from the support surface 10. When the support end 62 is in the second position, the support end 62 is located inside the receiving hole 5. Thus, when it is necessary to pick up or put down the substrate, the support rod 6 can be used to assist in supporting the substrate, so as to support the substrate to the required height relative to the support surface 10. Figure 3 and Figure 5 As shown, Figure 3 The diagram shows a partial structure of the lower electrode 100 when the support end 62 is in the first position. Figure 5 The diagram shows a partial structure of the lower electrode 100 when the support end 62 is in the second position.

[0083] The receiving hole 5 may or may not be connected to the air supply channel 11. Since the gap between the support rod 6 and the receiving hole 5 can be small, even if the receiving hole 5 is connected to the air supply channel 11, the air flow that can enter the receiving hole 5 when the air supply channel 11 is supplied is small. Therefore, the air supply received in the air supply hole 3 is less affected by the air distribution in the receiving hole 5, and the process of the support rod 6 moving relative to the receiving hole 5 is also less affected by the air flow in the receiving hole 5.

[0084] like Figure 10 As shown, a chemical vapor deposition apparatus is also provided, including an apparatus housing 200 and a lower electrode 100 as described in the foregoing technical solution. The apparatus housing 200 has a reaction chamber 200a, and the lower electrode 100 is disposed in the reaction chamber 200a and located at the bottom of the reaction chamber 200a. By using the aforementioned lower electrode 100, the possibility of substrate breakage when it is picked up and placed on the support surface 10 can be reduced, thereby effectively improving the manufacturing yield of the display panel.

[0085] Although embodiments of the present invention have been described above with reference to the accompanying drawings, the present invention is not limited to the above embodiments, but can be made in various forms, and those skilled in the art will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential characteristics of the present invention. Therefore, it should be understood that the above embodiments are exemplary in all respects and not restrictive.

Claims

1. A lower electrode of a chemical vapor deposition apparatus, characterized by, include: An insulating support platform has a support surface for supporting a substrate, and an air supply channel is provided inside the insulating support platform. An electrode plate is disposed within the insulating support platform and is parallel to the support surface; An air supply hole has a first end and a second end. The first end penetrates the bearing surface, and the second end is connected to the air supply channel. The air supply hole penetrates the electrode plate to form an electrode air hole on the electrode plate. The electrode plate is located between the first end and the second end. There are multiple air supply holes, which are spaced apart.

2. The lower electrode of a chemical vapor deposition apparatus according to claim 1, wherein The air supply port has a first expanding section, the inner diameter of which gradually increases from a position away from the bearing surface to a position closer to the bearing surface, and the first expanding section penetrates the bearing surface; and / or, The air supply hole has a second gradually expanding section, the inner diameter of which gradually increases from a position close to the bearing surface to a position away from the bearing surface, and the second gradually expanding section is connected to the air supply channel.

3. The lower electrode of a chemical vapor deposition apparatus according to claim 1, wherein The air supply hole has a first gradually expanding section, a straight section and a second gradually expanding section connected in sequence. The inner diameter of the first gradually expanding section gradually increases from a position away from the bearing surface to a position closer to the bearing surface, and the first gradually expanding section penetrates the bearing surface. The inner diameter of the second gradually expanding section gradually increases from a position closer to the bearing surface to a position away from the bearing surface, and the second gradually expanding section is connected to the air supply channel.

4. The lower electrode of a chemical vapor deposition apparatus according to claim 1, wherein The lower electrode further includes a conductive cover and a first driving member. The conductive cover is provided in at least a portion of the air supply hole. The first driving member is disposed on the insulating support platform and is tractively connected to the conductive cover. The first driving member can drive the conductive cover to switch between a first posture and a second posture. When the conductive cover is in the first posture, the conductive cover blocks the electrode air hole and is electrically connected to the electrode plate. When the conductive cover is in the second posture, the conductive cover is at least partially away from the electrode plate and the interior of the air supply hole is not blocked.

5. The lower electrode of a chemical vapor deposition apparatus according to claim 4, wherein The air supply hole includes a gradually expanding section. The inner diameter of the gradually expanding section gradually increases along the direction from one end of the air supply hole to the other end, and the gradually expanding section includes the electrode air hole. The first driving member can drive the conductive cover to move along the extension direction of the air supply hole. When the conductive cover is in the second posture, the conductive cover is located in the position where the inner diameter of the conductive cover in the gradually expanding section is larger than the inner diameter of the electrode air hole.

6. The lower electrode of a chemical vapor deposition apparatus according to claim 4, wherein The first driving member can drive the conductive cover to rotate relative to the insulating support platform. When the conductive cover is in the first posture, the conductive cover is parallel to the support surface. When the conductive cover is in the second posture, the conductive cover is tilted relative to the support surface.

7. The lower electrode of the chemical vapor deposition apparatus according to claim 6, characterized in that, The air supply hole includes a straight hole section, and the straight hole section includes the electrode air hole. The first driving member can drive the conductive cover to rotate around the first axis. Wherein, the first axis is perpendicular to the second axis and intersects the second axis, and the second axis is the central axis of the straight hole section.

8. The lower electrode of a chemical vapor deposition apparatus according to claim 6, wherein The air supply hole includes a gradually expanding section. The inner diameter of the gradually expanding section gradually increases along the direction from one end of the air supply hole to the other end, and the gradually expanding section includes the electrode air hole. The first driving member can drive the conductive cover to rotate about a pivot near one edge of the conductive cover. When the conductive cover is in the second posture, the conductive cover is at least partially located in the expanding section where the inner diameter is larger than the inner diameter of the electrode vent.

9. A lower electrode of a chemical vapor deposition apparatus according to any one of claims 1 to 8, characterized in that, It also includes a receiving hole extending in a direction perpendicular to the bearing surface, the receiving hole being spaced apart from the air supply hole, the receiving hole having a third end and a fourth end opposite to each other, the third end penetrating the bearing surface, the fourth end being located inside the lower electrode, the receiving hole penetrating the electrode plate to form an electrode through hole on the electrode plate, and the electrode plate being located between the third end and the fourth end; The lower electrode also includes a support rod and a second driving member. The support rod is movably inserted through the receiving hole. The second driving member is located at the fourth end and connected between the insulating support platform and the support rod. The second driving rod is used to drive the support end of the support rod to switch between a first position and a second position. When the support end is in the first position, the support end extends from the third end to protrude from the bearing surface. When the support end is in the second position, the support end is located inside the receiving hole.

10. A chemical vapor deposition apparatus characterized by comprising: The device includes a housing and a lower electrode of the chemical vapor deposition apparatus as described in any one of claims 1-9, wherein the housing has a reaction chamber and the lower electrode is disposed within the reaction chamber and located at the bottom of the reaction chamber.

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