An electronic refrigeration temperature control device

Abstract

This utility model discloses an electronic cooling temperature control device, relating to the field of semiconductor refrigeration equipment technology. The electronic cooling temperature control device includes a semiconductor refrigeration chip. A first heat-insulating frame is installed around the outer wall of the semiconductor refrigeration chip. A second heat-insulating frame is installed outside the first heat-insulating frame. A filling layer is provided between the first and second heat-insulating frames. A cooling conduction base is installed on the top of the second heat-insulating frame, and a heat dissipation conduction base is installed on the bottom of the second heat-insulating frame. A first placement groove is provided at the bottom of the cooling conduction base, and a second placement groove is provided at the top of the heat dissipation conduction base. This solution solves the problem that existing electronic cooling temperature control devices, due to their cooling and heating surfaces at both ends, are prone to reduced cooling efficiency due to heat from the heating surface during use.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor refrigeration equipment technology, specifically to an electronic refrigeration temperature control device. Background Technology

[0002] Electronic refrigeration temperature control devices, also known as semiconductor refrigeration temperature control devices, are devices that utilize the thermoelectric effect of semiconductor materials to achieve temperature control. They generate a temperature difference across the two ends of the material by driving an electric current, thereby achieving the purpose of cooling or temperature control. Based on the Peltier effect, when direct current passes through a thermocouple composed of P-type and N-type semiconductors, one end absorbs heat and the other end releases heat. The heat is then dissipated through a heat dissipation device to maintain a low temperature at the cold end.

[0003] Existing electronic refrigeration temperature control devices, with their cooling and heating surfaces at opposite ends, are prone to reduced cooling efficiency due to heat from the heating surface. Therefore, we propose an electronic refrigeration temperature control device to address the aforementioned problems. Utility Model Content

[0004] The purpose of this utility model is to provide an electronic refrigeration temperature control device to solve the problem mentioned in the background art that the existing electronic refrigeration temperature control device is prone to reduced cooling effect due to the heat of the heating surface during use, since its two ends are respectively a cooling surface and a heating surface.

[0005] To achieve the above objectives, this utility model provides the following technical solution: an electronic cooling temperature control device, comprising a semiconductor cooling chip, a first heat insulation frame installed around the outer wall of the semiconductor cooling chip, a second heat insulation frame installed outside the first heat insulation frame, a filling layer provided between the first heat insulation frame and the second heat insulation frame, a cooling conduction base installed on the top of the second heat insulation frame, a heat dissipation conduction base installed on the bottom of the second heat insulation frame, a first placement groove provided at the bottom of the cooling conduction base, a second placement groove provided at the top of the heat dissipation conduction base, the top and bottom of the semiconductor cooling chip being located inside the first placement groove and the second placement groove respectively, a heat dissipation plate installed at the bottom of the heat dissipation conduction base, and multiple sets of heat dissipation fins evenly installed at the bottom of the heat dissipation plate.

[0006] Preferably, the heat dissipation plate is provided with a heat dissipation channel inside. The heat dissipation channel is an S-shaped channel composed of multiple direct current channels and multiple arc-shaped channels. A liquid inlet is installed at the front end of one side of the heat dissipation plate, and a liquid outlet is installed at the rear end of one side of the heat dissipation plate. The liquid inlet and the liquid outlet are connected to the heat dissipation channel. A spiral conveying plate is installed inside the heat dissipation channel on the side near the liquid inlet and the liquid outlet.

[0007] Preferably, multiple sets of straight pipes are installed through the interior of the heat dissipation fins, and one end of two adjacent straight pipes is connected by an arc-shaped pipe. The multiple straight pipes and multiple arc-shaped pipes form an S-shape, with one end of one of the straight pipes on one side serving as a water inlet and the other end of one of the straight pipes on the other side serving as a water outlet.

[0008] Preferably, a fixing plate is installed at the bottom of the heat dissipation fins, and a cooling fan is installed inside the fixing plate.

[0009] Preferably, a power supply wire is installed on one side of the semiconductor cooling chip, and a reserved hole is provided on one side of the first heat insulation frame and the second heat insulation frame, through which the power supply wire is connected to the outside.

[0010] Preferably, a number of sets of conduction columns are evenly installed on the top of the cooling conduction base, and baffles are installed around the outer wall of the cooling conduction base.

[0011] Preferably, the second heat insulation frame is fixedly connected to the baffle via a first mounting plate. The first mounting plate has an L-shaped cross-section and is bolted to the second heat insulation frame and the baffle. The second heat insulation frame is fixedly connected to the heat dissipation and conduction base via a second mounting plate and is bolted to the second heat insulation frame and the heat dissipation and conduction base.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] (1) This utility model forms a double-layer physical barrier by using the first heat insulation frame, the second heat insulation frame and the flexible heat insulation material of the middle filling layer on the outer wall of the semiconductor cooling chip to directly block the heat from the hot side from entering the cold side. This solves the problem that the existing electronic cooling temperature control device is prone to reduced cooling effect due to the heat of the heating surface during use, since its two ends are the cooling and heating surfaces respectively.

[0014] (2) By blocking the intrusion of ambient heat through the baffle on the outer wall of the cooling conduction base, the gap design of the conduction column reduces lateral heat exchange, ensuring that the cold energy is concentrated and transferred to the target area, and avoiding being offset by the heat on the hot side.

[0015] (3) Through the synergistic effect of heat dissipation plate, heat dissipation fins and heat dissipation fan, the heat of the hot end is quickly discharged to the outside, the temperature of the hot end is reduced, and the heat radiation and heat conduction from the hot side to the cold side are reduced from the source. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a front cross-sectional view of the present invention.

[0018] Figure 3 This is a schematic diagram of the top cross-sectional structure of the present invention. Figure 1 ;

[0019] Figure 4 This is a schematic diagram of the top cross-sectional structure of the present invention. Figure 2 ;

[0020] Figure 5 This is a schematic diagram of the top cross-sectional structure of the present invention. Figure 3 ;

[0021] In the diagram: 1. Semiconductor cooling chip; 2. First heat insulation frame; 3. Second heat insulation frame; 4. Filling layer; 5. Cooling conduction base; 6. Heat dissipation conduction base; 7. First placement slot; 8. Second placement slot; 9. Heat spreader; 10. Heat dissipation channel; 11. Liquid inlet; 12. Liquid outlet; 13. Spiral conveyor plate; 14. Heat dissipation fins; 15. Straight pipe; 16. Arc-shaped pipe; 17. Water inlet; 18. Water outlet; 19. Fixing plate; 20. Cooling fan; 21. Power supply wire; 22. Reserved hole; 23. Conducting column; 24. Baffle; 25. First mounting plate; 26. Second mounting plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0023] Please see Figure 1-5 This utility model provides an embodiment of an electronic cooling temperature control device, comprising a semiconductor cooling chip 1, a first heat insulation frame 2 installed around the outer wall of the semiconductor cooling chip 1, a second heat insulation frame 3 installed outside the first heat insulation frame 2, a filling layer 4 disposed between the first heat insulation frame 2 and the second heat insulation frame 3, a cooling conduction base 5 installed on the top of the second heat insulation frame 3, and a heat dissipation conduction base 6 installed on the bottom of the second heat insulation frame 3, a first placement groove 7 disposed at the bottom of the cooling conduction base 5, and a second placement groove 8 disposed on the top of the heat dissipation conduction base 6, the top and bottom of the semiconductor cooling chip 1 being located inside the first placement groove 7 and the second placement groove 8 respectively, and a heat dissipation plate 9 installed at the bottom of the heat dissipation conduction base 6, with multiple sets of heat dissipation fins 14 evenly installed on the bottom of the heat dissipation plate 9. (Please refer to...) Figure 4The heat spreader 9 has a heat dissipation channel 10 inside. The heat dissipation channel 10 is an S-shaped channel composed of multiple direct-flow channels and multiple arc-shaped channels. A liquid inlet 11 is installed at the front end of one side of the heat spreader 9, and a liquid outlet 12 is installed at the rear end of one side of the heat spreader 9. The liquid inlet 11 and the liquid outlet 12 are connected to the heat dissipation channel 10. A spiral conveyor plate 13 is installed inside the heat dissipation channel 10 near the liquid inlet 11 and the liquid outlet 12. Please refer to [link / reference]. Figure 5 Multiple straight pipes 15 are installed through the interior of the heat dissipation fins 14. One end of two adjacent straight pipes 15 is connected by an arc-shaped pipe 16. The multiple straight pipes 15 and multiple arc-shaped pipes 16 form an S-shape. One end of one straight pipe 15 on one side is set as a water inlet 17, and the other straight pipe 15 on the other side is set as a water outlet 18. Please refer to [link / reference]. Figure 5 A mounting plate 19 is installed at the bottom of the heat dissipation fins 14, and a cooling fan 20 is installed inside the mounting plate 19. (See also...) Figure 2 The top of the cooling conduction base 5 is uniformly equipped with several sets of conduction columns 23, and baffles 24 are installed around the outer wall of the cooling conduction base 5. After the semiconductor cooling chip 1 is powered on, based on the Peltier effect, its cold end at the top absorbs heat to produce a cooling effect, and its hot end at the bottom releases heat to produce a heating effect. The cold end of the semiconductor cooling chip 1 is embedded in the first placement groove 7 of the cooling conduction base 5. The cooling energy is transferred to the multiple sets of conduction columns 23 at the top through the cooling conduction base 5. The conduction columns 23 directionally transfer the cooling energy to the target area that needs to be cooled. The baffles 24 form an isolation barrier to prevent the heat from the heat conduction component from intruding into the cold side. The first heat insulation frame 2, the second heat insulation frame 3, and the filling layer 4 between them can further block the direct heat conduction between the cold side and the hot side, and prevent the heat from the hot end from penetrating back to the cold end. The filling layer 4 is made of flexible heat insulation material. The hot end of the semiconductor cooling chip 1 is embedded in the second placement groove 8 of the heat dissipation conduction base 6. The heat generated at the hot end is transferred to the heat dissipation conduction base 6 to the heat spreader 9. The heat spreader 9 absorbs heat quickly through large-area contact, preventing heat from accumulating at the hot end. The coolant flows through the heat dissipation channel 10 inside the heat spreader 9. Combined with the inlet 11, outlet 12, and spiral conveyor plate 13, this accelerates coolant circulation, evenly distributing heat across the entire heat spreader 9 and preventing localized overheating. Heat from the heat spreader 9 is transferred to the heat dissipation fins 14. The flow channels formed by the straight tubes 15 and arc-shaped tubes 16 inside the heat dissipation fins 14 further expand the heat dissipation area, transferring heat to the flowing coolant and enhancing heat exchange efficiency. The cooling fan 20 accelerates the airflow around the heat dissipation fins 14, quickly dissipating heat from the surface of the fins 14 to the external environment and reducing the temperature of the hot end.

[0024] Please see Figure 3A power cord 21 is installed on one side of the thermoelectric cooler 1, and a reserved hole 22 is provided on one side of the first heat insulation frame 2 and the second heat insulation frame 3. The power cord 21 is connected to the outside through the reserved hole 22. The thermoelectric cooler 1 needs to be connected to an external power source through the power cord 21 to work. The reserved hole 22 provides a dedicated channel for the power cord 21 to pass through, avoiding structural damage caused by the power cord 21 passing through an arbitrary opening. The size of the reserved hole 22 can be adapted to the diameter of the power cord 21, thereby reducing the convection exchange between the hot air on the heat dissipation base 6 side and the cold air on the cooling base 5 side through the gap, reducing the possibility of heat from the hot side intruding into the cold side through air convection, and helping to maintain the heat insulation effect of the first heat insulation frame 2 and the second heat insulation frame 3.

[0025] Please see Figure 2 The second heat insulation frame 3 is fixedly connected to the baffle 24 via the first mounting plate 25. The first mounting plate 25 has an L-shaped cross-section and is bolted to the second heat insulation frame 3 and the baffle 24. The second heat insulation frame 3 is fixedly connected to the heat dissipation base 6 via the second mounting plate 26, which is also bolted to the second heat insulation frame 3 and the heat dissipation base 6. When the device is running, there is a temperature difference on both sides of the semiconductor cooling chip 1, and the components may undergo slight deformation due to thermal expansion and contraction. Through the threaded connection of the first mounting plate 25 and the second mounting plate 26, the second heat insulation frame 3, the heat dissipation base 6, and the baffle 24 can be fixedly connected to form a stable overall structure, preventing component deformation and misalignment, and ensuring that the cold-side heat insulation and hot-side heat dissipation are not affected by structural loosening.

[0026] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An electronic refrigeration temperature control device, comprising a semiconductor refrigeration chip (1), characterized in that: A first heat insulation frame (2) is installed around the outer wall of the semiconductor cooling chip (1). A second heat insulation frame (3) is installed outside the first heat insulation frame (2). A filling layer (4) is provided between the first heat insulation frame (2) and the second heat insulation frame (3). A cooling conduction base (5) is installed on the top of the second heat insulation frame (3). A heat dissipation conduction base (6) is installed on the bottom of the second heat insulation frame (3). A first placement groove (7) is provided on the bottom of the cooling conduction base (5). A second placement groove (8) is provided on the top of the heat dissipation conduction base (6). The top and bottom of the semiconductor cooling chip (1) are located inside the first placement groove (7) and the second placement groove (8) respectively. A heat dissipation plate (9) is installed on the bottom of the heat dissipation conduction base (6). Multiple sets of heat dissipation fins (14) are evenly installed on the bottom of the heat dissipation plate (9). The top of the cooling conduction base (5) is uniformly equipped with several sets of conduction columns (23), and the outer wall of the cooling conduction base (5) is equipped with baffles (24).

2. The electronic refrigeration temperature control device according to claim 1, characterized in that: The heat dissipation plate (9) is provided with a heat dissipation channel (10) inside. The heat dissipation channel (10) is an S-shaped channel composed of multiple straight channels and multiple arc channels. A liquid inlet (11) is installed at the front end of one side of the heat dissipation plate (9), and a liquid outlet (12) is installed at the rear end of one side of the heat dissipation plate (9). The liquid inlet (11) and the liquid outlet (12) are connected to the heat dissipation channel (10). A spiral conveying plate (13) is installed inside the heat dissipation channel (10) on the side close to the liquid inlet (11) and the liquid outlet (12).

3. The electronic refrigeration temperature control device according to claim 1, characterized in that: Multiple straight pipes (15) are installed inside the heat dissipation fins (14). One end of two adjacent straight pipes (15) is connected by an arc pipe (16). The multiple straight pipes (15) and the multiple arc pipes (16) form an S-shape. The other end of one of the straight pipes (15) on one side is set as a water inlet (17), and the other straight pipe (15) on the other side is set as a water outlet (18).

4. The electronic refrigeration temperature control device according to claim 1, characterized in that: A fixing plate (19) is installed at the bottom of the heat dissipation fins (14), and a cooling fan (20) is installed inside the fixing plate (19).

5. The electronic refrigeration temperature control device according to claim 1, characterized in that: A power cord (21) is installed on one side of the semiconductor cooling chip (1), and a reserved hole (22) is provided on one side of the first heat insulation frame (2) and the second heat insulation frame (3). The power cord (21) is connected to the outside through the reserved hole (22).

6. The electronic refrigeration temperature control device according to claim 1, characterized in that: The second heat insulation frame (3) is fixedly connected to the baffle (24) through the first mounting plate (25). The cross-sectional shape of the first mounting plate (25) is L-shaped. The first mounting plate (25) is bolted to the second heat insulation frame (3) and the baffle (24). The second heat insulation frame (3) is fixedly connected to the heat dissipation and conduction base (6) through the second mounting plate (26). The second mounting plate (26) is bolted to the second heat insulation frame (3) and the heat dissipation and conduction base (6).

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