Heat dissipation devices and outdoor air conditioning units

Abstract

This utility model discloses a heat dissipation device and an outdoor unit for an air conditioner. The heat dissipation device includes a heat dissipation plate and a heat pipe. The heat dissipation plate includes a heat dissipation surface, which includes a heat-conducting area overlapping with a heat-generating device. The heat pipe is disposed on the heat dissipation plate. The heat pipe includes a heat-absorbing section located on the heat dissipation surface. On the orthographic projection plane of the heat dissipation plate in the thickness direction, the heat-absorbing section is inclined to the side of the heat dissipation plate to increase the overlap area between the heat-absorbing section and the heat-conducting area. This heat dissipation device can effectively dissipate heat from the heat-generating device and has a good heat dissipation effect, which is beneficial to improving the overall performance of the outdoor unit of the air conditioner.

Description

Technical Field

[0001] This disclosure relates to the field of electrical technology, and in particular to a heat dissipation device and an outdoor unit of an air conditioner. Background Technology

[0002] With the development of society and economy and the improvement of people's living standards, air conditioning equipment has gradually become an indispensable household appliance. The electrical control box inside the outdoor unit of the air conditioner contains multiple electronic components. During the operation of the outdoor unit, the temperature of these electronic components will rise. When the heat generated by the components cannot be dissipated in time, the electronic components may burn out or malfunction due to excessive temperature.

[0003] In related technologies, heat sinks are usually installed on the electrical control box to dissipate heat from electronic components, but their heat dissipation effect is poor and will affect the overall performance of the outdoor unit of the air conditioner. Utility Model Content

[0004] In view of this, the present disclosure provides a heat dissipation device and an outdoor unit of an air conditioner. The heat dissipation device can effectively dissipate heat from the electronic components that generate heat, and the heat dissipation effect is good, which is beneficial to improving the overall performance of the outdoor unit of the air conditioner.

[0005] Specifically, this disclosure is achieved through the following technical solution.

[0006] According to a first aspect of the present disclosure, a heat dissipation device is provided, comprising a heat sink and a heat pipe. The heat sink includes a heat dissipation surface, and the heat dissipation surface includes a heat-conducting region overlapping with a heat-generating device. The heat pipe is disposed on the heat sink. The heat pipe includes a heat-absorbing section located on the heat dissipation surface. On the orthographic projection plane of the heat sink in the thickness direction, the heat-absorbing section is inclined to the side surface of the heat sink to increase the overlap area between the heat-absorbing section and the heat-conducting region.

[0007] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0008] When installing the heating element and the heat dissipation device, the heating chip can be mounted on the heat-conducting area of ​​the heat dissipation surface, and the heating element and the heat-conducting area are overlapped. The heat-absorbing section of the heat pipe is located on the heat dissipation surface, and the heat-absorbing section is inclined to the side of the heat dissipation plate on its thickness direction projection plane, thus increasing the overlap area between the heat-absorbing section and the heat-conducting area. When the heat dissipation device operates to dissipate heat from the heating element, the larger overlap area between the heat-absorbing section and the heat-conducting area, coupled with the overlap between the heat-conducting area and the heating chip, further increases the overlap area between the heat-absorbing section and the heating element on the heat dissipation device, thereby improving the heat dissipation effect and ensuring more effective heat dissipation, ultimately improving the overall performance of the outdoor unit of the air conditioner.

[0009] The technical solution disclosed herein will be further explained below.

[0010] In one embodiment, the heat-absorbing section includes a heat-absorbing plane that is exposed outside the heat-dissipating surface.

[0011] In one embodiment, the heat-absorbing section is embedded in the heat sink, and the heat-absorbing surface is flush with the heat-dissipating surface.

[0012] In one embodiment, the heat-absorbing section further includes a mounting portion connected to the heat-absorbing plane, and the heat sink is provided with a groove adapted to the mounting portion, and the mounting portion is installed in the groove.

[0013] In one embodiment, the heat-absorbing section includes a first section and a second section that are bent and connected, and the extension directions of the first section and the second section intersect with the side of the heat sink, respectively.

[0014] And / or, the heat-absorbing section located within the heat-conducting zone at least partially coincides with the diagonal of the heat-conducting zone.

[0015] In one embodiment, the heat sink is also provided with a clearance notch, and part of the heat pipe is located within the clearance notch.

[0016] And / or, the heat pipes include multiple heat pipes, which are staggered and placed on the heat sink.

[0017] In one embodiment, the heat sink further includes a mounting surface disposed opposite to the heat dissipation surface. Along the length of the heat sink, the mounting surface is provided with a plurality of heat dissipation fins at intervals.

[0018] In one embodiment, the heat dissipation fins are vertically disposed on the mounting surface.

[0019] And / or, the heat sink and heat sink fins are integrally formed.

[0020] In one embodiment, the heat pipe further includes a condensation section connected to the heat absorption section, and the heat sink is provided with heat dissipation fins. At least a portion of the condensation section is inserted into the heat dissipation fins.

[0021] In one embodiment, at least a portion of the condensation section is perpendicular to the heat dissipation fins.

[0022] In one embodiment, the condensation section is welded and fixed to the heat dissipation fins.

[0023] Alternatively, the heat dissipation fins are provided with mounting holes adapted to the condensation section, and the heat dissipation device also includes a heat conductor disposed in the condensation section. The condensation section is interference-fitted with the mounting holes through the heat conductor so that the condensation section is fixedly connected to the heat dissipation fins.

[0024] In one embodiment, the heat pipe includes a pipe body, a capillary wick, and a heat exchange medium. The capillary wick is disposed on the inner wall of the pipe body, and the heat exchange medium is disposed within the pipe body. The heat pipe includes a heat-absorbing section and a condensing section connected to the heat-absorbing section. The heat exchange medium can absorb heat in the heat-absorbing section to form a gaseous state and flow to the condensing section, where it releases heat to form a liquid state and flows back to the heat-absorbing section.

[0025] According to a second aspect of the present disclosure, an outdoor unit for an air conditioner is provided. The outdoor unit includes a heating element and a heat dissipation device as described in any of the above embodiments, wherein the heating element and the heat-conducting zone are thermally connected.

[0026] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0027] The outdoor unit of the air conditioner uses the heat dissipation device in any of the above embodiments. This heat dissipation device can effectively dissipate heat from the electronic components, and the heat dissipation effect is good, which helps to improve the overall performance of the outdoor unit of the air conditioner, thereby improving the user experience.

[0028] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0029] The accompanying drawings, which form part of this disclosure, are used to provide a further understanding of this disclosure. The illustrative embodiments of this disclosure and their descriptions are used to explain this disclosure and do not constitute an undue limitation of this disclosure.

[0030] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] Figure 1 This is a schematic diagram of the structure of an outdoor unit of an air conditioner, as shown in one embodiment.

[0032] Figure 2 This is a schematic diagram of the heat dissipation device according to one embodiment.

[0033] Figure 3 for Figure 2 A schematic diagram of the heat dissipation device from another perspective.

[0034] Figure 4 for Figure 2 The diagram shows a top view of the heat dissipation device.

[0035] Figure 5 for Figure 2The diagram shows a front view of the heat dissipation device.

[0036] Figure 6 for Figure 2 The diagram shows a side view of the heat dissipation device.

[0037] Figure 7 for Figure 2 The diagram shows the structure of the heat pipe in the heat dissipation device.

[0038] Figure 8 for Figure 7 The diagram shows a cross-sectional view of the heat pipe.

[0039] Explanation of the reference numerals in the attached figures.

[0040] 10. Outdoor unit of air conditioner; 100. Heat dissipation device; 110. Heat dissipation plate; 111. Heat dissipation surface; 1111. Heat conduction zone; 112. Side; 113. Groove; 114. Clearance notch; 115. Mounting surface; 120. Heat pipe; 121. Heat absorption section; 1211. Heat absorption plane; 1212. Mounting part; 1213. First section; 1214. Second section; 122. Condensation section; 123. Pipe body; 124. Capillary wick; 125. Heat exchange medium; 130. Heat dissipation fins; 131. Mounting hole; 140. Heat conductor; 101. Fastener; 200. Heating element. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this disclosure clearer, the following detailed description is provided in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and do not limit the scope of protection of this disclosure.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of this disclosure.

[0043] With the development of society and economy and the improvement of people's living standards, air conditioning equipment has gradually become an indispensable household appliance. The electrical control box inside the outdoor unit of the air conditioner contains multiple electronic components. During the operation of the outdoor unit, the temperature of these electronic components will rise. When the heat generated by the components cannot be dissipated in time, the electronic components may burn out or malfunction due to excessive temperature.

[0044] In related technologies, heat sinks are usually installed on the electrical control box to dissipate heat from electronic components, but their heat dissipation effect is poor and will affect the overall performance of the outdoor unit of the air conditioner.

[0045] As a household appliance, air conditioning is becoming increasingly popular due to its ability to provide a comfortable environment. However, with a wide variety of types and brands available, consumers have many choices. Therefore, how to win over consumers and enhance product competitiveness has become a growing concern for air conditioning manufacturers.

[0046] Based on this, the present disclosure provides a heat dissipation device 100 and an outdoor unit 10 of an air conditioner. The heat dissipation device 100 can effectively dissipate heat from the electronic components that generate heat, and the heat dissipation effect is good, which is beneficial to improving the overall performance of the outdoor unit 10 of the air conditioner.

[0047] In some embodiments, the outdoor unit 10 of the air conditioner includes a compressor, a heat exchanger, and electronic control components, the electronic control components including a variety of electronic components that generate heat during operation, namely, heat-generating devices 200.

[0048] It should be noted that the heat-generating device 200 can specifically be various electronic devices within the electronic control components, including the main chip, rectifier bridge, and IPM (Intelligent Power Module), etc.

[0049] like Figures 1 to 4 As shown, in some embodiments, the outdoor unit 10 of the air conditioner further includes a heat dissipation device 100, which includes a heat dissipation plate 110 and a heat pipe 120. The heat dissipation plate 110 includes a heat dissipation surface 111, which includes a heat-conducting area 1111 overlapping with the heat-generating device 200. The heat pipe 120 is disposed on the heat dissipation plate 110. The heat pipe 120 includes a heat-absorbing section 121 located on the heat dissipation surface 111. On the orthographic projection plane of the thickness direction of the heat dissipation plate 110, the heat-absorbing section 121 is inclined to the side surface 112 of the heat dissipation plate 110 to increase the overlap area between the heat-absorbing section 121 and the heat-conducting area 1111.

[0050] Thus, when the heating device 200 and the heat dissipation device 100 are installed, the heating chip can be installed on the heat conduction area 1111 on the heat dissipation surface 111, and the heating device 200 and the heat conduction area 1111 are overlapped. The heat absorption section 121 of the heat pipe 120 is located on the heat dissipation surface 111, and on the orthographic projection plane of the heat dissipation plate 110 in the thickness direction, the heat absorption section 121 and the side surface 112 of the heat dissipation plate 110 are inclined, thereby increasing the overlap area between the heat absorption section 121 and the heat conduction area 1111. When the heat dissipation device 100 is working to dissipate heat from the heat-generating device 200, the overlap area between the heat-absorbing section 121 and the heat-conducting area 1111 is larger, and the heat-conducting area 1111 overlaps with the heat-generating chip, thereby increasing the overlap area between the heat-absorbing section 121 and the heat-generating device 200 disposed in the heat dissipation device 100, thus improving the heat dissipation effect on the heat-generating device 200, ensuring more effective heat dissipation of the heat-generating device 200, and thereby improving the overall performance of the outdoor unit 10 of the air conditioner.

[0051] It should be noted that, Figure 4 The image shown is the frontal projection of the heat sink 110 in the thickness direction.

[0052] like Figures 2 to 4 As shown, in one embodiment, the heating element 200 is thermally coupled with the heat-conducting area 1111. Thus, when the outdoor unit 10 of the air conditioner is working, the heat generated by the heating element 200 can be transferred to the heat-conducting area 1111 by utilizing the thermal coupling between the heating element 200 and the heat-conducting area 1111, so that the heat-absorbing section 121 located on the heat-conducting area 1111 can dissipate heat from the heating element 200.

[0053] like Figure 3 as well as Figure 4 As shown, in some embodiments, the heating element 200 is fixedly connected to the heat-conducting area 1111. Thus, by fixing the heating element 200 to the heat-conducting area 1111, a fixed connection between the heating element 200 and the heat dissipation device 100 is achieved, which helps to ensure the reliability of heat dissipation from the heat dissipation device 100 to the heating element 200.

[0054] It should be noted that there are various ways to fix the heating element 200 to the heat-conducting area 1111, including adhesive fixing and screw fixing, etc.

[0055] like Figure 2 as well as Figure 4 As shown, in one example, the heat dissipation device 100 also includes a fastener 101, and the heat-generating device 200 is fixedly connected to the heat-conducting area 1111 via the fastener 101.

[0056] It should be noted that there are various ways to implement fastener 101, including screws and bolts, etc.

[0057] In one example, the heat dissipation device 100 further includes an adhesive layer, through which the heat-generating device 200 is fixedly connected to the heat-conducting area 1111.

[0058] like Figure 2 as well as Figure 3 As shown, in some embodiments, the heat-absorbing section 121 includes a heat-absorbing plane 1211, which is exposed on the heat-dissipating surface 111. Thus, by providing the heat-absorbing plane 1211 in the heat-absorbing section 121 and exposing it on the heat-dissipating surface 111, the heat-generating device 200 can contact the heat-absorbing section 121 through the heat-absorbing plane 121 when it is in thermal contact with the heat-conducting area 1111. Using the heat-absorbing plane 1211 increases the contact area between the heat-generating device 200 and the heat-absorbing section 121, thereby improving the heat dissipation efficiency of the heat dissipation device 100 on the heat-generating device 200, enabling the heat dissipation device 100 to provide better heat dissipation, and further improving the overall performance of the outdoor unit 10 of the air conditioner.

[0059] like Figure 2 as well as Figure 3 As shown, in some embodiments, the heat-absorbing section 121 is embedded in the heat sink 110, and the heat-absorbing plane 1211 is flush with the heat dissipation surface 111. Thus, by embedding the heat-absorbing section 121 into the heat sink 110 and venting the heat-absorbing plane 1211 and the heat dissipation surface 111, when the heating element 200 is installed in the heat-conducting area 1111, the heating element 200 can simultaneously contact both the heat dissipation surface 111 and the heat-absorbing plane 1211. This further improves the heat dissipation efficiency of the heat dissipation device 100 for the heating element 200, enabling the heat dissipation device 100 to provide better heat dissipation and further improving the overall performance of the outdoor unit 10 of the air conditioner.

[0060] like Figure 2 , Figure 7 as well as Figure 8 As shown, in some embodiments, the heat-absorbing section 121 further includes a mounting portion 1212 connected to the heat-absorbing plane 1211, and the heat sink 110 is provided with a groove 113 adapted to the mounting portion 1212, with the mounting portion 1212 disposed in the groove 113. Thus, during the assembly of the heat dissipation device 100, the heat-absorbing section 121 is mounted to the heat sink 110 via the mounting portion 1212 and the groove 113, thereby achieving the mounting of the heat-absorbing section 121 onto the heat sink 110. This assembly method is simple and easy to implement.

[0061] like Figure 2 , Figure 7 as well as Figure 8As shown, in some embodiments, the heat-absorbing section 121 is installed in the groove 113 by the mounting part 1212 so that the heat-absorbing section 121 is embedded in the heat sink 110 and the heat-absorbing surface 1211 is flush with the heat sink surface 111.

[0062] like Figure 2 , Figure 7 as well as Figure 8 As shown, in some embodiments, after the mounting part 1212 is installed in the groove 113, the heat-absorbing section 121 and the heat sink 110 are fixedly connected. In this way, the fixed connection between the heat-absorbing section 121 and the heat sink 110 can ensure the reliability of the connection between the heat-absorbing section 121 and the heat sink 110, thereby ensuring the heat dissipation reliability of the heat dissipation device 100.

[0063] It should be noted that after the mounting part 1212 is installed in the groove 113, there are several ways to achieve a fixed connection between the heat absorption section 121 and the heat sink 110. These include the mounting part 1212 being snapped into the groove 113 to achieve a fixed connection between the heat absorption section 121 and the heat sink 110; the mounting part 1212 being glued to the groove 113 to achieve a fixed connection between the heat absorption section 121 and the heat sink 110; and the mounting part 1212 being welded to the groove 113 to achieve a fixed connection between the heat absorption section 121 and the heat sink 110, etc.

[0064] like Figure 2 as well as Figure 4 As shown, in some embodiments, the heat-absorbing section 121 includes a first section 1213 and a second section 1214 that are bent and connected, and the extending directions of the first section 1213 and the second section 1214 intersect the side surface of the heat sink 110, respectively. Thus, by designing the heat-absorbing section 121 with the first section 1213 and the second section 1214 bent and connected, and by ensuring that the extending directions of the first section 1213 and the second section 1214 intersect the side surface of the heat sink 110, the overlap area between the heat-absorbing section 121 and the heat-conducting area 1111 can be increased, which is beneficial to improving the heat dissipation efficiency of the heat dissipation device 100 for the heat-generating device 200.

[0065] like Figure 2 as well as Figure 4 As shown, in some embodiments, the heat-absorbing section 121 located within the heat-conducting region 1111 at least partially overlaps with the diagonal of the heat-conducting region 1111. Thus, by aligning the heat-absorbing section 121 within the heat-conducting region 1111 with at least partial overlap with the diagonal of the heat-conducting region 1111, the area of ​​the heat-absorbing section 121 within the heat-conducting region 1111 can be effectively increased. This allows the heat-generating device 200, which overlaps with the heat-conducting region 1111, to have a larger contact area with the heat-absorbing section 121, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0066] like Figure 2 as well as Figure 4As shown, in some embodiments, the heat-absorbing section 121 located within the heat-conducting zone 1111 is close to the diagonal of the heat-conducting zone 1111. This effectively increases the area of ​​the heat-absorbing section 121 within the heat-conducting zone 1111, allowing the heating device 200, which overlaps with the heat-conducting zone 1111, to have a larger contact area with the heat-absorbing section 121. This enables the heat pipe to pass through and adhere to the heating device 200 to the maximum extent, allowing the heat from the heating device 200 to be quickly and evenly dissipated through the heat pipe, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0067] like Figure 2 as well as Figure 4 As shown, in some embodiments, the heat sink 110 is also provided with a clearance notch 114, and part of the heat pipe 120 is located within the clearance notch 114. In this way, when the heat sink 100 is assembled, by placing part of the heat pipe 120 within the clearance notch 114, it is possible to prevent the heat pipe 120 from protruding relative to the heat sink 110, which helps to make the overall structure of the heat sink 100 more compact and reduce the space occupied by the heat sink 100 in the outdoor unit 10 of the air conditioner.

[0068] like Figure 2 as well as Figure 4 As shown, in some embodiments, the heat pipe 120 includes multiple heat pipes 120, which are staggered and disposed on the heat sink 110. Thus, by providing multiple heat pipes 120 on the heat sink 110 and staggering them, the area occupied by the heat pipes 120 on the heat sink 110 is increased, thereby enabling the heat dissipation device 100 to dissipate heat for more heat-generating devices 200 and improving heat dissipation efficiency.

[0069] It should be noted that the number of heat pipes 120 can be two, three, or four, etc. The specific position and number of heat pipes 120 can be set according to the position and number of heating devices 200.

[0070] like Figure 2 as well as Figure 5As shown, in some embodiments, the heat sink 110 further includes a mounting surface 115 disposed opposite to the heat dissipation surface 111. Along the length of the heat sink 110, the mounting surface 115 is provided with a plurality of heat dissipation fins 130 spaced apart. Thus, by spaced apart on the mounting surface 115 opposite to the heat dissipation surface 111, when the heat dissipation device 100 dissipates heat from the heat-generating device 200, the cooling airflow can pass through the heat dissipation fins 130 to carry away the heat transferred to the heat dissipation fins 130, thereby reducing the temperature of the heat dissipation device 100 and improving the heat dissipation efficiency of the heat dissipation device 100 for the heat-generating device 200. The arrangement of the heat dissipation fins 130 ensures a larger contact area between the cooling airflow and the heat dissipation device 100, thereby improving heat dissipation efficiency. Simultaneously, when the cooling airflow flows through the gaps between the heat dissipation fins 130, the airflow can smoothly pass through the gaps at maximum flow rate to carry away heat, thereby improving heat dissipation efficiency.

[0071] It should be noted that the length direction of the heat sink 110 is... Figure 5 The X direction is shown.

[0072] like Figure 2 as well as Figure 5 As shown, in some embodiments, the heat dissipation fins 130 are vertically disposed on the mounting surface 115. In this way, by vertically disposing the heat dissipation fins 130 on the mounting surface 115, it is beneficial for the cooling airflow to flow better through the heat dissipation fins 130 and to increase the contact area between the cooling airflow and the heat dissipation fins 130, so as to further improve the heat dissipation efficiency of the heat dissipation device 100.

[0073] It should be noted that there are various ways to connect the heat sink fins 130 and the heat sink plate 110, including but not limited to welding the heat sink fins 130 and the heat sink plate 110, bonding the heat sink fins 130 and the heat sink plate 110, snapping the heat sink fins 130 and the heat sink plate 110, screwing the heat sink fins 130 and the heat sink plate 110, and integrally molding the heat sink plate 110 and the heat sink fins 130, etc.

[0074] like Figure 2 as well as Figure 5 As shown, in one example, the heat sink 110 and the heat sink fins 130 are integrally formed. In this way, by integrally forming the heat sink 110 and the heat sink fins 130, the assembly steps of the heat dissipation device 100 can be reduced, thereby improving the assembly efficiency of the heat dissipation device 100.

[0075] It should be noted that the material of the heat sink fin 130 can be made in various ways, including aluminum, aluminum alloy, copper, and copper alloy, etc.

[0076] like Figure 2 as well as Figure 5As shown, in some embodiments, the gap between adjacent heat dissipation fins 130 is 2mm to 10mm. By designing the gap between adjacent heat dissipation fins 130 to be 2mm to 10mm, it is possible to avoid situations where the gap is too large, resulting in a smaller number of heat dissipation fins 130 on the heat sink 110, thus reducing the heat dissipation efficiency of the heat dissipation device 100. On the other hand, it is also possible to avoid situations where the gap is too small, resulting in a reduced contact area between the cooling airflow and the heat dissipation fins 130. Therefore, setting the gap between adjacent heat dissipation fins 130 to 2mm to 10mm can improve the heat dissipation efficiency of the heat dissipation device 100.

[0077] like Figure 2 as well as Figure 5 As shown, in some embodiments, the gap between adjacent heat dissipation fins 130 is 3mm to 8mm.

[0078] like Figure 2 as well as Figure 5 As shown, in some embodiments, the gap between adjacent heat dissipation fins 130 is 3mm to 5mm.

[0079] It should be noted that there are various ways to implement the gap between adjacent heat dissipation fins 130, including gaps of 2mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm and 10mm, etc.

[0080] like Figure 2 as well as Figure 5 As shown, in some embodiments, the heat pipe 120 further includes a condensing section 122 connected to the heat absorption section 121, and the heat sink 110 is provided with heat dissipation fins 130. At least a portion of the condensing section 122 is inserted into the heat dissipation fins 130. Thus, when the heat dissipation device 100 is working, the heat absorption section 121 can absorb heat from the heat-generating device 200, and the heat can be transferred from the heat absorption section 121 to the condensing section 122. By inserting at least a portion of the condensing section 122 into the heat dissipation fins 130, when the cooling airflow flows through the heat dissipation fins 130, the condensing section 122 can be cooled simultaneously, allowing the heat in the heat pipe 120 to dissipate quickly, thereby improving the heat dissipation efficiency of the heat pipe 120 and improving the heat dissipation effect and efficiency of the heat absorption section 121 on the heat-generating device 200.

[0081] like Figure 2 as well as Figure 5 As shown, in some embodiments, at least a portion of the condensation section 122 is perpendicular to the heat dissipation fins 130. Thus, by vertically arranging the condensation section 122 to the heat dissipation fins 130, the heat dissipation efficiency of the cooling airflow on the condensation section 122 can be further improved, thereby further improving the heat dissipation efficiency of the heat dissipation device 100.

[0082] like Figure 2 , Figure 7 as well as Figure 8 As shown, in some embodiments, the heat pipe 120 includes a pipe body 123, a capillary wick 124, and a heat exchange medium 125. The capillary wick 124 is disposed on the inner wall of the pipe body 123, and the heat exchange medium 125 is disposed inside the pipe body 123. The heat pipe 120 includes a heat absorption section 121 and a condensation section 122 connected to the heat absorption section 121. The heat exchange medium 125 can absorb heat in the heat absorption section 121 to form a gaseous state and flow to the condensation section 122, so as to release heat in the condensation section 122 to form a liquid state and flow back to the heat absorption section 121. Thus, when the heat dissipation device 100 is working, the heat generated by the heating device 200 can be transferred to the heat absorption section 121 in the heat conduction zone 1111, and the heat exchange medium 125 in the heat pipe 120 can absorb heat in the heat absorption section 121. The high-temperature heat exchange medium 125 vaporizes and, under the action of pressure difference, can carry the heat to the lower-temperature condensation section 122 to achieve heat dissipation for the heating device 200. When the high-temperature heat exchange medium 125 liquefies at a low temperature in the condensing section 122, it adheres to the capillary wick 124 on the inner wall of the tube body 123. The capillary phenomenon formed by the capillary wick 124 causes the liquefied heat exchange medium 125 to flow back from the condensing section 122 to the heat absorption section 121, and the heat pipe 120 can repeatedly circulate to achieve a cooling effect.

[0083] In some embodiments, the capillary wick 124 is formed of copper wire or other dense mesh channels so that the heat exchange medium 125 can be condensed and then flow back from the condensation section 122 to the heat absorption section 121, where it absorbs heat from the heating device 200 and flows back to the condensation section 122, thereby realizing the reciprocating circulation of the heat exchange medium 125 within the heat pipe 120.

[0084] like Figure 2 as well as Figure 5 As shown, in some embodiments, the condensation section 122 is located at the edge of the heat dissipation device 100 or at a location with a high flow rate, and the capillary wick 124 is attached to the inner wall of the tube body 123 so that the heat exchange medium 125 flows between the condensation section 122 and the evaporation section through the capillary wick 124, thereby enabling the heat pipe 120 to dissipate heat from the heat-generating device 200.

[0085] like Figure 2 as well as Figure 5 As shown, in some embodiments, the condensing section 122 is welded to the heat dissipation fins 130. Thus, welding the condensing section 122 to the heat dissipation fins 130 improves the reliability of the connection between them.

[0086] like Figure 2 as well as Figure 6As shown, in some embodiments, the heat dissipation fins 130 are provided with mounting holes 131 adapted to the condensation section 122. The heat dissipation device 100 also includes a heat conductor 140 disposed on the condensation section 122. The condensation section 122 is interference-fitted with the mounting holes 131 through the heat conductor 140, so that the condensation section 122 and the heat dissipation fins 130 are fixedly connected. Thus, when the heat dissipation device 100 is assembled, the condensation section 122 can be installed with the heat dissipation fins 130 through the mounting holes 131. By providing the heat conductor 140 so that the condensation section 122 can be interference-fitted with the mounting holes 131, on the one hand, the condensation section 122 and the heat dissipation fins 130 are fixedly connected, and on the other hand, heat transfer between the condensation section 122 and the heat dissipation fins 130 can be achieved by utilizing the heat conductor 140, which is beneficial to improving the heat dissipation efficiency of the condensation section 122, thereby improving the heat dissipation efficiency of the heat dissipation device 100.

[0087] It should be noted that there are various ways to implement the material of the heat conductor 140, including materials with excellent thermal conductivity such as thermal grease.

[0088] In some embodiments, the heat conductor 140 is elastic. Thus, when the condenser section 122 is installed in the mounting hole 131 via the heat conductor 140, the elasticity of the heat conductor 140 facilitates the installation of the condenser section 122 into the mounting hole 131 during the interference fit. After installation, the elasticity of the heat conductor 140 allows it to rebound, ensuring an interference fit between the condenser section 122 and the mounting hole 131.

[0089] It should be noted that the technical solutions or features described in the above embodiments can be combined or complemented by each other without conflict. The scope of protection of this disclosure is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A heat dissipating device, characterized by, include: A heat sink (110) includes a heat dissipation surface (111), the heat dissipation surface (111) including a heat-conducting area (1111) overlapping with a heat-generating device; and A heat pipe (120) is disposed on the heat sink (110); the heat pipe (120) includes a heat-absorbing section (121) located on the heat dissipation surface (111). On the orthographic projection plane of the thickness direction of the heat sink (110), the heat-absorbing section (121) is inclined to the side surface (112) of the heat sink (110) to increase the overlap area between the heat-absorbing section (121) and the heat-conducting area (1111).

2. The heat dissipating device according to claim 1, wherein The heat-absorbing section (121) includes a heat-absorbing plane (1211), which is exposed outside the heat-dissipating surface (111).

3. The heat dissipating device according to claim 2, wherein The heat-absorbing section (121) is embedded in the heat dissipation plate (110), and the heat-absorbing plane is flush with the heat dissipation surface (111).

4. The heat dissipating device of claim 2, wherein The heat absorption section (121) further includes a mounting part (1212) connected to the heat absorption plane (1211), and the heat dissipation plate (110) is provided with a groove (113) adapted to the mounting part (1212), and the mounting part (1212) is installed in the groove (113).

5. The heat dissipating device of claim 1, wherein The heat absorption section (121) includes a first section (1213) and a second section (1214) that are bent and connected. The extension directions of the first section (1213) and the second section (1214) intersect with the side surface (112) of the heat dissipation plate (110), respectively. And / or, the heat-absorbing section (121) located within the heat-conducting region (1111) at least partially coincides with the diagonal of the heat-conducting region (1111).

6. The heat dissipating device of claim 1, wherein The heat sink (110) is also provided with a clearance notch (114), and part of the heat pipe (120) is located in the clearance notch (114); And / or, the heat pipe (120) includes a plurality of heat pipes (120) which are staggered and disposed on the heat sink (110).

7. The heat dissipating device of claim 1, wherein The heat sink (110) also includes a mounting surface (115) disposed opposite to the heat dissipation surface (111); along the length direction of the heat sink (110), the mounting surface (115) is provided with a plurality of heat dissipation fins (130) at intervals.

8. The heat dissipating device according to claim 7, wherein The heat dissipation fins (130) are vertically disposed on the mounting surface (115); And / or, the heat sink (110) is integrally formed with the heat sink fins (130).

9. The heat dissipating device of claim 1, wherein, The heat pipe (120) also includes a condensation section (122) connected to the heat absorption section (121), and the heat sink (110) is provided with heat dissipation fins (130); at least a portion of the condensation section (122) is inserted into the heat dissipation fins (130).

10. The heat dissipation device according to claim 9, characterized in that, At least a portion of the condensation section (122) is perpendicular to the heat dissipation fins (130).

11. The heat dissipation device according to claim 9, characterized in that, The condensation section (122) is welded and fixed to the heat dissipation fins (130); Alternatively, the heat dissipation fins (130) are provided with mounting holes adapted to the condensation section (122), and the heat dissipation device further includes a heat conductor disposed in the condensation section (122). The condensation section (122) is interference-fitted with the mounting holes through the heat conductor so that the condensation section (122) is fixedly connected to the heat dissipation fins (130).

12. The heat dissipation device according to any one of claims 1 to 11, characterized in that, The heat pipe (120) includes a pipe body (123), a capillary wick (124), and a heat exchange medium (125). The capillary wick (124) is disposed on the inner wall of the pipe body (123), and the heat exchange medium (125) is disposed inside the pipe body (123). The heat pipe (120) includes a heat absorption section (121) and a condensation section (122) connected to the heat absorption section (121). The heat exchange medium (125) can absorb heat in the heat absorption section (121) to form a gaseous state and flow to the condensation section (122) to release heat in the condensation section (122) to form a liquid state and flow back to the heat absorption section (121).

13. An outdoor unit for an air conditioner, characterized in that, It includes a heating element and a heat dissipation device (100) as described in any one of claims 1 to 12, wherein the heating element is thermally connected to the heat-conducting area (1111).

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